WO2011026293A1 - Temperature compensating circuit for power amplifier - Google Patents

Temperature compensating circuit for power amplifier Download PDF

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Publication number
WO2011026293A1
WO2011026293A1 PCT/CN2009/075982 CN2009075982W WO2011026293A1 WO 2011026293 A1 WO2011026293 A1 WO 2011026293A1 CN 2009075982 W CN2009075982 W CN 2009075982W WO 2011026293 A1 WO2011026293 A1 WO 2011026293A1
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Prior art keywords
power amplifier
temperature
circuit
temperature compensation
feedback loop
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PCT/CN2009/075982
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French (fr)
Chinese (zh)
Inventor
余正明
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惠州市正源微电子有限公司
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Publication of WO2011026293A1 publication Critical patent/WO2011026293A1/en

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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189High frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/34Negative-feedback-circuit arrangements with or without positive feedback
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/141Indexing scheme relating to amplifiers the feedback circuit of the amplifier stage comprising a resistor and a capacitor in series, at least one of them being an active one
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/144Indexing scheme relating to amplifiers the feedback circuit of the amplifier stage comprising a passive resistor and passive capacitor
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/18Indexing scheme relating to amplifiers the bias of the gate of a FET being controlled by a control signal
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/447Indexing scheme relating to amplifiers the amplifier being protected to temperature influence

Definitions

  • the present invention relates to the technical field of power amplifiers, and in particular to a power amplifier temperature compensation circuit having a stable gain effect.
  • Power amplifiers are key components in various wireless communication system transmitters. Each communication standard has strict requirements for its various indicators. As the amount of data transmission increases, the current 3G standard puts more emphasis on power amplifiers. For the demanding requirements, on the basis of high linearity and high efficiency, the power amplifier is also required to have good temperature characteristics over the entire temperature range.
  • GaAs HBT is a high-linearity and high-efficiency RF device that is widely used in linear power amplifier designs in mobile communication systems, but is currently designed with GaAs HBT devices.
  • the performance of the power amplifier has a large deviation at different temperatures, because the temperature change causes the junction voltage drop and the amplification factor of the power transistor to change, which causes the gain of the power amplifier to be greatly affected by the temperature.
  • the gain varies with temperature by 2 to 3 dB, which causes the performance of the handheld device using the power amplifier to vary greatly with temperature.
  • Temperature compensation techniques are used to compensate for this deviation of the gain of the power amplifier as a function of temperature.
  • the main focus is on designing a bias circuit with temperature compensation and using a power supply voltage control circuit with temperature compensation to achieve temperature compensation.
  • this temperature compensation method is mainly used to compensate for the loss.
  • the output power varies with temperature, and it does not have much effect on the compensation of the power amplifier gain with temperature. Therefore, current temperature compensation methods have little effect on reducing the gain of the power amplifier as a function of temperature.
  • the problem to be solved by the present invention is to provide a temperature compensation circuit capable of effectively reducing the variation of the power amplifier gain with temperature.
  • the basic technical solution adopted by the present invention is: Providing a power amplifier temperature compensation circuit for suppressing a deviation of a power amplifier gain with a temperature change, specifically including a feedback loop and a And a control circuit, the control circuit generates a control signal that varies with a temperature change of the power amplifier chip to adjust a feedback amount of the power amplifier feedback loop, and the feedback loop is connected between the input and the output of the power amplifier.
  • the feedback loop contains a diode (which can be replaced by a PN junction in a transistor of a different material), and the amount of feedback of the power amplifier is controlled by controlling the degree of conduction of the diode.
  • the feedback loop contains a field effect transistor, and the amount of feedback of the power amplifier is controlled by controlling the degree of conduction of the field effect transistor.
  • FIG. 1 is a schematic block diagram of an embodiment of a temperature compensation circuit according to the present invention
  • FIG. 2 is a circuit schematic diagram of a first preferred embodiment of the temperature compensation circuit according to the present invention
  • Circuit diagram of a preferred embodiment
  • FIG. 4 is a circuit diagram of a third preferred embodiment of the temperature compensation circuit of the present invention
  • FIG. 5 is a comparison diagram of gain versus temperature of a secondary power amplifier using the temperature compensation circuit and the temperature compensation circuit of the present invention.
  • FIG. 1 is a schematic block diagram of an embodiment of a temperature compensation circuit according to the present invention.
  • the power amplifier is connected between the input signal and the output signal
  • the control circuit is connected to the feedback loop
  • the feedback loop is connected between the input and output of the power amplifier.
  • the implementation of this embodiment is to use a control circuit to generate a control signal following the temperature change of the chip.
  • the amplification factor of the HBT device /1 ⁇ 1
  • the gain of the power amplifier decreases with the rise of the temperature T assuming that the bias current Ic does not change with temperature
  • the present invention adjusts the feedback loop of the power amplifier by the control signal.
  • the amount of feedback can effectively compensate for the change in gain with temperature, thus providing temperature compensation.
  • FIG. 5 a comparison diagram of the gain of the secondary power amplifier with temperature variation of the patented temperature compensation circuit and the temperature compensation circuit is used.
  • the vertical axis represents the gain
  • the horizontal axis represents the temperature
  • the solid line is the gain curve without temperature compensation
  • the dotted line is the gain curve with temperature compensation.
  • FIG. 2 is a circuit schematic diagram of a first preferred embodiment of the temperature compensation circuit of the present invention.
  • the reference voltage generating circuit, the voltage adjusting circuit and the control signal generating circuit are connected in series to form a control circuit, wherein the reference voltage generating circuit is configured to generate a reference voltage VBG that does not vary with temperature and power supply voltage, and a current IPTAT that follows the temperature change.
  • the voltage adjustment circuit converts the temperature-changing current IPTAT into a temperature-varying voltage VPTAT, and simultaneously converts the VBG into a more powerful reference voltage VREF, and the control signal generating circuit combines the voltages VREF and VPTAT to generate a follower chip.
  • the control signal Vtf or Itf; the resistor R1, the diode D1 and the capacitor CI are serially connected between the output end and the input end of the amplifier, and the cathode of the diode D1 is connected to the control circuit through the resistor R2, the resistor R1, the resistor R2, the diode D1 Together with capacitor C1, a feedback loop is formed in which the diode can be replaced by a PN junction of transistors of various materials; transistor Q1 is used for power amplification, and inductor L1 is a choke inductor.
  • the control circuit When the temperature changes, the control circuit generates a control signal Vtf or Itf that follows the temperature change.
  • the control signal further controls the conduction level of the diode D1 connected to the output of the control circuit, thereby changing the feedback of the feedback loop of the power amplifier at different temperatures. Amount to compensate for the gain of the power amplifier as a function of temperature.
  • FIG. 3 is a circuit schematic diagram of a second preferred embodiment of the temperature compensation circuit of the present invention.
  • the base of the transistor Q1 is connected to the input signal, the collector is connected to the inductor L1 and the output signal, and the emitter is grounded; the other end of the inductor L1 is connected to the power source VCC ; the capacitor C l , the resistor R1 and the capacitor C2 are serially connected to the transistor Q1 Between the base and the collector, the anode of the diode D1 is first connected to the junction of the resistor R1 and the capacitor C2, and then connected to the output terminal of the control circuit through the resistor R2, and the cathode is grounded.
  • Transistor Q1 is used for power amplification, and inductor L1 is a choke inductor; capacitor Cl, resistor R1, resistor R2, capacitor C2, and diode D1 form a feedback loop.
  • the control circuit When the temperature changes, the control circuit generates a control signal Vtf or Itf following the temperature change, and the control signal further controls the conduction degree of the diode D1 at different temperatures, thereby changing the feedback amount of the power amplifier feedback loop at different temperatures, It compensates for the gain of the power amplifier as a function of temperature.
  • FIG. 4 is a circuit schematic diagram of a third preferred embodiment of the temperature compensation circuit of the present invention.
  • the base of the transistor Q1 is connected to the input signal, the collector is connected to the inductor L1 and the output signal, and the emitter is grounded; the other end of the inductor L1 is connected to the power source VCC ; the capacitor C l , the resistor R1 and the capacitor C2 are serially connected to the transistor Q1 Between the base and the collector, the drain of the field effect transistor M1 is connected to the junction of the resistor R1 and the capacitor C2, the gate is connected to the output of the control circuit, and the source is grounded.
  • the transistor Q1 is used for power amplification, and the inductor L1 is a choke inductor; the capacitor C1, the resistor R1, the capacitor C2, and the field effect transistor M1 constitute a feedback loop.
  • the control circuit When the temperature changes, the control circuit generates a control voltage Vtf following the temperature change, and the control voltage further controls the conduction degree of the field effect transistor M1 at different temperatures, thereby changing the feedback amount of the power amplifier feedback loop at different temperatures, It compensates for the gain of the power amplifier as a function of temperature.
  • control circuit in the foregoing embodiment is not unique, and may be implemented in different manners. These implementation manners can be implemented by those skilled in the art according to the description in the present invention, and are not praised here.
  • the diodes in the various embodiments may be replaced by PN junctions in transistors of different materials;
  • the above temperature compensation method is also applicable to an amplifier made of different materials to suppress the change of the amplifier gain with respect to temperature.

Abstract

A temperature compensating circuit for a power amplifier includes a feedback circuit (2) and a control circuit (1). A control signal (Vtf/Itf) varied with the variation of the temperature of the power amplifier is generated by the control circuit (1) to adjust the feedback of the feedback circuit (2). The feedback circuit (2) is connected between an input terminal (RFin) and an output terminal (RFout) of the power amplifier. The temperature compensating circuit can reduce the deviation of the gain of the power amplifier when the temperature of the power amplifier is changed, and keep the performance of the power amplifier.

Description

Title of Invention:功率放大器温度补偿电路 说明书  Title of Invention: Power amplifier temperature compensation circuit
[1] 技术领域 [1] Technical field
[2] 本发明涉及功率放大器技术领域, 具体是指一种具有稳定增益作用的功率放大 器温度补偿电路。  [2] The present invention relates to the technical field of power amplifiers, and in particular to a power amplifier temperature compensation circuit having a stable gain effect.
[3] 背景技术 [3] Background Art
[4] 功率放大器作为各种无线通讯系统发射机中的关键部件, 各通信标准对其各项 指标均有严格要求, 随着数据传输量的增大, 当前的 3G标准对功率放大器提出 了更为苛刻的要求, 在高线性度、 高效率的基础上, 还要求功率放大器在整个 温度变化范围内具有良好的温度特性指标。  [4] Power amplifiers are key components in various wireless communication system transmitters. Each communication standard has strict requirements for its various indicators. As the amount of data transmission increases, the current 3G standard puts more emphasis on power amplifiers. For the demanding requirements, on the basis of high linearity and high efficiency, the power amplifier is also required to have good temperature characteristics over the entire temperature range.
砷化镓异质结器件 (GaAs HBT) 是一种具有高线性度与高效率性能的射频器 件, 被广泛应用在移动通信系统中的线性功率放大器设计中, 但目前釆用 GaAs HBT器件设计的功率放大器的性能在不同温度下存在较大偏差, 因为温度变化 会引起功率晶体管的结压降及放大倍数变化, 从而导致功率放大器的增益受温 度影响而有较大变化。 对于一个典型的二级功率放大器来说, 其增益随温度的 变化通常在 2〜3dB, 这会导致使用该功率放大器的手持设备性能随温度变化偏 差很大, 为了补偿这种性能偏差, 就需要釆用温度补偿技术来补偿功率放大器 的增益随温度变化而产生的这一偏差。 目前的功率放大器温度补偿技术中, 主 要集中在设计带温度补偿的偏置电路与釆用带温度补偿的电源电压控制电路来 实现温度补偿。 带温度补偿的偏置电路着重在于提供一个不随电源电压及温度 变化的偏置电流, 它能部分的补偿功率晶体管结压降随温度的变化, 但由 GaAs HBT器件的放大倍数公式 P=qlc/KT可知, 放大器的增益除了与偏置电流 Ic有关还 直接和温度相关, 在不影响偏置电路自身调节能力的前提下, 釆用带温度补偿 偏置电路的方法对于减少功率放大器的增益随温度的变化效果不大。 对于釆用 带温度补偿的电源电压控制电路来实现温度补偿的方法, 由于它是利用一个与 温度相关的电源电压来调节功率放大器, 这种温度补偿方法主要是用来补偿输 出功率随温度的变化, 其对功率放大器增益随温度变化的补偿作用不大。 因此 , 目前的温度补偿方法对于减少功率放大器的增益随温度变化而变化的效果不 大。 GaAs HBT is a high-linearity and high-efficiency RF device that is widely used in linear power amplifier designs in mobile communication systems, but is currently designed with GaAs HBT devices. The performance of the power amplifier has a large deviation at different temperatures, because the temperature change causes the junction voltage drop and the amplification factor of the power transistor to change, which causes the gain of the power amplifier to be greatly affected by the temperature. For a typical secondary power amplifier, the gain varies with temperature by 2 to 3 dB, which causes the performance of the handheld device using the power amplifier to vary greatly with temperature. To compensate for this performance deviation, Temperature compensation techniques are used to compensate for this deviation of the gain of the power amplifier as a function of temperature. In current power amplifier temperature compensation technology, the main focus is on designing a bias circuit with temperature compensation and using a power supply voltage control circuit with temperature compensation to achieve temperature compensation. The bias circuit with temperature compensation focuses on providing a bias current that does not vary with the supply voltage and temperature. It can partially compensate for the voltage drop of the power transistor as a function of temperature, but the amplification factor of the GaAs HBT device is P=qlc/ KT knows that the gain of the amplifier is directly related to the temperature in addition to the bias current Ic. Without affecting the adjustment capability of the bias circuit itself, the method with temperature compensation bias circuit is used to reduce the gain of the power amplifier with temperature. The change is not very effective. For the method of temperature compensation using a temperature-compensated power supply voltage control circuit, since it uses a temperature-dependent power supply voltage to regulate the power amplifier, this temperature compensation method is mainly used to compensate for the loss. The output power varies with temperature, and it does not have much effect on the compensation of the power amplifier gain with temperature. Therefore, current temperature compensation methods have little effect on reducing the gain of the power amplifier as a function of temperature.
[6] 发明内容  [6] Summary of the invention
[7] 本发明需解决的问题是提供一种能够有效减少功率放大器增益随温度变化而变 化的温度补偿电路。  [7] The problem to be solved by the present invention is to provide a temperature compensation circuit capable of effectively reducing the variation of the power amplifier gain with temperature.
[8] 为解决上述问题, 本发明所釆取的基本技术方案为: 提供一种功率放大器温度 补偿电路,用于抑制功率放大器增益随温度变化而产生的偏差, 具体包括一反馈 环路和一控制电路, 所述控制电路产生一随功率放大器芯片温度变化而变化的 控制信号以调节功率放大器反馈环路的反馈量, 所述反馈环路连接于功率放大 器输入端与输出端之间。 所述控制电路产生的控制电压 (控制电流 Itf) 的函数关 系为 Vtf=VtfO+f(T) (ltf=ItfO+f(T)) ; 其中 f(T)为温度补偿函数, VtfO (wo) 取温 度为常温 25°C吋控制电路输出的电压 (电流值) 。  [8] In order to solve the above problems, the basic technical solution adopted by the present invention is: Providing a power amplifier temperature compensation circuit for suppressing a deviation of a power amplifier gain with a temperature change, specifically including a feedback loop and a And a control circuit, the control circuit generates a control signal that varies with a temperature change of the power amplifier chip to adjust a feedback amount of the power amplifier feedback loop, and the feedback loop is connected between the input and the output of the power amplifier. The function relationship of the control voltage (control current Itf) generated by the control circuit is Vtf=VtfO+f(T) (ltf=ItfO+f(T)); where f(T) is the temperature compensation function, VtfO (wo) Take the temperature (current value) of the control circuit output at a normal temperature of 25 °C.
[9] 优选的方案为: 所述反馈环路中含有二极管 (可利用不同材料晶体管中的 PN 结来代替) , 通过控制二极管的导通程度来控制功率放大器的反馈量。  [9] A preferred solution is: the feedback loop contains a diode (which can be replaced by a PN junction in a transistor of a different material), and the amount of feedback of the power amplifier is controlled by controlling the degree of conduction of the diode.
[10] 更为优选的方案为: 所述反馈环路含有场效应晶体管, 通过控制场效应晶体管 的导通程度来控制功率放大器的反馈量。  [10] A more preferred solution is: The feedback loop contains a field effect transistor, and the amount of feedback of the power amplifier is controlled by controlling the degree of conduction of the field effect transistor.
[11] 与现有技术相比, 本发明的有益效果在于:  [11] Compared with the prior art, the beneficial effects of the present invention are:
[12] 1) 通过调节功率放大器的反馈量来补偿功率放大器增益随温度的变化, 这样 能在不影响功率放大器的效率等其他指标的前提下来减少增益随温度的变化; [12] 1) By adjusting the feedback amount of the power amplifier to compensate the change of the power amplifier gain with temperature, this can reduce the change of gain with temperature without affecting other indicators such as the efficiency of the power amplifier;
[13] 2) 釆用所述温度补偿电路, 当温度在 -20〜80°C范围内变化吋, 功率放大器的 增益变化小于 ±0.5dB; [13] 2) Using the temperature compensation circuit, when the temperature changes within the range of -20~80 °C, the gain variation of the power amplifier is less than ±0.5 dB;
[14] 3) 本发明所述电路结构简洁, 在提高功率放大器增益随温度变化的补偿性能 的同吋不会增加太多成本。  [14] 3) The circuit structure of the present invention is simple, and the improvement of the compensation performance of the power amplifier gain with temperature does not increase the cost.
[15] 附图说明 [15] BRIEF DESCRIPTION OF THE DRAWINGS
[16] 图 1为本发明所述温度补偿电路实施例原理框图; 图 2为本发明所述温度补偿电 路第一种优选实施例电路原理图; 图 3为本发明所述温度补偿电路第二种优选实 施例电路原理图; 图 4为本发明所述温度补偿电路第三种优选实施例电路原理图 ; 图 5为釆用本发明所述温度补偿电路与不釆用温度补偿电路的二级功率放大器 增益随温度变化的对比图。 1 is a schematic block diagram of an embodiment of a temperature compensation circuit according to the present invention; FIG. 2 is a circuit schematic diagram of a first preferred embodiment of the temperature compensation circuit according to the present invention; Circuit diagram of a preferred embodiment; FIG. 4 is a circuit diagram of a third preferred embodiment of the temperature compensation circuit of the present invention FIG. 5 is a comparison diagram of gain versus temperature of a secondary power amplifier using the temperature compensation circuit and the temperature compensation circuit of the present invention.
[17] 具体实施方式 [17] Specific implementation
[18] 为了便于本领域技术人员理解, 下面结合附图及实施例对本发明作进一步的详 细说明。 需要说明的是以下所列附图只是为了方便对本发明进行说明而举的例 子, 而不应理解为对本发明的一个限制, 在未脱离本发明实质的任何改变和替 换均属于本发明的保护范围。  [18] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the following drawings are merely illustrative of the present invention and are not to be construed as limiting the scope of the invention. .
[19] 图 1为本发明所述温度补偿电路实施例原理框图。 如图, 功率放大器接于输入 信号与输出信号之间, 控制电路与反馈环路相连, 反馈环路跨接于功率放大器 的输入与输出之间。 该实施例的实现方式是利用控制电路产生一个跟随芯片温 度变化的控制信号, 其控制电压 Vtf (控制电流 Itf) 与温度的函数关系为 Vtf=Vtf 0+f(T) (ltf=ItfO+f(T)) , 其中 f(T)为温度补偿函数,然后利用这个控制电压 (控制 电流) 来控制功率放大器反馈环路的反馈量, 由 GaAs  1 is a schematic block diagram of an embodiment of a temperature compensation circuit according to the present invention. As shown, the power amplifier is connected between the input signal and the output signal, the control circuit is connected to the feedback loop, and the feedback loop is connected between the input and output of the power amplifier. The implementation of this embodiment is to use a control circuit to generate a control signal following the temperature change of the chip. The control voltage Vtf (control current Itf) is a function of temperature as Vtf=Vtf 0+f(T) (ltf=ItfO+f (T)) , where f(T) is the temperature compensation function, and then this control voltage (control current) is used to control the feedback amount of the power amplifier feedback loop, by GaAs
HBT器件的放大倍数 = /1^1可知, 在假定偏置电流 Ic不随温度变化的情况下, 功率放大器的增益随温度 T的上升而下降, 本发明专利通过控制信号来调节功率 放大器反馈环路的反馈量就能有效补偿增益随温度的变化, 从而起到温度补偿 作用。  The amplification factor of the HBT device = /1^1, the gain of the power amplifier decreases with the rise of the temperature T assuming that the bias current Ic does not change with temperature, and the present invention adjusts the feedback loop of the power amplifier by the control signal. The amount of feedback can effectively compensate for the change in gain with temperature, thus providing temperature compensation.
[20] 参照图 5, 为釆用本发明专利温度补偿电路与不釆用温度补偿电路的二级功率 放大器增益随温度变化的对比图。 其中纵轴表示增益, 横轴表示温度, 实线为 不带温度补偿的增益曲线, 虚线为带温度补偿的增益曲线。 从图可以看出, 在 不釆用温度补偿技术吋, 在温度从 -20°C变化到 80°C吋, 功率放大器的增益变化 达 ±1.2dB, 在釆用温度补偿电路后, 功率放大器的增益变化减少至 ±0.5dB。  [20] Referring to Fig. 5, a comparison diagram of the gain of the secondary power amplifier with temperature variation of the patented temperature compensation circuit and the temperature compensation circuit is used. The vertical axis represents the gain, the horizontal axis represents the temperature, the solid line is the gain curve without temperature compensation, and the dotted line is the gain curve with temperature compensation. As can be seen from the figure, after the temperature compensation technique is used, the gain of the power amplifier changes by ±1.2 dB after the temperature changes from -20 ° C to 80 ° C. After the temperature compensation circuit is used, the power amplifier The gain variation is reduced to ±0.5dB.
[21] 图 2为本发明所述温度补偿电路第一种优选实施例电路原理图。 图中基准电压 产生电路、 电压调整电路和控制信号产生电路串行连接构成控制电路, 其中基 准电压产生电路用于产生一个不随温度和电源电压变化的基准电压 VBG和一个 跟随温度变化的电流 IPTAT, 电压调整电路把随温度变化的电流 IPTAT转换成随 温度变化的电压 VPTAT, 同吋把 VBG转换成一个驱动能力更强的基准电压 VREF , 控制信号产生电路把电压 VREF和 VPTAT进行组合产生一个跟随芯片温度变化 的控制信号 Vtf或 Itf; 电阻 Rl、 二极管 D1和电容 CI串行连接于放大器的输出端与 输入端之间,二极管 D1的阴极再通过电阻 R2与控制电路相连, 电阻 Rl、 电阻 R2 、 二极管 D1和电容 C1一起构成反馈环路, 其中二极管可由各种不同材料的晶体 管的 PN结代替; 晶体管 Q1用于实现功率放大, 电感 L1为扼流电感。 当温度变化 吋, 控制电路产生一个跟随温度变化的控制信号 Vtf或 Itf, 控制信号进一步控制 与控制电路输出端相连的二极管 D1的导通程度, 从而改变功率放大器反馈环路 在不同温度下的反馈量, 以起到对功率放大器增益随温度变化的补偿作用。 2 is a circuit schematic diagram of a first preferred embodiment of the temperature compensation circuit of the present invention. The reference voltage generating circuit, the voltage adjusting circuit and the control signal generating circuit are connected in series to form a control circuit, wherein the reference voltage generating circuit is configured to generate a reference voltage VBG that does not vary with temperature and power supply voltage, and a current IPTAT that follows the temperature change. The voltage adjustment circuit converts the temperature-changing current IPTAT into a temperature-varying voltage VPTAT, and simultaneously converts the VBG into a more powerful reference voltage VREF, and the control signal generating circuit combines the voltages VREF and VPTAT to generate a follower chip. temperature change The control signal Vtf or Itf; the resistor R1, the diode D1 and the capacitor CI are serially connected between the output end and the input end of the amplifier, and the cathode of the diode D1 is connected to the control circuit through the resistor R2, the resistor R1, the resistor R2, the diode D1 Together with capacitor C1, a feedback loop is formed in which the diode can be replaced by a PN junction of transistors of various materials; transistor Q1 is used for power amplification, and inductor L1 is a choke inductor. When the temperature changes, the control circuit generates a control signal Vtf or Itf that follows the temperature change. The control signal further controls the conduction level of the diode D1 connected to the output of the control circuit, thereby changing the feedback of the feedback loop of the power amplifier at different temperatures. Amount to compensate for the gain of the power amplifier as a function of temperature.
[22] 图 3为本发明所述温度补偿电路第二种优选实施例电路原理图。 其中晶体管 Q1 的基极与输入信号相连, 集电极与电感 L1和输出信号相连, 射极接地; 电感 L1 的另一端与电源 VCC相连; 电容 Cl、 电阻 R1和电容 C2串行连接于晶体管 Q1的基 极与集电极之间, 二极管 D1阳极先与电阻 R1和电容 C2的交接处相连, 再通过电 阻 R2与控制电路的输出端相连, 阴极接地。 晶体管 Q1用于功率放大, 电感 L1为 扼流电感; 电容 Cl、 电阻 Rl、 电阻 R2、 电容 C2和二极管 D1构成反馈环路。 当温 度变化吋, 控制电路产生一个跟随温度变化的控制信号 Vtf或 Itf, 控制信号进一 步控制二极管 D1在不同温度下的导通程度, 从而改变功率放大器反馈环路在不 同温度下的反馈量, 以起到对功率放大器增益随温度变化的补偿作用。 3 is a circuit schematic diagram of a second preferred embodiment of the temperature compensation circuit of the present invention. The base of the transistor Q1 is connected to the input signal, the collector is connected to the inductor L1 and the output signal, and the emitter is grounded; the other end of the inductor L1 is connected to the power source VCC ; the capacitor C l , the resistor R1 and the capacitor C2 are serially connected to the transistor Q1 Between the base and the collector, the anode of the diode D1 is first connected to the junction of the resistor R1 and the capacitor C2, and then connected to the output terminal of the control circuit through the resistor R2, and the cathode is grounded. Transistor Q1 is used for power amplification, and inductor L1 is a choke inductor; capacitor Cl, resistor R1, resistor R2, capacitor C2, and diode D1 form a feedback loop. When the temperature changes, the control circuit generates a control signal Vtf or Itf following the temperature change, and the control signal further controls the conduction degree of the diode D1 at different temperatures, thereby changing the feedback amount of the power amplifier feedback loop at different temperatures, It compensates for the gain of the power amplifier as a function of temperature.
[23] 图 4为本发明所述温度补偿电路第三种优选实施例电路原理图。 其中晶体管 Q1 的基极与输入信号相连, 集电极与电感 L1和输出信号相连, 射极接地; 电感 L1 的另一端与电源 VCC相连; 电容 Cl、 电阻 R1和电容 C2串行连接于晶体管 Q1的基 极与集电极之间, 场效应晶体管 Ml的漏极与电阻 R1和电容 C2的交接处相连, 栅 极与控制电路的输出端相连, 源极接地。 晶体管 Q1用于功率放大, 电感 L1为扼 流电感; 电容 Cl、 电阻 Rl、 电容 C2和场效应晶体管 Ml构成反馈环路。 当温度变 化吋, 控制电路产生一个跟随温度变化的控制电压 Vtf, 控制电压进一步控制场 效应晶体管 Ml在不同温度下的导通程度, 从而改变功率放大器反馈环路在不同 温度下的反馈量, 以起到对功率放大器增益随温度变化的补偿作用。 4 is a circuit schematic diagram of a third preferred embodiment of the temperature compensation circuit of the present invention. The base of the transistor Q1 is connected to the input signal, the collector is connected to the inductor L1 and the output signal, and the emitter is grounded; the other end of the inductor L1 is connected to the power source VCC ; the capacitor C l , the resistor R1 and the capacitor C2 are serially connected to the transistor Q1 Between the base and the collector, the drain of the field effect transistor M1 is connected to the junction of the resistor R1 and the capacitor C2, the gate is connected to the output of the control circuit, and the source is grounded. The transistor Q1 is used for power amplification, and the inductor L1 is a choke inductor; the capacitor C1, the resistor R1, the capacitor C2, and the field effect transistor M1 constitute a feedback loop. When the temperature changes, the control circuit generates a control voltage Vtf following the temperature change, and the control voltage further controls the conduction degree of the field effect transistor M1 at different temperatures, thereby changing the feedback amount of the power amplifier feedback loop at different temperatures, It compensates for the gain of the power amplifier as a function of temperature.
[24] 上述实施例中的控制电路的实现方式不是唯一的, 可以釆用不同的方式来实现 , 这些实现方式是本领域的技术人员根据本发明中的描述可以实现的, 在此不 再赞述; 各实施例中的二极管可以釆用不同材料晶体管中的 PN结来代替; 并且 上述温度补偿方法同样适用于釆用不同材料制作的放大器中以抑制放大器增益 相对于温度的变化。 [24] The implementation of the control circuit in the foregoing embodiment is not unique, and may be implemented in different manners. These implementation manners can be implemented by those skilled in the art according to the description in the present invention, and are not praised here. The diodes in the various embodiments may be replaced by PN junctions in transistors of different materials; The above temperature compensation method is also applicable to an amplifier made of different materials to suppress the change of the amplifier gain with respect to temperature.
需说明的是, 在未脱离本发明构思前提下对其所做的任何微小变化及等同替换 , 均应属于本发明的保护范围。  It should be noted that any minor changes and equivalent substitutions made thereto without departing from the inventive concept are intended to be within the scope of the invention.

Claims

权利要求书 Claim
1、 功率放大器温度补偿电路,用于抑制功率放大器增益随温度变 化而产生的偏差, 其特征在于: 包括一反馈环路和一控制电路, 所述控制电路产生一随功率放大器芯片温度变化而变化的控制信 号以调节功率放大器反馈环路的反馈量, 所述反馈环路连接于功 率放大器输入端与输出端之间。  1. A power amplifier temperature compensation circuit for suppressing a deviation of a power amplifier gain with a temperature change, comprising: a feedback loop and a control circuit, wherein the control circuit generates a change according to a temperature change of the power amplifier chip; The control signal is used to adjust the feedback amount of the power amplifier feedback loop, and the feedback loop is connected between the power amplifier input and the output.
2、 根据权利要求 1所述的功率放大器温度补偿电路, 其特征在于 2. The power amplifier temperature compensation circuit according to claim 1, wherein
: 所述控制电路产生的控制信号为电压信号 Vtf, 其函数关系为 Vtf =VtfO+f(T); 其中 f(T)为温度补偿函数, VtfO取温度为常温 25°C吋控 制电路输出的电压值。 : The control signal generated by the control circuit is a voltage signal Vtf, and its function relationship is Vtf = VtfO + f(T); wherein f(T) is a temperature compensation function, and VtfO takes a temperature of 25 ° C at a normal temperature, and the output of the control circuit Voltage value.
3、 根据权利要求 1所述的功率放大器温度补偿电路, 其特征在于 3. The power amplifier temperature compensation circuit according to claim 1, wherein
: 所述控制电路产生的控制信号为电流信号 Itf, 其函数关系为 Itf=I tfO+f(T); 其中 f(T)为温度补偿函数, ItfO取温度为常温 25°C吋控制 电路输出的电流值。 : The control signal generated by the control circuit is a current signal Itf, and its function relationship is Itf=I tfO+f(T); wherein f(T) is a temperature compensation function, and ItfO takes a temperature of normal temperature 25 ° C 吋 control circuit output Current value.
4、 根据权利要求 1所述的功率放大器温度补偿电路, 其特征在于 4. The power amplifier temperature compensation circuit according to claim 1, wherein
: 所述反馈环路中含有二极管, 通过控制二极管的导通程度来改 变功率放大器的反馈量。 : The feedback loop contains a diode that changes the amount of feedback from the power amplifier by controlling the conduction level of the diode.
5、 根据权利要求 1所述的功率放大器温度补偿电路, 其特征在于: 所述反馈环路中含有场效应晶体管, 通过控制场效应晶体管的导 通程度来改变功率放大器的反馈量。  5. The power amplifier temperature compensation circuit according to claim 1, wherein: the feedback loop includes a field effect transistor, and the feedback amount of the power amplifier is changed by controlling the conduction degree of the field effect transistor.
6、 根据权利要求 1所述的功率放大器温度补偿电路, 其特征在于 : 所述控制电路包括一个基准电压产生电路、 一个电压调整电路 和一个控制信号产生电路。  A power amplifier temperature compensating circuit according to claim 1, wherein: ???said control circuit comprises a reference voltage generating circuit, a voltage adjusting circuit and a control signal generating circuit.
7、 根据权利要求 3所述的功率放大器温度补偿电路, 其特征在于 : 所述反馈环路中的二极管釆用不同材料晶体管中的 PN结来代替  7. The power amplifier temperature compensation circuit according to claim 3, wherein: the diode in the feedback loop is replaced by a PN junction in a transistor of a different material.
PCT/CN2009/075982 2009-09-04 2009-12-24 Temperature compensating circuit for power amplifier WO2011026293A1 (en)

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