WO2011025229A2 - 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법 - Google Patents
전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법 Download PDFInfo
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- WO2011025229A2 WO2011025229A2 PCT/KR2010/005652 KR2010005652W WO2011025229A2 WO 2011025229 A2 WO2011025229 A2 WO 2011025229A2 KR 2010005652 W KR2010005652 W KR 2010005652W WO 2011025229 A2 WO2011025229 A2 WO 2011025229A2
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- Prior art keywords
- ink composition
- solvent
- conductive metal
- pattern
- conductive
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
Definitions
- the present invention relates to a conductive metal ink composition and a method of forming a conductive pattern. More specifically, the present invention relates to a conductive metal ink composition and a method of forming a conductive pattern using the same, which is suitably applied to the printing process, enabling the formation of a good conductive pattern.
- the interest in the conductive pattern formation method by the inkjet printing method, the printing method, or the like has increased.
- the printing method has been attracting more attention because there is an advantage in the process, such as to form a fine conductive pattern that is difficult to form by the inkjet printing method.
- the conductive ink composition for the formation of the conductive pattern should have a low initial viscosity so that it can be applied to the roller well, and after being applied to the roller in a desired pattern form
- a conductive ink composition with suitable properties that must be able to be transferred well on a substrate.
- the present invention is to provide a conductive metal ink composition that is suitably applied to the printing process, enabling the formation of a good conductive pattern.
- the present invention also provides a method of forming a conductive pattern using the conductive metal ink composition to form a finer and better conductive pattern.
- the present invention is a conductive metal powder; At 25 ° C the non-aqueous solvent to a vapor pressure of a second non-aqueous solvent having a vapor pressure at 3torr than the first non-aqueous solvent and 25 ° C exceeds 3torr; And a polymer coating enhancer, and printed on a substrate by a roll printing process to be used to form a conductive pattern.
- the present invention also includes applying the conductive metal ink composition to a roller; Contacting the roller with a cliché in which a pattern opposed to a conductive pattern is engraved with the roller, thereby forming a pattern of the ink composition on the roller formed in the conductive pattern; Transferring the ink composition pattern-ol substrate on the wafer; And firing the transferred pattern on the substrate.
- a conductive metal ink composition and a method of forming a conductive pattern using the same according to a specific embodiment of the present invention will be described.
- the conductive metal powder At 25 ° C the non-aqueous solvent to a vapor pressure of a second non-aqueous solvent having a vapor pressure at 3torr than the first non-aqueous solvent and 25 ° C exceeds 3torr; And a polymer coating improver, and a conductive metal ink composition is provided which is printed on a substrate by a printing process and used to form a conductive pattern.
- the conductive metal ink composition may be formed of different vapor pressures at room temperature.
- First and second non-aqueous solvents are included as the medium. These first and second nonaqueous solvents have different volatility by different vapor pressures, and in particular, the second nonaqueous solvent High vapor pressure and thus high volatility at room temperature.
- the conductive metal ink compositions comprising these first and second nonaqueous solvents have a low viscosity during storage and until they are applied to the furnace for printing, and the medium comprising the first and second nonaqueous solvents.
- a uniform composition such as conductive metal powder can be maintained within. Therefore, the conductive metal ink composition is easy to apply uniformly on the lor.
- the second non-aqueous solvent may immediately volatilize, and the viscosity may increase greatly in about several minutes. Therefore, it becomes easy to pattern the ink composition applied on the roller in a desired pattern form, and even after the pattern formation, the ink composition can maintain a good pattern form without flowing down on the roller.
- the conductive metal ink composition further includes a polymer coating improver.
- the polymeric coating enhancer acts as a binder in the ink composition while imparting tackiness to the ink composition, so that the ink composition is well applied or transferred to the substrate on which the conductive pattern is to be formed. can do. Therefore, as the conductive metal ink composition includes such a polymer coating improver, the conductive metal ink composition may be more suitably applied to the printing process to form a fine conductive pattern.
- the ink composition can be applied to the roller well, and the occurrence of defects such as pinholes on the applied ink composition can be greatly reduced.
- the ink composition applied to the roller can have both a property to a somewhat hard coating and stickiness, the ink composition can be transferred to the substrate well. That is, even if the lor is brought into contact with the substrate at a relatively low pressure (phosphorus pressure), the ink composition applied to the lor is It can transfer well to a board
- the ink composition is selectively removed only at the portion where the ink composition touches the cliché by the action of the appropriate polymer coating improver.
- the pattern can be precisely formed on the buller (see FIG. 1B). This makes it possible to transfer the ink composition on the ruffler onto the substrate in a more precise pattern form.
- the adhesion of the ink composition is too low or only has a property as a hard coating film, it is impossible to form an ink composition pattern on the roller accurately, or the roller The ink composition of the image may not be well transferred to the substrate.
- the polymer coating improver when the polymer coating improver is not used, only a portion of the ink composition on the lor can be transferred to the substrate because the adhesion of the ink composition is too low (see FIG. 1C). As a result, the thickness of the ink composition transferred to the substrate may become thin or a part of the pattern formed on the substrate may be broken, so that good transfer and pattern formation to the substrate may be difficult.
- (cl) of FIG. 1 shows a state in which the ink composition is not completely transferred to the substrate and remains in a large amount, and (c2) compares the case where the ink composition is not completely transferred to the substrate and not completely transferred. The picture shown.
- the ink composition has only properties such as an overly hard coating film, so that only a portion of the ink composition on the lerler which touches the cliché cannot be selectively removed, and a larger area is removed, Alternatively, cracks may occur on the ink composition pattern remaining in the roller due to the contact pressure between the roller and the cliché (see FIG. 1A). For this reason, the ink composition pattern may not be precisely formed on the lor, and thus, the precise pattern may not be formed on the substrate. For reference, (al) of FIG.
- the conductive metal ink composition includes a conductive metal powder as a basic component for exhibiting conductivity.
- a conductive metal powder any metal powder known to exhibit electrical conductivity may be used, and for example, silver (Ag), copper (Cu), gold (Au), crum (Cr), aluminum (A1), One or more metal powders selected from tungsten (W), zinc (Zn), nickel (Ni), iron (Fe), platinum (Pt), lead (Pb) and the like can be used.
- the metal powder may have an average particle size of nanoscale.
- the metal powder may have an average particle diameter of about 1-100 nm, preferably about 5 to 70 nm, more preferably about 10 50 nm.
- the conductive metal powder may also comprise about 15 to about the total weight of the conductive metal ink composition (e.g., the weight sum of the conductive metal powder, the first and second non-aqueous solvents, the polymer coatability enhancer, and optionally the surfactant). 30 weight%, preferably about 20 to 30 weight%, more preferably about 23 to 30 weight%.
- the content of the conductive metal powder is too small, the conductivity of the conductive pattern formed from the ink composition may not be sufficient.
- the content of the conductive metal powder is too large, the dispersibility of the metal powder in the ink composition may be poor, resulting in poor properties of the conductive pattern. Or even application of the ink composition may be difficult.
- the conductive metal ink composition also includes first and second nonaqueous solvents.
- the first non-aqueous solvent is a solvent having a vapor pressure of 3 torr or less at 25 ° C. and exhibiting relatively low volatility, and may serve as a dispersion medium of the ink composition before firing.
- any non-aqueous solvent known to have a vapor pressure of 3 torr or less at 25 ° C. may be used, for example, at 25 ° C.
- Non-volatile solvents such as a solvent or a nitrile solvent, may be used, or 2 or more types of mixed solvents selected from these may be used.
- first non-aqueous solvent examples include ethylene glycol, propylene glycol, glycerol, propylene glycol propyl ether ethylene glycol monophenyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, propylene glycol monobutyl ether, di Ethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol ethyl ether, N-methylpyridone, nucledecane, pentadecane, tetradecane, tridecane, dodecane, undecane, decane, DMS0, aceto Nitrile or butyl cellosolve, etc. are mentioned, Two or more mixed solvents selected from these can also be used, of course.
- the second non-aqueous solvent is a solvent exhibiting high volatility and a vapor pressure of more than 3 torr at 25 ° C.
- any non-aqueous solvent known to have a vapor pressure of more than 3 torr at 25 ° C. may be used, for example, an alcohol solvent or a glycol ether solvent having a vapor pressure of more than 3 tor at 25 ° C.
- Volatile solvents such as glycol ether ester solvents, ketone solvents, hydrocarbon solvents, lactate solvents, ester solvents, aprotic sulfoxide solvents or nitrile solvents, or two or more selected from them Solvents may also be used.
- Such a second non-aqueous solvent include methanol, ethanol, propane, isopropane, n-butanol, t-butanol, pentane, nucleic acid ol, nonan, octane, heptane, nucleic acid, acetone, methyl ethyl ketone, Methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol methyl ether acetate, chloroform, Methylene chloride, 1,2-dichloroethane, 1,1,1-trichloroethane, 1,1,2-trichloroethane, 1,1, 2-trichloroethene, cyclonucleic acid, tetrahydrofuran, benzene, Toluene, xylene, etc. are mentioned, Two or more types of
- the first and second non-aqueous solvents described above are based on the total weight of the conductive metal ink composition (e.g., the sum of the weights of the conductive metal powder, the first and second non-aqueous solvents, the polymer coatability improving agent and optionally the surfactant), respectively.
- the drying rate may be difficult after transferring the ink composition to the lor, which may make it difficult to transfer the substrate.
- the drying speed may be slow, resulting in a long process time and uniform application of the ink composition.
- the above-described content range of the first and second non-aqueous solvents is optimized, when the roll printing process is applied to the ink composition, a good conductive pattern may be formed while the process time is shortened.
- the conductive metal ink composition includes a polymer coating improver.
- this coating enhancer is a kind of polymer resin, which acts as a binder in the ink composition and imparts tackiness to the ink composition, so that the ink composition can be well applied or transferred to the substrate on which the conductive pattern is to be formed. It can be used as an ingredient. That is, as the conductive metal ink composition includes such a polymer coating enhancer, the conductive metal ink composition is well applied to the roller and then transferred to the substrate well, thereby enabling the formation of a better conductive pattern by the printing process.
- the conductive pattern when using a composition that does not include the polymer coating enhancer, the conductive pattern may not be properly formed by the printing process, or properties such as the straightness of the conductive pattern may be reduced.
- an adhesive polymer such as an epoxy polymer, a phenolic polymer, or an alcoholic polymer may be used.
- epoxy-based polymers among these coating improvers include flame-retardant epoxy polymers such as bisphenol A type epoxy polymers, bisphenol F type epoxy polymers, novolac type epoxy polymers, and brominated epoxy polymers, epoxy polymers having aliphatic rings, and rubber modifications.
- phenolic polymer include novolak-type phenolic polymers or resol type phenolic polymers, and the like.
- the alcohol-based polymers may include cellulose-based polymers, polyvinyl alcohol, or ethylene vinyl alcohol polymers.
- ethylene vinyl acetate, rosin resin, urethane polymer, acrylic polymer, styrene-butadiene-styrene polymer or polyester polymer may be used.
- materials belonging to these specific examples materials commercially available in the art may be used as the coating improver.
- the ink composition includes these coatability enhancers, such ink composition can exhibit excellent applicability to lor and good transferability to the substrate, and can be suitably applied to the printing process and finer on the substrate.
- the conductive pattern can be formed well.
- the polymeric coating enhancer is about 0.1 to 5, based on the total weight of the conductive metal ink composition (e.g., the weight sum of the conductive metal powder, the first and second non-aqueous solvents, the polymeric coating improver and optionally the surfactant). Weight%, preferably about 1 to 4 weight 3 ⁇ 4, more preferably about 2 to 3 weight%.
- the content of the coating enhancer is too small, the coating property or transferability of the ink composition may be insufficient.
- the coating enhancer is too large, the conductivity of the conductive pattern formed from the ink composition may be insufficient.
- the above-described conductive metal ink composition may further include a surfactant in addition to the above-mentioned components.
- a surfactant is further included, dewetting or pinholes may be further suppressed when the ink composition is applied to the lor.
- the ink composition can be favorably applied onto the roller to form a more precise and good conductive pattern.
- silicone-based surfactants for example, polydimethylsiloxane-based surfactants, which have been conventionally used in conductive metal ink compositions, may be used, and various other surfactants may be used without particular limitation.
- Such surfactants are preferably from about 0.01 to 4% by weight, preferably with respect to the total weight of the conductive metal ink composition (e.g., the sum of the weights of the conductive metal powder, the first and second nonaqueous solvents, the polymer coatability improving agent and the surfactant). Preferably about 1 to 4 weight 3 ⁇ 4, more preferably about 2 to 3 weight percent. With this content, the ink composition can be applied onto the lor better, including the surfactant.
- the conductive metal ink composition according to one embodiment of the present invention may have an initial viscosity of about lOcPs or less, preferably about 7 cPs, more preferably about 5 cPs or less.
- the initial viscosity may mean the viscosity from the initial production of the conductive metal ink composition until the coating on the roller for the printing process. More specifically, the initial viscosity refers to the viscosity of the conductive metal ink composition when it is being stored before being applied to the lor (ie, before being exposed to air for application to the lor) or applied. It can mean the viscosity immediately before.
- the conductive metal ink composition can have such a low initial viscosity, including the first and second non-aqueous solvents, and thus can exhibit good applicability to lor.
- the viscosity of the second non-aqueous solvent which is highly volatile, may be increased on the roller, thereby forming and maintaining a pattern well on the roller and transferring the pattern onto the substrate. You can.
- the printing process using the conductive metal ink composition By applying, it is possible to form a finer conductive pattern on the substrate well.
- a fine conductive pattern for example, about 3 to 80 // m, which cannot be formed by an inkjet printing method applied previously, is preferably used. It is possible to satisfactorily form a conductive pattern having a line width of about 3 to 40.
- the ink composition and the printing process it is possible to satisfactorily form a conductive pattern having a fine line width / line interval having a line width of about 3 to 10 and a line interval of about 3 to 10 / m.
- the conductive metal ink composition may be preferably applied to form a conductive pattern by being printed on a substrate, for example, a glass substrate, or the like by a printing process, and specifically, to form an electrode pattern or the like of a flat panel display element. Very preferably.
- a substrate for example, a glass substrate, or the like by a printing process
- the conductive metal ink composition and the printing process it is possible to form a finer electrode pattern better, it is possible to greatly contribute to the improvement of visibility or large area of the flat panel display device.
- a method of forming a conductive pattern using the above-described conductive metal ink composition may include applying the aforementioned conductive metal ink composition to a roller; Contacting the cliché with a concave pattern formed on the conductive pattern to the lor to form a pattern of the ink composition on the lor in the conductive pattern; Transferring the ink composition pattern on the roller onto a substrate; And firing the transferred pattern on the substrate.
- the cliché means a kind of uneven plate used for patterning the ink composition applied on the lor into a desired conductive pattern form.
- a pattern opposed to the conductive pattern may be formed intaglio on the cliché.
- FIG. 2 is a view schematically illustrating a process of forming a conductive pattern through an e-printing process.
- the above-mentioned conductive metal ink composition is formed.
- the components may be mixed and then stirred or shaken to form a uniform ink composition.
- the step of filtering the ink composition may be further performed to remove impurities and allow the conductive pattern to be evenly formed.
- the conductive metal ink composition 22 is applied to the lor 20.
- the outer surface of the lorler 20 may be covered with a blanket 21, the blanket 21 may be made of polydimethylsiloxane (PDMS).
- PDMS polydimethylsiloxane
- the conductive metal ink composition 22 may be discharged from the discharge port 10 of the supply apparatus and applied onto the blanket 21, from which the second non-aqueous solvent begins to evaporate, and thus the viscosity of the ink composition 22 Begins to increase at a rapid pace.
- a cliché formed by a negative pattern of the desired conductive pattern is contacted with the lor to reveal the pattern of the ink composition that is opposite the conductive pattern. Form on the roller.
- the cliché 30 serves to selectively remove the ink portion 32 which is not necessary to form the conductive pattern in contact with the blanket 21 to which the ink composition 22 is applied, and as a result, A pattern of ink composition can be formed that matches the desired conductive pattern.
- the cliché 30 has a shape in which the pattern facing the blanket 21 is engraved in an intaglio form, so that only the protrusions 31 of the cliché 30 are supported by the blanket ( The ink portion 32, which is in contact with the ink composition 22 on 21), which is not necessary for the formation of the conductive pattern, can be transferred to and removed from the protrusion 31.
- the pattern of the ink composition is transferred onto the substrate.
- the blanket 21 of Ehller in which the pattern of the ink composition is formed, may be brought into contact with the substrate 40, and as a result, the pattern of the ink composition is transferred to the substrate 40, and thus the predetermined pattern on the substrate 40 is transferred.
- the pattern 41 can be formed.
- a firing process may be performed to form a conductive pattern on the substrate.
- the firing process may be performed under appropriate conditions depending on the kind of the conductive pattern to be formed. For example, when the conductive pattern is an electrode pattern of a flat panel display device, the firing process may be performed at about 400 ° C. to 600 ° C. It may proceed for about 5-50 minutes, for example, at about 400-480 ° C. for 10-40 minutes.
- the conductive pattern can be formed on the substrate in a very simple and fast process compared to the photolithography process, which has been previously applied, and is formed by the previous inkjet printing process.
- a finer conductive pattern that could not be achieved for example, a conductive pattern having a line width of about 3 to 80, preferably about 3 to 40, can be formed well.
- the conductive pattern forming method it is possible to satisfactorily form a conductive pattern having a fine line width / line interval having a line width of about 3 to 10 and a line interval of about 3 to 10.
- the ink composition and the conductive pattern forming method according to the embodiment of the present invention it is possible to form a fine conductive pattern, for example, an electrode pattern of a flat panel display device having excellent conductivity, which is fine It is possible to make good formation of the electrode pattern, which can greatly contribute to improvement of visibility or large area of the flat panel display element.
- a conductive metal ink composition may be provided, which is suitably applied to a printing process so that a fine conductive pattern can be formed well.
- a finer conductive pattern for example, a fine electrode pattern of a flat panel display element, can be formed well.
- Figure 1 shows a good pattern is formed using a conductive metal ink composition according to an embodiment of the invention (b), and cracks on the pattern by using an ink composition that does not include a suitable polymeric coating enhancer It is a schematic diagram and an electron micrograph showing the comparison (c) which occurred (a) or the transfer of the pattern to the substrate is not properly done.
- FIG. 2 is a view schematically illustrating a process of forming a conductive pattern through a roll printing process.
- Example 3 is an optical micrograph of the conductive pattern formed in Example 1.
- a mean particle size of 50nm is vapor pressure in the nanoparticles 5g, propylene glycol methyl ether acetate (25 ° C vapor pressure at 3.8torr) 10g, ethanol (25 ° C vapor pressure at 59.3torr) 5g, ethylene glycol monobutyl ether (25 ° C 0.80torr 4.84 g, polydimethylsiloxane surfactant 0.15 g, butyl phenol aldehyde novolak resin O.lg, a type of phenolic polymer, and 0.06 g of polyurethane diol, a type of urethane-based polymer, were mixed and shaken for 12 hours. Thereafter, the filter was filtered with a filter to prepare an ink composition. According to the method mentioned later, the initial viscosity of this ink composition was measured and found to be 2.8 cPs.
- Example 4 Formation of Conductive Metal Ink Composition and Conductive Pattern
- a mean particle size of 50nm is vapor pressure in the nanoparticles 5g, propylene glycol methyl ether acetate (25 ° C vapor pressure at 3.8torr) 10g, ethane (vapor pressure at 25 ° C 59.3torr) 5g, ethylene glycol monobutyl ether (25 ° C 0.80 torr) 4.84 g, and 0.15 g of polydimethylsiloxane-based surfactant were mixed and shaken for 12 hours. Thereafter, the filter was filtered with a filter of 1 Pa to prepare an ink composition. According to the method described below, the initial viscosity of the ink composition was measured,
- each conductive pattern was evaluated by measuring the specific resistance of each of the conductive patterns formed in Examples 1 to 6 and Comparative Example 1. Resistivity was measured from Mitsubishi Chemical's MCP-T600 4-point probe, and the thickness was measured in alpha steps. These resistivity accumulation results are shown in Table 1 below.
- FIG. 3 An optical photomicrograph of the conductive pattern formed in Example 1 was taken and shown in FIG. 3.
- Nikon's Eclipse 90 / was used as the optical microscope.
- FIG. 3 it is confirmed that a conductive pattern having a fine line width of approximately 10 / m can be formed well using the ink composition of the embodiment.
- the conductive pattern having the same line width is formed using the composition of Comparative Example 1 without using the polymer coating improver, the ink composition pattern on the roller is properly transferred onto the substrate as shown in FIG. As a result, the resistivity and thus conductivity of the formed pattern could not be measured, and the sentence height could not be measured properly.
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Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US13/392,831 US8883046B2 (en) | 2009-08-28 | 2010-08-24 | Conductive metal ink composition and method for forming a conductive pattern |
JP2012526639A JP2013503234A (ja) | 2009-08-28 | 2010-08-24 | 導電性金属インク組成物および導電性パターンの形成方法 |
CN201080038429XA CN102482522A (zh) | 2009-08-28 | 2010-08-24 | 导电金属油墨组合物和形成导电图形的方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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KR20090080374 | 2009-08-28 | ||
KR10-2009-0080374 | 2009-08-29 | ||
KR10-2010-0081972 | 2010-08-24 | ||
KR1020100081972A KR101221780B1 (ko) | 2009-08-28 | 2010-08-24 | 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법 |
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WO2011025229A2 true WO2011025229A2 (ko) | 2011-03-03 |
WO2011025229A3 WO2011025229A3 (ko) | 2011-06-16 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102573313A (zh) * | 2012-02-13 | 2012-07-11 | 苏州晶讯科技股份有限公司 | 一种利用贱金属催化油墨制作印刷电路的方法 |
CN102585602A (zh) * | 2012-02-13 | 2012-07-18 | 苏州晶讯科技股份有限公司 | 一种取代贵金属的印刷电路用催化油墨 |
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US20140017404A1 (en) * | 2011-04-04 | 2014-01-16 | Korea Institute Of Machinery & Materials | Pattern-printing device |
DE112012001568B4 (de) * | 2011-04-04 | 2015-12-24 | Korea Institute Of Machinery & Materials | Musterdruckvorrichtung |
CN102775849A (zh) * | 2011-05-13 | 2012-11-14 | 深圳市信濠精密组件有限公司 | 一种金属油墨组合物 |
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WO2023104849A1 (en) * | 2021-12-08 | 2023-06-15 | Ferro Gmbh | Environmentally friendly medium for ceramic colours for indirect decoration of glass, porcelain, bone china, enamel, and ceramics |
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