WO2011024644A1

WO2011024644A1 - Electronic thermometer and production method for same

Info

Publication number: WO2011024644A1
Application number: PCT/JP2010/063553
Authority: WO
Inventors: 智夫渡辺; 廣一北川; 克成前橋; 勝美森田; 隆典岩井; 守常田
Original assignee: オムロンヘルスケア株式会社
Priority date: 2009-08-27
Filing date: 2010-08-10
Publication date: 2011-03-03
Also published as: TW201129341A; JP2011047811A

Abstract

Disclosed is a production method for an electronic thermometer. The method comprises: a step whereby a first sub-assembly is formed by positioning and fixing a temperature sensor onto a print substrate by means of a lead wire; a step whereby a sub-case (50) is positioned and mounted onto an assembly base (102) by inserting a positioning reference pin (103), provided on the assembly base (102), into a positioning reference hole (58), provided in the sub-case (50); a step whereby a second sub-assembly, which includes the sub-case (50) and the first sub-assembly, is formed by positioning and attaching the first sub-assembly onto the sub-case (50), which is positioned and mounted onto the assembly base (102); and a step whereby the second sub-assembly is positioned and incorporated into a casing.

Description

Electronic thermometer manufacturing method and electronic thermometer

The present invention relates to a method for manufacturing an electronic thermometer provided with a temperature sensor and an electronic thermometer manufactured according to the manufacturing method.

In general, in an electronic thermometer that enables measurement of body temperature by being sandwiched between measurement sites such as the armpit and the tongue, a printed circuit board on which various electronic components are mounted is disposed inside a main body housing as a housing. In addition, a configuration is adopted in which a temperature measuring unit in which a temperature sensor is accommodated is provided at the front end of the main body housing. In such an electronic thermometer, in order to ensure electrical connection between the temperature sensor located in the temperature measuring section and the processing circuit formed on the printed circuit board by mounting various electronic components, the following 2 One of the street structures is adopted.

In the first structure, the above-described printed circuit board is extended to the temperature measuring unit, and a temperature sensor is mounted on the extended printed circuit board so that the temperature is measured via a conductive wire formed on the printed circuit board. The electrical connection between the sensor and the processing circuit is ensured. As a document that specifically discloses an electronic thermometer employing such a structure, there is, for example, Japanese Patent Application Laid-Open No. 9-89680.

The second structure secures an electrical connection between the temperature sensor and the processing circuit via the lead wire by connecting the above-described printed circuit board and the temperature sensor via the lead wire. Documents that specifically disclose electronic thermometers employing such a structure include, for example, Japanese Patent Application Laid-Open Nos. 2001-66191 and 2006-98179.

JP-A-9-89680 JP 2001-66191 A JP 2006-98179 A

In the electronic thermometer employing the above-described first structure, a rigid printed circuit board is inserted into the main body housing and fixed at the time of manufacture, so that the temperature sensor is positioned and arranged at the temperature measuring unit. Therefore, there is an advantage that the assembling can be easily performed while suppressing variation in assembling accuracy. However, when such a structure is adopted, the heat applied to the temperature sensor escapes through the printed circuit board at the time of measurement, and the thermal response becomes slow and the measurement is accurate in a short time. The problem that it becomes difficult to perform occurs. Further, in order to employ the first structure, it is necessary to extend the printed circuit board to the temperature measuring unit, so that there is a problem that the component cost increases and the manufacturing cost is pressed.

On the other hand, in the electronic thermometer employing the above-described second structure, it is possible to limit the heat escape at the time of measurement to the lead wire. Therefore, when the heat escape is the first structure, Compared to this, it has the advantage that the thermal response is fast and accurate measurement can be performed in a short time, and the electrical connection between the temperature sensor and the processing circuit using a relatively inexpensive lead wire. Since secure connection is ensured and the printed circuit board can be formed in a small size, there can be obtained an advantage that the manufacturing cost can be suppressed as compared with the case of the first structure. However, at the time of manufacturing, it is necessary to assemble the temperature sensor and the printed circuit board to the main body housing in a state where the temperature sensor is fixed to the printed circuit board with a relatively rigid lead wire. There is a disadvantage that it is difficult to position and arrange the sensor in the temperature measuring section. For this reason, when the second structure is employed, there is a tendency that variations in assembly accuracy tend to occur, and it is necessary to take some measures.

Therefore, the present invention has been made to solve the above-described problems, and even when a structure in which a temperature sensor and a printed board are connected via a lead wire is adopted, the occurrence of variations in assembly accuracy is suppressed. An object of the present invention is to provide an electronic thermometer that can be manufactured at low cost and a method for manufacturing the same.

An electronic thermometer manufacturing method according to the present invention includes a printed circuit board on which a processing circuit is formed, a lead wire having one end fixed to the printed circuit board, a temperature sensor fixed to the other end of the lead wire, and the printed circuit board. A method for manufacturing an electronic thermometer comprising a holding member that holds a substrate and a casing that accommodates the printed board, lead wires, temperature sensor, and holding member, and includes the following steps (a) to (d) ).
(A) A step of forming a first subassembly including the printed circuit board, the lead wire, and the temperature sensor by positioning and fixing the temperature sensor to the printed circuit board via the lead wire.
(B) A step of placing the holding member while positioning the holding member on the assembling table by inserting a positioning reference pin provided on the assembling table into a positioning reference hole provided on the holding member. .
(C) A second subassembly including the holding member and the first subassembly is formed by assembling the first subassembly while positioning the first subassembly on the holding member positioned and placed on the assembly base. Process.
(D) A step of assembling the second subassembly to the casing by accommodating the second subassembly in the casing while being positioned.

In the method for manufacturing an electronic thermometer according to the present invention, the reference hole is preferably provided at a position near the end of the holding member on the side from which the lead wire is drawn.

In the method for manufacturing an electronic thermometer according to the present invention, when the reference pin and the reference hole are viewed in plan along the insertion direction, it is preferable that both of these shapes are perfectly circular. In this case, in the step (b) of positioning and holding the holding member on the assembly base, at least a part of the side surface of the holding member is provided on the assembly base for preventing rotation. It is preferable to prevent the holding member from rotating with respect to the assembly table by placing the holding member on the assembly table so as to face each other.

In this case, it is preferable that the guide block faces the side surface portion closest to the reference hole of the holding member in a state where the holding member is positioned and placed on the assembly base. .

In the method for manufacturing an electronic thermometer according to the present invention, when the reference pin and the reference hole are viewed in plan along the insertion direction, it is preferable that both of these shapes are perfectly circular. In this case, in the step (b) of positioning and holding the holding member on the assembly base, a rotation prevention guide pin provided on the assembly base is provided with the rotation prevention provided on the holding member. It is preferable to prevent the holding member from rotating with respect to the assembly base by inserting it into the guide hole.

In this case, it is preferable to provide the guide hole at a position near the end of the holding member on the side opposite to the side from which the lead wire is drawn.

Further, in that case, when the guide pin and the guide hole are viewed in plan along the insertion direction, both of these shapes may be made into a perfect circle shape. It is preferable that the difference between the diameter of the guide pin and the diameter of the guide hole is larger than the difference between the diameter of the reference pin and the diameter of the reference hole.

In this case, when the guide pin and the guide hole are viewed in plan along the insertion direction, the shape of the guide pin may be a perfect circle. The shape of the guide hole may be a long hole extending along the lead wire drawing direction.

In the electronic thermometer manufacturing method according to the present invention, when the reference pin and the reference hole are viewed in plan along the insertion direction, both of these shapes may be non-circular. In that case, in the step (b) of positioning and holding the holding member on the mounting base, the reference pin provided on the mounting base is inserted into the reference hole provided on the holding member. By inserting, it is preferable to prevent the holding member from rotating relative to the assembly base.

The method for manufacturing an electronic thermometer according to the present invention may further include the following step (e) in addition to the steps (a) to (d) described above.
(E) A step of assembling a component other than the first subassembly to the holding member placed on the assembly table.

In that case, a plurality of the mounting bases are provided along the circumferential direction of the turntable, and various supply devices for supplying the first subassembly and the other parts are arranged along the periphery of the turntable. The first subassembly and the other parts are individually supplied from the various supply devices to the assembly bases that rotate along the circumferential direction as the rotary table rotates. It is preferable.

In that case, in the step (b) of positioning and holding the holding member on the assembly base, the end of the holding member on the side from which the lead wire is drawn out is the rotation center of the rotary table. It is preferable that the holding member is placed on the assembly base so as to be positioned on the side.

In addition, the electronic thermometer based on this invention is manufactured according to the manufacturing method of the electronic thermometer based on this invention mentioned above.

According to the present invention, even when a structure in which a temperature sensor and a printed circuit board are connected via a lead wire is adopted, an electronic thermometer can be manufactured at a low cost while suppressing variations in assembly accuracy.

It is a perspective view which shows the external appearance structure of the electronic thermometer in Embodiment 1 of this invention. It is a figure which shows the structure of the functional block of the electronic thermometer in Embodiment 1 of this invention. It is a disassembled perspective view which shows the assembly structure of the electronic thermometer in Embodiment 1 of this invention. It is a disassembled perspective view which shows the assembly | attachment structure of the 2nd subassembly of the electronic thermometer in Embodiment 1 of this invention. It is a top view which shows the structure of the assembly apparatus applied to the manufacturing method of the electronic thermometer in Embodiment 1 of this invention. It is a flowchart at the time of employ | adopting the manufacturing method of the electronic thermometer in Embodiment 1 of this invention. It is a bottom view which shows the shape of the sub case of the electronic thermometer in Embodiment 1 of this invention. It is a top view which shows the shape of the assembly stand of the assembly apparatus applied to the manufacturing method of the electronic thermometer in Embodiment 1 of this invention. It is a perspective view which shows a mode that a subcase is mounted in the assembly stand of an assembly apparatus according to the manufacturing method of the electronic thermometer in Embodiment 1 of this invention. It is a bottom view which shows the shape of the sub case of the electronic thermometer which concerns on a 1st modification. It is a top view which shows the shape of the assembly | attachment stand of the assembly apparatus applied to the manufacturing method of the electronic thermometer which concerns on a 1st modification. In a 1st modification, it is a figure which shows the location which should be hold | maintained when mounting the subcase of an electronic thermometer on an assembly stand. It is a bottom view which shows the shape of the sub case of the electronic thermometer which concerns on a 2nd modification. It is a bottom view which shows the shape of the sub case of the electronic thermometer which concerns on a 3rd modification. It is a top view which shows the shape of the assembly | attachment stand of the assembly apparatus applied to the manufacturing method of the electronic thermometer which concerns on a 3rd modification. It is a top view which shows the structure of the assembly apparatus applied to the manufacturing method of the electronic thermometer in Embodiment 2 of this invention. It is a flowchart at the time of employ | adopting the manufacturing method of the electronic thermometer in Embodiment 2 of this invention. It is a perspective view which shows a mode that the 2nd subassembly is inserted in a main body housing according to the manufacturing method of the electronic thermometer in Embodiment 2 of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments and modifications thereof, the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a perspective view showing an external structure of an electronic thermometer according to Embodiment 1 of the present invention, and FIG. 2 is a diagram showing a functional block configuration of the electronic thermometer shown in FIG. First, with reference to these FIG. 1 and FIG. 2, the structure of the electronic thermometer in this Embodiment is demonstrated.

As shown in FIG. 1, the electronic thermometer 1 according to the present embodiment includes a main body housing 10, a cap 15, and a closing member 16 as a casing. The main body housing 10 is made of a cylindrical member made of a resin material such as ABS (Acrylonitrile Butadiene Styrene) resin, and a nameplate is attached to a predetermined position on the surface, and the display unit 4 and the operation on the predetermined position on the surface. Part 5. The cap 15 is formed of a bottomed cylindrical member having one end closed made of a metal material such as a stainless alloy. The closing member 16 is made of a block-shaped member made of a resin material such as ABS resin. Here, the cap 15 is attached to a front end portion 11 (see FIG. 3) that is one end portion of the main body housing 10 in the axial direction, and the closing member 16 is a rear end portion that is the other end portion of the main body housing 10 in the axial direction. It is attached to the end 12 (see FIG. 3).

As shown in FIG. 2, the electronic thermometer 1 in the present embodiment includes a control unit 2, a memory unit 3, a notification unit 6, a power supply unit 7, and a temperature measuring unit 8 in addition to the display unit 4 and the operation unit 5 described above. I have. The control part 2 is comprised by CPU (Central Processing Unit), for example, and is a means for controlling the whole electronic thermometer 1. FIG. The memory unit 3 is composed of, for example, a ROM (Read-Only Memory) or a RAM (Random-Access Memory), and stores a program for causing the control unit 2 or the like to execute a processing procedure for body temperature measurement. It is a means for storing results and the like.

The display unit 4 is configured by a display panel such as an LCD (Liquid Crystal Display), and is a means for displaying measurement results and the like. The operation unit 5 is constituted by, for example, a push button, and is a means for accepting an operation by the user and inputting an external command to the control unit 2 and the power supply unit 7. The notification unit 6 is configured by, for example, a buzzer, and is a means for notifying the user that measurement has been completed or that a user operation has been accepted.

The power supply unit 7 is constituted by, for example, a button battery, and is means for supplying power as a power source to the control unit 2. The temperature measuring unit 8 is configured by the cap 15 described above and a temperature sensor 73 (see FIG. 3 and the like) housed in the cap 15, and is sandwiched between measurement sites such as the armpit and the tongue. This is the part where the temperature is detected.

The control unit 2 includes a processing circuit for performing body temperature measurement, and performs body temperature measurement based on a program read from the memory unit 3. At that time, the control unit 2 calculates the body temperature as a measurement result by processing the temperature data input from the temperature measuring unit 8, and controls or displays the calculated body temperature on the display unit 4. Control is performed so that the body temperature is stored in the memory unit 3, or control is performed so as to notify the user that the measurement is completed using the notification unit 6.

FIG. 3 is an exploded perspective view showing the assembly structure of the electronic thermometer shown in FIG. 1, and FIG. 4 is an exploded perspective view showing the assembly structure of the second subassembly shown in FIG. Next, with reference to these FIG. 3 and FIG. 4, the assembly structure of the electronic thermometer in this Embodiment is demonstrated. The exploded perspective view shown in FIG. 4 shows a state in which the second subassembly shown in FIG.

As shown in FIG. 3, the electronic thermometer 1 in the present embodiment includes a main body housing 10, a cap 15, and a closing member 16 as the above-described housing, and a second subassembly 18 in which various internal components are assembled. It is constituted by. The cap 15 is fixed to the front end portion 11 of the main body housing 10 by adhesion, for example. The second subassembly 18 is accommodated in the hollow portion 13 inside the main body housing 10 by being inserted from an opening located at the rear end portion 12 of the main body housing 10. The closing member 16 is fixed to the main body housing 10 by adhesion, ultrasonic welding or the like so as to close the opening located at the rear end portion 12 of the main body housing 10 described above. Here, if ultrasonic welding is employed for fixing the closing member 16 to the main body housing 10, processing in a shorter time can be achieved as compared with the case where adhesion is employed.

As shown in FIG. 4, the second subassembly 18 includes a subcase 50 as a holding member, a first subassembly 17 including a printed circuit board 70, lead wires 72, and a temperature sensor 73, and a display constituting the display unit 4. A part assembly 61, an operation part assembly 62 constituting the operation part 5, an elastic connector 63, a buzzer 65 as a notification part 6, a buzzer cover 66 provided with a terminal 67, and a terminal 69 are provided. The fixing member 68 is mainly provided.

The subcase 50 is a base on which the various internal components described above are assembled, and is formed of a flat, substantially rectangular parallelepiped member having a lower end opening formed of a resin material such as ABS resin. A display portion window portion 51 is formed by providing an opening at a predetermined position on the upper end surface of the sub case 50, and an operation portion tongue portion 52 is formed by cutting a part of the window portion 51. Here, a protrusion for positioning and fixing the operation unit assembly 62 is formed at a predetermined position of the operation unit tongue 52. Further, a buzzer accommodating portion 53 for accommodating a buzzer 65 is provided at a position near the front end of the sub case 50, and a fixing member for accommodating a fixing member 68 at a position near the rear end of the sub case 50. A battery accommodating part 55 for accommodating the accommodating part 54 and the button battery is provided. Further, a plurality of support pins 56 for supporting the printed circuit board 70 are provided at predetermined positions on the upper end surface of the sub case 50.

The display unit assembly 61 is composed of a substantially plate-like assembly including the display panel described above, and the display panel faces the display unit window 51 at a position where the display unit window 51 of the sub case 50 is formed. By being placed in this manner, the sub case 50 is assembled. The operation part assembly 62 is a substantially cylindrical assembly, and is assembled by being placed at a position where the operation part tongue part 52 of the sub case 50 is formed.

Here, a concave portion is formed on the main surface of the operation unit assembly 62 on the sub case 50 side, and the concave portion is fitted to the protrusion provided on the operation unit tongue portion 52 described above. The operation unit assembly 62 is positioned and fixed to the operation unit tongue 52. A rubber sheet having elasticity is affixed to the main surface opposite to the main surface on which the concave portion is formed of the operation unit assembly 62. The rubber sheet is disposed so as to face the printed circuit board 70 with a predetermined gap after assembly, and comes into contact with the printed circuit board 70 when the user presses the operation unit 5. The rubber sheet itself is made of conductive rubber, or has a conductive property by carbon printing on the surface thereof, and the contact provided on the printed circuit board 70 in accordance with the user's operation. Switch between conductive and non-conductive state.

Further, the elastic connector 63 is placed at a predetermined position on the display unit assembly 61 assembled to the sub case 50. The elastic connector 63 is a pressure contact type connector part including a cushioning material having elasticity, and is sandwiched and fixed between the display unit assembly 61 described above and a printed circuit board 70 described later, whereby the display unit assembly. The display panel included in 61 and the printed circuit board 70 are electrically connected.

The buzzer 65 is a thin disc-shaped electronic component in which a vibration plate and a piezoelectric plate are integrated, and is placed on the sub case 50 by being housed in a buzzer housing portion 53 provided in the sub case 50. And assembled. In addition to the buzzer 65 described above, a buzzer cover 66 is assembled to the buzzer accommodating portion 53 of the sub case 50. The buzzer cover 66 is made of a resin member in which the terminals 67 are integrated, and is assembled by being placed in the buzzer accommodating portion 53 so as to cover the buzzer 65 placed on the sub case 50. . The terminal 67 is made of a conductive member having a leaf spring structure, and is a member for electrically connecting the buzzer 65 and a printed board 70 described later. For the integration of the buzzer cover 66 and the terminal 67, techniques such as insert molding, adhesion, and fitting can be used.

The fixing member 68 is made of a resin member in which the terminals 69 are integrated, and is placed on the sub case 50 and assembled by being accommodated in the fixing member accommodating portion 54 of the sub case 50. Here, a part of the terminal 69 integrated with the fixing member 68 reaches the battery accommodating portion 55 by accommodating the fixing member 68 in the fixing member accommodating portion 54. Further, as described above, a button battery (not shown) is accommodated in the battery accommodating portion 55 of the sub case 50. The terminal 69 is made of a conductive member having a leaf spring structure, and is a member for electrically connecting a button battery accommodated in the battery accommodating portion 55 and a printed board 70 described later. For the integration of the fixing member 68 and the terminal 69, techniques such as insert molding, adhesion, and fitting can be used.

As described above, the first subassembly 17 is an assembly including the printed circuit board 70, the lead wire 72, and the temperature sensor 73. The printed circuit board 70 is formed of a plate-shaped rigid wiring board having a substantially rectangular shape in plan view, on which conductive wires having a predetermined pattern are formed. Various electronic components are mounted on the surface of the printed circuit board 70, and various circuits such as a processing circuit for performing the body temperature measurement described above are formed on the printed circuit board 70.

The temperature sensor 73 is composed of a small temperature sensing element such as a thermistor, and is electrically connected to the processing circuit provided on the printed circuit board 70 via the lead wire 72 described above and printed via the lead wire 72. It is physically fixed to the substrate 70. Note that it is preferable to use a lead wire 72 that has a certain degree of rigidity and is difficult to deform, and resists the weight of the temperature sensor 73 and the weight of the lead wire 72 itself at least in a state of being fixed to the printed circuit board 70. It is necessary to be independent.

The first subassembly 17 is on the subcase 50 in which the display unit assembly 61, the operation unit assembly 62, the elastic connector 63, the buzzer 65, the buzzer cover 66 with the terminal 67, and the fixing member 68 with the terminal 69 are assembled. Assembled to. At that time, the first subassembly 17 is placed on the sub case 50 so that the support pin 56 provided in the sub case 50 is inserted into the through hole 71 provided in a predetermined position of the printed circuit board 70. The support pins 56 protruding from 71 are heat squeezed to assemble the printed circuit board 70 in a state of being pressed toward the sub case 50, whereby the display described above is performed by the sub case 50 and the printed circuit board 70. Various parts such as the subassembly 61 are sandwiched and fixed.

It should be noted that the sub case 50 is attached to an assembly base 102 (see FIGS. 5, 7B, 8 and the like) of an assembly apparatus 100A described later at a predetermined position on the upper end surface of the sub case 50 of the electronic thermometer 1 in the present embodiment. A reference hole 58 used for positioning at the time of mounting is provided. Further, a bulge for inserting and fixing the second subassembly 18 including the subcase 50 into the hollow portion 13 of the main body housing 10 at a predetermined position on the side surface of the subcase 50 of the electronic thermometer 1 in the present embodiment. A portion 57 is provided. Details of the reference hole 58 and the bulging portion 57 will be described later.

FIG. 5 is a plan view showing a configuration of an assembling apparatus applied to the manufacturing method of the electronic thermometer in the present embodiment. Next, with reference to this FIG. 5, the structure of the assembly apparatus applied to the manufacturing method of the electronic thermometer in this Embodiment is demonstrated.

As shown in FIG. 5, an assembling apparatus 100 </ b> A applied to the method for manufacturing an electronic thermometer in the present embodiment includes a rotary table 101 and

various supply apparatuses

110, 120, 120 arranged along the periphery of the rotary table 101. 130, 140, 150, 160, 170, 180, a heat caulking device 190, and an unloading device 200. The turntable 101 has a plurality of mounting bases 102 arranged along the circumferential direction thereof, and is driven by a drive mechanism (not shown), so that the rotation shaft 101a is the center of rotation and the direction of arrow A in the figure. Rotate to.

The sub case supply device 110 includes a parts feeder 111, a parts conveyance path 112, and a parts transfer unit 113. The sub case supply apparatus 110 supplies a sub case 50 as a part to the assembling table 102 and supplies it to the assembling table 102. Placed on.

Here, the parts transfer unit 113 discriminates the orientation of the sub case 50 conveyed through the parts conveyance path 112 and, based on this, reverses or rotates the sub case 50 as necessary, and the mounting table 102. To supply. With this configuration, the orientation of the sub case 50 supplied to the assembly base 102 can be aligned in a predetermined direction. Alternatively, the sub case 50 whose orientation is not suitable is configured so as to be returned to the parts feeder 111 so that only the sub case 50 whose orientation is suitable is supplied to the assembly base 102. May be.

The display unit assembly supply device 120 supplies the display unit assembly 61 as a part to the assembly base 102 and assembles it to the sub case 50 placed on the assembly base 102. Further, the operation unit assembly supply device 130 supplies the operation unit assembly 62 as a part to the assembling table 102 and assembles it to the sub case 50 mounted on the assembling table 102.

The elastic connector supply device 140 supplies the elastic connector 63 as a part to the assembly base 102 and attaches it to the sub case 50 placed on the assembly base 102. Further, the buzzer supply device 150 supplies the buzzer 65 as a part to the assembling table 102 and assembles it to the subcase 50 placed on the assembling table 102.

The terminal-equipped buzzer cover supply device 160 supplies a buzzer cover 66 with a terminal 67 as a part to the assembling table 102 and assembles it to the sub case 50 placed on the assembling table 102. Further, the fixing member supplying device with terminal 170 supplies the fixing member 68 with the terminal 69 as a part to the assembling table 102 and assembles it to the sub case 50 placed on the assembling table 102.

The first subassembly supply device 180 supplies the first subassembly 17 as a part to the assembling table 102 and assembles it to the subcase 50 placed on the assembling table 102.

The heat caulking device 190 includes a heater as a heating source, and the front end of the support pin 56 is pressed against the front end of the support pin 56 of the sub case 50 placed on the assembly base 102. The printed circuit board 70 is fixed to the sub case 50 by heat caulking by melting the portion once and then solidifying the tip of the support pin 56 by releasing the pressing of the heater. The carry-out device 200 carries out the second subassembly 18 assembled and integrated on the assembly base 102 from the assembly base 102.

Here, the turntable 101 is driven to rotate step by step by a predetermined angle by the drive mechanism (not shown) described above. Thereby, each of the plurality of assembling bases 102 is disposed so as to sequentially face each of the

various supply devices

110, 120, 130, 140, 150, 160, 170, 180, the heat caulking device 190, and the carry-out device 200 described above. Thus, in the face-to-face state, individual steps described later (more specifically, steps from step S102 to step S111 shown in FIG. 6) are sequentially performed.

FIG. 6 is a flowchart when the method for manufacturing the electronic thermometer according to the present embodiment is employed. FIG. 7A is a bottom view showing the shape of the sub case of the electronic thermometer in the present embodiment, and FIG. 7B is an assembly table of the assembly apparatus applied to the manufacturing method of the electronic thermometer in the present embodiment. It is a top view which shows a shape. Further, FIG. 8 is a perspective view showing a state in which the sub case is placed on the assembly base of the assembly apparatus according to the method for manufacturing the electronic thermometer in the present embodiment. Next, with reference to these FIG. 6 thru | or FIG. 8, the manufacturing method of the electronic thermometer in this Embodiment is demonstrated.

As shown in FIG. 6, in the manufacturing method of the electronic thermometer in the present embodiment, first, the first subassembly 17 is formed by fixing the temperature sensor 73 to the printed circuit board 70 via the lead wire 72 while positioning. (Step S101). Specifically, the other end of the lead wire 72 whose one end is fixed to the temperature sensor 73 in advance is connected to a connection electrode provided on the printed circuit board 70 by, for example, soldering, whereby the temperature sensor 73 is connected to the printed circuit board 70. Fix it. At that time, the temperature sensor 73 is reliably positioned with respect to the printed circuit board 70 by using a dedicated jig or the like as necessary.

Next, the sub case 50 is placed on the assembly base 102 while being positioned (step S102). The sub case supply device 110 of the assembly device 100A described above is used for placing the sub case 50 on the assembly table 102. A nameplate is affixed in advance to the sub case 50 supplied to the assembly base 102 by the sub case supply device 110.

Here, as shown in FIG. 7A, the sub case 50 of the electronic thermometer 1 according to the present embodiment has one positioning reference hole 58 at a predetermined position on the upper end surface thereof as described above. On the other hand, as shown in FIG. 7B, one positioning reference pin 103 and two guides are provided at predetermined positions of the assembly base 102 of the assembly apparatus 100A applied to the manufacturing method of the electronic thermometer in the present embodiment.

Blocks

104 and 105 are provided.

The reference hole 58 provided in the sub-case 50 is formed in a size and shape into which the reference pin 103 provided in the assembly base 102 can be inserted. Here, the shapes of the reference hole 58 and the reference pin 103 are When viewed in plan along the insertion direction, both are formed in a perfect circle shape, and the diameter R1 of the reference hole 58 and the diameter r1 of the reference pin 103 satisfy the condition of R1> r1. Further, the difference (R1−r1) between the diameter R1 of the reference hole 58 and the diameter r1 of the reference pin 103 is allowed from the assembly position accuracy of the subcase 50 and other parts assembled to the subcase 50. It is made a size. Thus, when the sub case 50 is placed on the assembly base 102 as shown in FIG. 8, the reference pin 103 is inserted into the reference hole 58, thereby positioning the sub case 50 with respect to the assembly base 102 with high accuracy. It becomes possible to do.

Further, the guide blocks 104 and 105 are arranged from the front end portion and the rear end portion of the sub case 50 in a state where the reference hole 58 is inserted into the reference pin 103 and the sub case 50 is placed on the mounting base 102. The side surface of the sub case 50 faces the guide blocks 104 and 105 in a state where the sub case 50 is placed on the mounting table 102 so as to surround each of the parts. is doing. Thus, when the sub case 50 is placed on the assembly base 102 as shown in FIG. 8, the sub case 50 is accommodated and placed in the space defined by the guide blocks 104 and 105. Thus, the rotation of the 50 assembly bases 102 is prevented.

Here, in a state where the sub case 50 is placed on the assembly base 102, one of the guide blocks 104, 105 is configured to face the side surface portion closest to the reference hole 58 of the sub case 50. Thus, the sub case 50 can be placed while being positioned at a predetermined position on the mounting base 102 with higher accuracy. Further, as shown in FIGS. 7A and 7B, the distance t1 between the reference pin 103 and the guide blocks 104 and 105 located in the portion closest to the reference pin 103 is as small as possible. By adjusting and setting the position of the reference pin 103 and the position of the guide blocks 104 and 105, the sub case 50 can be placed while being positioned at a predetermined position on the mounting base 102 with higher accuracy. Become. However, in the present embodiment, it is necessary to place the sub-case 50 having a box shape in the space defined by the guide blocks 104 and 105 so as to be placed on the assembling table 102. It is preferable that t1 is somewhat larger than the thickness T1 of the side wall of the sub case 50.

Further, in step S102 in which the sub case 50 is placed on the mounting base 102, the end of the sub case 50 on the side from which the lead wire 72 is drawn is the rotation center side of the rotary table 101 (that is, the rotation shaft 101a is It is preferable that the sub case 50 is placed on the assembly base 102 so as to face the side on which it is positioned. In this way, the lead wire 72 and the temperature sensor 73 can be prevented from protruding outward from the rotary table 101, and various supply devices and the like can be disposed close to the rotary table 101. The installation space for the device 100A can be reduced to a small area.

Next, as shown in FIG. 6, the display unit assembly 61 is assembled to the sub case 50 placed on the assembly table 102 (step S103). For assembling the display unit assembly 61 to the sub case 50, the display unit assembly supply device 120 of the assembly apparatus 100A described above is used. Here, as described above, since the positioning of the sub case 50 with respect to the mounting base 102 is reliably performed in step S102, the assembly position accuracy of the display unit assembly 61 with respect to the sub case 50 is determined by the assembly apparatus 100A. It is surely maintained by the machine accuracy. Accordingly, in step S103, the display unit assembly 61 is assembled to the sub case 50 with high assembly position accuracy.

Next, the operation unit assembly 62 is assembled to the sub case 50 placed on the assembly table 102 (step S104). For assembling the operation section assembly 62 to the sub case 50, the operation section assembly supply apparatus 130 of the assembly apparatus 100A described above is used. Here, as described above, since the positioning of the sub case 50 with respect to the mounting base 102 is reliably performed in step S102, the assembly position accuracy of the operation unit assembly 62 with respect to the sub case 50 is determined by the assembly apparatus 100A. It is surely maintained by the machine accuracy. Therefore, in step S104, the operation unit assembly 62 is assembled to the sub case 50 with high assembly position accuracy.

Next, the elastic connector 63 is assembled to the sub case 50 placed on the assembly table 102 (step S105). For the assembly of the elastic connector 63 to the sub case 50, the elastic connector supply device 140 of the assembly apparatus 100A described above is used. Here, as described above, since the positioning of the sub case 50 with respect to the mounting base 102 is reliably performed in step S102, the assembly position accuracy of the elastic connector 63 with respect to the sub case 50 is determined by the machine of the assembly apparatus 100A. Secured by accuracy. Therefore, in step S105, the elastic connector 63 is assembled to the sub case 50 with high assembly position accuracy.

Next, the buzzer 65 is assembled to the sub case 50 placed on the assembly table 102 (step S106). For assembling the buzzer 65 to the sub case 50, the buzzer supply device 150 of the assembly device 100A described above is used. Here, as described above, since the positioning of the sub case 50 with respect to the mounting base 102 is reliably performed in step S102, the assembling position accuracy of the buzzer 65 with respect to the sub case 50 is the mechanical accuracy of the assembling apparatus 100A. Is surely kept by. Accordingly, in step S106, the buzzer 65 is assembled to the sub case 50 with high assembly position accuracy.

Next, the buzzer cover 66 with the terminal 67 is assembled to the sub case 50 placed on the assembly table 102 (step S107). For assembling the buzzer cover 66 with the terminal 67 to the sub case 50, the buzzer cover supply device 160 with the terminal of the assembly apparatus 100A described above is used. Here, as described above, since the positioning of the sub case 50 with respect to the mounting base 102 is reliably performed in step S102, the assembly position accuracy of the buzzer cover 66 with the terminal 67 with respect to the sub case 50 is determined by the assembling apparatus. Secured by 100A machine accuracy. Therefore, in step S107, the buzzer cover 66 with the terminal 67 is assembled to the sub case 50 with high assembly position accuracy.

Next, the fixing member 68 with the terminal 69 is assembled to the sub case 50 placed on the assembly table 102 (step S108). For assembling the fixing member 68 with the terminal 69 to the sub case 50, the fixing member supplying device with terminal 170 of the assembly apparatus 100A described above is used. Here, as described above, since the positioning of the sub case 50 with respect to the mounting base 102 is reliably performed in step S102, the assembling position accuracy of the fixing member 68 with the terminal 69 with respect to the sub case 50 is determined by the assembling apparatus. Secured by 100A machine accuracy. Accordingly, in step S108, the fixing member 68 with the terminal 69 is assembled to the sub case 50 with high assembly position accuracy.

Next, the first subassembly 17 is assembled to the subcase 50 placed on the assembly table 102 while being positioned (step S109). For the assembly of the first subassembly 17 to the subcase 50, the first subassembly supply device 180 of the assembly device 100A described above is used. At this time, each of the plurality of support pins 56 provided in the sub case 50 is inserted into each of the through holes 71 provided in the printed circuit board 70, thereby positioning the first sub assembly 17 with respect to the sub case 50. Here, as described above, the temperature sensor 73 is reliably positioned with respect to the printed circuit board 70 in step S101, and the sub case 50 is reliably positioned with respect to the assembly base 102 in step S102. The assembly position accuracy of the temperature sensor 73 with respect to the sub case 50 is reliably maintained by these. Therefore, in step S109, the temperature sensor 73 is assembled to the sub case 50 with high assembly position accuracy.

Here, by providing the reference hole 58 provided in the subcase 50 described above at a position near the end portion (that is, the front end portion) of the subcase 50 on the side from which the lead wire 72 is drawn, the temperature sensor 73 with respect to the subcase 50 is provided. Assembly position accuracy can be maintained with higher accuracy. Compared with the case where the reference hole 58 is provided at a position near the end (that is, the rear end) of the sub case 50 on the side opposite to the side from which the lead wire 72 is drawn out by adopting the above configuration. This is because the distance between the portion where the hole 58 is provided and the portion where the temperature sensor 73 is located can be further shortened. Therefore, with this configuration, even when a slight error occurs in the assembly position accuracy of the first subassembly 17 with respect to the subcase 50, the error in the assembly position accuracy of the temperature sensor 73 with respect to the subcase 50 is reduced. It can be minimized.

Next, the first subassembly 17 is fixed to the subcase 50 by heat caulking to form the second subassembly 18 (step S110). For fixing the first subassembly 17 to the subcase 50, the above-described heat caulking device 190 of the assembling apparatus 100A is used. More specifically, the tip of the support pin 56 is once melted by pressing the heater of the heat caulking device 190 against each of the tips of the plurality of support pins 56 of the sub case 50, and then the heater is pressed. Is released to solidify the tip of the melted support pin 56, thereby fixing the printed circuit board 70 included in the first subassembly 17 to the subcase 50 by heat caulking. Thus, various parts such as the display unit assembly 61 described above are sandwiched between the sub case 50 and the printed circuit board 70 and fixed to the sub case 50.

Next, the second subassembly 18 placed on the assembly table 102 is unloaded from the assembly apparatus 100A (step S111). For carrying out the second subassembly 18, the carry-out device 200 of the assembly device 100A described above is used.

Then, the second subassembly 18 carried out from the assembly apparatus 100A is accommodated while being positioned in the main body housing 10, thereby fixing the second subassembly 18 to the main body housing 10 (step S112). At this time, the bulging portion 57 provided on the side surface of the sub case 50 is fitted to the inner peripheral surface of the main body housing 10 so that the sub case 50 is positioned and accommodated with respect to the main body housing 10. Thus, the temperature sensor 73 positioned with respect to the sub case 50 is surely positioned and arranged at a position exposed from the front end portion 11 of the main body housing 10.

Thereafter, the cap 15 is attached to the front end portion 11 of the main body housing 10 so as to cover the temperature sensor 73 exposed at the front end portion 11 of the main body housing 10, and the closing member 16 is attached to the rear end portion 12 of the main body housing 10 (step S113). ). Thus, the manufacture of the electronic thermometer 1 as shown in FIG. 1 is completed.

By adopting the manufacturing method of the electronic thermometer according to the present embodiment as described above, various internal components of the electronic thermometer 1 are assembled to the housing composed of the main body housing 10, the cap 15 and the closing member 16 with high assembly position accuracy. Can be placed inside the body. In particular, regarding the temperature sensor 73, even when a structure in which the temperature sensor 73 is connected to the printed circuit board 70 via the lead wire 72 is employed, the temperature sensor 73 is positioned and fixed in advance with respect to the sub case 50 with high accuracy. Therefore, when the second subassembly 18 is inserted into the main body housing 10, the insertion work is facilitated, and the sub case 50 is inserted into the main body housing 10 and fixed while being positioned. The cap 15 attached to the front end portion 11 can be positioned and arranged with high accuracy. Therefore, it is possible to effectively suppress the variation in assembly accuracy, and it is possible to manufacture the electronic thermometer 1 that can accurately measure the body temperature with a high yield.

Further, by adopting the manufacturing method of the electronic thermometer according to the present embodiment as described above, the positioning reference hole 58 is formed in the sub case 50, and accordingly, the sub case 50 has a corresponding amount. As a result, the weight can be reduced, and as a result, the amount of resin material required can be reduced, and the manufacturing cost can be reduced.

Further, by adopting the electronic thermometer manufacturing method according to the present embodiment as described above, the second subassembly 18 can be automatically assembled using the assembly apparatus 100A as shown in FIG. Therefore, it is possible to easily and inexpensively manufacture the electronic thermometer 1 that can accurately measure the body temperature.

Therefore, by adopting the method for manufacturing an electronic thermometer according to the present embodiment described above, even when a structure in which a temperature sensor and a printed board are connected via a lead wire is employed, a high-performance electronic thermometer is assembled with high accuracy. It can be manufactured at low cost while suppressing the occurrence of variations.

In the present embodiment described above, in order to position the sub case 50 with respect to the assembly base 102, one reference hole 58 is provided in the sub case 50, and one reference pin 103 is provided on the assembly base 102. A configuration in which two

guide blocks

104 and 105 are provided is adopted. However, it is naturally possible to position the sub case 50 with respect to the mounting base 102 by adopting another configuration. In the following, the case where the above-described positioning is performed using another configuration will be exemplified and described as first to third modifications of the present embodiment.

FIG. 9A is a bottom view showing the shape of the sub case of the electronic thermometer according to the first modified example, and FIG. 9B is an assembly table of the assembly apparatus applied to the method for manufacturing the electronic thermometer according to the first modified example. It is a top view which shows a shape. Moreover, FIG. 10 is a figure which shows the location which should be hold | maintained when mounting the subcase of an electronic thermometer on an assembly base in the said 1st modification. First, with reference to these FIG. 9A, FIG. 9B, and FIG. 10, the 1st modification of this Embodiment is demonstrated.

As shown in FIG. 9A, in the first modification, one guide hole 59 is provided at a predetermined position of the sub case 50 in addition to the above-described one reference hole 58 for positioning. Corresponding to this, as shown in FIG. 9B, one guide pin 106 is also provided at a predetermined position of the assembly base 102. Here, the assembling table 102 is not provided with the guide blocks 104 and 105 as described above.

The guide hole 59 provided in the sub case 50 is formed in a size and shape into which the guide pin 106 provided in the assembly base 102 can be inserted. Here, the shape of the guide hole 59 and the guide pin 106 is the When viewed in plan along the insertion direction, both are formed in a perfect circle shape, and the diameter R2 of the guide hole 59 and the diameter r2 of the guide pin 106 satisfy the condition of R2> r2.

As a result, when the sub case 50 is placed on the mounting base 102, the reference pin 103 is inserted into the reference hole 58, whereby the sub case 50 can be positioned with respect to the mounting base 102 with high accuracy. At the same time, by inserting the guide pin 106 into the guide hole 59, the rotation of the sub case 50 with respect to the mounting base 102 can be prevented. Therefore, by adopting the above configuration, it is possible to prevent the rotation of the sub case 50 with respect to the mounting base 102 without providing the large guide blocks 104 and 105 as described above on the mounting base 102.

Also, the wall portion of the sub case 50 is often formed very thin, and there is a possibility that deformation such as bending or falling occurs during manufacture. Therefore, if the configuration as in the present modification is employed, the sub case 50 can be positioned with respect to the mounting base 102 without using the side surface of the sub case 50. Even if there is, an electronic thermometer can be manufactured with high yield.

Here, the difference (R2-r2) between the diameter R2 of the guide hole 59 and the diameter r2 of the guide pin 106 is larger than the difference (R1-r1) between the diameter R1 of the reference hole 58 and the diameter r1 of the reference pin 103. Preferably it is taken. This is because the positioning of the sub case 50 with respect to the mounting base 102 is sufficiently ensured by the reference hole 58 and the reference pin 103 described above. The guide hole 59 and the guide pin 106 simply rotate the sub case 50 greatly. This is because the guide pin 106 can be easily inserted into the guide hole 59 by providing a large margin for insertion in that sense.

Further, the guide hole 59 provided in the sub case 50 is provided at a position near the end (that is, the rear end) of the sub case 50 on the side opposite to the side from which the lead wire 72 is drawn out, so Assembling position accuracy with respect to 50 can be maintained with higher accuracy. By adopting the above-described configuration, this is between the reference hole 58 provided near the front end of the sub case 50 and the guide hole 59 provided near the rear end of the sub case 50. This is because a longer distance can be secured.

As shown in FIG. 10, when the configuration as in the first modified example is adopted, when the sub case 50 is placed on the assembly table 102 by the parts transfer unit 113 of the sub case supply device 110. By the holding

arms

114A and 114B of the part transfer portion 113, the substantially central portion of the side surface of the sub case 50 (that is, the side portion between the portions where the reference hole 58 and the guide hole 59 are located, the region B shown in the figure) Is preferably sandwiched and held in the horizontal direction. In this way, the sub case 50 can be more stably held by the holding

arms

114A and 114B, and the drop off of the sub case 50 from the parts transfer portion 113 can be suppressed.

FIG. 11 is a bottom view showing the shape of the sub case of the electronic thermometer according to the second modification. In addition, the shape of the assembly base of the assembly apparatus applied to the manufacturing method of the electronic thermometer according to the second modification is the same as that in the first modification described above. Next, a second modification example of the present embodiment will be described with reference to FIG.

As shown in FIG. 11, in the second modification, the guide hole 59 provided in the sub case 50 has a long hole shape extending along the lead-out direction of the lead wire 72. A guide pin 106 is inserted into the elongated hole-shaped guide hole 59 when the sub case 50 is placed on the mounting base 102, thereby preventing the rotation of the sub case 50 relative to the mounting base 102. Will be.

In such a configuration, the guide pin 106 can be inserted into the guide hole 59 more easily, and further work efficiency can be improved.

FIG. 12A is a bottom view showing the shape of the sub case of the electronic thermometer according to the third modification, and FIG. 12B is an assembly table of the assembly apparatus applied to the method for manufacturing the electronic thermometer according to the third modification. It is a top view which shows a shape. Next, a third modification of the present embodiment will be described with reference to FIGS. 12A and 12B.

As shown in FIGS. 12A and 12B, in the third modification, one positioning reference hole 58 is provided at a predetermined position of the sub case 50, and a predetermined position of the mounting base 102 is correspondingly provided. One reference pin 103 is also provided at the position. Here, the assembling table 102 is not provided with the guide blocks 104 and 105 as described above.

The reference hole 58 provided in the sub case 50 is formed in a size and shape into which the reference pin 103 provided in the assembly base 102 can be inserted. Here, the shapes of the guide hole 59 and the guide pin 106 are Each is formed so as to have a non-circular shape (for example, a triangle as shown) when viewed in plan along the insertion direction.

As a result, when the sub case 50 is placed on the mounting base 102, the reference pin 103 is inserted into the reference hole 58, whereby the sub case 50 can be positioned with respect to the mounting base 102 with high accuracy. At the same time, the rotation of the sub case 50 with respect to the mounting base 102 is prevented. Therefore, by adopting the above-described configuration, the large guide blocks 104 and 105 as described above are not provided in the mounting base 102, and a guide hole for preventing rotation is separately provided in the sub case 50, or the mounting base is not provided. The rotation of the sub case 50 relative to the mounting base 102 can be prevented without providing the rotation prevention guide pin 102.

In addition, as the reference hole 58 and the reference pin 103, various shapes such as a polygonal shape such as a quadrangle and a pentagon, a cross shape, a D shape, and a star shape can be used. That is, as the shape of the reference hole 58 and the reference pin 103, any shape may be adopted as long as the rotation of the reference pin 103 is limited in the reference hole 58.

(Embodiment 2)
FIG. 13 is a plan view showing a configuration of an assembling apparatus applied to the manufacturing method of the electronic thermometer according to the second embodiment of the present invention, and FIG. 14 is a case where the manufacturing method of the electronic thermometer according to the present embodiment is adopted. FIG. FIG. 15 is a perspective view showing a state in which the second subassembly is inserted into the main body housing according to the manufacturing method of the electronic thermometer in the present embodiment. Below, with reference to these FIG. 13 thru | or FIG. 15, the structure of the assembly apparatus applied to the manufacturing method of the electronic thermometer in this Embodiment and the manufacturing method of the electronic thermometer in this Embodiment are demonstrated.

In the first embodiment described above, by using the assembly apparatus 100A shown in FIG. 5, the steps from step S102 to step S111 in the flow shown in FIG. 6 are automatically performed. On the other hand, in the present embodiment, in addition to this, the step of inserting the second subassembly 18 into the main body housing 10 is also automatically performed.

As shown in FIG. 13, an assembling apparatus 100B applied to the method for manufacturing an electronic thermometer in the present embodiment includes an insertion and unloading apparatus 210 instead of the unloading apparatus 200 of the assembling apparatus 100A shown in FIG. ing. The inserting / carrying-out device 210 is disposed at a predetermined position on the periphery of the turntable 101 and includes a parts feeder 211, a parts conveying path 212, and a parts transfer unit 213. The inserting / carrying-out device 210 extrapolates the main body housing 10 as a part to the second subassembly 18 assembled and integrated on the mounting base 102, and then assembles the second subassembly 18 together with the main body housing 10. Unload from device 100B.

Here, the parts transfer unit 213 discriminates the orientation of the main body housing 10 that has been conveyed through the parts conveyance path 212, and based on this, the main body housing 10 is reversed or rotated as necessary to provide the second subassembly. 18 to extrapolate. By configuring in this way, the direction of the main body housing 10 that is extrapolated to the second subassembly 18 can be aligned in a predetermined direction. Alternatively, the main body housing 10 whose orientation is not suitable is configured to be returned to the parts feeder 211 so that only the main housing 10 whose orientation is suitable is extrapolated to the second subassembly 18. It may be configured.

As shown in FIG. 14, the steps from step S201 to step S210 in the flow in the manufacturing method of the electronic thermometer according to the present embodiment are the same as the steps from step S101 to step S110 in the flow shown in FIG. Therefore, the description is omitted here.

As shown in FIG. 14, in step S <b> 211, the second subassembly 18 is fixed to the main body housing 10 and fixed to the main body housing 10 by being accommodated in the main body housing 10 while positioning the second subassembly 18. Then, the second subassembly 18 is carried out together with the main body housing 10 from the assembling apparatus 100B. For the fixation of the main body housing 10 to the second subassembly 18 and the unloading of the second subassembly 18 to which the main body housing 10 is fixed, the above-described insertion / unloading device 210 of the assembling apparatus 100B is used.

More specifically, as shown in FIG. 15, the rear end portion 12 of the main body housing 10 held by a holding arm (not shown) of the parts transfer portion 213 of the insertion / unloader 210 is connected to the rotary shaft 101 a side of the rotary table 101. Then, the main body housing 10 is brought close to the end of the second subassembly 18 by approaching the end of the lead wire 72 of the second subassembly 18 placed on the assembly base 102 toward the end from which the lead wire 72 is drawn. Extrapolate. At this time, the second subassembly 18 is temporarily fixed to the main body housing 10 by fitting the bulging portion 57 provided on the side surface of the sub case 50 to the inner peripheral surface of the main body housing 10. Here, in order to enable the above-described second subassembly 18 to be temporarily fixed to the main body housing 10, the assembly apparatus 100 </ b> B applied to the electronic thermometer manufacturing method according to the present embodiment is assembled. The guide block 104 that surrounds the portion near the front end portion of the sub case 50 is not provided on the base 102.

After this temporary fixing, the holding arm that holds the main body housing 10 is raised, and the second subassembly 18 is pulled away from the mounting base 102. At this time, all of the engagement between the sub case 50 and the mounting base 102 including the engagement between the reference hole 58 provided in the sub case 50 and the reference pin 103 provided in the mounting base 102 is released. Will be.

Then, in a state where the second subassembly 18 is separated from the mounting base 102, the second subassembly 18 is pushed toward the main body housing 10 by a pushing means (not shown) provided in the insertion / unloading device 210. The second subassembly 18 is completely accommodated inside the body housing 10. At that time, the sub case 50 is positioned and fixed to the main body housing 10 by the above-described bulging portion 57 and the like, and the temperature sensor 73 positioned with respect to the sub case 50 is surely connected to the front end portion of the main body housing 10. 11 is positioned at a position exposed from 11.

By adopting the manufacturing method of the electronic thermometer in the present embodiment as described above, in addition to the effect when the manufacturing method of the electronic thermometer in the above-described first embodiment is employed, the electronic thermometer 1 is more efficiently performed. The effect that can be manufactured is obtained. In particular, the automatic assembly of the second subassembly 18 and the automatic insertion of the second subassembly 18 into the main body housing 10 using the assembly apparatus 100B as shown in FIG. 13 can be performed, and the body temperature can be measured with high accuracy. The electronic thermometer 1 can be easily and inexpensively manufactured.

In the above-described embodiment of the present invention and its modifications, the description has been given by exemplifying the case where the reference hole and the guide hole provided in the sub case as the holding member are configured by through holes. The guide hole is not necessarily a through hole, and may be, for example, a hole with a bottom (that is, a recess or a groove).

Further, in the above-described embodiment of the present invention and its modifications, the description has been given by exemplifying the case where one reference hole is provided in the sub case as the holding member and at most one guide hole is provided. However, these numbers are not limited, and a plurality of these may be provided. However, in this case, it is necessary to adjust the number of reference pins and guide pins provided on the assembly base accordingly.

Further, in the above-described embodiment of the present invention and the modification thereof, the case where the shape of the reference pin and the guide pin provided on the assembly base is a columnar shape or a triangular prism shape has been described as an example. In order to facilitate insertion into a reference hole and a guide hole provided in a sub case as a member, the reference pin and the guide pin may be tapered.

Further, in the above-described embodiment of the present invention and the modifications thereof, the case where the sub case as the holding member and the closing member attached to the rear end portion of the main body housing are configured as separate members will be described as an example. Although it has been carried out, it is naturally possible to manufacture them as one member in advance. When configured in this manner, the manufacturing cost can be reduced as the number of parts decreases.

Further, in the above-described embodiment of the present invention and the modification thereof, the case where a box-shaped sub case is employed as the holding member has been described as an example. However, instead of this, a holding having a plate shape is used. It is good also as using a member.

Further, in the above-described embodiment of the present invention and the modification thereof, the case where the buzzer cover, the terminal, the fixing member, and the terminal are configured to be supplied to the sub case as an integrated part has been exemplified. Of course, it is also possible to supply the fixing member and the terminal as separate members to the sub case. Further, in the above-described embodiment of the present invention and its modification, the case where heat caulking is used for fixing the printed circuit board to the sub case has been described as an example, but the tip of the support pin of the sub case has a wedge shape. It is also possible to fix the printed circuit board to the sub case by providing a locking portion and inserting a through hole of the printed circuit board into the support pin. Thus, the specific method for assembling the various components described above is merely an example, and other methods can naturally be adopted.

Further, in the above-described embodiment of the present invention and its modifications, the case where a body formed of a hard resin member is used as the main body housing of the electronic thermometer has been described as an example. A portion having a flexibility formed by a soft resin member near the temperature measuring portion (that is, near the front end portion) may be used, and the present invention can naturally be applied to such a case. .

Further, in the above-described embodiment of the present invention and its modifications, only the case where a part of various steps for manufacturing an electronic thermometer is configured to be performed by an automatic machine will be described as an example. However, the present invention does not exclude application to the case where an electronic thermometer is manufactured without using an automatic machine, or to the case where all the various processes are performed using an automatic machine.

As described above, the above-described embodiments and modifications thereof disclosed herein are illustrative in all respects and are not restrictive. The technical scope of the present invention is defined by the scope of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 electronic thermometer, 2 control section, 3 memory section, 4 display section, 5 operation section, 6 notification section, 7 power supply section, 8 temperature measurement section, 10 body housing, 11 front end section, 12 rear end section, 13 hollow section, 15 cap, 16 closing member, 17 first subassembly, 18 second subassembly, 50 subcase, 51 display window, 52 operating section tongue, 53 buzzer housing, 54 fixing member housing, 55 battery Housing part, 56 support pin, 57 bulge part, 58 reference hole, 59 guide hole, 61 display part assembly, 62 operation part assembly, 63 elastic connector, 65 buzzer, 66 buzzer cover, 67 terminal, 68 fixing member, 69 terminals, 70 printed circuit boards, 71 through holes, 72 lead wires, 73 temperature sensors, 100A, 100B assembly equipment, 10 Rotating table, 101a Rotating shaft, 102 Assembly base, 103 Reference pin, 104, 105 Guide block, 106 Guide pin, 110 Sub case feeder, 111 Parts feeder, 112 Parts transport path, 113 Parts transfer section, 114A, 114B Holding arm, 120 display unit assembly supply device, 130 operation unit assembly supply device, 140 elastic connector supply device, 150 buzzer supply device, 160 buzzer cover supply device with terminal, 170 fixed member supply device with terminal, 180 first sub Assembly supply device, 190 heat caulking device, 200 unloading device, 210 insertion and unloading device, 211 parts feeder, 212 parts conveying path, 213 parts transfer section.

Claims

A printed circuit board (70) on which a processing circuit is formed, a lead wire (72) having one end fixed to the printed circuit board (70), and a temperature sensor (73) fixed to the other end of the lead wire (72) A holding member (50) for holding the printed circuit board (70), and a housing (10, 10) for accommodating the printed circuit board (70), the lead wire (72), the temperature sensor (73), and the holding member (50). 15, 16), and a method of manufacturing an electronic thermometer,
The printed circuit board (70), the lead wire (72), and the temperature sensor (73) are fixed to the printed circuit board (70) by positioning and fixing the temperature sensor (73) via the lead wire (72). Forming a first subassembly (17) comprising:
The holding member (50) is inserted into the positioning reference hole (58) provided in the holding member (50) by inserting a positioning reference pin (103) provided on the assembly base (102). Placing on the assembly table (102) while positioning;
The holding member (50) and the first subassembly are assembled by positioning the first subassembly (17) on the holding member (50) positioned and mounted on the assembly base (102). Forming a second subassembly (18) comprising: (17);
Assembling the second subassembly (18) to the housing (10) by positioning and accommodating the second subassembly (18) in the housing (10, 15, 16). The manufacturing method of an electronic thermometer.
The method for manufacturing an electronic thermometer according to claim 1, wherein the reference hole (58) is provided at a position near the end of the holding member (50) on the side from which the lead wire (72) is drawn.
When the reference pin (103) and the reference hole (58) are viewed in plan along the insertion direction, these shapes are all made into a perfect circle,
In the step of positioning and holding the holding member (50) on the assembly base (102), at least a part of the side surface of the holding member (50) is provided on the assembly base (102) to prevent rotation. By mounting the holding member (50) on the assembly base (102) so as to face the guide blocks (104, 105) for use, the holding member (50) with respect to the assembly base (102) The manufacturing method of the electronic thermometer of Claim 1 which prevents rotation.
In a state where the holding member (50) is positioned and placed on the assembly base (102), the guide block (104) is located on the side surface portion closest to the reference hole (58) of the holding member (50). The manufacturing method of the electronic thermometer of Claim 3 made to face.
When the reference pin (103) and the reference hole (58) are viewed in plan along the insertion direction, these shapes are all made into a perfect circle,
In the step of positioning and holding the holding member (50) on the assembly base (102), a guide pin (106) for preventing rotation provided on the assembly base (102) is attached to the holding member (50). 2. The electronic device according to claim 1, wherein the holding member (50) is prevented from rotating with respect to the assembly base (102) by being inserted into a rotation-preventing guide hole (59) provided in the electronic device according to claim 1. A method of manufacturing a thermometer.
The electronic thermometer according to claim 5, wherein the guide hole (59) is provided at a position near the end of the holding member (50) opposite to the side from which the lead wire (72) is drawn. Method.
When the guide pin (106) and the guide hole (59) are viewed in plan along the insertion direction, these shapes are all made into a perfect circle shape,
The difference between the diameter of the guide pin (106) and the diameter of the guide hole (59) is larger than the difference between the diameter of the reference pin (103) and the diameter of the reference hole (58). The manufacturing method of the electronic thermometer of the range 5th term | claim.
When the guide pin (106) and the guide hole (59) are viewed in plan along the insertion direction, the guide pin (106) has a perfect circular shape, and the guide hole (59) The method for manufacturing an electronic thermometer according to claim 5, wherein the shape is an elongated hole shape extending along the lead-out direction of the lead wire (72).
When the reference pin (103) and the reference hole (58) are viewed in plan along the insertion direction, these shapes are all non-circular,
In the step of positioning and holding the holding member (50) on the assembly base (102), the reference pin (103) provided on the assembly base (102) is provided on the holding member (50). The method of manufacturing an electronic thermometer according to claim 1, wherein the holding member (50) is prevented from rotating with respect to the assembly base (102) by being inserted into the reference hole (58).
A step of assembling other parts other than the first subassembly (17) to the holding member (50) placed on the assembly base (102);
A plurality of the assembly tables (102) are provided along the circumferential direction of the turntable (101), and the first subassembly (17) and the other parts are supplied along the periphery of the turntable (101), respectively. The first subassembly (17) and the other components are arranged on each of the assembly bases (102) that are arranged along the circumferential direction as the rotary table (101) rotates. Are individually supplied from the various supply devices,
In the step of positioning and holding the holding member (50) on the assembly base (102), the end of the holding member (50) on the side from which the lead wire (72) is pulled out is the rotary table (101). 2. The method of manufacturing an electronic thermometer according to claim 1, wherein the holding member (50) is placed on the assembly base (102) such that the holding member (50) is positioned on the side of the rotation center (101 a).
An electronic thermometer manufactured according to the method for manufacturing an electronic thermometer according to claim 1.