Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
  • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
  • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/83—Electrodes
  • H10H20/831—Electrodes characterised by their shape
  • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/81—Bodies
  • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/81—Bodies
  • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/81—Bodies
  • H10H20/822—Materials of the light-emitting regions
  • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
  • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/851—Wavelength conversion means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
  • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
  • H10W72/541—Dispositions of bond wires
  • H10W72/547—Dispositions of multiple bond wires

Definitions

• Radiation-emitting Semiconductor Device There is a radiation-emitting semiconductor device
• conversion elements in the beam path of the primary radiation emitted by the light-emitting diode chip can be used in order to convert part of the short-wave primary radiation into longer-wave secondary radiation.
• Secondary radiation determines the emission color of the emitted light.
• the wavelengths of the primary radiation of different light-emitting diode chips differ - even if they are produced together and originate, for example, from a single wafer - and, on the other hand, the optical thicknesses of the conversion elements are such that they become one
• LED chips with emission colors within certain desired limits LED chips are sorted (so-called binning).
• One problem to be solved is to
• Specify radiation-emitting semiconductor device in which the color of the emitted light can be adjusted.
• Radiation-emitting semiconductor device includes the
• the LED chip comprises at least two independently operable emission regions.
• the LED chip is in at least two
• Emission areas separated which can be operated independently.
• electromagnetic radiation can be generated at the same or at different times.
• the emission regions can be energized with different current intensity, so that electromagnetic radiation with mutually different intensities can be generated by the emission regions.
• Radiation-emitting semiconductor device includes the
• LED chip at least two differently configured conversion elements. "Differently designed" means that the conversion elements, if they are with
• Electromagnetic radiation of the same wavelength and the same intensity are irradiated from each other
• the conversion elements may differ from each other in terms of their geometric dimensions, such as their thickness, and / or their composition.
• a first conversion element may contain a first phosphor, while the second conversion element contains a second phosphor. Also, the first conversion element may contain a first phosphor, while the second conversion element contains a second phosphor. Also, the first conversion element may contain a first phosphor, while the second conversion element contains a second phosphor. Also, the first conversion element may contain a first phosphor, while the second conversion element contains a second phosphor. Also, the
• each of the emission regions of the light-emitting diode chip is in
• the emission regions can each have an active zone in which electromagnetic radiation can be generated during the operation of the light-emitting diode chip.
• the emission regions can have identically formed active zones, so that the primary radiation generated in the emission regions always has the same wavelength.
• the emission regions can be generated, for example, by structuring a contact of the LED chip. Preference is given to the contact, the
• the emission regions may then comprise a common active layer extending through all emission regions
• the semiconductor body of the light-emitting diode chip to separate the light-emitting diode chip into a plurality of emission regions itself is structured so that, for example, an active layer is severed.
• each emission region of the light-emitting diode chip has a
• Primary radiation is coupled out of the LED chip.
• the emission surfaces are arranged, for example, in a main surface of the LED chip on its upper side.
• the conversion elements are for absorbing at least part of the primary radiation and for re-emission of
• the primary radiation is electromagnetic radiation from the wavelength range of blue light.
• Conversion elements can then be provided for re-emission of yellow light as secondary radiation.
• Primary radiation and secondary radiation can mix to white light.
• each emission region of the light-emitting diode chip each have an emission surface, wherein each emission surface is a conversion element
• the mixed light emitted by the two emission surfaces also differs from each other.
• Radiation-emitting semiconductor device includes the Radiation-emitting semiconductor device, an electrical resistance element.
• the electrical resistance element is a component which has a predeterminable, preferably adjustable electrical resistance.
• the electrical resistance element is connected in series or in parallel with at least one of the emission regions.
• the semiconductor device can also be several electrical
• Emission areas can be assigned.
• LED chips are connected in series or in parallel.
• electrical resistance elements can be connected in parallel with the emission regions in the case of series connection, and in the case of the parallel connection electrical resistance elements can be connected in series.
• the parallel connection of the emission regions offers the advantage of a common cathode or anode, which reduces the outlay for the production of the light-emitting diode chip of the
• a semiconductor component is provided to emit white light, wherein, for example, blue light generated in the emission regions is at least partially wavelength-converted by the conversion elements in such a way that white light results.
• the emission regions are preferably connected in parallel in this case, the
• Resistor element is connected in series. It proves to be particularly advantageous if the resistance element is connected in series in front of an emission region whose Emission surface downstream of a conversion element, which converts the light generated by the emission region or the electromagnetic radiation generated by the emission region less than other existing in the semiconductor device conversion elements.
• the conversion element is thinner or the concentration of a
• Phosphor is smaller in this conversion element than in other conversion elements. In other words that's it
• Resistor element connected in series to an emission region, which emits, for example, together with its conversion element, more blue light than other pairs of
• the LED chip comprises at least two independently operable
• the electrical resistance element is connected in series or in parallel at least one of the emission regions.
• the LED chip further comprises at least two differently configured conversion elements. Each of the emission regions of the LED chip is in operation for
• each emission region has an emission surface through which at least a portion of the primary radiation from the LED chip is coupled out.
• the conversion elements are provided for absorbing at least part of the primary radiation and for re-emitting secondary radiation, wherein the differently configured conversion elements are arranged downstream of different emission surfaces.
• LED chip with at least two emission areas, whose emission areas separate from each other
• Conversion elements for the emission areas can be different
• Resistive elements are set. Overall, a semiconductor device is specified in this way, in which a total emission of defined color can be set.
• Conversion element is arranged downstream. From the associated emission surface is then in operation, for example
• Emission surfaces may then comprise a conversion element or conversion elements that over-convert a little. That is, that radiated from these pairs of emission areas with emission areas and conversion elements
• the electrical resistance element is a component that is spatially separated from the light-emitting diode chip.
• the light-emitting diode chip can comprise, for each emission region, at least one contact point at which an external electrical
• Resistance element can be connected.
• the electrical resistance element can then, for example, a
• the electrical resistance element may be mounted on a common carrier of
• Such a carrier may be arranged.
• Such a carrier may be arranged.
• Radiation-emitting semiconductor device is the
• the resistance element can, for example, in a carrier be integrated for the emission regions of the LED chip. Furthermore, it is possible for the resistance element to be arranged on an outer surface of the light-emitting diode chip. Both cases allow a radiation-emitting semiconductor device, which is designed to be particularly compact.
• Radiation-emitting semiconductor device is the
• Resistance element formed as a layer on a
• the layer may be formed, for example, as a metal layer or as a layer of a doped semiconductor material.
• the layer can for example be applied directly to the semiconductor body of the
• the layer is applied to the main surface of the light-emitting diode chip, which also includes the emission surfaces of the individual emission regions. That means the layer is
• the resistance element is arranged below the emission surfaces.
• the resistance element can be arranged, for example, between the light-emitting diode chip and a carrier.
• Radiation-emitting semiconductor device the layer forming the resistive element, a plurality of
• the electrically conductive portions are for example strip-shaped and connected at least in places.
• the portions of the layer may form a grid-like grid. At least one of the sections can be used for adjustment be severed by the resistance of the resistive element.
• connection points of the resistive element reduced, so that the electrical resistance of the resistive element can be increased by the cutting.
• the resistance can also be changed by providing predetermined electrically conductive partial structures
• Conductive compounds can be applied, for example, by conductive adhesive materials or by electroplating.
• the mixed light of the individual emission surfaces mixes for the viewer in turn to a total light.
• the mixed light of different emission surfaces may be in terms of its color location and / or its
• Color temperature and / or its brightness differ.
• Radiation-emitting semiconductor device differ differently configured conversion elements with respect to their thicknesses.
• the thickness of the conversion element is measured, for example, in a direction perpendicular to the first main surface of the LED chip runs, in which also the emission surfaces of the LED chip are.
• conversion elements can be applied to all
• Material removal over an emission surface - for example by grinding or sawing with stepped tools or by location-selective removal by means of etching or ablation - is adjustable.
• Emission surfaces has different thicknesses of its layers. Alternatively, it is possible to differentiate each other on different emission surfaces
• Conversion elements set up which are present for example in the form of ceramic plates, which may consist of a ceramic phosphor. According to at least one embodiment of the
• At least one of the emission surfaces in the lateral direction is enclosed by at least one other emission surface of the radiation-emitting semiconductor component.
• the lateral direction is that direction which is parallel to the first main surface of the light-emitting diode chip and which faces the emission surfaces
• the light-emitting diode chip comprises a
• Emission surface which is arranged centrally on the first main surface. Further emission surfaces or a further emission surface are arranged around this first emission surface. Such an arrangement of emission surfaces can contribute to a mixed light mixture of the total light of the LED chip already taking place at the chip level, so that in the far field the LED chip is uniform
• Emission surface in the lateral direction is thus a
• Radiation-emitting semiconductor device lead in which the total light is emitted particularly homogeneous. According to at least one embodiment of the
• Radiation-emitting semiconductor device is at least one conductor for contacting at least one of
• Emission regions of the LED chip disposed below at least one emission surface.
• One of the advantages of this embodiment is that the first main surface of the light-emitting diode chip can be used particularly efficiently for coupling out electromagnetic radiation, since the emission surfaces are not covered by conductor tracks on the first
• Light-emitting diode chips can then also be made from only one side, for example from the bottom or the top side.
• the radiation-emitting semiconductor component described here will be explained in more detail on the basis of exemplary embodiments and the associated figures.
• the radiation-emitting semiconductor component comprises a light-emitting diode chip 1.
• the light-emitting diode chip 1 has two emission surfaces 21, 22.
• the first emission surface 21 is central in a first
• Main surface Ia arranged at the top of the LED chip 1.
• the first emission surface 21 is at least in places in the lateral direction of the second
• Each emission surface is a conversion element 31, 32 arranged downstream, wherein the two conversion elements differ from each other.
• the two conversion elements differ from each other.
• Operation of the LED chip 1 can be emitted from the emission surfaces 21, 22 forth at the same times mixed light that is made of the respective primary radiation and the
• the radiation-emitting semiconductor device further comprises an electrical resistance element 4.
• the electrical resistance element 4 is integrated into the LED chip by being applied to an outer surface of the light-emitting diode chip
• the resistance element 4 is formed as a metal layer having a plurality of electrically conductive portions 41 which are arranged like a grid.
• the metal layer consists for example of gold, nickel or
• the resistance element 4 also has Through openings 42, which cut through some of the electrically conductive portions 41 such that in the operation of the
• the severing of the sections 41 can be carried out, for example, by melting or thermal decomposition of the section 41. This is possible, for example, by impressing a high current or by bombardment with a laser beam.
• the setting of the resistance of the resistance element can furthermore be carried out as follows: First, the light-emitting diode chip 1 is still in the wafer composite after a first measurement of the
• Photoresist coated This is followed by chip-selective, ie individually for each LED chip 1, an exposure of the photoresist to the parts to be separated or connected, for example, the electrically conductive portions 41,
• the resistance elements defined in this way are separated by etching or bonding by galvanic growth of metals or by surface coating, for example by evaporation with metals and subsequent lifting of the photoresist.
• a film with a metallic coating can be placed over the wafer, this metallic coating is then transferred to the points to be joined of the resistive element by a laser pulse or by laser pulses to the wafer. That is, the compounds are made by laser-induced metal transfer.
• a metal for forming the portions of the resistive element may also be a semiconductor material
• Resistance element which is formed with a semiconductor material, can then also be done by appropriate doping - for example by ion bombardment - of the semiconductor material.
• a resistance element can, for example, also in a carrier for the emission regions of
• the emission regions 2a, 2b are contacted via the contact points 5a, 5b.
• the emission regions are connected in parallel, the resistive element is connected in series with one of the emission regions. It is also possible that the other emission region is also a resistor element 4 connected in series.
• the emission regions 2a, 2b are connected in series and a resistive element 4 is connected in parallel to one of the emission regions 2a.
• FIGS. 2A to 2D show, in schematic plan views, further exemplary embodiments of what is described here
• Conversion element 32 surrounded by four further emission surfaces 22, 23, 24, 25, which corresponding conversion elements 32, 33, 34, 35 are arranged downstream.
• Radiation-emitting semiconductor device thus includes five different emission regions with different
• an emission surface 21 with the associated conversion element 31 is of a further emission surface 22 with the associated one
• the light-emitting diode chip 1 of the radiation-emitting semiconductor component has three
• the light-emitting diode chip 1 of the radiation-emitting semiconductor component has two
• the light-emitting diode chips of the radiation-emitting semiconductor component described here can be made very flexible with regard to their emission regions, the associated emission surfaces and the associated conversion elements. Several different emission surfaces can be accommodated in a relatively small space, so that even without further optical element in the far field a uniform color impression of the radiated total light, the one
• Emission regions 2a, 2b of the LED chip 1 below the emission surfaces 21, 22 are arranged.
• the light-emitting diode chip 1 in this exemplary embodiment comprises two emission regions 2a, 2b.
• the emission regions 2a, 2b are provided by electrically insulating separation layers 61
• the contact point 5a is electrically conductively connected to the conductor track 65, which extends below the emission surface 21 of the emission region 2a.
• the contact point 5b is electrically conductively connected to the conductor track 65, which runs below the emission surface 22 of the emission region 2b.
• the electric current is over, for example
• the emission surfaces 21, 22 may include roughenings 63 that increase the likelihood of leakage of electromagnetic radiation.
• the emission regions may each comprise mirrors 68, which are provided for the reflection of electromagnetic radiation toward the emission surfaces 21, 22.
• the light-emitting diode chip 1 further comprises a carrier 67, which is connected by means of a connecting material 66 to the
• the carrier may be formed electrically insulating. Similar contacting schemes, in which printed conductors run below emission surfaces, are explained in more detail, for example, in the document DE 10 2007 022 947 A1, the disclosure content of which is hereby expressly incorporated by reference.
• a resistance element 4 is arranged below the emission surfaces 21, 22.
• the resistance element 4 is arranged between the light-emitting diode chip 1 and the carrier 67.
• the resistance element 4 is formed as a metal layer having a plurality of electrically conductive portions 41
• the resistance element 4 has, which are arranged like a grid (see also the figure IA).
• the resistance element 4 it is also possible for the resistance element 4 to be integrated below the light-emitting diode chip 1 in the carrier 67. In any case, the resistance element 4 is then from
• LED chip covers and does not lead to a
• Emission surfaces 21, 22 of the LED chip 1 is arranged.

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• 2009
  • 2009-08-12 DE DE102009037186A patent/DE102009037186A1/de not_active Withdrawn
• 2010
  • 2010-08-05 US US13/389,661 patent/US9012926B2/en not_active Expired - Fee Related
  • 2010-08-05 EP EP10740230A patent/EP2465139A1/de not_active Withdrawn
  • 2010-08-05 WO PCT/EP2010/061446 patent/WO2011018411A1/de not_active Ceased
  • 2010-08-05 JP JP2012524205A patent/JP2013502062A/ja not_active Withdrawn
  • 2010-08-05 KR KR1020127006427A patent/KR20120040741A/ko not_active Withdrawn
  • 2010-08-05 CN CN2010800356637A patent/CN102473717A/zh active Pending

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