WO2011007789A1 - Curable composition for optical material - Google Patents
Curable composition for optical material Download PDFInfo
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- WO2011007789A1 WO2011007789A1 PCT/JP2010/061865 JP2010061865W WO2011007789A1 WO 2011007789 A1 WO2011007789 A1 WO 2011007789A1 JP 2010061865 W JP2010061865 W JP 2010061865W WO 2011007789 A1 WO2011007789 A1 WO 2011007789A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/485—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms containing less than 25 silicon atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
- C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/549—Silicon-containing compounds containing silicon in a ring
Definitions
- the present invention relates to a curable composition for an optical material that gives a cured product excellent in releasability to a substrate, the cured product, and an optical member, an optical component, and an optical semiconductor module using the cured product.
- polymer materials for optical materials such as optical components such as lenses and optical fibers, adhesives and coating agents thereof, and optical semiconductors such as LEDs and light receiving elements have high transparency and hardness.
- Epoxy resins, acrylic resins, polycarbonate resins, cycloolefin resins, etc. are used.
- Patent Document 1 and Patent Document 2 disclose optical lenses or compositions made of silicone or organopolysiloxane, and propose cured products for optical lenses that ensure heat resistance, transparency, and hardness.
- the linear expansion coefficient is larger than that of the resin, so that the refractive index dependency with respect to temperature is increased or cracks are generated when a thermal shock is applied. There is.
- an object of the present invention is to provide a curable composition that has high transparency and hardness, is excellent in heat discoloration resistance, has low birefringence, and can provide a cured product suitable for an optical material. is there.
- the present invention (A) an organic compound having a number average molecular weight of 10,000 or less, containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule; (B) a polysiloxane compound containing at least two SiH groups in one molecule, obtained by reacting a bifunctional or higher organic compound with a polysiloxane compound; (C) a hydrosilylation catalyst, and (D) The following general formula: R 1 n SiO (4-n) / 2 (R 1 is hydrogen or a monovalent organic group having 1 to 50 carbon atoms, which may be substituted with oxygen, nitrogen, sulfur or halogen atoms, and each R 1 may be different or the same.
- N may be an integer from 1 to 3.
- a silicone compound having a carbon-carbon double bond having at least two SiH groups and / or reactivity with SiH groups in one molecule (A) component and (B)
- the present invention relates to a curable composition for optical materials containing 0.005 to 10 parts by weight with respect to 100 parts by weight as a total of the components.
- the viscosity of component (D) at 23 ° C. is preferably 0.001 to 5.0 Pa ⁇ s.
- the number average molecular weight in terms of polystyrene measured by gel permeation chromatography of component (D) is preferably 300 to 30000.
- the component (D) preferably has a weight loss of less than 10% after heating at 100 ° C. for 1 minute in a thermogravimetric apparatus.
- R 2 is a monovalent organic group having 1 to 50 carbon atoms, and may be substituted with oxygen, nitrogen, sulfur, or halogen atoms. Each R 2 may be different or the same. May be.) It is preferable that it is obtained from the organic compound more than bifunctional represented by these.
- R 3 is a monovalent organic group having 1 to 50 carbon atoms and may be substituted with an oxygen, nitrogen, sulfur, or halogen atom. Each R 3 may be different or the same. It may preferably be obtained from a bifunctional or higher organic compound represented by
- the component (B) is preferably obtained from a bifunctional or higher aliphatic hydrocarbon compound having a cyclic structure.
- the component (A) is preferably an aliphatic hydrocarbon compound having a cyclic structure.
- the component (A) is represented by the following general formula (I):
- R 2 is a monovalent organic group having 1 to 50 carbon atoms, and may be substituted with oxygen, nitrogen, sulfur, or halogen atoms. Each R 2 may be different or the same. May be.
- R 2 is a monovalent organic group having 1 to 50 carbon atoms, and may be substituted with oxygen, nitrogen, sulfur, or halogen atoms. Each R 2 may be different or the same. May be.
- R 3 is a monovalent organic group having 1 to 50 carbon atoms and may be substituted with an oxygen, nitrogen, sulfur, or halogen atom. Each R 3 may be different or the same. May be.) It is preferable that it is at least 1 selected from the group which consists of a compound represented by these.
- Component (A) is triallyl isocyanurate, diallyl monoglycidyl isocyanurate, divinylbenzene, bisphenol A diallyl ether, bisphenol S diallyl ether, polybutadiene, vinylnorbornene, vinylcyclohexene, and 1,4,6-trivinylcyclohexane. It is preferably at least one selected from the group consisting of
- the component (A) preferably contains at least 0.4 mmol of carbon-carbon double bonds having reactivity with SiH groups per 1 g of the component (A).
- a cured product having a Shore D hardness of 30 or more at 25 ° C.
- the present invention also relates to a transparent cured product obtained by curing the curable composition for optical materials.
- the present invention relates to an optical member, an optical component, and an optical semiconductor module that use the transparent cured product.
- the curable resin for optical materials of the present invention comprises a silicone compound having a specific structure and having at least two SiH groups and / or carbon-carbon double bonds having reactivity with SiH groups in one molecule. Because it is formulated, it has excellent mold releasability, low birefringence (low curing unevenness), high transparency, heat discoloration and hardness, and suitable for optical materials with low linear expansion coefficient at high temperature. A cured product can be obtained.
- the component (A) is an organic compound having a number average molecular weight of 10,000 or less, containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule.
- the molecular structure of the organic compound is not particularly limited, but the organic compound does not include a siloxane unit (Si—O—Si) such as a polysiloxane-organic block copolymer or a polysiloxane-organic graft copolymer.
- 90% by weight or more of the element is preferably at least one selected from the group consisting of C, H, N, O, S and halogen.
- the number average molecular weight indicates a polystyrene-reduced number average molecular weight by gel permeation chromatography (GPC).
- An organic compound having at least two carbon-carbon double bonds that are reactive with a SiH group in one molecule is an organic skeleton portion and the reactivity with the SiH group covalently bonded to the organic skeleton portion.
- Those consisting of a group having a carbon-carbon double bond having The group having a carbon-carbon double bond having reactivity with the SiH group may be covalently bonded to any part of the organic skeleton.
- the group having a carbon-carbon double bond in the organic compound (A) is not particularly limited as long as it has reactivity with the SiH group.
- Examples of the group having a carbon-carbon double bond reactive with the SiH group include the following general formula (III):
- a group having a structure represented by the formula (wherein R 4 represents a hydrogen atom or a methyl group) is preferable because of its high reactivity. From the standpoint of easy availability of raw materials, R 4 is particularly preferably a hydrogen atom.
- R 5 represents a hydrogen atom or a methyl group. Each R 5 may be the same or different.) In view of the availability of raw materials, R 5 is particularly preferably a hydrogen atom.
- the group having a carbon-carbon double bond that is reactive with the SiH group may be covalently bonded to the organic skeleton through a divalent or higher functional group.
- the divalent or higher functional group is preferably a functional group having 0 to 20 carbon atoms, and more preferably a functional group having 0 to 10 carbon atoms.
- two or more functional groups may be connected by a covalent bond to form one divalent or higher functional group in a larger unit.
- the group having a carbon-carbon double bond include vinyl group, allyl group, methallyl group, acrylic group, methacryl group, 2-allylphenyl group, 3-allylphenyl group, 4-allylphenyl group, 2 -(Allyloxy) phenyl group, 3- (allyloxy) phenyl group, 4- (allyloxy) phenyl group, 2- (allyloxy) ethyl group, 3- (allyloxy) propyl group, 2,2-bis (allyloxymethyl) butyl Groups, 3-allyloxy-2,2-bis (allyloxymethyl) propyl group, and groups represented by the following general formula.
- the organic skeleton is a skeleton mainly composed of elements selected from the group consisting of carbon, hydrogen, nictogen atoms, chalcogen atoms including oxygen, and halogen atoms, and is not particularly limited as long as it is composed of the above elements.
- organic polymer skeletons such as vinyl, saturated hydrocarbon, ether, ester, acrylate ester, carbonate, arylate, amide, imide, phenol-formaldehyde (phenol resin),
- aromatic hydrocarbons such as phenols, bisphenols, benzene, and naphthalene, aliphatic hydrocarbons, aliphatic alcohols, cyclic hydrocarbons, and the like, and organic monomer skeletons composed of two or more of these.
- the molecular weight of the organic skeleton portion is not particularly limited, but from the viewpoint of handleability, the molecular weight is preferably 10,000 or less, and more preferably 5000 or less. In this invention, molecular weight shows the number average molecular weight of polystyrene conversion by GPC.
- organic polymer skeleton examples include polyether polymers such as polyoxyethylene, polyoxypropylene, polyoxytetramethylene, polyoxyethylene-polyoxypropylene copolymer, and polybutadiene. More specific examples:
- R 6 is a monovalent organic group having 0 to 50 carbon atoms
- R 7 and R 8 are divalent organic groups having 1 to 100 carbon atoms
- X and Y are the same or different and are directly bonded or
- R 6 is preferably a monovalent hydrocarbon group having 0 to 6 carbon atoms
- R 7 and R 8 are preferably divalent hydrocarbon groups having 1 to 100 carbon atoms, and more preferably 1 to 100 carbon atoms.
- An alkylene group more preferably an alkylene group having 1 to 50 carbon atoms, X and Y are preferably the same or different, and a direct bond or a divalent hydrocarbon group having 1 to 10 carbon atoms, p, q and r are preferably Each represents an integer of 1 to 50.
- the organic group herein is not particularly limited, but is preferably a hydrocarbon-based functional group that may have an ether bond, an ester bond, an acetal bond, an imide bond, an amide bond, or a halogen compound.
- Examples of other polymers used as the organic polymer skeleton include dibasic acids such as adipic acid, phthalic acid, isophthalic acid, terephthalic acid, and hexahydrophthalic acid, and ethylene glycol, diethylene glycol, propylene glycol, tetramethylene glycol, Polyester polymers obtained by condensation with glycols such as neopentyl glycol or ring-opening polymerization of lactones; ethylene-propylene copolymers; polyisobutylene, copolymers of isobutylene and isoprene, etc .; polychloroprene; polyisoprene , Copolymers of isoprene and butadiene, acrylonitrile, styrene, etc .; copolymers of polybutadiene, butadiene and styrene, acrylonitrile, etc .; polyolefins obtained by hydrogenating polyisoprene
- R 9 is a hydrogen atom or a methyl group
- R 10 and R 11 are the same or different
- X and Y are the same or different and are directly bonded or
- the divalent organic group having 1 to 48 carbon atoms, p, q and r each represents an integer of 1 to 100
- R 12 is a hydrogen atom or a methyl group
- R 13 and R 14 are the same or different, a divalent organic group having 1 to 100 carbon atoms
- X and Y are the same or different and are directly bonded or
- n represents an integer of 1 to 50
- R 15 is a hydrogen atom or a methyl group
- R 16 and R 17 are the same or different, a divalent organic group having 1 to 100 carbon atoms
- X and Y are the same or different and are directly bonded or
- R 18 is a hydrogen atom or a methyl group
- R 19 , R 20 and R 21 are the same or different
- X and Y are the same or different
- R 10 , R 11 , R 13 and R 14 are divalent organic groups having 1 to 100 carbon atoms, preferably a hydrocarbon group, and more preferably an alkylene group.
- the carbon number of the organic group is preferably 1-60.
- R 16 and R 17 are each a divalent organic group having 1 to 100 carbon atoms, preferably a hydrocarbon group, and more preferably an alkylene group.
- the organic group preferably has 1 to 6 carbon atoms.
- R 19 , R 20 and R 21 are a divalent organic group having 1 to 6 carbon atoms, preferably a divalent hydrocarbon group having 1 to 6 carbon atoms, more preferably an alkylene having 1 to 6 carbon atoms. It is a group.
- X and Y are a direct bond or a divalent organic group having 1 to 48 carbon atoms, preferably a direct bond or a divalent hydrocarbon group having 1 to 48 carbon atoms.
- An alkylene group is more preferred.
- the carbon number of the organic group is preferably 1-12.
- p and q are each preferably an integer of 1 to 20, r is preferably an integer of 1 to 20, s is preferably an integer of 1 to 10, and n is preferably an integer of 1 to 10.
- organic monomers examples include aliphatic chain compounds such as ethane, propane, and isobutane, aliphatic cyclic compounds such as cyclopentane, dicyclopentane, and norbornane, or epoxy, oxetane, furan, and thiophene, Pyrrole, oxazole, isoxazole, thiazole, imidazole, pyrazole, furazane, triazole, tetrazole, pyran, thiine, pyridine, oxazine, thiazine, pyridazine, pyrimidine, pyrazine There are heterocyclic compounds such as a series, a piperazine series, and an isocyanurate series.
- the heterocyclic ring is not particularly limited as long as it is a cyclic compound having a hetero element in a cyclic skeleton. However, those in which Si is contained in the atoms forming the ring are excluded.
- the number of atoms forming the ring is not particularly limited and may be 3 or more. From availability, it is preferable that it is 10 or less.
- component (A) comprising an organic monomer examples include aliphatic chain polyene compound systems such as butadiene, isoprene, octadiene, decadiene, cyclopentadiene, cyclohexadiene, cyclooctadiene, dicyclopentadiene, tricyclopentadiene, Aliphatic cyclic polyene compounds such as norbornadiene, substituted aliphatic cyclic olefin compounds such as vinylcyclopentene, vinylcyclohexene and vinylnorbornene, diallyl phthalate, triallyl trimellitate, diethylene glycol bisallyl carbonate, trimethylolpropane diallyl ether, pentaerythritol Triallyl ether, 1,1,2,2-tetraallyloxyethane, diarylidenepentaerythritol, triallyl cyanurate, triallyl isocyanurate , Diallyl monoglycid
- the component (A) from the viewpoint of further improving the heat resistance, it is preferable to contain 0.4 mmol or more of a carbon-carbon double bond having reactivity with the SiH group per gram of the component (A). Those containing 1.0 mmol or more per gram are more preferable.
- the number of carbon-carbon double bonds having reactivity with the SiH group of component (A) should be at least 2 on average per molecule, but it should exceed 2 if it is desired to further improve the mechanical strength. It is preferable that the number is 3 or more. When the number of carbon-carbon double bonds having reactivity with the SiH group of component (A) is 1 or less per molecule, a crosslinked structure is obtained even if it reacts with component (B), resulting in a graft structure. Not.
- the component (A) From the viewpoint of good reactivity as the component (A), it is preferable that one or more vinyl groups are contained in one molecule, and two or more vinyl groups are contained in one molecule. Is more preferable. Further, from the viewpoint that the storage stability tends to be good, it is preferable that 6 or less vinyl groups are contained in one molecule, and it is more preferable that 4 or less vinyl groups are contained in one molecule.
- the fluidity is at a temperature of 100 ° C. or less. Some are preferred and may be linear or branched.
- the lower limit of the molecular weight is preferably 50 and the upper limit is 5000. Those having a low molecular weight have high volatility, and if the molecular weight is too large, the raw material becomes highly viscous and inferior in workability, and the effect of crosslinking due to the reaction between the alkenyl group and the SiH group tends to hardly be exhibited.
- the viscosity is preferably less than 3000 Pa ⁇ s at 23 ° C., more preferably less than 2000 Pa ⁇ s. Preferably, the one less than 1000 Pa ⁇ s is more preferable.
- the viscosity can be measured with an E-type viscometer.
- the component (A) from the viewpoint of suppression of coloring, particularly yellowing, those having a small content of a compound having a phenolic hydroxyl group and / or a derivative of a phenolic hydroxyl group are preferable. Those not containing a compound having a derivative of are more preferable.
- the phenolic hydroxyl group means a hydroxyl group directly bonded to an aromatic hydrocarbon nucleus exemplified by a benzene ring, naphthalene ring, anthracene ring, etc.
- the phenolic hydroxyl group derivative means a hydrogen atom of the above-mentioned phenolic hydroxyl group.
- a group substituted by an alkyl group such as a methyl group or an ethyl group, an alkenyl group such as a vinyl group or an allyl group, an acyl group such as an acetoxy group, or the like.
- the component (A) includes vinylcyclohexene, dicyclopentadiene, triallyl isocyanurate, diallyl monoglycidyl isocyanurate, and tris (2-acryloyloxyethyl).
- Isocyanurate, 2,2-bis (4-hydroxycyclohexyl) propane diallyl ether, 1,2,4-trivinylcyclohexane are preferred, triallyl isocyanurate, 2,2-bis (4-hydroxycyclohexyl) propane diallyl Ether and 1,2,4-trivinylcyclohexane are particularly preferred.
- the reactive group in this case include an epoxy group, an amino group, a radical polymerizable unsaturated group, a carboxyl group, an isocyanate group, a hydroxyl group, and an alkoxysilyl group.
- an epoxy group is preferred from the viewpoint that the adhesiveness can be further increased.
- R 2 is a monovalent organic group having 1 to 50 carbon atoms, and may be substituted with oxygen, nitrogen, sulfur, or halogen atoms. Each R 2 may be different or the same. The compound represented by this may be preferable.
- R 2 in the general formula (I) is preferably a monovalent organic group having 1 to 20 carbon atoms from the viewpoint that the heat resistance of the obtained cured product can be further increased. 10 monovalent organic groups are more preferable, and monovalent organic groups having 1 to 4 carbon atoms are more preferable. Examples of these preferable R 2 include methyl group, ethyl group, propyl group, butyl group, phenyl group, benzyl group, phenethyl group, vinyl group, allyl group, glycidyl group, and the following.
- organic compound represented by the general formula (I) as described above include triallyl isocyanurate and the following compounds.
- a mixture of triallyl isocyanurate and diallyl monoglycidyl isocyanurate is preferred in order to achieve both improved resin strength and light resistance of the cured product. Since the mixture has an isocyanuric ring skeleton, it is also effective from the viewpoint of heat resistance.
- the mixing ratio can be arbitrarily set, but in order to achieve the above object, triallyl isocyanurate / diallyl monoglycidyl isocyanurate (molar ratio) is preferably 99/1 to 1/99, more preferably 95/5 to 5/95. 90/10 to 10/90 is particularly preferable.
- (A) component is an aliphatic hydrocarbon compound which has a cyclic structure from a viewpoint that the Abbe number of the hardened
- vinyl norbornene, vinylcyclohexene, diallyl ether of 2,2-bis (4-hydroxycyclohexyl) propane, 1,2,4-trivinylcyclohexane and the like can be mentioned.
- a compound having the skeleton of the general formula (II) is preferable. Further, from the viewpoint of increasing the Abbe number of the obtained cured product, the compound having the skeleton of the general formula (I), the aliphatic hydrocarbon compound having a cyclic structure, and the like are preferable.
- R 3 is a monovalent organic group having 1 to 50 carbon atoms and may be substituted with an oxygen, nitrogen, sulfur, or halogen atom. Each R 3 may be different or the same. The compound represented by this may be preferable.
- R 3 is a monovalent organic group having 1 to 50 carbon atoms, preferably a hydrocarbon group, more preferably an alkenyl group. The carbon number of the organic group is preferably 1-30.
- divinylbenzenes divinylbiphenyl, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, and oligomers thereof, bisphenol A diallyl ether, bis [4- (2-allyloxy) Preferred are those in which part or all of the glycidyl group bonded to an epoxy resin containing an aromatic ring such as) phenyl] sulfone (bisphenol S diallyl ether) or phenol novolac resin is substituted with an allyl group.
- a compound having a plurality of aromatic rings is preferable from the viewpoint that the obtained cured product can have higher heat resistance.
- Such an aromatic ring preferably has the structure shown below.
- the component (A) includes triallyl isocyanurate, diallyl monoglycidyl isocyanurate, divinylbenzene, 1,4,6-trivinylcyclohexane, vinylcyclohexene, vinylnorbornene, bisphenol A. It is preferably selected from diallyl ether and bisphenol S diallyl ether. Among these, bisphenol A diallyl ether and bisphenol S diallyl ether can improve heat resistance while maintaining a low Abbe number.
- a component can be used individually or in mixture of 2 or more types.
- the component (B) of the present invention is a polysiloxane compound containing at least two SiH groups in one molecule obtained by reacting a bifunctional or higher functional organic compound with a polysiloxane compound.
- the molecular structure of the organic compound is not particularly limited, but does not include a siloxane unit (Si—O—Si) such as polysiloxane-organic block copolymer or polysiloxane-organic graft copolymer, and 90% by weight or more of the constituent elements Is preferably at least one selected from the group consisting of C, H, N, O, S and halogen. This indicates that the component (B) is not a compound composed only of a siloxane skeleton.
- the siloxane skeleton is (R 22 3 SiO 1/2 ) p (R 22 2 SiO 2/2 ) q (R 22 SiO 3/2 ) r (SiO 4/2 ) t
- R 22 represents the same or different unsubstituted or substituted monovalent hydrocarbon group
- p, q, r and t represent the number of moles of each siloxane unit
- p, q, r and t are 0 or positive
- It is a skeleton consisting of only a continuous SiO bond in the main chain, such as p + q + r + t 1.
- p is 0 to 300, preferably 0 to 100
- q is 0 to 500, preferably 0 to 300
- r is 0 to 500, preferably 0 to 300
- t is 0 to 500, preferably 0-300.
- the component (B) is bifunctional.
- an organic compound ( ⁇ ) containing two or more carbon-carbon double bonds having reactivity with SiH group in one molecule, and at least three in one molecule as a polysiloxane compound It is preferable that it is a compound obtained by hydrosilylating the polyorganosiloxane ( ⁇ ) having a SiH group.
- the molecular weight of the component (B) is not particularly limited, and any one can be suitably used. However, from the viewpoint that the fluidity of the curable composition can be more easily controlled, those having a low molecular weight are preferably used. In this case, the lower limit of the preferable molecular weight is 50, and the upper limit of the preferable molecular weight is 100,000, more preferably 10,000, and still more preferably 2,000.
- the component ( ⁇ ) is a number containing at least two carbon-carbon double bonds having reactivity with SiH groups from the viewpoint of compatibility with the components (A) and (D).
- An organic compound having an average molecular weight of 30000 or less is preferable.
- component (A1) As the organic compound having a number average molecular weight of 10,000 or less and containing at least two carbon-carbon double bonds having reactivity with SiH groups, which is the component (A). Can do.
- the component ( ⁇ 1) is used, the resulting cured product has a high crosslink density and tends to be a cured product having high mechanical strength.
- an organic compound ( ⁇ 2) containing two carbon-carbon double bonds having reactivity with the SiH group in one molecule and having a molecular weight larger than 10,000 can also be used.
- the ( ⁇ 1) component it is more preferable to use the ( ⁇ 1) component from the viewpoint of heat discoloration of the obtained cured product and transparency at high temperature.
- a compound having a skeleton of the general formula (I) or the general formula (II) is preferable from the viewpoint of high heat resistance.
- a compound having a cyclic structure for example, an aliphatic hydrocarbon compound such as vinyl norbornene, or a compound having the skeleton of the general formula (II) described above is preferable from the viewpoint of a high refractive index.
- Examples of the compound having the skeleton of the general formula (II) include divinylbenzenes, divinylbiphenyl, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, and oligomers thereof, bisphenol A diallyl ether, And glycidyl groups bonded to aromatic ring-containing epoxy resins such as bis [4- (2-allyloxy) phenyl] sulfone and phenol novolac resins are substituted with allyl groups.
- a compound having the skeleton of the general formula (II) is preferable from the viewpoint that the Abbe number of the obtained cured product is reduced. Further, from the viewpoint of increasing the Abbe number of the obtained cured product, the compound having the skeleton of the general formula (I), the aliphatic hydrocarbon compound having a cyclic structure, and the like are preferable.
- the polyorganosiloxane having at least 3 SiH groups in one molecule that can be used as the ( ⁇ ) component is not particularly limited, and is, for example, a compound described in International Publication No. 96/15194 pamphlet. Those having at least 3 SiH groups can be used.
- each R 23 and R 24 represents hydrogen or a monovalent organic group having 1 to 50 carbon atoms, and each R 23 and R 24 may be different or the same, 3 represents hydrogen, and n represents an integer of 1 to 1000).
- R 23 and R 24 are preferably monovalent organic groups having 1 to 20 carbon atoms, and monovalent organic groups having 1 to 15 carbon atoms from the viewpoint that the resulting cured product can have higher heat resistance.
- the organic group is more preferably a monovalent organic group having 1 to 10 carbon atoms.
- examples of these preferable R 23 and R 24 include methyl group, ethyl group, propyl group, butyl group, phenyl group, benzyl group, phenethyl group, methoxy group, ethoxy group, vinyl group, allyl group, glycidyl group and the like. Can be mentioned.
- n is preferably an integer of 1 to 300.
- examples of the cyclic polyorganosiloxane include the following general formula (VI):
- R 25 represents hydrogen or an organic group having 1 to 6 carbon atoms, and each R 25 may be different or the same, but at least three are hydrogen.
- N is 2 to 10.
- R 25 in the general formula (VI) is preferably an organic group having 1 to 6 carbon atoms composed of C, H, and O, and more preferably a hydrocarbon group having 1 to 6 carbon atoms. Preferably, it is an alkyl group having 1 to 6 carbon atoms.
- N is preferably an integer of 3 to 10.
- cyclic polyorganosiloxane represented by the general formula (VI) include 1,3,5-trimethylcyclotrisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5 , 7,9-pentamethylcyclopentasiloxane and the like.
- a linear and / or cyclic and / or branched polyorganosiloxane having at least 3 SiH groups in one molecule is preferable.
- a cyclic polyorganosiloxane or a linear polyorganosiloxane having a molecular weight of 10,000 or less is preferable.
- glass transition temperature cyclic and branched polyorganosiloxanes are preferred.
- high strength cyclic polyorganosiloxane is preferred.
- the ( ⁇ ) component can be used alone or in combination of two or more.
- the mixing ratio of the bifunctional or higher organic compound and the polysiloxane compound in the hydrosilylation reaction is not particularly limited as long as two or more SiH groups remain in one molecule.
- the number of moles of carbon-carbon double bonds having reactivity with SiH groups in the ( ⁇ ) component is preferably Y / X ⁇ 5, and more preferably Y / X ⁇ 3. From the viewpoint of the heat resistance of the cured product, 3 ⁇ Y / X ⁇ 0.7 is preferable, and 2 ⁇ Y / X ⁇ 0.8 is more preferable.
- an appropriate catalyst may be used.
- the catalyst for example, the component (C) described later can be used.
- the addition amount of the catalyst is not particularly limited, but the lower limit of the preferable addition amount is sufficient for the polyorganosiloxane ( ⁇ ) component having SiH groups in order to have sufficient curability and keep the cost of the curable composition relatively low. 10 -10 mol per SiH group 1 mol, more preferably 10 -8 mole, the upper limit of the preferable amount is, the polyorganosiloxane (beta) 10 per mole of the SiH group in component having an SiH group - 1 mol, more preferably 10 -3 mol.
- a cocatalyst can be used in combination with the above catalyst.
- examples thereof include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl malate, 2-hydroxy-2-methyl-1 -Acetylene alcohol compounds such as butyne, sulfur compounds such as simple sulfur, and amine compounds such as triethylamine.
- the addition amount of the cocatalyst is not particularly limited, but the lower limit of the preferable addition amount with respect to 1 mol of the hydrosilylation catalyst is 10 ⁇ 5 mol, more preferably 10 ⁇ 1 mol, and the upper limit of the preferable addition amount is 10 2. Mol, more preferably 10 mol.
- a method in which a mixture of the ( ⁇ ) component and the hydrosilylation catalyst (C) is mixed with the ( ⁇ ) component is preferable.
- the method of mixing the hydrosilylation catalyst (C) with the mixture of the ( ⁇ ) component and the ( ⁇ ) component it may be difficult to control the reaction.
- the lower limit of the preferred temperature range is 30 ° C., more preferably 50 ° C.
- the upper limit of the preferred temperature range is 200 ° C., more preferably 150 ° C. If the reaction temperature is low, the reaction time for sufficient reaction tends to be long, and if the reaction temperature is high, it may be industrially disadvantageous.
- the reaction may be carried out at a constant temperature, and the temperature may be changed in multiple steps or continuously as required.
- the reaction time is not particularly limited. From the economical aspect, it is preferably within 20 hours, more preferably within 10 hours.
- the pressure is not particularly limited, but is preferably from atmospheric pressure to 5 MPa, more preferably from atmospheric pressure to 2 MPa from the viewpoint that a special apparatus is required and the operation becomes complicated.
- a solvent may be used during the hydrosilylation reaction.
- Solvents that can be used are not particularly limited as long as they do not inhibit the hydrosilylation reaction. Specifically, hydrocarbon solvents such as benzene, toluene, hexane, heptane, tetrahydrofuran, 1,4-dioxane, 1, Ether solvents such as 3-dioxolane and diethyl ether, ketone solvents such as acetone and methyl ethyl ketone, and halogen solvents such as chloroform, methylene chloride and 1,2-dichloroethane can be preferably used.
- the solvent can also be used as a mixed solvent of two or more types.
- solvent toluene, tetrahydrofuran, 1,3-dioxolane, 1,4-dioxane and chloroform are preferable.
- the amount of solvent to be used can also be set as appropriate.
- the amount of the solvent used is not particularly limited, but is preferably an amount that can completely dissolve the component ( ⁇ ) in order to make the reaction uniform and promote.
- ( ⁇ ) 20 parts by weight or more and 500 parts by weight or less are preferable with respect to 100 parts by weight of the component, and 50 parts by weight or more and 300 parts by weight or less are more preferable.
- additives may be used for the purpose of controlling reactivity.
- Examples of the removal method include treatment with activated carbon, aluminum silicate, silica gel and the like in addition to vacuum devolatilization.
- the upper limit of the preferable temperature in this case is 120 ° C, more preferably 100 ° C.
- Examples of the component (B) obtained by the above method include a reaction product of triallyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, diallyl monoglycidyl isocyanurate and 1,3,5,7.
- reaction product of (b) cyclotetrasiloxane reaction product of monoallyl diglycidyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, divinylbenzene and 1,3,5,7-tetramethylcyclotetrasiloxane
- reaction product of bisphenol A diallyl ether and 1,3,5,7-tetramethylcyclotetrasiloxane reaction product of vinylnorbornene and 1,3,5,7-tetramethylcyclotetrasiloxane, bis [4 -(2-Allyloxy) phenyl] sulfone and 1,3,5,7-tetramethylsilane
- the reaction product of (b) cyclotetrasiloxane is more preferred.
- (B) component can be used individually or in mixture of 2 or more types.
- the hydrosilylation catalyst is not particularly limited as long as it has catalytic activity for the hydrosilylation reaction.
- platinum alone solid platinum supported on a support such as alumina, silica, carbon black; chloroplatinic acid; platinum chloride Complexes of acids with alcohols, aldehydes, ketones, etc .; platinum-olefin complexes (eg Pt (CH 2 ⁇ CH 2 ) 2 (PPh 3 ) 2 , Pt (CH 2 ⁇ CH 2 ) 2 Cl 2 ); platinum-vinyl Siloxane complexes (eg, Pt (ViMe 2 SiOSiMe 2 Vi) a , Pt [(MeViSiO) 4 ] b ); platinum-phosphine complexes (eg, Pt (PPh 3 ) 4 , Pt (PBu 3 ) 4 ); platinum-phos Fight complexes (e.g., Pt [P (OPh) 3 ] 4, Pt [P [
- platinum chloride-olefin complexes eg, the platinum chloride-olefin complexes described in Modic US Pat. No. 3,516,946 are also useful in the present invention.
- catalysts other than platinum compounds include RhCl (PPh) 3 , RhCl 3 , RhAl 2 O 3 , RuCl 3 , IrCl 3 , FeCl 3 , AlCl 3 , PdCl 2 .2H 2 O, NiCl 2 , TiCl 4. Etc.
- chloroplatinic acid platinum-olefin complexes, platinum-vinylsiloxane complexes and the like are preferable from the viewpoint of catalytic activity.
- these catalysts may be used independently and may be used together 2 or more types.
- a cocatalyst can be used in combination with the catalyst.
- promoters include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl malate, acetylene alcohol compounds such as 2-hydroxy-2-methyl-1-butyne, and simple sulfur And the like, amine compounds such as triethylamine, water and the like.
- the addition amount of the co-catalyst is not particularly limited, with respect to the hydrosilylation catalyst 1 mol, the lower limit 10 -5 mol, the range of the upper limit 10 2 mol, more preferably lower 10 -1 mol, the upper limit 10 mols It is.
- ((D) component) Next, the following general formula as the component (D): R 1 n SiO (4-n) / 2 (R 1 is hydrogen or a monovalent organic group having 1 to 50 carbon atoms, which may be substituted with oxygen, nitrogen, sulfur or halogen atoms, and each R 1 may be different or the same. N may be an integer from 1 to 3.)
- R 1 is hydrogen or a monovalent organic group having 1 to 50 carbon atoms, which may be substituted with oxygen, nitrogen, sulfur or halogen atoms, and each R 1 may be different or the same.
- N may be an integer from 1 to 3.
- a silicone compound having a structure represented by the following formula and having a carbon-carbon double bond having reactivity with at least two SiH groups and / or SiH groups in one molecule will be described.
- the component (D) is not particularly limited as long as it is a linear and / or cyclic silicone compound having a carbon-carbon double bond having reactivity with at least two SiH groups and / or SiH groups in one molecule.
- the compounds described in International Publication WO 96/15194 Pamphlet can be used.
- the carbon-carbon double bond having reactivity with the SiH group is preferably that described in the description of the component (A).
- R 1 is preferably hydrogen or a monovalent organic group having 1 to 6 carbon atoms, more preferably hydrogen or a monovalent hydrocarbon group having 1 to 6 carbon atoms.
- component (D) contains at least two SiH groups and / or carbon-carbon double bonds having reactivity with SiH groups in one molecule, the repetition of components (A) and (B) There is an advantage that it is easy to be taken into the unit, and the obtained cured product has high surface transferability and is difficult to bleed out. From the viewpoints of availability, handling, and compatibility, the number of carbon-carbon double bonds having reactivity with SiH groups and / or SiH groups should be 50 or less per molecule. Is preferred.
- chain silicone compound examples include the following general formula (V):
- each R 23 and R 24 represents hydrogen or a monovalent organic group having 1 to 50 carbon atoms, and each R 23 and R 24 may be different or the same.
- a carbon-carbon double bond having reactivity with at least two hydrogen or SiH groups is contained in the molecule, and n represents an integer of 1 to 1000).
- a hydrocarbon group is preferable, and an alkyl group is more preferable.
- the carbon number of the organic group is preferably 1-6.
- n is preferably an integer of 1 to 500.
- cyclic silicone compound examples include the following general formula (VI):
- R 25 represents hydrogen or a monovalent organic group having 1 to 10 carbon atoms, and each R 25 may be different or the same, but at least two hydrogen atoms or A carbon-carbon double bond having reactivity with SiH groups is included, and n represents an integer of 2 to 10.
- R 25 in the general formula (VI) is preferably hydrogen or an organic group having 1 to 6 carbon atoms composed of C, H, and O, and among the organic groups, a hydrocarbon having 1 to 6 carbon atoms. And more preferably an alkyl group having 1 to 6 carbon atoms.
- N is preferably an integer of 3 to 10.
- R 23 , R 24 and R 25 are methyl group, ethyl group, propyl group, butyl group, phenyl group, benzyl group, phenethyl group, methoxy group, ethoxy group, vinyl group, allyl group, glycidyl. Group, acryloyl group and the like.
- the silicone compound When a compound having an alkoxy group or a hydroxyl group is used as the silicone compound, there is a risk of white turbidity when the cured product is exposed under high humidity conditions, or the adhesion to the substrate tends to be high.
- the viscosity of the component (D) at 23 ° C. is preferably 0.001 to 5.0 Pa ⁇ s, and 0.003 to 4 More preferably, it is 0.000 Pa ⁇ s.
- the number average molecular weight in terms of polystyrene measured by GPC as the component (D) is preferably 300 to 30,000. More preferably, it is 300 to 20000, and most preferably 300 to 15000.
- the component (D) preferably has a weight loss of less than 10% after heating at 100 ° C. for 1 minute in a thermogravimetric apparatus. . More preferably, it is less than 5%.
- the material in the said range in order to suppress volatilization of (D) component at the time of hardening from a viewpoint of transparency and refractive index of the hardened
- a linear silicone is preferable from the viewpoint of releasability of a cured product.
- a linear dimethyl silicone (DMS-V00, DMS-V03, DMS-V05, DMS-V21 manufactured by Gelest) , DMS-H03, DMS-H21, etc.), methylhydrosiloxane-dimethylsiloxane copolymer (HMS-031, HMS-151, HMS-301, etc.
- linear silicones and cyclic siloxanes having a plurality of SiH groups in one molecule are preferable.
- methyl H siloxane-dimethylsiloxane copolymer (HMS manufactured by Gelest Co., Ltd.) is used as the linear silicone.
- HMS-151, HMS-301, etc. examples of the cyclic siloxane include LS-8600, LS-8670, LS-8990 and the like manufactured by Shin-Etsu Chemical Co., Ltd.
- Component (D) is added in an amount of 0.005 to 10 parts by weight, preferably 0.03 to 5 parts by weight, particularly 100 parts by weight of the total weight of components (A) and (B). 0.1 to 3.5 parts by weight are preferred.
- the amount is less than 0.005 parts by weight, there is a problem that sufficient releasability from the substrate cannot be ensured or curing unevenness due to a rapid curing reaction occurs.
- the amount is more than 10 parts by weight, there are problems that bleed out or surface hardness decreases. In either case, there is a problem that the birefringence of the cured product is increased.
- the amount is preferably 0.005 to 2.5 parts by weight.
- the linear expansion coefficient tends to increase by using the component (D), but by using a specific amount of the component (D), the linear expansion coefficient is kept within a practically acceptable range, and a complex amount is obtained. It can be made into the composition from which the hardened
- the ratio of the component (A) to the component (B) in the curable composition is [number of moles of carbon-carbon double bond having reactivity with the SiH group of the component (A) in the curable composition /
- the value of the number of moles of SiH groups in the component (B) in the curable composition] is preferably a ratio that is in the range of 0.05 and 10 to the lower limit, and is 0.1 and 5 in the upper limit. A ratio is more preferable. Furthermore, it is more preferable that the ratio is in a range of a lower limit of 0.3 and an upper limit of 2.5.
- the ratio is preferably 1.5 or less. If it is larger than 1.5, coloring after the environmental test may become large.
- the addition amount of the hydrosilylation catalyst of the component (C) in the curable composition is not particularly limited, but in order to impart sufficient curability, the lower limit is 10 ⁇ with respect to 1 mol of the SiH group of the component (A). 10 mol, more preferably 10 -8 mole, in order to reduce the cost of the curable composition, per mole of the SiH group of component (a), the upper limit is 10 -2 mol, more preferably 10 - The range is 3 moles.
- the catalyst does not necessarily need to be added if the remaining amount used at the synthesis of the component (B) shows sufficient curability, but is newly added in the above range in order to adjust curability. It can also be added.
- a curing retarder can be used for the purpose of improving the storage stability of the composition of the present invention or adjusting the reactivity of the hydrosilylation reaction during the production process.
- the curing retarder include a compound containing an aliphatic unsaturated bond, an organic phosphorus compound, an organic sulfur compound, a nitrogen-containing compound, a tin compound, and an organic peroxide. These may be used alone or in combination of two or more.
- Examples of the compound containing an aliphatic unsaturated bond include propargyl alcohols, ene-yne compounds, maleate esters and the like.
- Examples of the organophosphorus compound include triorganophosphine, diorganophosphine, organophosphon, and triorganophosphite.
- Examples of organic sulfur compounds include organomercaptans, diorganosulfides, hydrogen sulfide, benzothiazole, thiazole, benzothiazole disulfide, and the like.
- nitrogen-containing compounds include ammonia, primary to tertiary alkylamines, arylamines, urea, hydrazine and the like.
- tin compounds include stannous halide dihydrate and stannous carboxylate.
- organic peroxide include di-tert-butyl peroxide, dicumyl peroxide, benzoyl peroxide, and tert-butyl perbenzoate.
- benzothiazole thiazole, dimethylmalate, 3-hydroxy-3-methyl-1-butyne, 1-ethynyl-1- Cyclohexanol is preferred.
- the resin examples include polycarbonate resin, polyethersulfone resin, polyarylate resin, epoxy resin, cyanate resin, phenol resin, acrylic resin, polyimide resin, polyvinyl acetal resin, urethane resin, polyester resin, and the like. It is not limited.
- the inorganic filler is preferably in the form of fine particles, and examples thereof include alumina, aluminum hydroxide, fused silica, crystalline silica, ultrafine amorphous silica, hydrophobic ultrafine silica, talc, barium sulfate, and phosphor. .
- Examples of the method for adding the filler include hydrolyzable silane monomers or oligomers such as alkoxysilanes, acyloxysilanes, and halogenated silanes, and metal alkoxides, acyloxides, and halides such as titanium and aluminum.
- Examples of the method include adding to the curable composition and reacting in the composition or a partial reaction product of the composition to form an inorganic filler in the composition.
- antioxidant may add antioxidant to the curable composition obtained by this invention.
- the anti-aging agent include citric acid, phosphoric acid, sulfur-based anti-aging agent and the like in addition to the anti-aging agents generally used such as hindered phenol type.
- the hindered phenol-based anti-aging agent various types such as Irganox 1010 available from Ciba Specialty Chemicals are used.
- Sulfur-based antioxidants include mercaptans, mercaptan salts, sulfide carboxylates, sulfides including hindered phenol sulfides, polysulfides, dithiocarboxylates, thioureas, thiophosphates, sulfonium Examples thereof include compounds, thioaldehydes, thioketones, mercaptals, mercaptols, monothioacids, polythioacids, thioamides, and sulfoxides. Moreover, these anti-aging agents may be used independently and may be used together 2 or more types.
- radical inhibitors include 2,6-di-t-butyl-3-methylphenol (BHT), 2,2′-methylene-bis (4-methyl-6-t-butylphenol), tetrakis (methylene- Phenol radical inhibitors such as 3 (3,5-di-t-butyl-4-hydroxyphenyl) propionate) methane, phenyl- ⁇ -naphthylamine, ⁇ -naphthylamine, N, N′-secondarybutyl-p- Examples include amine radical inhibitors such as phenylenediamine, phenothiazine, N, N′-diphenyl-p-phenylenediamine. Moreover, these radical inhibitors may be used alone or in combination of two or more.
- BHT 2,6-di-t-butyl-3-methylphenol
- tetrakis methylene- Phenol radical inhibitors such as 3 (3,5-di-t-butyl-4-hydroxyphenyl)
- UV absorber You may add a ultraviolet absorber to the curable composition obtained by this invention.
- the ultraviolet absorber include 2 (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, bis (2,2,6,6-tetramethyl-4-piperidine) sebacate and the like. Can be mentioned.
- these ultraviolet absorbers may be used independently and may be used together 2 or more types.
- the curable composition of the present invention includes other flame retardants, surfactants, antifoaming agents, emulsifiers, leveling agents, anti-fogging agents, ion trapping agents such as antimony-bismuth, thixotropic agents, and tackifiers.
- Ozone degradation inhibitor, light stabilizer, thickener, plasticizer, antioxidant, heat stabilizer, processing stabilizer, reactive diluent, antistatic agent, radiation blocker, nucleating agent, phosphorus peroxide Decomposing agents, lubricants, pigments, metal deactivators, adhesion-imparting agents, physical property modifiers and the like can be added as long as the object and effect of the present invention are not impaired.
- the curable composition of this invention is obtained by mixing said each component.
- a temperature range with a lower limit of 25 ° C. and an upper limit of 300 ° C. is preferred, a lower limit of 50 ° C. and an upper limit of 280 ° C. are more preferred, and a lower limit of 100 ° C. and an upper limit of 260 ° C. are even more preferred.
- the temperature is lower than 25 ° C., the reaction time for sufficiently reacting tends to be long.
- the temperature is higher than 300 ° C., the product tends to be thermally deteriorated.
- the reaction may be carried out at a constant temperature, but the temperature may be changed in multiple steps or continuously as required. Rather than carrying out the reaction at a constant temperature, the reaction is preferably carried out while raising the temperature in a multistage manner or continuously in that a uniform cured product without distortion can be easily obtained.
- the pressure during the reaction can be variously set as required, and the reaction can be carried out at normal pressure, high pressure or reduced pressure.
- the cured product obtained by curing the curable composition of the present invention is transparent, and the transmittance is well maintained even in the ultraviolet region. Specifically, it is possible to obtain a cured product having a thickness of 3 mm and a light transmittance of 60% or more at a wavelength of 400 nm.
- the light transmittance is preferably 70% or more, and more preferably 80% or more.
- the change in light transmittance at a wavelength of 400 nm is extremely small.
- the light transmittance at a wavelength of 400 nm after heat treatment at 280 ° C. for 3 minutes in the atmosphere is 60% or more, and the light transmittance change can be maintained at 10% or less.
- the light transmittance after heating is preferably 70% or more, and more preferably 80% or more.
- the change in light transmittance is preferably 5% or less.
- the cured product of the present invention has solder reflow resistance.
- such high heat resistance can increase the degree of freedom of design and application destinations of optical semiconductors, modules, and optical components.
- the cured product obtained by curing the curable composition of the present invention has a small birefringence.
- the birefringence amount is preferably less than 200 nm, and more preferably less than 100 nm.
- the cured product obtained by curing the curable composition of the present invention has a small coefficient of linear expansion.
- a cured product having a linear expansion coefficient at 30 ° C. of 150 ppm / K or less, 150 ppm at 200 ppm / K or less, preferably 185 ppm / K or less can be obtained, so there is little deviation in focus and aberration due to the temperature of the optical component, and the thermal history when the component is fixed Can be reduced in thermal shock and has excellent characteristics for optical components.
- Some parts require various coatings such as AR coating. At this time, if the linear expansion coefficient at a high temperature is large, the coating process may restrict the thermal process, which may complicate the process or prevent the coating process. However, the composition according to the present invention is used. The cured product can improve these problems.
- the cured product obtained by curing the composition of the present invention has a JIS K6253 type D durometer hardness (Shore D) of 30 or more at 25 ° C., preferably 50 or more, more preferably 55 or more, and still more preferably. It is possible to obtain more than 60. Since the Shore D hardness is high, there is an advantage that there is mechanical strength, the surface is hardly scratched, and dust is difficult to adhere. Furthermore, since mechanical processing such as a cutter or a drill is possible, a complicated shape can be given or corrected after the optical component molding.
- the glass transition temperature of the cured product obtained by curing the composition of the present invention is preferably 60 ° C. or higher, more preferably 80 ° C. or higher, and further preferably 120 ° C. or higher.
- optical component optical characteristics and dimensional accuracy largely change in the vicinity of the glass transition point. If the temperature is less than 60 ° C., the usable temperature range of the obtained molded product tends to be narrowed.
- cured material obtained by hardening the composition of this invention shows the outstanding mold release property with respect to a base material. It does not specifically limit as a base material, Raw materials, such as metal steel materials and glass used for general plastic molding, are mentioned. On these materials, a material processed by plating such as Cr or Ni or special plating containing fluorine can be used as a mold.
- the optical material referred to in the present invention refers to general materials used for applications in which light such as visible light, infrared light, ultraviolet light, X-rays, and laser passes through the material.
- the optical material can have various shapes such as a thin film such as a film or a sheet or a bulk material such as a lens or a prism.
- Applications include optical members such as light guide plates and antireflection films, optical components such as lenses and prisms, and optical semiconductor modules. More specifically, for example, various lenses and prisms used in cameras (steel cameras, digital cameras, security cameras, mobile phone cameras, in-vehicle cameras, etc.), optical measuring devices, optical memory equipment, etc. Examples thereof include various transparent films and sheets such as a sealant, a light guide plate, an antireflection film, a prism sheet, and a deflection plate, and optical semiconductor modules such as LEDs and light receiving elements.
- Two or more kinds of cured products obtained from the composition for optical materials of the present invention can be used in combination.
- Examples of the application include an imaging lens unit.
- Weight reduction rate Shimadzu Corporation DTG50H was used. After increasing the temperature from room temperature to 100 ° C. under a temperature of 20 ° C./min under a nitrogen flow (50 ml / min) under a sample amount of 11 ⁇ 1 mg, the weight loss rate after holding at 100 ° C. for 1 minute was determined.
- this is a product in which a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane has reacted with divinylbenzene (referred to as B3, SiH value: 9.0 mmol / g).
- B3 divinylbenzene
- the product was a mixture, it contained as a main component the following (B) component of the present invention.
- the platinum vinylsiloxane complex which is (C) component of this invention was contained.
- Example 1 Blended according to Table 1 below.
- C) A xylene solution of platinum-divinyltetramethyldisiloxane complex (containing 3% by weight of platinum) was used as component (C), and DMS-V05 (vinyl group-terminated linear dimethyl silicone, manufactured by Gelest) was used as component (D) at 23 ° C.
- PDV-2331 Vinyl-terminated linear dimethyl Diphenyl silicone, viscosity 1 Pa ⁇ s at 23 ° C., polystyrene equivalent molecular weight 12000, weight loss 1%, LS-8670 manufactured by Shin-Etsu Chemical Co., Ltd.
- a mixture obtained by stirring and defoaming was used as a curable composition.
- This curable composition was poured into a cell prepared by sandwiching a 3 mm-thick silicone rubber sheet as a spacer between two glass plates, and a cured product was obtained by applying heat up to 180 ° C.
- Glass-transition temperature A test piece of 30 mm ⁇ 5 mm ⁇ 3 mm is cut out from the cured product, and a tensile mode, a measurement frequency of 10 Hz, a strain of 0.1%, a static / power ratio of 1.5, and a temperature rise using DVA-200 manufactured by IT Measurement & Control Co., Ltd. Dynamic viscoelasticity measurement was performed under the condition of a lateral degree of 5 ° C./min. The peak temperature of tan ⁇ was taken as the glass transition temperature of the cured product. When there is no clear peak, it is described as ND.
- Linear expansion coefficient A test piece of 5 mm ⁇ 5 mm ⁇ 3 mm was cut out from the cured product, and a thermomechanical analysis measurement was performed using a ThermoPlus TMA8310 manufactured by Rigaku Corporation under conditions of a compression mode and a temperature rising side degree of 10 ° C./min. The linear expansion coefficient was determined from the expansion ratio at 30-40 ° C.
- the curable composition was put in an iron ointment can and a glass cell not coated with an external mold release agent, cured under the same curing conditions as in the above examples, and it was examined whether the cured product could be taken out. Those that were peeled off from the substrate after curing were marked with ⁇ , those that peeled off from the substrate when applied with force were marked with ⁇ , and those that were not peeled off from the substrate with x.
- a 50 ⁇ 50 ⁇ 3 mm test piece was cut out and measured several times using a KOBRA-CCD manufactured by Oji Scientific Instruments, and the birefringence of the entire 50 ⁇ 50 mm was measured. Those having a birefringence amount of 200 nm or more were evaluated as “x” assuming that there was uneven curing or striae, “ ⁇ ” from 100 nm to less than 200 nm, and “ ⁇ ” as less than 100 nm.
- a cured product using the curable composition of the present invention has optical transparency, heat discoloration resistance, a low linear expansion coefficient, excellent releasability, and low birefringence.
Abstract
Description
(A)SiH基との反応性を有する炭素-炭素二重結合を1分子中に少なくとも2個含有する数平均分子量10000以下の有機化合物、
(B)二官能以上の有機化合物とポリシロキサン化合物を反応させて得られた、1分子中に少なくとも2個のSiH基を含有するポリシロキサン化合物、
(C)ヒドロシリル化触媒、及び、
(D)下記一般式:
R1 nSiO(4-n)/2
(R1は、水素又は炭素数1~50の一価の有機基であって、酸素、窒素、硫黄、又はハロゲン原子で置換されていてもよく、それぞれのR1は異なっていても同一であってもよい。nは1~3の整数である。)
で表される構造を有し、1分子中に少なくとも2個のSiH基及び/又はSiH基との反応性を有する炭素-炭素二重結合を有するシリコーン化合物を、(A)成分と(B)成分との総量100重量部に対して0.005~10重量部含有する光学材料用硬化性組成物に関する。 That is, the present invention
(A) an organic compound having a number average molecular weight of 10,000 or less, containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule;
(B) a polysiloxane compound containing at least two SiH groups in one molecule, obtained by reacting a bifunctional or higher organic compound with a polysiloxane compound;
(C) a hydrosilylation catalyst, and
(D) The following general formula:
R 1 n SiO (4-n) / 2
(R 1 is hydrogen or a monovalent organic group having 1 to 50 carbon atoms, which may be substituted with oxygen, nitrogen, sulfur or halogen atoms, and each R 1 may be different or the same. N may be an integer from 1 to 3.)
And a silicone compound having a carbon-carbon double bond having at least two SiH groups and / or reactivity with SiH groups in one molecule, (A) component and (B) The present invention relates to a curable composition for optical materials containing 0.005 to 10 parts by weight with respect to 100 parts by weight as a total of the components.
で表される二官能以上の有機化合物から得られるものであることが好ましい。 (Wherein R 2 is a monovalent organic group having 1 to 50 carbon atoms, and may be substituted with oxygen, nitrogen, sulfur, or halogen atoms. Each R 2 may be different or the same. May be.)
It is preferable that it is obtained from the organic compound more than bifunctional represented by these.
で表される化合物、及び、下記一般式(II): (Wherein R 2 is a monovalent organic group having 1 to 50 carbon atoms, and may be substituted with oxygen, nitrogen, sulfur, or halogen atoms. Each R 2 may be different or the same. May be.)
And a compound represented by the following general formula (II):
で表される化合物からなる群より選択される少なくとも1つであることが好ましい。 (Wherein R 3 is a monovalent organic group having 1 to 50 carbon atoms and may be substituted with an oxygen, nitrogen, sulfur, or halogen atom. Each R 3 may be different or the same. May be.)
It is preferable that it is at least 1 selected from the group which consists of a compound represented by these.
(A)成分はSiH基との反応性を有する炭素-炭素二重結合を1分子中に少なくとも2個含有する数平均分子量10000以下の有機化合物である。上記有機化合物の分子構造は特に限定されないが、上記有機化合物としては、ポリシロキサン-有機ブロックコポリマーやポリシロキサン-有機グラフトコポリマーのようなシロキサン単位(Si-O-Si)を含むものではなく、構成元素の90重量%以上がC、H、N、O、S及びハロゲンからなる群から選択される少なくとも1種であるものが好ましい。 ((A) component)
The component (A) is an organic compound having a number average molecular weight of 10,000 or less, containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule. The molecular structure of the organic compound is not particularly limited, but the organic compound does not include a siloxane unit (Si—O—Si) such as a polysiloxane-organic block copolymer or a polysiloxane-organic graft copolymer. 90% by weight or more of the element is preferably at least one selected from the group consisting of C, H, N, O, S and halogen.
2価以上の官能基とは、炭素数0~20の官能基であることが好ましく、炭素数0~10の官能基であることがより好ましい。特に制限はないが、このような官能基の例としては、下記一般式を有する化合物が挙げられる。 The group having a carbon-carbon double bond that is reactive with the SiH group may be covalently bonded to the organic skeleton through a divalent or higher functional group.
The divalent or higher functional group is preferably a functional group having 0 to 20 carbon atoms, and more preferably a functional group having 0 to 10 carbon atoms. Although there is no restriction | limiting in particular, As an example of such a functional group, the compound which has the following general formula is mentioned.
上記炭素-炭素二重結合を有する基の具体例としては、ビニル基、アリル基、メタリル基、アクリル基、メタクリル基、2-アリルフェニル基、3-アリルフェニル基、4-アリルフェニル基、2-(アリルオキシ)フェニル基、3-(アリルオキシ)フェニル基、4-(アリルオキシ)フェニル基、2-(アリルオキシ)エチル基、3-(アリルオキシ)プロピル基、2,2-ビス(アリルオキシメチル)ブチル基、3-アリルオキシ-2,2-ビス(アリルオキシメチル)プロピル基、下記一般式で示す基が挙げられる。 Of these, two or more functional groups may be connected by a covalent bond to form one divalent or higher functional group in a larger unit.
Specific examples of the group having a carbon-carbon double bond include vinyl group, allyl group, methallyl group, acrylic group, methacryl group, 2-allylphenyl group, 3-allylphenyl group, 4-allylphenyl group, 2 -(Allyloxy) phenyl group, 3- (allyloxy) phenyl group, 4- (allyloxy) phenyl group, 2- (allyloxy) ethyl group, 3- (allyloxy) propyl group, 2,2-bis (allyloxymethyl) butyl Groups, 3-allyloxy-2,2-bis (allyloxymethyl) propyl group, and groups represented by the following general formula.
なお、R6は好ましくは炭素数0~6の一価の炭化水素基、R7及びR8は好ましくは炭素数1~100の二価の炭化水素基、より好ましくは炭素数1~100のアルキレン基、さらに好ましくは炭素数1~50のアルキレン基、X及びYは好ましくは、同一又は異なって、直接結合又は炭素数1~10の二価の炭化水素基、p、q及びrは好ましくは、それぞれ1~50の整数を表す。 (Wherein R 6 is a monovalent organic group having 0 to 50 carbon atoms, R 7 and R 8 are divalent organic groups having 1 to 100 carbon atoms, and X and Y are the same or different and are directly bonded or A divalent organic group having 1 to 48 carbon atoms, p, q and r each represents an integer of 1 to 60).
R 6 is preferably a monovalent hydrocarbon group having 0 to 6 carbon atoms, R 7 and R 8 are preferably divalent hydrocarbon groups having 1 to 100 carbon atoms, and more preferably 1 to 100 carbon atoms. An alkylene group, more preferably an alkylene group having 1 to 50 carbon atoms, X and Y are preferably the same or different, and a direct bond or a divalent hydrocarbon group having 1 to 10 carbon atoms, p, q and r are preferably Each represents an integer of 1 to 50.
等が挙げられる。 (Wherein R 18 is a hydrogen atom or a methyl group, R 19 , R 20 and R 21 are the same or different, a divalent organic group having 1 to 6 carbon atoms, X and Y are the same or different, (Direct bond or divalent organic group having 1 to 48 carbon atoms, p, q and r each represents an integer of 1 to 50, and s represents an integer of 1 to 20)
Etc.
R16及びR17は、炭素数1~100の二価の有機基であるが、炭化水素基が好ましく、アルキレン基がより好ましい。また、有機基の炭素数は、1~6が好ましい。
R19、R20及びR21は、炭素数1~6の二価の有機基であるが、好ましくは炭素数1~6の二価の炭化水素基、より好ましくは炭素数1~6のアルキレン基である。
X及びYは、直接結合又は炭素数1~48の二価の有機基であるが、直接結合又は炭素数1~48の二価の炭化水素基が好ましく、直接結合又は炭素数1~48のアルキレン基がより好ましい。有機基の炭素数は、好ましくは1~12である。
p及びqはそれぞれ好ましくは1~20の整数、rは好ましくは1~20の整数、sは好ましくは1~10の整数、nは好ましくは1~10の整数である。 R 10 , R 11 , R 13 and R 14 are divalent organic groups having 1 to 100 carbon atoms, preferably a hydrocarbon group, and more preferably an alkylene group. The carbon number of the organic group is preferably 1-60.
R 16 and R 17 are each a divalent organic group having 1 to 100 carbon atoms, preferably a hydrocarbon group, and more preferably an alkylene group. Also, the organic group preferably has 1 to 6 carbon atoms.
R 19 , R 20 and R 21 are a divalent organic group having 1 to 6 carbon atoms, preferably a divalent hydrocarbon group having 1 to 6 carbon atoms, more preferably an alkylene having 1 to 6 carbon atoms. It is a group.
X and Y are a direct bond or a divalent organic group having 1 to 48 carbon atoms, preferably a direct bond or a divalent hydrocarbon group having 1 to 48 carbon atoms. An alkylene group is more preferred. The carbon number of the organic group is preferably 1-12.
p and q are each preferably an integer of 1 to 20, r is preferably an integer of 1 to 20, s is preferably an integer of 1 to 10, and n is preferably an integer of 1 to 10.
R3としては、炭素数1~50の一価の有機基であるが、炭化水素基が好ましく、アルケニル基がより好ましい。また、有機基の炭素数は、好ましくは1~30である。
具体的には、ジビニルベンゼン類、ジビニルビフェニル、1,3-ジイソプロペニルベンゼン、1,4-ジイソプロペニルベンゼン、およびそれらのオリゴマーや、ビスフェノールAジアリルエーテルや、ビス〔4-(2-アリルオキシ)フェニル〕スルホン(ビスフェノールSジアリルエーテル)、フェノールノボラック樹脂等の芳香環を含有するエポキシ樹脂に結合するグリシジル基の一部あるいは全部をアリル基に置換したもの等が好ましい。 (Wherein R 3 is a monovalent organic group having 1 to 50 carbon atoms and may be substituted with an oxygen, nitrogen, sulfur, or halogen atom. Each R 3 may be different or the same. The compound represented by this may be preferable.
R 3 is a monovalent organic group having 1 to 50 carbon atoms, preferably a hydrocarbon group, more preferably an alkenyl group. The carbon number of the organic group is preferably 1-30.
Specifically, divinylbenzenes, divinylbiphenyl, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, and oligomers thereof, bisphenol A diallyl ether, bis [4- (2-allyloxy) Preferred are those in which part or all of the glycidyl group bonded to an epoxy resin containing an aromatic ring such as) phenyl] sulfone (bisphenol S diallyl ether) or phenol novolac resin is substituted with an allyl group.
次に、(B)成分について説明する。 ((B) component)
Next, the component (B) will be described.
(R22 3SiO1/2)p(R22 2SiO2/2)q(R22SiO3/2)r(SiO4/2)t
(R22はそれぞれ同一または異種の非置換または置換の1価炭化水素基を示し、p、q、r及びtは各シロキサン単位のモル数を示し、p、q、r及びtは0または正数であり、p+q+r+t=1である)のように、主鎖がSiO結合の連続のみからなる骨格をいう。シロキサン骨格のみからなる化合物は、pやqの値が大きい場合は、線膨張係数が大きくなってしまい、光学部品として適用し難く、rやtの値が大きい場合は、熱衝撃をかけたときに割れ易くなる傾向がある。pは0~300、好ましくは0~100であり、qは0~500、好ましくは0~300であり、rは0~500、好ましくは0~300であり、tは0~500、好ましくは0~300である。 The component (B) of the present invention is a polysiloxane compound containing at least two SiH groups in one molecule obtained by reacting a bifunctional or higher functional organic compound with a polysiloxane compound. The molecular structure of the organic compound is not particularly limited, but does not include a siloxane unit (Si—O—Si) such as polysiloxane-organic block copolymer or polysiloxane-organic graft copolymer, and 90% by weight or more of the constituent elements Is preferably at least one selected from the group consisting of C, H, N, O, S and halogen. This indicates that the component (B) is not a compound composed only of a siloxane skeleton. Here, the siloxane skeleton is
(R 22 3 SiO 1/2 ) p (R 22 2 SiO 2/2 ) q (R 22 SiO 3/2 ) r (SiO 4/2 ) t
(R 22 represents the same or different unsubstituted or substituted monovalent hydrocarbon group, p, q, r and t represent the number of moles of each siloxane unit, and p, q, r and t are 0 or positive It is a skeleton consisting of only a continuous SiO bond in the main chain, such as p + q + r + t = 1. When a compound consisting only of a siloxane skeleton has a large value of p or q, the coefficient of linear expansion increases, making it difficult to apply as an optical component. When a value of r or t is large, a thermal shock is applied. Tend to break easily. p is 0 to 300, preferably 0 to 100, q is 0 to 500, preferably 0 to 300, r is 0 to 500, preferably 0 to 300, and t is 0 to 500, preferably 0-300.
ここで(α)成分は、(A)成分や(D)成分との相溶性の観点から、SiH基との反応性を有する炭素-炭素二重結合を1分子中に少なくとも2個含有する数平均分子量30000以下の有機化合物であることが好ましい。 ((Α) component)
Here, the component (α) is a number containing at least two carbon-carbon double bonds having reactivity with SiH groups from the viewpoint of compatibility with the components (A) and (D). An organic compound having an average molecular weight of 30000 or less is preferable.
(β)成分として使用できる1分子中に少なくとも3個のSiH基を有するポリオルガノシロキサンについては、特に制限がなく、例えば国際公開第96/15194号パンフレットに記載される化合物で、1分子中に少なくとも3個のSiH基を有するものが使用できる。 ((Β) component)
The polyorganosiloxane having at least 3 SiH groups in one molecule that can be used as the (β) component is not particularly limited, and is, for example, a compound described in International Publication No. 96/15194 pamphlet. Those having at least 3 SiH groups can be used.
一般式(VI)で表される環状ポリオルガノシロキサンの好ましい具体例としては、1,3,5-トリメチルシクロトリシロキサン、1,3,5,7-テトラメチルシクロテトラシロキサン、1,3,5,7,9-ペンタメチルシクロペンタシロキサン等が挙げられる。 (Wherein R 25 represents hydrogen or an organic group having 1 to 6 carbon atoms, and each R 25 may be different or the same, but at least three are hydrogen. N is 2 to 10) And a cyclic polyorganosiloxane having at least three SiH groups in one molecule. R 25 in the general formula (VI) is preferably an organic group having 1 to 6 carbon atoms composed of C, H, and O, and more preferably a hydrocarbon group having 1 to 6 carbon atoms. Preferably, it is an alkyl group having 1 to 6 carbon atoms. N is preferably an integer of 3 to 10.
Preferable specific examples of the cyclic polyorganosiloxane represented by the general formula (VI) include 1,3,5-trimethylcyclotrisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5 , 7,9-pentamethylcyclopentasiloxane and the like.
次に、(B)成分を得るための反応について説明する。 (Preliminary reaction)
Next, the reaction for obtaining the component (B) will be described.
次に、(C)成分であるヒドロシリル化触媒について説明する。 ((C) component)
Next, the hydrosilylation catalyst as component (C) will be described.
次に、(D)成分である下記一般式:
R1 nSiO(4-n)/2
(R1は、水素又は炭素数1~50の一価の有機基であって、酸素、窒素、硫黄、又はハロゲン原子で置換されていてもよく、それぞれのR1は異なっていても同一であってもよい。nは1~3の整数である。)
で表される構造を有し、1分子中に少なくとも2個のSiH基及び/又はSiH基との反応性を有する炭素-炭素二重結合を有するシリコーン化合物について説明する。 ((D) component)
Next, the following general formula as the component (D):
R 1 n SiO (4-n) / 2
(R 1 is hydrogen or a monovalent organic group having 1 to 50 carbon atoms, which may be substituted with oxygen, nitrogen, sulfur or halogen atoms, and each R 1 may be different or the same. N may be an integer from 1 to 3.)
A silicone compound having a structure represented by the following formula and having a carbon-carbon double bond having reactivity with at least two SiH groups and / or SiH groups in one molecule will be described.
上記炭素数1~50の一価の有機基の中でも、炭化水素基が好ましく、アルキル基がより好ましい。また、有機基の炭素数は、好ましくは1~6である。nは好ましくは1~500の整数である。 (In the formula, each R 23 and R 24 represents hydrogen or a monovalent organic group having 1 to 50 carbon atoms, and each R 23 and R 24 may be different or the same. A carbon-carbon double bond having reactivity with at least two hydrogen or SiH groups is contained in the molecule, and n represents an integer of 1 to 1000).
Among the monovalent organic groups having 1 to 50 carbon atoms, a hydrocarbon group is preferable, and an alkyl group is more preferable. The carbon number of the organic group is preferably 1-6. n is preferably an integer of 1 to 500.
また、(D)成分のGPCで測定されるポリスチレン換算の数平均分子量が300~30000であることが好ましい。さらに好ましくは、300~20000、もっとも好ましくは、300~15000である。 Further, from the viewpoint of compatibility with other components contained in the curable composition, the viscosity of the component (D) at 23 ° C. is preferably 0.001 to 5.0 Pa · s, and 0.003 to 4 More preferably, it is 0.000 Pa · s.
The number average molecular weight in terms of polystyrene measured by GPC as the component (D) is preferably 300 to 30,000. More preferably, it is 300 to 20000, and most preferably 300 to 15000.
また、線膨張係数の面からは0.005~2.5重量部であることが好ましい。 Component (D) is added in an amount of 0.005 to 10 parts by weight, preferably 0.03 to 5 parts by weight, particularly 100 parts by weight of the total weight of components (A) and (B). 0.1 to 3.5 parts by weight are preferred. When the amount is less than 0.005 parts by weight, there is a problem that sufficient releasability from the substrate cannot be ensured or curing unevenness due to a rapid curing reaction occurs. When the amount is more than 10 parts by weight, there are problems that bleed out or surface hardness decreases. In either case, there is a problem that the birefringence of the cured product is increased.
In view of the linear expansion coefficient, the amount is preferably 0.005 to 2.5 parts by weight.
硬化性組成物中の(A)成分と(B)成分の比率としては、[硬化性組成物中の(A)成分のSiH基との反応性を有する炭素-炭素二重結合のモル数/硬化性組成物中の(B)成分のSiH基のモル数]の値が、下限0.05、上限10の範囲となる比率であることが好ましく、下限0.1、上限5の範囲となる比率であることがより好ましい。さらには下限0.3、上限2.5の範囲となる比率であることがより好ましい。0.05より小さい場合は炭素-炭素二重結合とSiH基との反応による架橋の効果が不十分になる傾向にあり、10より大きい場合は硬化物から未反応の(A)成分がブリードしてくる傾向にある。 (Curable composition)
The ratio of the component (A) to the component (B) in the curable composition is [number of moles of carbon-carbon double bond having reactivity with the SiH group of the component (A) in the curable composition / The value of the number of moles of SiH groups in the component (B) in the curable composition] is preferably a ratio that is in the range of 0.05 and 10 to the lower limit, and is 0.1 and 5 in the upper limit. A ratio is more preferable. Furthermore, it is more preferable that the ratio is in a range of a lower limit of 0.3 and an upper limit of 2.5. If it is smaller than 0.05, the effect of crosslinking due to the reaction between the carbon-carbon double bond and the SiH group tends to be insufficient, and if it is larger than 10, unreacted component (A) is bleed from the cured product. Tend to come.
本発明の組成物の保存安定性を改良する目的、又は、製造過程でのヒドロシリル化反応の反応性を調整する目的で、硬化遅延剤を使用することができる。硬化遅延剤としては、例えば、脂肪族不飽和結合を含有する化合物、有機リン化合物、有機硫黄化合物、窒素含有化合物、スズ系化合物、有機過酸化物等が挙げられる。これらは、単独で使用してもよく、2種以上併用してよい。 (Other additives)
A curing retarder can be used for the purpose of improving the storage stability of the composition of the present invention or adjusting the reactivity of the hydrosilylation reaction during the production process. Examples of the curing retarder include a compound containing an aliphatic unsaturated bond, an organic phosphorus compound, an organic sulfur compound, a nitrogen-containing compound, a tin compound, and an organic peroxide. These may be used alone or in combination of two or more.
また、これらの老化防止剤は単独で使用してもよく、2種以上併用してもよい。 You may add antioxidant to the curable composition obtained by this invention. Examples of the anti-aging agent include citric acid, phosphoric acid, sulfur-based anti-aging agent and the like in addition to the anti-aging agents generally used such as hindered phenol type. As the hindered phenol-based anti-aging agent, various types such as Irganox 1010 available from Ciba Specialty Chemicals are used. Sulfur-based antioxidants include mercaptans, mercaptan salts, sulfide carboxylates, sulfides including hindered phenol sulfides, polysulfides, dithiocarboxylates, thioureas, thiophosphates, sulfonium Examples thereof include compounds, thioaldehydes, thioketones, mercaptals, mercaptols, monothioacids, polythioacids, thioamides, and sulfoxides.
Moreover, these anti-aging agents may be used independently and may be used together 2 or more types.
また、これらのラジカル禁止剤は単独で使用してもよく、2種以上併用してもよい。 You may add a radical inhibitor to the curable composition obtained by this invention. Examples of radical inhibitors include 2,6-di-t-butyl-3-methylphenol (BHT), 2,2′-methylene-bis (4-methyl-6-t-butylphenol), tetrakis (methylene- Phenol radical inhibitors such as 3 (3,5-di-t-butyl-4-hydroxyphenyl) propionate) methane, phenyl-β-naphthylamine, α-naphthylamine, N, N′-secondarybutyl-p- Examples include amine radical inhibitors such as phenylenediamine, phenothiazine, N, N′-diphenyl-p-phenylenediamine.
Moreover, these radical inhibitors may be used alone or in combination of two or more.
また、これらの紫外線吸収剤は単独で使用してもよく、2種以上併用してもよい。 You may add a ultraviolet absorber to the curable composition obtained by this invention. Examples of the ultraviolet absorber include 2 (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, bis (2,2,6,6-tetramethyl-4-piperidine) sebacate and the like. Can be mentioned.
Moreover, these ultraviolet absorbers may be used independently and may be used together 2 or more types.
本発明の硬化性組成物を硬化させて得られる硬化物は透明であり、紫外線領域においても透過度の保持が良好である。具体的には3mm厚で波長400nmにおける光線透過率が60%以上である硬化物を得ることが可能である。光線透過率は好ましくは70%以上であり、より好ましくは80%以上である。 (Cured product)
The cured product obtained by curing the curable composition of the present invention is transparent, and the transmittance is well maintained even in the ultraviolet region. Specifically, it is possible to obtain a cured product having a thickness of 3 mm and a light transmittance of 60% or more at a wavelength of 400 nm. The light transmittance is preferably 70% or more, and more preferably 80% or more.
バリアン・テクノロジーズ・ジャパン・リミテッド社製、300MHz NMR装置を用いた。
(B)成分合成でのアリル基の反応率は、反応液を重クロロホルムで1%程度まで希釈したものをNMR用チューブに加えて測定し、未反応アリル基由来のメチレン基のピークと、反応アリル基由来のメチレン基のピークから求めた。ビニル基の反応率は、反応液を重クロロホルムで1%程度まで希釈したものをNMR用チューブに加えて測定し、未反応炭素-炭素二重結合由来のC-H基のピークと反応Si-C結合由来のC-H基のピークから求めた。反応生成物であるSiH基含有化合物の官能基価は、1,2-ジブロモエタン換算でのSiH基価(mmol/g)を求めた。 (NMR)
A 300 MHz NMR apparatus manufactured by Varian Technologies Japan Limited was used.
(B) The reaction rate of the allyl group in the component synthesis was measured by adding the reaction solution diluted to about 1% with deuterated chloroform to the NMR tube, the peak of the methylene group derived from the unreacted allyl group, and the reaction. It calculated | required from the peak of the methylene group derived from an allyl group. The reaction rate of the vinyl group was measured by adding a reaction solution diluted to about 1% with deuterated chloroform to an NMR tube. The peak of the CH group derived from the unreacted carbon-carbon double bond and the reaction Si— It was determined from the peak of the C—H group derived from the C bond. As the functional group value of the SiH group-containing compound as the reaction product, the SiH group value (mmol / g) in terms of 1,2-dibromoethane was obtained.
東京計器社製、E型粘度計を用いた。測定温度23℃、EHD型48φコーンで測定した。 (viscosity)
An E-type viscometer manufactured by Tokyo Keiki Co., Ltd. was used. Measurement was performed at a measurement temperature of 23 ° C. using an EHD type 48φ cone.
島津製作所社製、DTG50Hを用いた。サンプル量11±1mg、窒素気流下(50ml/分)、昇温条件20℃/分で、室温から100℃まで昇温後、100℃1分間保持後の重量減少率を求めた。 (Weight reduction rate)
Shimadzu Corporation DTG50H was used. After increasing the temperature from room temperature to 100 ° C. under a temperature of 20 ° C./min under a nitrogen flow (50 ml / min) under a sample amount of 11 ± 1 mg, the weight loss rate after holding at 100 ° C. for 1 minute was determined.
2Lオートクレーブにトルエン696g、1、3、5、7-テトラメチルシクロテトラシロキサン556gを加えて、内温が104℃になるように加熱した。そこに、トリアリルイソシアヌレート80g、白金ビニルシロキサン錯体のキシレン溶液(ユミコアプレシャスメタルズ社製PTVTS-C-3.0X、白金として3wt%含有)0.05g、トルエン60gの混合物を滴下し、7時間加熱撹拌させた。未反応の1、3、5、7-テトラメチルシクロテトラシロキサンおよびトルエンを80℃、0.4kPaにて減圧留去した。 (Synthesis Example 1)
To a 2 L autoclave, 696 g of toluene, 556 g of 1,3,5,7-tetramethylcyclotetrasiloxane were added and heated to an internal temperature of 104 ° C. A mixture of 80 g of triallyl isocyanurate, xylene solution of platinum vinylsiloxane complex (PTVTS-C-3.0X, produced by Umicore Precious Metals, 3 wt% as platinum) and 60 g of toluene was added dropwise. The mixture was heated and stirred for an hour. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure at 80 ° C. and 0.4 kPa.
2Lオートクレーブにトルエン700g、1、3、5、7-テトラメチルシクロテトラシロキサン470gを加えて、内温が105℃になるように加熱した。そこに、ビス〔4-(2-アリルオキシ)フェニル〕スルホン52gと、白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有)0.06g、トルエン15gの混合物を滴下し、8時間加熱撹拌させた。滴下中、内温が110℃まで上昇した。未反応の1、3、5、7-テトラメチルシクロテトラシロキサンおよびトルエン、キシレンを80℃、0.4kPaにて減圧留去した。1H-NMRによりこのものは1、3、5、7-テトラメチルシクロテトラシロキサンのSiH基の一部がビス〔4-(2-アリルオキシ)フェニル〕スルホンと反応したもの(B2と称す、SiH価:6.3mmol/g)であることがわかった。生成物は混合物であるが、本発明の(B)成分である下記のものを主成分として含有していた。また、本発明の(C)成分である白金ビニルシロキサン錯体を含有していた。 (Synthesis Example 2)
To a 2 L autoclave, 700 g of toluene, 470 g of 1,3,5,7-tetramethylcyclotetrasiloxane were added and heated so that the internal temperature became 105 ° C. Thereto, a mixture of 52 g of bis [4- (2-allyloxy) phenyl] sulfone, 0.06 g of platinum vinylsiloxane complex in xylene (containing 3 wt% as platinum) and 15 g of toluene was dropped, and heated and stirred for 8 hours. . During the dropping, the internal temperature rose to 110 ° C. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane, toluene and xylene were distilled off under reduced pressure at 80 ° C. and 0.4 kPa. According to 1 H-NMR, this was obtained by reacting a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane with bis [4- (2-allyloxy) phenyl] sulfone (referred to as B2, SiH Value: 6.3 mmol / g). Although the product was a mixture, it contained as a main component the following (B) component of the present invention. Moreover, the platinum vinylsiloxane complex which is (C) component of this invention was contained.
2L四つ口ナスフラスコにトルエン600g、1、3、5、7-テトラメチルシクロテトラシロキサン600gを加えて、内温が90℃になるように加熱した。そこに、ジビニルベンゼン73.5g、白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有)0.003g、トルエン73.2gの混合物を滴下した。未反応の1、3、5、7-テトラメチルシクロテトラシロキサンおよびトルエンを減圧留去した。1H-NMRによりこのものは1、3、5、7-テトラメチルシクロテトラシロキサンのSiH基の一部がジビニルベンゼンと反応したもの(B3と称す、SiH価:9.0mmol/g)であることがわかった。生成物は混合物であるが、本発明の(B)成分である下記のものを主成分として含有していた。また、本発明の(C)成分である白金ビニルシロキサン錯体を含有していた。 (Synthesis Example 3)
To a 2 L four-necked eggplant flask, 600 g of toluene, 600 g of 1,3,5,7-tetramethylcyclotetrasiloxane was added and heated so that the internal temperature was 90 ° C. Thereto was added dropwise a mixture of 73.5 g of divinylbenzene, 0.003 g of a xylene solution of platinum vinylsiloxane complex (containing 3 wt% as platinum) and 73.2 g of toluene. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure. According to 1 H-NMR, this is a product in which a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane has reacted with divinylbenzene (referred to as B3, SiH value: 9.0 mmol / g). I understood it. Although the product was a mixture, it contained as a main component the following (B) component of the present invention. Moreover, the platinum vinylsiloxane complex which is (C) component of this invention was contained.
2Lオートクレーブにトルエン600g、1、3、5、7-テトラメチルシクロテトラシロキサン360gを加えて、内温が108℃になるように加熱した。そこに、5-ビニル2-ノルボルネン35gと、白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有)0.01g、トルエン300gの混合物を滴下し、4時間加熱撹拌させた。滴下中、内温が110℃まで上昇した。未反応の1、3、5、7-テトラメチルシクロテトラシロキサンおよびトルエン、キシレンを80℃、0.1kPaにて減圧留去した。1H-NMRによりこのものは1、3、5、7-テトラメチルシクロテトラシロキサンのSiH基の一部がビニルノルボルネンと反応したもの(B4と称す、SiH価:8.0mmol/g)であることがわかった。生成物は混合物であるが、本発明の(B)成分である下記のものを主成分として含有していた。また、本発明の(C)成分である白金ビニルシロキサン錯体を含有していた。 (Synthesis Example 4)
To a 2 L autoclave was added 600 g of toluene, 360 g of 1,3,5,7-tetramethylcyclotetrasiloxane, and the mixture was heated to an internal temperature of 108 ° C. A mixture of 35 g of 5-vinyl 2-norbornene, 0.01 g of a platinum vinylsiloxane complex in xylene (containing 3 wt% as platinum) and 300 g of toluene was added dropwise, and the mixture was heated and stirred for 4 hours. During the dropping, the internal temperature rose to 110 ° C. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane, toluene and xylene were distilled off under reduced pressure at 80 ° C. and 0.1 kPa. According to 1 H-NMR, this is a product in which a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane has reacted with vinylnorbornene (referred to as B4, SiH value: 8.0 mmol / g). I understood it. Although the product was a mixture, it contained as a main component the following (B) component of the present invention. Moreover, the platinum vinylsiloxane complex which is (C) component of this invention was contained.
下記表1に従い配合した。(A)成分としてトリアリルイソシアヌレート、ジビニルベンゼン、ビニルノルボルネン、ポリブタジエン(SARTOMER社製RICON-130、ポリスチレン換算分子量4600~10000)、(B)成分として合成例1~4の合成物を用い、(C)成分として白金-ジビニルテトラメチルジシロキサン錯体のキシレン溶液(白金3重量%含有)を用い、(D)成分としてGelest社製DMS-V05(ビニル基末端直鎖状ジメチルシリコーン、23℃での粘度6mPa・s、ポリスチレン換算分子量2200、重量減少率4%)、DMS-H03(SiH基末端直鎖状ジメチルシリコーン、23℃での粘度4mPa・s、ポリスチレン換算分子量2100、重量減少率5%)、PDV-2331(ビニル基末端直鎖状ジメチルジフェニルシリコーン、23℃での粘度1Pa・s、ポリスチレン換算分子量12000、重量減少率1%)、信越化学工業社製LS-8670(ビニル末端環状ジメチルシリコーン、23℃での粘度3mPa・s、ポリスチレン換算分子量350、重量減少率7%)を用い、(D)成分に代わって一官能ポリオルガノシロキサンとして信越化学工業社製X-22-2475を用いた。その他、老化防止剤としてイルガノックス1010、ヒドロシリル化触媒として白金-ビニルシロキサン錯体のキシレン溶液、硬化遅延剤として1-エチニル-1-シクロヘキサノールを用いて、表1に示した配合割合(重量)で硬化性組成物を作製した。 (Examples 1 to 11 and Comparative Examples 1 to 4)
Blended according to Table 1 below. Triallyl isocyanurate, divinylbenzene, vinylnorbornene, polybutadiene (RICON-130 manufactured by SARTOMER, polystyrene equivalent molecular weight 4600 to 10000) as the component (A), and the synthesized products of Synthesis Examples 1 to 4 are used as the component (B). C) A xylene solution of platinum-divinyltetramethyldisiloxane complex (containing 3% by weight of platinum) was used as component (C), and DMS-V05 (vinyl group-terminated linear dimethyl silicone, manufactured by Gelest) was used as component (D) at 23 ° C. Viscosity 6 mPa · s, polystyrene conversion molecular weight 2200, weight reduction rate 4%), DMS-H03 (SiH group-terminated linear dimethyl silicone, viscosity at 23 ° C. 4 mPa · s, polystyrene conversion molecular weight 2100, weight reduction rate 5%) PDV-2331 (Vinyl-terminated linear dimethyl) Diphenyl silicone, viscosity 1 Pa · s at 23 ° C., polystyrene equivalent molecular weight 12000, weight loss 1%, LS-8670 manufactured by Shin-Etsu Chemical Co., Ltd. (vinyl-terminated cyclic dimethyl silicone, viscosity 3 mPa · s at 23 ° C., polystyrene equivalent) X-22-2475 manufactured by Shin-Etsu Chemical Co., Ltd. was used as a monofunctional polyorganosiloxane instead of the component (D). In addition, Irganox 1010 as an anti-aging agent, a xylene solution of a platinum-vinylsiloxane complex as a hydrosilylation catalyst, and 1-ethynyl-1-cyclohexanol as a curing retarder were used in the blending ratio (weight) shown in Table 1. A curable composition was prepared.
得られた硬化物(3mm厚)の400nmにおける光線透過率(「初期透過率」とする)を分光光度計(日立分光光度計U-3300)で測定した。 (Transparency of cured product)
The obtained cured product (3 mm thick) was measured for light transmittance at 400 nm (referred to as “initial transmittance”) with a spectrophotometer (Hitachi spectrophotometer U-3300).
硬化物を280℃に熱したガラスに3分間挟みこんで耐熱性試験を行った。耐熱性試験後の硬化物について、400nmの光線透過率を分光光度計(日立分光光度計U-3300)で測定し(「耐熱性試験後透過率」とする)、下式に従って硬化物耐熱性試験後透過率(光線透過率変化)を導出した。
[硬化物耐熱性試験後透過率](%)=[初期透過率](%T)-[耐熱性試験後透過率](%T) (Heat resistance test)
The cured product was sandwiched between glasses heated to 280 ° C. for 3 minutes to conduct a heat resistance test. For the cured product after the heat resistance test, the light transmittance at 400 nm was measured with a spectrophotometer (Hitachi spectrophotometer U-3300) (referred to as “transmission after heat resistance test”), and the cured product heat resistance according to the following formula The transmittance (change in light transmittance) after the test was derived.
[Transmissivity after heat resistance test of cured product] (%) = [Initial transmittance] (% T) − [Transmittance after heat resistance test] (% T)
硬化物より30mm×5mm×3mmの試験片を切り出し、アイティー計測制御社製DVA-200を用いて、引張りモード、測定周波数10Hz、歪0.1%、静/動力比1.5、昇温側度5℃/分の条件にて動的粘弾性測定を行った。tanδのピーク温度を硬化物のガラス転移温度とした。明確なピークを示さない場合は、NDと記載する。 (Glass-transition temperature)
A test piece of 30 mm × 5 mm × 3 mm is cut out from the cured product, and a tensile mode, a measurement frequency of 10 Hz, a strain of 0.1%, a static / power ratio of 1.5, and a temperature rise using DVA-200 manufactured by IT Measurement & Control Co., Ltd. Dynamic viscoelasticity measurement was performed under the condition of a lateral degree of 5 ° C./min. The peak temperature of tan δ was taken as the glass transition temperature of the cured product. When there is no clear peak, it is described as ND.
硬化物より5mm×5mm×3mmの試験片を切り出し、リガク社製ThermoPlus TMA8310を用いて、圧縮モード、昇温側度10℃/分の条件にて熱機械分析測定を行った。30-40℃での膨張の割合から線膨張係数を求めた。 (Linear expansion coefficient)
A test piece of 5 mm × 5 mm × 3 mm was cut out from the cured product, and a thermomechanical analysis measurement was performed using a ThermoPlus TMA8310 manufactured by Rigaku Corporation under conditions of a compression mode and a temperature rising side degree of 10 ° C./min. The linear expansion coefficient was determined from the expansion ratio at 30-40 ° C.
硬化物を青ガラスの上に乗せ、JIS K6253に基づき、タイプDデュロ-メータによって25℃での硬さ(ショアD)を測定した。 (Hardness test)
The cured product was placed on a blue glass, and the hardness (Shore D) at 25 ° C. was measured with a type D durometer according to JIS K6253.
硬化性組成物を鉄製の軟膏缶、および、外部離型剤を塗布していないガラスセルに入れ上記実施例と同様の硬化条件で硬化させ、硬化物を取り出せるか調べた。硬化後基材から剥がれているものを◎、力を掛けると基材から剥がれるものを〇、基材から剥がれないものを×とした。 (Releasability test)
The curable composition was put in an iron ointment can and a glass cell not coated with an external mold release agent, cured under the same curing conditions as in the above examples, and it was examined whether the cured product could be taken out. Those that were peeled off from the substrate after curing were marked with ◎, those that peeled off from the substrate when applied with force were marked with ◯, and those that were not peeled off from the substrate with x.
50×50×3mmの試験片を切り出し、王子計測機器社製KOBRA-CCDを用いて複数回測定し、50×50mm全面の複屈折を測定した。200nm以上の複屈折量が生じているものは硬化ムラや脈理があるものとして×、100nm以上200nm未満のものを△、100nm未満のものを〇として評価した。 (Birefringence determination)
A 50 × 50 × 3 mm test piece was cut out and measured several times using a KOBRA-CCD manufactured by Oji Scientific Instruments, and the birefringence of the entire 50 × 50 mm was measured. Those having a birefringence amount of 200 nm or more were evaluated as “x” assuming that there was uneven curing or striae, “Δ” from 100 nm to less than 200 nm, and “◯” as less than 100 nm.
Claims (19)
- (A)SiH基との反応性を有する炭素-炭素二重結合を1分子中に少なくとも2個含有する数平均分子量10000以下の有機化合物、
(B)二官能以上の有機化合物とポリシロキサン化合物を反応させて得られた、1分子中に少なくとも2個のSiH基を含有するポリシロキサン化合物、
(C)ヒドロシリル化触媒、及び、
(D)下記一般式:
R1 nSiO(4-n)/2
(R1は、水素又は炭素数1~50の一価の有機基であって、酸素、窒素、硫黄、又はハロゲン原子で置換されていてもよく、それぞれのR1は異なっていても同一であってもよい。nは1~3の整数である。)
で表される構造を有し、1分子中に少なくとも2個のSiH基及び/又はSiH基との反応性を有する炭素-炭素二重結合を有するシリコーン化合物を、(A)成分と(B)成分との総量100重量部に対して0.005~10重量部含有する光学材料用硬化性組成物。 (A) an organic compound having a number average molecular weight of 10,000 or less, containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule;
(B) a polysiloxane compound containing at least two SiH groups in one molecule, obtained by reacting a bifunctional or higher organic compound with a polysiloxane compound;
(C) a hydrosilylation catalyst, and
(D) The following general formula:
R 1 n SiO (4-n) / 2
(R 1 is hydrogen or a monovalent organic group having 1 to 50 carbon atoms, which may be substituted with oxygen, nitrogen, sulfur or halogen atoms, and each R 1 may be different or the same. N may be an integer from 1 to 3.)
And a silicone compound having a carbon-carbon double bond having at least two SiH groups and / or reactivity with SiH groups in one molecule, (A) component and (B) A curable composition for optical materials, containing 0.005 to 10 parts by weight with respect to 100 parts by weight as a total of the components. - (D)成分の23℃における粘度が0.001~5.0Pa・sである、請求項1に記載の光学材料用硬化性組成物。 The curable composition for optical materials according to claim 1, wherein the viscosity of component (D) at 23 ° C is 0.001 to 5.0 Pa · s.
- (D)成分のゲル浸透クロマトグラフィーで測定されるポリスチレン換算の数平均分子量が300~30000である、請求項1又は2に記載の光学材料用硬化性組成物。 The curable composition for optical materials according to claim 1 or 2, wherein the number average molecular weight in terms of polystyrene measured by gel permeation chromatography of component (D) is 300 to 30,000.
- (D)成分が、熱重量測定装置において100℃で1分間加熱後の重量減少が10%未満である、請求項1~3のいずれかに記載の光学材料用硬化性組成物。 The curable composition for optical materials according to any one of claims 1 to 3, wherein the component (D) has a weight loss of less than 10% after heating at 100 ° C for 1 minute in a thermogravimetric apparatus.
- (B)成分が、下記一般式(I):
で表される二官能以上の有機化合物から得られるものである、請求項1~4のいずれかに記載の光学材料用硬化性組成物。 (B) component is the following general formula (I):
The curable composition for optical materials according to any one of claims 1 to 4, which is obtained from a bifunctional or higher functional organic compound represented by the formula: - (B)成分が、下記一般式(II):
で表される二官能以上の有機化合物から得られるものである請求項1~4のいずれかに記載の光学材料用硬化性組成物。 (B) component is the following general formula (II):
The curable composition for optical materials according to any one of claims 1 to 4, which is obtained from a bifunctional or higher functional organic compound represented by the formula: - (B)成分が、環状構造を有する二官能以上の脂肪族炭化水素化合物から得られるものである請求項1~4のいずれかに記載の光学材料用硬化性組成物。 The curable composition for optical materials according to any one of claims 1 to 4, wherein the component (B) is obtained from a bifunctional or higher functional aliphatic hydrocarbon compound having a cyclic structure.
- (A)成分が、環状構造を有する脂肪族炭化水素化合物であることを特徴とする請求項1~7のいずれかに記載の光学材料用硬化性組成物。 The curable composition for optical materials according to any one of claims 1 to 7, wherein the component (A) is an aliphatic hydrocarbon compound having a cyclic structure.
- (A)成分が、下記一般式(I):
で表される化合物、及び、下記一般式(II):
で表される化合物からなる群より選択される少なくとも1つであることを特徴とする請求項1~7のいずれかに記載の光学材料用硬化性組成物。 The component (A) is represented by the following general formula (I):
And a compound represented by the following general formula (II):
The curable composition for optical materials according to any one of claims 1 to 7, wherein the curable composition for an optical material is at least one selected from the group consisting of compounds represented by: - (A)成分が、トリアリルイソシアヌレート、ジアリルモノグリシジルイソシアヌレート、ジビニルベンゼン、ビスフェノールAジアリルエーテル、ビスフェノールSジアリルエーテル、ポリブタジエン、ビニルノルボルネン、ビニルシクロヘキセン、及び、1,4,6-トリビニルシクロヘキサンからなる群より選択される少なくとも1つであることを特徴とする請求項1~7のいずれかに記載の光学材料用硬化性組成物。 Component (A) is triallyl isocyanurate, diallyl monoglycidyl isocyanurate, divinylbenzene, bisphenol A diallyl ether, bisphenol S diallyl ether, polybutadiene, vinylnorbornene, vinylcyclohexene, and 1,4,6-trivinylcyclohexane. The curable composition for optical materials according to any one of claims 1 to 7, wherein the curable composition for optical materials is at least one selected from the group consisting of:
- (A)成分が、SiH基との反応性を有する炭素-炭素二重結合を(A)成分1gあたり0.4mmol以上含有するものである、請求項1~10のいずれかに記載の光学材料用硬化性組成物。 The optical material according to any one of claims 1 to 10, wherein the component (A) contains at least 0.4 mmol of carbon-carbon double bonds having reactivity with SiH groups per gram of component (A). Curable composition.
- 硬化物(3mm厚)の波長400nmにおける光線透過率が60%以上である硬化物を与えることを特徴とする請求項1~11のいずれかに記載の光学材料用硬化性組成物。 The curable composition for optical materials according to any one of claims 1 to 11, wherein a cured product (3 mm thick) has a light transmittance of 60% or more at a wavelength of 400 nm.
- 硬化物(3mm厚)を大気中で280℃にて3分間熱処理した後の光線透過率が400nmの波長において60%以上である硬化物を与えることを特徴とする請求項1~12のいずれかに記載の光学材料用硬化性組成物。 The cured product (3 mm thick) is obtained by giving a cured product having a light transmittance of 60% or more at a wavelength of 400 nm after heat treatment at 280 ° C for 3 minutes in the atmosphere. The curable composition for optical materials described in 1.
- 25℃におけるショアD硬度が30以上である硬化物を与えることを特徴とする請求項1~13のいずれかに記載の光学材料用硬化性組成物。 The curable composition for optical materials according to any one of claims 1 to 13, which gives a cured product having a Shore D hardness of 30 or more at 25 ° C.
- 30℃における線膨張係数が150ppm/K以下である硬化物を与えることを特徴とする請求項1~14のいずれかに記載の光学材料用硬化性組成物。 The curable composition for optical materials according to any one of claims 1 to 14, which gives a cured product having a linear expansion coefficient at 30 ° C of 150 ppm / K or less.
- 請求項1~15のいずれかに記載の光学材料用硬化性組成物を硬化させて得られる透明硬化物。 A transparent cured product obtained by curing the curable composition for optical materials according to any one of claims 1 to 15.
- 請求項16に記載の透明硬化物を使用した光学部材。 An optical member using the transparent cured product according to claim 16.
- 請求項16に記載の透明硬化物を使用した光学部品。 An optical component using the transparent cured product according to claim 16.
- 請求項16に記載の透明硬化物を使用した光半導体モジュール。 An optical semiconductor module using the transparent cured product according to claim 16.
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JP2011522823A JP5735423B2 (en) | 2009-07-15 | 2010-07-14 | Curable composition for optical materials |
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JP2009270101A (en) * | 2008-04-11 | 2009-11-19 | Momentive Performance Materials Inc | Curable silicone composition for semiconductor and semiconductor device therewith |
WO2013051600A1 (en) * | 2011-10-04 | 2013-04-11 | 株式会社カネカ | Curable resin composition, tablet of curable resin composition, molded body, semiconductor package, semiconductor component and light emitting diode |
JP2013079331A (en) * | 2011-10-04 | 2013-05-02 | Kaneka Corp | Resin molding for led module |
JP2013174840A (en) * | 2012-02-27 | 2013-09-05 | Sumitomo Bakelite Co Ltd | Optical waveguide, optical wiring component and electronic apparatus |
JP2013174839A (en) * | 2012-02-27 | 2013-09-05 | Sumitomo Bakelite Co Ltd | Optical waveguide, optical wiring component and electronic apparatus |
JP2015081328A (en) * | 2013-10-24 | 2015-04-27 | 株式会社Adeka | Prepolymer and curable resin composition |
US9994681B2 (en) | 2015-01-13 | 2018-06-12 | Henkel Ag & Co. Kgaa | Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same |
JP2019163425A (en) * | 2018-03-20 | 2019-09-26 | 株式会社カネカ | Curable composition and optical semiconductor device using the composition as sealing agent |
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JP6038824B2 (en) * | 2014-02-07 | 2016-12-07 | 信越化学工業株式会社 | Curable composition, semiconductor device, and organosilicon compound containing ester bond |
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JP2009270101A (en) * | 2008-04-11 | 2009-11-19 | Momentive Performance Materials Inc | Curable silicone composition for semiconductor and semiconductor device therewith |
WO2013051600A1 (en) * | 2011-10-04 | 2013-04-11 | 株式会社カネカ | Curable resin composition, tablet of curable resin composition, molded body, semiconductor package, semiconductor component and light emitting diode |
JP2013079331A (en) * | 2011-10-04 | 2013-05-02 | Kaneka Corp | Resin molding for led module |
JPWO2013051600A1 (en) * | 2011-10-04 | 2015-03-30 | 株式会社カネカ | Curable resin composition, curable resin composition tablet, molded product, semiconductor package, semiconductor component, and light emitting diode |
JP2013174840A (en) * | 2012-02-27 | 2013-09-05 | Sumitomo Bakelite Co Ltd | Optical waveguide, optical wiring component and electronic apparatus |
JP2013174839A (en) * | 2012-02-27 | 2013-09-05 | Sumitomo Bakelite Co Ltd | Optical waveguide, optical wiring component and electronic apparatus |
JP2015081328A (en) * | 2013-10-24 | 2015-04-27 | 株式会社Adeka | Prepolymer and curable resin composition |
US9994681B2 (en) | 2015-01-13 | 2018-06-12 | Henkel Ag & Co. Kgaa | Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same |
JP2019163425A (en) * | 2018-03-20 | 2019-09-26 | 株式会社カネカ | Curable composition and optical semiconductor device using the composition as sealing agent |
JP7042126B2 (en) | 2018-03-20 | 2022-03-25 | 株式会社カネカ | A curable composition and an optical semiconductor device using the composition as a sealing agent. |
WO2022215510A1 (en) * | 2021-04-09 | 2022-10-13 | ダウ・東レ株式会社 | Curable organopolysiloxane composition, thermally conductive member, and heat dissipation structure |
Also Published As
Publication number | Publication date |
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JPWO2011007789A1 (en) | 2012-12-27 |
CN102471580B (en) | 2014-06-18 |
JP5735423B2 (en) | 2015-06-17 |
TWI481670B (en) | 2015-04-21 |
CN102471580A (en) | 2012-05-23 |
TW201120145A (en) | 2011-06-16 |
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