JP5367962B2 - Curable composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a curable composition that is reduced in the amount of volatile components and exhibits excellent adhesive properties. <P>SOLUTION: The curable composition comprises, as essential ingredients, (A) an organic compound having, in one molecule, at least two carbon-carbon double bonds reactive with an SiH group, (B) a compound bearing at least two SiH groups in one molecule and (C) a hydrosilylation catalyst, where the component (B) contains, as a component (B1), a compound bearing at least two SiH groups in one molecule and at least one hydrolyzable silyl group in one molecule. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a curable composition. More specifically, the present invention relates to a curable composition having excellent adhesiveness and low volatile components.

  Curability containing an organic compound having at least two carbon-carbon double bonds reactive with SiH groups in one molecule, a compound having at least two SiH groups in one molecule, and a hydrosilylation catalyst as an essential component Various compositions have been proposed (for example, Patent Document 1 and Patent Document 2).

These curable compositions themselves may not have sufficient adhesion, and a silane coupling agent is added as an adhesion improver when supplementing adhesion. However, since silane coupling agents are often volatile, they volatilize during curing and cause contamination of surrounding substrates. A curable composition having a low volatile component and excellent adhesion is desired.
JP 2002-235005 A JP 2004-292779 A

  The present invention comprises an organic compound having at least two carbon-carbon double bonds reactive with SiH groups in one molecule, a compound having at least two SiH groups in one molecule, and a hydrosilylation catalyst as essential components. In the curable composition to contain, it is providing the curable composition excellent in adhesiveness with few volatile components.

  As a result of intensive studies, the present inventors have found that an organic compound having at least two carbon-carbon double bonds reactive with SiH groups in one molecule, a compound having at least two SiH groups in one molecule, In a curable composition containing a hydrosilylation catalyst as an essential component, in a compound having at least two SiH groups in one molecule, at least two SiH groups in one molecule and hydrolyzable silicon groups in one molecule The inventors have found that a cured product having a low volatile component and excellent adhesion can be obtained by containing at least one compound in the present invention.

  That is, the present invention relates to (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups in one molecule, and (B) a compound having at least two SiH groups in one molecule. (C) a curable composition containing a hydrosilylation catalyst as an essential component, wherein (B1) at least two SiH groups and one hydrolyzable silicon group in one molecule in component (B) It contains at least one compound in the curable composition.

  In a preferred embodiment of the present invention, the hydrolyzable silicon group in the component (B1) is an alkoxysilyl group (claim 2).

  In a preferred embodiment of the present invention, the hydrolyzable silicon group in the component (B1) is a methoxysilyl group and / or an ethoxysilyl group.

  In a preferred embodiment of the present invention, the component (B1) is an organic compound (α1 ′) having at least two carbon-carbon double bonds reactive with SiH groups in one molecule, and has reactivity with SiH groups. Having at least one carbon-carbon double bond in one molecule and at least one hydrolyzable silicon group in one molecule (α2 ′), and having at least three SiH groups in one molecule A compound obtained by subjecting a cyclic polyorganosiloxane (β1 ′) to a hydrosilylation reaction (Claim 4).

  A preferred embodiment of the present invention is a compound (α2 ′) having at least one carbon-carbon double bond reactive with the SiH group in one molecule and at least one hydrolyzable silicon group in one molecule. The hydrolyzable silicon group is an alkoxysilyl group (Claim 5).

  A preferred embodiment of the present invention is a compound (α2 ′) having at least one carbon-carbon double bond reactive with the SiH group in one molecule and at least one hydrolyzable silicon group in one molecule. The hydrolyzable silicon group is at least one selected from the group consisting of trimethoxyvinylsilane, methyldimethoxyvinylsilane, dimethylmethoxyvinylsilane, triethoxyvinylsilane, methyldiethoxyvinylsilane, and dimethylethoxyvinylsilane.

  In a preferred embodiment of the present invention, the organic compound (α1 ′) having at least two carbon-carbon double bonds having reactivity with the SiH group is a triallyl isocyanurate and / or diallyl monoglycidyl isocyanate. Nurate (Claim 7).

  In a preferred embodiment of the present invention, the silicon compound (β1 ′) having at least three SiH groups in one molecule is 1,3,5,7-tetramethylcyclotetrasiloxane (claim 8).

  In a preferred embodiment of the present invention, the content of the component (B1) in the component (B) is 5% by weight or more (claim 9).

  Since the curable composition of this invention has adhesiveness even if it does not contain the adhesive improvement agent which has volatility, the hardened | cured material excellent in adhesiveness with few volatile components is obtained.

Hereinafter, the present invention will be described in detail.
((A) component)
Component (A) is an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule. The organic compound does not contain a siloxane unit (Si—O—Si) such as polysiloxane-organic block copolymer or polysiloxane-organic graft copolymer, and 90% by weight or more of the constituent elements are C, H, N, It consists of O, S and halogen. Those containing siloxane units have gas permeability and repelling problems.

  The bonding position of the carbon-carbon double bond having reactivity with the SiH group is not particularly limited, and may be present anywhere in the molecule.

  The organic compound (A) can be classified into an organic polymer compound and an organic monomer compound.

  Examples of organic polymer compounds include polyether, polyester, polyarylate, polycarbonate, saturated hydrocarbon, unsaturated hydrocarbon, polyacrylate ester, polyamide, phenol-formaldehyde (phenolic resin) ), Polyimide compounds can be used.

  Examples of organic monomer compounds include aromatic hydrocarbons such as phenols, bisphenols, benzene and naphthalene: aliphatic hydrocarbons such as linear and alicyclic: heterocyclic compounds and their A mixture etc. are mentioned.

  (A) Although it does not specifically limit as a carbon-carbon double bond reactive with SiH group of a component, The following general formula (I)

（式中Ｒ¹は水素原子あるいはメチル基を表す。）で示される基が反応性の点から好適である。また、原料の入手の容易さからは、

A group represented by the formula (wherein R ¹ represents a hydrogen atom or a methyl group) is preferred from the viewpoint of reactivity. In addition, from the availability of raw materials,

示される基が特に好ましい。

The groups shown are particularly preferred.

  As the carbon-carbon double bond having reactivity with the SiH group of the component (A), an alicyclic group having a partial structure represented by the following general formula (II) in the ring is the heat resistance of the cured product. Is preferable from the viewpoint of high.

（式中Ｒ²は水素原子あるいはメチル基を表す。）また、原料の入手の容易さからは、下記式で表される部分構造を環内に有する脂環式の基が好適である。

(In the formula, R ² represents a hydrogen atom or a methyl group.) From the viewpoint of availability of raw materials, an alicyclic group having a partial structure represented by the following formula in the ring is preferable.

ＳｉＨ基と反応性を有する炭素−炭素二重結合は（Ａ）成分の骨格部分に直接結合していてもよく、２価以上の置換基を介して共有結合していても良い。２価以上の置換基としては炭素数０〜１０の置換基であれば特に限定されないが、構成元素としてＣ、Ｈ、Ｎ、Ｏ、Ｓ、およびハロゲンのみを含むものが好ましい。これらの置換基の例としては、

The carbon-carbon double bond having reactivity with the SiH group may be directly bonded to the skeleton portion of the component (A) or may be covalently bonded via a divalent or higher valent substituent. The divalent or higher valent substituent is not particularly limited as long as it is a substituent having 0 to 10 carbon atoms, but preferably includes only C, H, N, O, S, and halogen as constituent elements. Examples of these substituents include

が挙げられる。また、これらの２価以上の置換基の２つ以上が共有結合によりつながって１つの２価以上の置換基を構成していてもよい。

Is mentioned. Moreover, two or more of these divalent or higher valent substituents may be connected by a covalent bond to constitute one divalent or higher valent substituent.

  Examples of the group covalently bonded to the skeleton as described above include vinyl group, allyl group, methallyl group, acrylic group, methacryl group, 2-hydroxy-3- (allyloxy) propyl group, 2-allylphenyl group, 3 -Allylphenyl group, 4-allylphenyl group, 2- (allyloxy) phenyl group, 3- (allyloxy) phenyl group, 4- (allyloxy) phenyl group, 2- (allyloxy) ethyl group, 2,2-bis (allyl) Oxymethyl) butyl group, 3-allyloxy-2, 2-bis (allyloxymethyl) propyl group,

が挙げられる。

Is mentioned.

  Specific examples of the component (A) include diallyl phthalate, triallyl trimellitate, diethylene glycol bisallyl carbonate, trimethylolpropane diallyl ether, pentaerythritol triallyl ether, 1,1,2,2-tetraallyloxyethane. Diarylidene pentaerythritol, triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinylcyclohexane, divinylbenzenes (having a purity of 50 to 100%, preferably having a purity of 80 to 100%) , Divinylbiphenyl, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, and oligomers thereof, 1,2-polybutadiene (1,2 ratio of 10 to 100%, preferably 1,2 ratio) 50-100%), Novo Allyl ether of click phenol, allylated polyphenylene oxide,

の他、従来公知のエポキシ樹脂のグルシジル基の一部あるいは全部をアリル基に置き換えたもの等が挙げられる。

In addition, there may be mentioned those in which part or all of the glycidyl group of a conventionally known epoxy resin is replaced with an allyl group.

  As the component (A), low molecular weight compounds that are difficult to express separately as described above for the skeleton portion and the alkenyl group can also be used. Specific examples of these low molecular weight compounds include aliphatic chain polyene compound systems such as butadiene, isoprene, octadiene and decadiene, fats such as cyclopentadiene, cyclohexadiene, cyclooctadiene, dicyclopentadiene, tricyclopentadiene and norbornadiene. Examples thereof include aromatic cyclic polyene compound systems and substituted aliphatic cyclic olefin compound systems such as vinylcyclopentene and vinylcyclohexene.

  The component (A) preferably contains 0.001 mol or more of a carbon-carbon double bond having reactivity with the SiH group per 1 g of the component (A) from the viewpoint of further improving the heat resistance. What contains 0.005 mol or more per is more preferable, and what contains 0.008 mol or more is still more preferable.

  The number of carbon-carbon double bonds having reactivity with the SiH group of component (A) should be on average at least two per molecule, but may exceed 2 if it is desired to further improve the mechanical strength. Preferably, it is 3 or more. When the number of carbon-carbon double bonds having reactivity with the SiH group of component (A) is 1 or less per molecule, only a graft structure is formed even if it reacts with component (B). Don't be.

  From the viewpoint of good reactivity as the component (A), it is preferable that one or more vinyl groups are contained in one molecule, and two or more vinyl groups are contained in one molecule. Is more preferable. Further, from the viewpoint that the storage stability tends to be good, it is preferable that 6 or less vinyl groups are contained in one molecule, and it is more preferable that 4 or less vinyl groups are contained in one molecule.

  As the component (A), those having a molecular weight of less than 900 are preferable from the viewpoint of high mechanical heat resistance and from the viewpoint that the raw material liquid has low stringiness and good moldability, handleability, and coatability. Those less than 700 are more preferred, and those less than 500 are more preferred.

  As the component (A), in order to obtain uniform mixing with other components and good workability, the viscosity is preferably less than 1000 poise at 23 ° C., more preferably less than 300 poise, More preferred is less than 30 poise. The viscosity can be measured with an E-type viscometer.

  As the component (A), those having a low content of a compound having a phenolic hydroxyl group and / or a derivative of a phenolic hydroxyl group are preferable from the viewpoint of suppressing coloring, particularly yellowing. What does not contain the compound which has a derivative is preferable. In the present invention, the phenolic hydroxyl group means a hydroxyl group directly bonded to an aromatic hydrocarbon nucleus exemplified by a benzene ring, naphthalene ring, anthracene ring, etc., and a phenolic hydroxyl group derivative means a hydrogen atom of the above-mentioned phenolic hydroxyl group. A group substituted by an alkyl group such as a methyl group or an ethyl group, an alkenyl group such as a vinyl group or an allyl group, an acyl group such as an acetoxy group, or the like.

  From the viewpoint that the obtained cured product is less colored and has high light resistance, the component (A) is vinylcyclohexene, dicyclopentadiene, triallyl isocyanurate, diallyl of 2,2-bis (4-hydroxycyclohexyl) propane. Ether and 1,2,4-trivinylcyclohexane are preferable, and triallyl isocyanurate, diallyl ether of 2,2-bis (4-hydroxycyclohexyl) propane, and 1,2,4-trivinylcyclohexane are particularly preferable.

  (A) As a component, you may have another reactive group. Examples of the reactive group in this case include an epoxy group, an amino group, a radical polymerizable unsaturated group, a carboxyl group, an isocyanate group, a hydroxyl group, and an alkoxysilyl group. When it has these functional groups, the adhesiveness of the resulting curable composition tends to be high, and the strength of the resulting cured product tends to be high. Of these functional groups, an epoxy group is preferable from the viewpoint that the adhesiveness can be further increased. Moreover, it is preferable to have 1 or more reactive groups in one molecule on average from the point that the heat resistance of the obtained cured product tends to be high.

  In particular, as the component (A), triallyl isocyanurate represented by the following general formula (III) and derivatives thereof are particularly preferable from the viewpoint of high heat resistance and light resistance.

（式中Ｒ³は炭素数１〜５０の一価の有機基を表し、それぞれのＲ³は異なっていても同一であってもよい。）で表される化合物が好ましい。

(Wherein R ³ represents a monovalent organic group having 1 to 50 carbon atoms, and each R ³ may be different or the same).

As R < ³ > of the said general formula (III), it is preferable that it is a C1-C20 monovalent organic group from a viewpoint that the heat resistance of the hardened | cured material obtained can become higher, and C1-C1 10 monovalent organic groups are more preferable, and monovalent organic groups having 1 to 4 carbon atoms are more preferable. Examples of these preferable R ³ include methyl group, ethyl group, propyl group, butyl group, phenyl group, benzyl group, phenethyl group, vinyl group, allyl group, glycidyl group,

等が挙げられる。

Etc.

R ^{3 in the} above general formula (III) is a carbon in which at least one of the three R ^{3 s} contains one or more epoxy groups from the viewpoint that adhesion of the obtained cured product with various materials can be improved. A monovalent organic group of 1 to 50 is preferable,

で表されるエポキシ基を１個以上含む炭素数１〜５０の一価の有機基であることがより好ましい。これらの好ましいＲ³の例としては、グリシジル基、

It is more preferable that it is a C1-C50 monovalent organic group containing 1 or more of epoxy groups represented by these. Examples of these preferred R ³ include a glycidyl group,

等が挙げられる。

Etc.

As R ³ of the general formula (III), from the viewpoint that the chemical thermal stability of the obtained cured product can be improved, it contains 2 or less oxygen atoms, and C, H, O as constituent elements It is preferably a monovalent organic group having 1 to 50 carbon atoms, and more preferably a monovalent hydrocarbon group having 1 to 50 carbon atoms. Examples of these preferable R ³ include methyl group, ethyl group, propyl group, butyl group, phenyl group, benzyl group, phenethyl group, vinyl group, allyl group, glycidyl group,

等が挙げられる。

Etc.

R ^{3 in the} general formula (III) is at least one of three R ³ from the viewpoint of improving the reactivity.

で表される基を１個以上含む炭素数１〜５０の一価の有機基であることが好ましく、下記一般式（ＩＶ）

It is preferable that it is a C1-C50 monovalent organic group containing 1 or more groups represented by general formula (IV) below.

（式中Ｒ⁴は水素原子あるいはメチル基を表す。）で表される基を１個以上含む炭素数１〜５０の一価の有機基であることがより好ましく、
３つのＲ³のうち少なくとも２つが下記一般式（Ｖ）

(Wherein R ⁴ represents a hydrogen atom or a methyl group) and is more preferably a monovalent organic group having 1 to 50 carbon atoms and containing at least one group represented by:
At least two of the three R ³ are represented by the following general formula (V)

（式中Ｒ⁵は直接結合あるいは炭素数１〜４８の二価の有機基を表し、Ｒ⁶は水素原子あるいはメチル基を表す。）で表される有機化合物（複数のＲ⁵およびＲ⁶はそれぞれ異なっていても同一であってもよい。）であることがさらに好ましい。

(Wherein R ⁵ represents a direct bond or a divalent organic group having 1 to 48 carbon atoms, and R ⁶ represents a hydrogen atom or a methyl group) (a plurality of R ⁵ and R ⁶ are More preferably, they may be the same or different.

R ^{5 in the} general formula (V) is a direct bond or a divalent organic group having 1 to 48 carbon atoms. From the viewpoint that the heat resistance of the obtained cured product can be further increased, the direct bond or carbon It is preferably a divalent organic group having 1 to 20 carbon atoms, more preferably a direct bond or a divalent organic group having 1 to 10 carbon atoms, and a direct bond or a divalent organic group having 1 to 4 carbon atoms. More preferably, it is a group. Examples of these preferred R ⁵ include

等が挙げられる。

Etc.

As R ⁵ of the general formula (V), from the viewpoint that the chemical thermal stability of the resulting cured product can be improved, it is a direct bond or contains 2 or less oxygen atoms and C as a constituent element, It is preferably a C1-C48 divalent organic group containing only H and O, more preferably a direct bond or a C1-C48 divalent hydrocarbon group. Examples of these preferred R ⁵ include

が挙げられる。

Is mentioned.

R ^{6 in the} general formula (V) is a hydrogen atom or a methyl group, and a hydrogen atom is preferable from the viewpoint of good reactivity.

  However, in the preferred examples of the organic compound represented by the general formula (III) as described above, it is necessary to contain at least two carbon-carbon double bonds having reactivity with the SiH group in one molecule. is there. From the viewpoint that heat resistance can be further improved, an organic compound containing three or more carbon-carbon double bonds having reactivity with SiH groups in one molecule is more preferable.

  Preferable specific examples of the organic compound represented by the general formula (III) as described above include triallyl isocyanurate,

等が挙げられる。

Etc.

  In order to improve the adhesiveness of the cured product, diallyl monoglycidyl isocyanurate is preferred as the component (A).

A mixture of triallyl isocyanurate and diallyl monoglycidyl isocyanurate is preferred in order to achieve both improved adhesion and light resistance of the cured product. Since the mixture has an isocyanuric ring skeleton, it is also effective from the viewpoint of heat resistance. The mixing ratio can be arbitrarily set, but in order to achieve the above object, triallyl isocyanurate / allyl monoglycidyl isocyanurate (molar ratio) = 9/1 to 1/9 is preferable, and 8/2 to 2/8 is more preferable. Preferably, 7/3 to 3/7 is particularly preferable.
(A) A component can be used individually or in mixture of 2 or more types.
((B) component)
Next, the component (B) will be described.

  The component (B) of the present invention is a compound containing at least two SiH groups in one molecule.

  The component (B) is not particularly limited as long as it is a compound containing at least two SiH groups in one molecule. For example, it is a compound described in International Publication WO 96/15194, and at least two compounds in one molecule. Those having SiH groups can be used.

  Among these, from the viewpoint of availability, a chain and / or cyclic organopolysiloxane having at least two SiH groups in one molecule is preferable, and from the viewpoint of good compatibility with the component (A), Furthermore, the following general formula (VI)

（式中、Ｒ⁷は炭素数１〜６の有機基を表し、ｎは３〜１０の数を表す。）で表される、１分子中に少なくとも２個のＳｉＨ基を有する環状オルガノポリシロキサンが好ましい。

(Wherein R ⁷ represents an organic group having 1 to 6 carbon atoms, and n represents a number of 3 to 10). Cyclic organopolysiloxane having at least two SiH groups in one molecule. Is preferred.

The substituent R ⁷ in the compound represented by the general formula (VI) is preferably composed of C, H and O, more preferably a hydrocarbon group, and a methyl group. Further preferred.

  From the viewpoint of availability, the compound represented by the general formula (VI) is preferably 1,3,5,7-tetramethylcyclotetrasiloxane.

The molecular weight of the component (B) is not particularly limited, and any one can be suitably used. However, from the viewpoint that the fluidity of the curable composition can be more easily controlled, those having a low molecular weight are preferably used. In this case, the lower limit of the preferable molecular weight is 50, and the upper limit of the preferable molecular weight is 100,000, more preferably 10,000, and still more preferably 2,000.
(B) A component can be used individually or in mixture of 2 or more types.

From the viewpoint of having good compatibility with the component (A), and from the viewpoint that the problem of outgas from the composition that can reduce the volatility of the component (B) is less likely to occur, the component (B) is a SiH group. An organic compound (α) containing at least one carbon-carbon double bond having reactivity with one molecule, and a chain and / or cyclic polyorgano having at least two SiH groups in one molecule A compound that can be obtained by hydrosilylation reaction of siloxane (β) is preferred.
((Α) component)
Here, the component (α) is the same component (α1) as the component (A) described above, which is the same as the organic compound containing at least two carbon-carbon double bonds reactive with the SiH group in one molecule. be able to. When the component (α1) is used, the resulting cured product has a high crosslink density and tends to be a cured product having high mechanical strength.

In addition, an organic compound (α2) containing one carbon-carbon double bond having reactivity with the SiH group in one molecule can also be used. When the (α2) component is used, the obtained cured product tends to have low elasticity.
((Α2) component)
The (α2) component is not particularly limited as long as it is an organic compound containing one carbon-carbon double bond having reactivity with the SiH group in one molecule, but the (B) component is the (A) component and In terms of improved compatibility, the compound does not contain a siloxane unit (Si—O—Si) such as polysiloxane-organic block copolymer or polysiloxane-organic graft copolymer, and 90% by weight or more of the constituent elements. Are preferably C, H, N, O, S, and halogen.

  The bonding position of the carbon-carbon double bond having reactivity with the SiH group of the (α2) component is not particularly limited and may be present anywhere in the molecule.

  The (α2) component compound can be classified into a polymer compound and a monomer compound.

  Examples of the polymer compound include polysiloxane, polyether, polyester, polyarylate, polycarbonate, saturated hydrocarbon, unsaturated hydrocarbon, polyacrylate ester, polyamide, phenol-formaldehyde ( Phenol resin type) and polyimide type compounds can be used.

  Examples of monomer compounds include aromatic hydrocarbons such as phenols, bisphenols, benzene, and naphthalene: aliphatic hydrocarbons such as straight-chain and alicyclics: heterocyclic compounds, and silicon-based compounds. Examples thereof include compounds and mixtures thereof.

  Although it does not specifically limit as a carbon-carbon double bond which has the reactivity with SiH group of ((alpha) 2) component, The following general formula (I)

（式中Ｒ¹は水素原子あるいはメチル基を表す。）で示される基が反応性の点から好適である。また、原料の入手の容易さからは、

A group represented by the formula (wherein R ¹ represents a hydrogen atom or a methyl group) is preferred from the viewpoint of reactivity. In addition, from the availability of raw materials,

示される基が特に好ましい。

The groups shown are particularly preferred.

  As the carbon-carbon double bond having reactivity with the SiH group of the (α2) component, an alicyclic group having a partial structure represented by the following general formula (II) in the ring is the heat resistance of the cured product. Is preferable from the viewpoint of high.

（式中Ｒ²は水素原子あるいはメチル基を表す。）また、原料の入手の容易さからは、下記式で表される部分構造を環内に有する脂環式の基が好適である。

(In the formula, R ² represents a hydrogen atom or a methyl group.) From the viewpoint of availability of raw materials, an alicyclic group having a partial structure represented by the following formula in the ring is preferable.

ＳｉＨ基と反応性を有する炭素−炭素二重結合は（α２）成分の骨格部分に直接結合していてもよく、２価以上の置換基を介して共有結合していても良い。２価以上の置換基としては炭素数０〜１０の置換基であれば特に限定されないが、（Ｂ）成分が（Ａ）成分と相溶性がよくなりやすいという点においては、構成元素としてＣ、Ｈ、Ｎ、Ｏ、Ｓ、およびハロゲンのみを含むものが好ましい。これらの置換基の例としては、

The carbon-carbon double bond having reactivity with the SiH group may be directly bonded to the skeleton portion of the (α2) component, or may be covalently bonded via a divalent or higher substituent. The divalent or higher valent substituent is not particularly limited as long as it is a substituent having 0 to 10 carbon atoms. However, in terms that the component (B) is easily compatible with the component (A), C, Those containing only H, N, O, S and halogen are preferred. Examples of these substituents include

が挙げられる。また、これらの２価以上の置換基の２つ以上が共有結合によりつながって１つの２価以上の置換基を構成していてもよい。

Is mentioned. Moreover, two or more of these divalent or higher valent substituents may be connected by a covalent bond to constitute one divalent or higher valent substituent.

  Examples of the group covalently bonded to the skeleton as described above include vinyl group, allyl group, methallyl group, acrylic group, methacryl group, 2-hydroxy-3- (allyloxy) propyl group, 2-allylphenyl group, 3 -Allylphenyl group, 4-allylphenyl group, 2- (allyloxy) phenyl group, 3- (allyloxy) phenyl group, 4- (allyloxy) phenyl group, 2- (allyloxy) ethyl group, 2,2-bis (allyl) Oxymethyl) butyl group, 3-allyloxy-2, 2-bis (allyloxymethyl) propyl group,

が挙げられる。

Is mentioned.

  Specific examples of the component (α2) include propene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-undecene, Idemitsu Petrochemical's linearene, 4,4-dimethyl-1-pentene, 2-methyl-1-hexene, 2,3,3-trimethyl-1-butene, 2,4,4-trimethyl-1-pentene, etc. Chain aliphatic hydrocarbon compounds such as cyclohexene, methylcyclohexene, methylenecyclohexane, norbornylene, ethylidenecyclohexane, vinylcyclohexane, camphene, carene, α-pinene, β-pinene and the like, Styrene, α-methylstyrene, indene, phenylacetylene, 4-ethynyltoluene, allylbenzene, 4- Aromatic hydrocarbon compounds such as phenyl-1-butene, allyl ethers such as alkyl allyl ether and allyl phenyl ether, glycerin monoallyl ether, ethylene glycol monoallyl ether, 4-vinyl-1,3-dioxolane- Substitution of aliphatic compounds such as 2-one, aromatic compounds such as 1,2-dimethoxy-4-allylbenzene, o-allylphenol, monoallyl dibenzyl isocyanurate, monoallyl diglycidyl isocyanurate, etc. Examples include isocyanurates, alkoxysilanes such as vinyltrimethoxysilane and vinyldimethoxymethylsilane, and silicon compounds such as vinyltrimethylsilane and vinyltriphenylsilane. Furthermore, polyether resins such as one-end allylated polyethylene oxide and one-end allylated polypropylene oxide, hydrocarbon resins such as one-end allylated polyisobutylene, one-end allylated polybutyl acrylate, one-end allylated polymethyl methacrylate Examples thereof also include polymers or oligomers having a vinyl group at one end, such as acrylic resins.

  The structure may be linear or branched, and the molecular weight is not particularly limited, and various types can be used. The molecular weight distribution is not particularly limited, but the molecular weight distribution is preferably 3 or less, more preferably 2 or less, and more preferably 1.5 or less in that the viscosity of the mixture is low and the moldability is likely to be good. More preferably it is.

  When the glass transition temperature of the component (α2) is present, there is no particular limitation on this, and various materials are used, but the glass point transfer temperature is 100 ° C. or less in that the obtained cured product tends to be tough. It is preferably 50 ° C. or lower, more preferably 0 ° C. or lower. Examples of preferred resins include polybutyl acrylate resins. Conversely, the glass transition temperature is preferably 100 ° C. or higher, more preferably 120 ° C. or higher, further preferably 150 ° C. or higher, in that the heat resistance of the cured product obtained is increased. Most preferably, it is 170 ° C. or higher. The glass transition temperature can be determined as a temperature at which tan δ exhibits a maximum in the dynamic viscoelasticity measurement.

  The (α2) component is preferably an aliphatic hydrocarbon compound in that the light resistance of the resulting cured product is increased. In this case, the preferable lower limit of the carbon number is 2, and the preferable upper limit of the carbon number is 10.

  The (α2) component is preferably an aromatic hydrocarbon compound in that the heat resistance of the resulting cured product is increased. In this case, the preferable lower limit of the carbon number is 7, and the preferable upper limit of the carbon number is 10.

  The component (α2) may have other reactive groups. Examples of the reactive group in this case include an epoxy group, an amino group, a radical polymerizable unsaturated group, a carboxyl group, an isocyanate group, a hydroxyl group, and an alkoxysilyl group. When it has these functional groups, the adhesiveness of the resulting curable composition tends to be high, and the strength of the resulting cured product tends to be high. Of these functional groups, an epoxy group is preferable from the viewpoint that the adhesiveness can be further increased. Moreover, it is preferable to have 1 or more reactive groups in one molecule on average from the point that the heat resistance of the obtained cured product tends to be high. Specific examples include monoallyl diglycidyl isocyanurate, allyl glycidyl ether, allyloxyethyl methacrylate, allyloxyethyl acrylate, vinyltrimethoxysilane, and the like.

  Further, from the viewpoint of good handleability, the molecular weight of the component (α2) is preferably 500 or less, and more preferably 300 or less.

As the above (α2) component, a single component may be used, or a plurality of components may be used in combination.
((Β) component)
The component (β) is a linear and / or cyclic polyorganosiloxane having at least two SiH groups in one molecule.

  Specifically, for example

が挙げられる。

Is mentioned.

  Here, from the viewpoint of easy compatibility with the component (α), the following general formula (VI)

（式中、Ｒ⁷は炭素数１〜６の有機基を表し、ｎは３〜１０の数を表す。）で表される、１分子中に少なくとも３個のＳｉＨ基を有する環状ポリオルガノシロキサン（β１）が好ましい。

(Wherein R ⁷ represents an organic group having 1 to 6 carbon atoms, and n represents a number of 3 to 10). Cyclic polyorganosiloxane having at least 3 SiH groups in one molecule. (Β1) is preferred.

The substituent R ⁷ in the compound represented by the general formula (VI) is preferably composed of C, H and O, more preferably a hydrocarbon group, and a methyl group. Further preferred.

  In view of availability, 1,3,5,7-tetramethylcyclotetrasiloxane is preferable.

Various (β) components as described above can be used alone or in admixture of two or more.
(Reaction of (α) component and (β) component)
Next, hydrosilylation of (α) component and (β) component in the case of using a compound obtained by hydrosilylation reaction of (α) component and (β) component as component (B) of the present invention The reaction will be described.

  In addition, when the (α) component and the (β) component are subjected to a hydrosilylation reaction, a mixture of a plurality of compounds containing the (B) component of the present invention may be obtained, but without separating the (B) component therefrom. The curable composition of the present invention can also be produced using the mixture as it is.

  The mixing ratio of the (α) component and the (β) component when the (α) component and the (β) component are subjected to a hydrosilylation reaction is not particularly limited, but the hydrosilylation of the obtained (B) component and (A) component is not limited. In view of the strength of the cured product due to the above, since it is preferable that the component (B) has a larger amount of SiH groups, the total number of carbon-carbon double bonds having reactivity with the SiH groups in the component (α) to be mixed ( The ratio of X) to the total number of SiH groups (Y) in the (β) component to be mixed is preferably Y / X ≧ 2, and more preferably Y / X ≧ 3. Further, from the viewpoint that the compatibility of the component (B) with the component (A) is easily improved, 5 ≧ Y / X is preferable, and 10 ≧ Y / X is more preferable.

When the (α) component and the (β) component are subjected to a hydrosilylation reaction, an appropriate catalyst may be used. As the catalyst, for example, the following can be used. Platinum simple substance, alumina, silica, carbon black or the like supported on solid platinum, chloroplatinic acid, a complex of chloroplatinic acid and alcohol, aldehyde, ketone or the like, platinum-olefin complex (for example, Pt (CH ₂ = CH ₂ ) ₂ (PPh ₃ ) ₂ , Pt (CH ₂ = CH ₂ ) ₂ Cl ₂ ), platinum-vinylsiloxane complex (for example, Pt (ViMe ₂ SiOSiMe ₂ Vi) _n , Pt [(MeViSiO) ₄ ]) _m ), platinum-phosphine complexes (eg, Pt (PPh ₃ ) ₄ , Pt (PBu ₃ ) ₄ ), platinum-phosphite complexes (eg, Pt [P (OPh) ₃ ] ₄ , Pt [P (OBu) ₃ ] ₄₎ (in the formula, Me represents a methyl group, Bu a butyl group, Vi is vinyl group, Ph represents a phenyl group, n, m is an integer.), dicarbonyl dichloroplatinum, Karushuteto Karstedt catalyst, as well as the platinum-hydrocarbon complexes described in Ashby US Pat. Nos. 3,159,601 and 3,159,622, and Lamoreaux US Pat. No. 3,220,972. And platinum alcoholate catalysts. In addition, platinum chloride-olefin complexes described in Modic US Pat. No. 3,516,946 are also useful in the present invention.

Examples of catalysts other than platinum compounds include RhCl (PPh) ₃ , RhCl ₃ , RhAl ₂ O ₃ , RuCl ₃ , IrCl ₃ , FeCl ₃ , AlCl ₃ , PdCl ₂ .2H ₂ O, NiCl ₂ , TiCl _4. , Etc.

  Of these, chloroplatinic acid, platinum-olefin complexes, platinum-vinylsiloxane complexes and the like are preferable from the viewpoint of catalytic activity. Moreover, these catalysts may be used independently and may be used together 2 or more types.

The addition amount of the catalyst is not particularly limited, but the lower limit of the preferred addition amount is sufficient with respect to 1 mole of SiH group of the (β) component in order to have sufficient curability and keep the cost of the curable composition relatively low. 10 ^-8 mol, more preferably 10 ^-6 mole, preferable amount of the upper limit is 10 ^-1 moles per mole of the SiH group (beta) component, more preferably 10 ^-2 moles.

In addition, a cocatalyst can be used in combination with the above catalyst. Examples thereof include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl maleate, 2-hydroxy-2-methyl-1 Examples include acetylene alcohol compounds such as butyne and 1-ethynyl-1-cyclohexanol, and sulfur compounds such as simple sulfur. The addition amount of the cocatalyst is not particularly limited, but the lower limit of the preferable addition amount with respect to 1 mol of the hydrosilylation catalyst is 10 ⁻² mol, more preferably 10 ⁻¹ mol, and the upper limit of the preferable addition amount is 10 ^2. Mol, more preferably 10 mol.

  Various methods can be used for mixing the (α) component, the (β) component, and the catalyst in the reaction. The (α) component mixed with the catalyst is mixed with the (β) component. The method is preferred. If the catalyst is mixed with the mixture of the (α) component and the (β) component, it is difficult to control the reaction. When the method of mixing the (β) component with the mixture of the (β) component and the catalyst, the (β) component is reactive in the presence of the catalyst and may be altered due to its reactivity with water. .

  The reaction temperature can be variously set. In this case, the lower limit of the preferable temperature range is 30 ° C., more preferably 50 ° C., and the upper limit of the preferable temperature range is 200 ° C., more preferably 150 ° C. If the reaction temperature is low, the reaction time for sufficiently reacting becomes long, and if the reaction temperature is high, it is not practical. The reaction may be carried out at a constant temperature, but the temperature may be changed in multiple steps or continuously as required.

  Various reaction times and pressures during the reaction can be set as required.

  A solvent may be used during the hydrosilylation reaction. Solvents that can be used are not particularly limited as long as they do not inhibit the hydrosilylation reaction. Specific examples include hydrocarbon solvents such as benzene, toluene, hexane, heptane, tetrahydrofuran, 1,4-dioxane, 1, Ether solvents such as 3-dioxolane and diethyl ether, ketone solvents such as acetone and methyl ethyl ketone, and halogen solvents such as chloroform, methylene chloride and 1,2-dichloroethane can be preferably used. The solvent can also be used as a mixed solvent of two or more types. As the solvent, toluene, tetrahydrofuran, 1,3-dioxolane and chloroform are preferable. The amount of solvent to be used can also be set as appropriate.

  In addition, various additives may be used for the purpose of controlling reactivity.

After reacting the (α) component and the (β) component, the solvent or / and the unreacted (α) component or / and the (β) component can be removed. By removing these volatile components, the component (B) obtained does not have volatile components, so that the problem of voids and cracks due to volatilization of the volatile components hardly occurs in the case of curing with the component (A). Examples of the removal method include treatment with activated carbon, aluminum silicate, silica gel and the like in addition to vacuum devolatilization. When devolatilizing under reduced pressure, it is preferable to treat at a low temperature. The upper limit of the preferable temperature in this case is 100 ° C, more preferably 80 ° C. When treated at high temperatures, it tends to be accompanied by alterations such as thickening.
The component (B) that is the reaction product of the component (α) and the component (β) as described above includes the reaction product of the component (α1) and the component (β), and the reaction of the component (α2) and the component (β). Product, (α1) component and reaction product of (α2) component and (β) component.
The reaction product of the (α1) component and the (β) component is not particularly limited, but a reaction product of divinylbenzene and 1,3,5,7-tetramethylcyclotetrasiloxane, bisphenol A diallyl ether and 1,3,5, Reaction product of 7-tetramethylcyclotetrasiloxane, reaction product of vinylcyclohexene and 1,3,5,7-tetramethylcyclotetrasiloxane, reaction of dicyclopentadiene and 1,3,5,7-tetramethylcyclotetrasiloxane And a reaction product of triallyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, and a reaction product of diallyl monoglycidyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane.

  The reaction product of the (α2) component and the (β) component is not particularly limited, but a reaction product of allyl glycidyl ether and 1,3,5,7-tetramethylcyclotetrasiloxane, α-methylstyrene and 1,3,5, Examples include a reaction product of 7-tetramethylcyclotetrasiloxane, a reaction product of monoallyl diglycidyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane.

  The reaction product of (α1) component and (α2) component and (β) component is not particularly limited, but reaction product of 1-hexene and divinylbenzene and 1,3,5,7-tetramethylcyclotetrasiloxane, α-methylstyrene And reaction products of divinylbenzene and 1,3,5,7-tetramethylcyclotetrasiloxane, reaction products of allyl glycidyl ether and divinylbenzene and 1,3,5,7-tetramethylcyclotetrasiloxane, 1-hexene and bisphenol Reaction product of A diallyl ether and 1,3,5,7-tetramethylcyclotetrasiloxane, reaction product of α-methylstyrene and bisphenol A diallyl ether and 1,3,5,7-tetramethylcyclotetrasiloxane, allyl glycidyl ether And bisphenol A diallyl ether and 1,3,5 Reaction product of 7-tetramethylcyclotetrasiloxane, reaction product of 1-hexene and vinylcyclohexene and 1,3,5,7-tetramethylcyclotetrasiloxane, α-methylstyrene and vinylcyclohexene and 1,3,5,7- Reactant of tetramethylcyclotetrasiloxane, allyl glycidyl ether and vinylcyclohexene with 1,3,5,7-tetramethylcyclotetrasiloxane, 1-hexene and dicyclopentadiene with 1,3,5,7-tetra Reaction product of methylcyclotetrasiloxane, reaction product of α-methylstyrene and dicyclopentadiene and 1,3,5,7-tetramethylcyclotetrasiloxane, dicyclopentadiene and 1,3,5,7-tetramethylcyclotetrasiloxane Reactants of 1-hexene and triallyl Reaction product of sosocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, reaction product of α-methylstyrene and triallyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, allyl glycidyl ether and tri Reaction product of allyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, reaction product of 1-hexene and diallyl monoglycidyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, α-methyl Reaction of styrene and diallyl monoglycidyl isocyanurate with 1,3,5,7-tetramethylcyclotetrasiloxane, reaction of allyl glycidyl ether and diallyl monoglycidyl isocyanurate with 1,3,5,7-tetramethylcyclotetrasiloxane Things are examples it can. be able to.

From the viewpoint of heat resistance and light resistance of the cured product, reaction product of divinylbenzene and 1,3,5,7-tetramethylcyclotetrasiloxane, triallyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane A reaction product, a reaction product of diallyl monoglycidyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, a reaction product of monoallyl diglycidyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, Reaction of allyl glycidyl ether and triallyl isocyanurate with 1,3,5,7-tetramethylcyclotetrasiloxane, allyl glycidyl ether and diallyl monoglycidyl isocyanurate with 1,3,5,7-tetramethylcyclotetrasiloxane A reactant is preferred.
Component (B) can be used alone or in combination of two or more.
((B1) component)
The component (B1) of the present invention is a compound having at least two SiH groups in one molecule and at least one hydrolyzable silicon group in one molecule, and the component (B1) alone or together with the component (B) ( A) A cured product excellent in adhesiveness with few volatile components is obtained while ensuring compatibility with the component. This (B1) component is contained in a part of the above-mentioned (B) component.

  The hydrolyzable silicon group is not particularly limited as long as it generates a silanol group by a hydrolysis reaction in the presence of moisture. Examples of such a hydrolyzable silicon group include, but are not limited to, an alkoxysilyl group generated by hydrolysis, an acyloxysilyl group generated by carboxylic acid, and a ketiminoxysilyl group generated by ketimine. Since the handleability is good, the hydrolyzable silicon group is preferably an alkoxysilyl group.

  The alkoxysilyl group is not particularly limited, but from the viewpoint of availability, a methoxy group, an ethoxy group, an n-propoxy group, an iso-propoxy group, an n-butoxy group, a sec-butoxy group, and a tert-butoxy group are preferable. From the viewpoint of curability, a methoxy group and an ethoxy group are preferable.

  The production method of such a component (B1) is not particularly limited, but is an organic compound (α1 ′) having at least two carbon-carbon double bonds reactive with SiH groups in one molecule, reactive with SiH groups. A compound having at least one carbon-carbon double bond having 1 and at least one hydrolyzable silicon group in one molecule (α2 ′) having at least three SiH groups in one molecule A compound obtained by a hydrosilylation reaction with polyorganosiloxane (β1 ′) is preferred.

  The organic compound having at least two carbon-carbon double bonds reactive with the SiH group as the component (α1 ′) per molecule can be the same as the above (α1), and (β1 ′) As the cyclic polyorganosiloxane having at least three SiH groups in one molecule as a component, the same one as the above-mentioned (β1) component can be used.

  The compound having at least one carbon-carbon double bond reactive with the SiH group as the component (α2 ′) per molecule and at least one hydrolyzable silicon group per molecule is not particularly limited. Vinyltrimethoxysilane, vinyltriethoxysilane, vinyldimethoxymethylsilane, vinyldiethoxymethylsilane, vinyldimethylmethoxysilane, and vinyldimethylethoxysilane are preferable.

When the (α2 ′) component is hydrosilylated with the (β1 ′) component, the proportion of each component when the (α1 ′) component and the (α2 ′) component are hydrosilylated with the (β1 ′) component is SiH group Is not particularly limited as long as it produces a compound having at least two hydrolyzable silicon groups per molecule and (α1 ′) component, (α2 ′) component, Various methods can be used for mixing the (β1 ′) component and the catalyst. However, when it is desired to obtain the (B1) component more easily, a mixture of the (α2 ′) component and the catalyst (β1 ′) is used. A method is preferred in which the component (α1 ′) is added and mixed and reacted after mixing and reacting with the component. When it is desired to obtain the component (B1) having a greater effect of lowering the elastic modulus and / or glass transition temperature, a mixture of the (α1 ′) component and the catalyst is mixed with the (β1 ′) component and reacted (α1 ') A method of adding and mixing the components and reacting them is preferred. After mixing the (α1') component and the catalyst with the (β1 ') component and reacting, the unreacted (β1') component is once removed. Subsequently, a method in which the component (α1 ′) is added and mixed and reacted is more preferable.
The component (B1) can be used alone or in combination of two or more.
The proportion of the component (B1) in the component (B) is not particularly limited as long as the effect of the component (B1) is expressed, but the preferable lower limit is 5% by weight, and the more preferable lower limit is 10%. %. (B1) component (mixing ratio of (A) component and (B) component)
The mixing ratio of the component (A) and the component (B) is not particularly limited as long as the strength required for the cured product is not lost, but the number of SiH groups in the component (B) (Y ′) in the component (A) In the ratio (Y ′ / X ′) to the number of carbon-carbon double bonds (X ′) (Y ′ / X ′), the lower limit of the preferable range is 0.3, more preferably 0.5, still more preferably 0.7, and the preferable range. Is preferably 3, more preferably 2, and even more preferably 1.5. When it deviates from the preferred range, sufficient strength may not be obtained or thermal deterioration may easily occur.
((C) component)
Next, the hydrosilylation catalyst as component (C) will be described.

The hydrosilylation catalyst is not particularly limited as long as it has a catalytic activity for the hydrosilylation reaction. For example, a platinum simple substance, a support made of alumina, silica, carbon black or the like on which solid platinum is supported, chloroplatinic acid, platinum chloride Complexes of acids with alcohols, aldehydes, ketones, etc., platinum-olefin complexes (eg Pt (CH ₂ ═CH ₂ ) ₂ (PPh ₃ ) ₂ , Pt (CH ₂ ═CH ₂ ) ₂ Cl ₂ ), platinum-vinyl Siloxane complexes (for example, Pt (ViMe ₂ SiOSiMe ₂ Vi) _n , Pt [(MeViSiO) ₄ ] _m ), platinum-phosphine complexes (for example, Pt (PPh ₃ ) ₄ , Pt (PBu ₃ ) ₄ ), platinum-phos Fight complexes _{(e.g., Pt [P (OPh) 3} ] 4, Pt [P (OBu) 3] 4) ( in the formula, Me represents a methyl group, Bu a butyl group, Vi represents a vinyl group Ph represents a phenyl group, and n and m represent integers.), Dicarbonyldichloroplatinum, Karstedt catalyst, and also described in Ashby US Pat. Nos. 3,159,601 and 3,159,662. Platinum-hydrocarbon complexes, as well as platinum alcoholate catalysts described in Lamoreaux US Pat. No. 3,220,972. In addition, platinum chloride-olefin complexes described in Modic US Pat. No. 3,516,946 are also useful in the present invention.

Examples of catalysts other than platinum compounds include RhCl (PPh) ₃ , RhCl ₃ , RhAl ₂ O ₃ , RuCl ₃ , IrCl ₃ , FeCl ₃ , AlCl ₃ , PdCl ₂ .2H ₂ O, NiCl ₂ , TiCl _4. , Etc.

  Of these, chloroplatinic acid, platinum-olefin complexes, platinum-vinylsiloxane complexes and the like are preferable from the viewpoint of catalytic activity. Moreover, these catalysts may be used independently and may be used together 2 or more types.

Although the addition amount of the catalyst is not particularly limited, the lower limit of the preferable addition amount is sufficient with respect to 1 mol of SiH groups of the component (B) in order to have sufficient curability and keep the cost of the curable composition relatively low. 10 ^-8 mol, more preferably 10 ^-6 mole, preferable amount of the upper limit is 10 ^-1 moles per mole of the SiH group (beta) component, more preferably 10 ^-2 moles.

In addition, a cocatalyst can be used in combination with the above catalyst. Examples thereof include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl maleate, 2-hydroxy-2-methyl-1 -Acetylene alcohol compounds, such as butyne, sulfur compounds, such as single-piece | unit sulfur, etc. are mentioned. The addition amount of the cocatalyst is not particularly limited, but the lower limit of the preferable addition amount with respect to 1 mol of the hydrosilylation catalyst is 10 ⁻² mol, more preferably 10 ⁻¹ mol, and the upper limit of the preferable addition amount is 10 ^2. Mol, more preferably 10 mol.

  In addition, when using a hydrosilylation catalyst at the time of manufacture of (B) component, and using this hydrosilylation catalyst without removing, the hydrosilylation catalyst which remains in (B) component is also contained in (C) component of this invention. .

(Method for adjusting curable composition and curing method)
The preparation method of this curable composition is not specifically limited, It can prepare by various methods. Various components may be mixed and prepared immediately before curing, or all components may be mixed and prepared in advance and stored at a low temperature. Alternatively, some components may be mixed and stored in advance so that there are 2 to 3 types, and the respective predetermined amounts may be mixed and prepared immediately before curing. (A) Organic compound containing at least two carbon-carbon double bonds reactive with SiH group as component, and at least two SiH groups per molecule as component (B) A method of separately storing the compounds to be used is preferable since there is little deterioration in quality during storage.

  The order of mixing the various components is not particularly limited, but the liquid mixture of the component (A) (C) and the component (B) are stored separately, and the liquid mixture of the component (A) (C) and ( A method of stirring and mixing the component B) is preferred. In the method of mixing the component (C) with the liquid mixture of the component (A) and the component (B), it is not easy to control the reaction. In the method of mixing the component (A) with the mixed solution of the component (B) and the component (C), the component (B) has reactivity with moisture in the environment, and thus may be altered during storage.

  In addition, a method is adopted in which only a part of the functional group in the composition is reacted (B-stage) by controlling reaction conditions and using the difference in the reactivity of the substituents, and then subjected to processing such as molding and further curing. You can also. According to these methods, viscosity adjustment at the time of molding becomes easy.

  As a curing method, the reaction can be performed by simply mixing, or the reaction can be performed by heating. A method of heating and reacting is preferable from the viewpoint that the reaction is fast and generally a material having high heat resistance is easily obtained.

  The curing temperature can be variously set, but the lower limit of the preferable temperature is 30 ° C, more preferably 100 ° C. The upper limit of preferable temperature is 300 degreeC, More preferably, it is 200 degreeC. If the reaction temperature is low, the reaction time for sufficient reaction will be long, and if the reaction temperature is high, molding will tend to be difficult.

Curing may be performed at a constant temperature, but the temperature may be changed in multiple steps or continuously as required. It is preferable to carry out the reaction while raising the temperature in a multistage manner or continuously, as compared with the case where the temperature is constant, in that a cured product with less distortion is easily obtained.
(Additive)
(Curing retarder)
For the purpose of improving the storage stability of the composition of the present invention or adjusting the reactivity of the hydrosilylation reaction during the curing process, a curing retarder can be used. Examples of the curing retarder include a compound containing an aliphatic unsaturated bond, an organic phosphorus compound, an organic sulfur compound, a nitrogen-containing compound, a tin-based compound, and an organic peroxide, and these may be used in combination.

  Examples of the compound containing an aliphatic unsaturated bond include propargyl alcohols such as 3-hydroxy-3-methyl-1-butyne, 3-hydroxy-3-phenyl-1-butyne and 1-ethynyl-1-cyclohexanol. And maleate esters such as ene-yne compounds and dimethyl malate. Examples of the organophosphorus compound include triorganophosphine, diorganophosphine, organophosphon, and triorganophosphite. Examples of organic sulfur compounds include organomercaptans, diorganosulfides, hydrogen sulfide, benzothiazole, thiazole, benzothiazole disulfide and the like. Examples of tin compounds include stannous halide dihydrate and stannous carboxylate. Examples of the organic peroxide include di-t-butyl peroxide, dicumyl peroxide, benzoyl peroxide, and t-butyl perbenzoate.

  Among these curing retarders, from the viewpoint of good retarding activity and good raw material availability, benzothiazole, thiazole, dimethyl malate, 3-hydroxy-3-methyl-1-butyne, 1-ethynyl-1- Cyclohexanol is preferred.

Although the addition amount of the curing retarder can be variously set, the lower limit of the preferable addition amount relative to 1 mol of the hydrosilylation catalyst to be used is 10 ⁻¹ mol, more preferably 1 mol, and the upper limit of the preferable addition amount is 10 ³ mol, more preferably Is 50 moles.

Moreover, these hardening retarders may be used independently and may be used together 2 or more types.
(Adhesion improver)
If necessary, an adhesion improver can be added to the composition of the present invention. In addition to commonly used adhesives as adhesion improvers, for example, various coupling agents, epoxy compounds, phenol resins, coumarone-indene resins, rosin ester resins, terpene-phenol resins, α-methylstyrene-vinyltoluene A copolymer, polyethylmethylstyrene, aromatic polyisocyanate, etc. can be mentioned.

  An example of the coupling agent is a silane coupling agent. The silane coupling agent is not particularly limited as long as it is a compound having at least one functional group reactive with an organic group and one hydrolyzable silicon group in the molecule. The group reactive with the organic group is preferably at least one functional group selected from an epoxy group, a methacryl group, an acrylic group, an isocyanate group, an isocyanurate group, a vinyl group, and a carbamate group from the viewpoint of handling. From the viewpoints of adhesion and adhesiveness, an epoxy group, a methacryl group, and an acrylic group are particularly preferable. As the hydrolyzable silicon group, an alkoxysilyl group is preferable from the viewpoint of handleability, and a methoxysilyl group and an ethoxysilyl group are particularly preferable from the viewpoint of reactivity.

  Preferred silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4- Epoxycyclohexyl) alkoxysilanes having an epoxy functional group such as ethyltriethoxysilane: 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyl Methacrylic or acrylic groups such as triethoxysilane, methacryloxymethyltrimethoxysilane, methacryloxymethyltriethoxysilane, acryloxymethyltrimethoxysilane, acryloxymethyltriethoxysilane Alkoxysilanes which can be exemplified.

  The addition amount of the silane coupling agent can be variously set, but the lower limit of the preferable addition amount with respect to 100 parts by weight of [(A) component + (B) component] is 0.1 parts by weight, more preferably 0.5 parts. The upper limit of the preferred addition amount is 50 parts by weight, more preferably 25 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

  Examples of the epoxy compound include novolak phenol type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, and 2,2′-bis (4-glycidyloxycyclohexyl). Propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, vinyl cyclohexylene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro- (3,4-epoxycyclohexane) -1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2-cyclopropanedicarboxylic acid bisglycidyl ester, triglycidyl isocyanurate, monoallyl diglycidyl iso Cyanurate, mention may be made of diallyl monoglycidyl isocyanurate and the like.

  Although the addition amount of the epoxy compound can be variously set, the lower limit of the preferable addition amount with respect to 100 parts by weight of [(A) component + (B) component] is preferably 1 part by weight, more preferably 3 parts by weight. The upper limit of the addition amount is 50 parts by weight, more preferably 25 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

  These coupling agents, silane coupling agents, epoxy compounds, etc. may be used alone or in combination of two or more.

  In the present invention, a silanol condensation catalyst can be further used to enhance the effect of the coupling agent or the epoxy compound, and the adhesion can be improved and / or stabilized.

Such a silanol condensation catalyst is not particularly limited, but is preferably a boron compound or / and an aluminum compound or / and a titanium compound.
Examples of the boron compound used in the present invention include tri-2-ethylhexyl borate, normal trioctadecyl borate, trinormal octyl borate, triphenyl borate, trimethylene borate, tris (trimethylsilyl) borate, trinormal butyl borate, triborate triborate. Examples thereof include borate esters such as -sec-butyl, tri-tert-butyl borate, triisopropyl borate, trinormal propyl borate, triallyl borate, triethyl borate, trimethyl borate, and boron methoxyethoxide.
These boric acid esters may be used alone or in combination of two or more. Mixing may be performed in advance or may be performed at the time of producing a cured product.
Of these boric acid esters, trimethyl borate, triethyl borate, and trinormal butyl borate are preferable, and trimethyl borate is more preferable among them because it is easily available and has high industrial utility.
From the point that the volatility at the time of curing can be suppressed, normal trioctadecyl borate, trinormal octyl borate, triphenyl borate, trimethylene borate, tris (trimethylsilyl) borate, trinormal butyl borate, tri-sec-butyl borate, boric acid Tri-tert-butyl, triisopropyl borate, tripropylpropyl borate, triallyl borate, and boron methoxyethoxide are preferred. Among these, normal trioctadecyl borate, tri-tert-butyl borate, triphenyl borate, and tributyl normal borate are more preferred. preferable.
From the viewpoint of suppression of volatility and good workability, trinormal butyl borate, triisopropyl borate and trinormal propyl borate are preferable, and trinormal butyl borate is more preferable.

  From the viewpoint of low colorability at high temperatures, trimethyl borate and triethyl borate are preferred, and trimethyl borate is more preferred.

  Examples of the aluminum compound used in the present invention include aluminum alkoxides such as aluminum triisopropoxide, sec-butoxyaluminum diisoflopoxide, aluminum trisec-butoxide: ethyl acetoacetate aluminum diisopropoxide, aluminum tris ( Ethyl acetoacetate), aluminum chelate M (manufactured by Kawaken Fine Chemicals, alkyl acetoacetate aluminum diisopropoxide), aluminum tris (acetylacetonate), aluminum monoacetylacetonate bis (ethylacetoacetate), etc. Aluminum chelates are more preferable from the viewpoint of handleability.

  Titanium compounds used in the present invention include tetraalkoxy titaniums such as tetraisopropoxy titanium and tetrabutoxy titanium: titanium chelates such as titanium tetraacetylacetonate: general residues having residues such as oxyacetic acid and ethylene glycol And titanate coupling agents.

  The amount used in the case of using a silanol condensation catalyst can be variously set, but the lower limit of the preferable addition amount with respect to 100 parts by weight of the coupling agent or the epoxy compound is 0.1 parts by weight, more preferably 1 part by weight, which is preferable. The upper limit of the addition amount is 50 parts by weight, more preferably 30 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

  These silanol condensation catalysts may be used alone or in combination of two or more.

  In the present invention, a silanol source compound can be further used in order to further enhance the effect of improving adhesiveness, and the adhesiveness can be improved and / or stabilized. Examples of such a silanol source include silanol compounds such as triphenylsilanol and diphenyldihydroxysilane, and alkoxysilanes such as diphenyldimethoxysilane, tetramethoxysilane, and methyltrimethoxysilane.

  The amount used in the case of using a silanol source compound can be variously set, but the lower limit of the preferred addition amount with respect to 100 parts by weight of the coupling agent or the epoxy compound is 0.1 parts by weight, more preferably 1 part by weight, The upper limit of the preferable addition amount is 50 parts by weight, more preferably 30 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

  Moreover, these silanol source compounds may be used independently and may be used together 2 or more types.

  In the present invention, carboxylic acids and / or acid anhydrides can be used to enhance the effect of the coupling agent or epoxy compound, and adhesion can be improved and / or stabilized. Such carboxylic acids and acid anhydrides are not particularly limited,

２−エチルヘキサン酸、シクロヘキサンカルボン酸、シクロヘキサンジカルボン酸、メチルシクロヘキサンジカルボン酸、テトラヒドロフタル酸、メチルテトラヒドロフタル酸、メチルハイミック酸、ノルボルネンジカルボン酸、水素化メチルナジック酸、マレイン酸、アセチレンジカルボン酸、乳酸、リンゴ酸、クエン酸、酒石酸、安息香酸、ヒドロキシ安息香酸、桂皮酸、フタル酸、トリメリット酸、ピロメリット酸、ナフタレンカルボン酸、ナフタレンジカルボン酸、およびそれらの単独あるいは複合酸無水物が挙げられる。

2-ethylhexanoic acid, cyclohexanecarboxylic acid, cyclohexanedicarboxylic acid, methylcyclohexanedicarboxylic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, methylheimic acid, norbornene dicarboxylic acid, hydrogenated methylnadic acid, maleic acid, acetylenedicarboxylic acid, Examples include lactic acid, malic acid, citric acid, tartaric acid, benzoic acid, hydroxybenzoic acid, cinnamic acid, phthalic acid, trimellitic acid, pyromellitic acid, naphthalene carboxylic acid, naphthalene dicarboxylic acid, and single or complex acid anhydrides thereof It is done.

  Of these carboxylic acids and / or acid anhydrides, they react with SiH groups in that they have hydrosilylation reactivity and are unlikely to impair the physical properties of the resulting cured product with little possibility of seepage from the cured product. What contains the carbon-carbon double bond which has property is preferable. Preferred carboxylic acids and / or acid anhydrides include, for example,

テトラヒドロフタル酸、メチルテトラヒドロフタル酸およびそれらの単独あるいは複合酸無水物等が挙げられる。

Examples thereof include tetrahydrophthalic acid, methyltetrahydrophthalic acid, and single or complex acid anhydrides thereof.

  The amount used in the case of using carboxylic acids or / and acid anhydrides can be variously set, but the lower limit of the preferred amount of addition relative to 100 parts by weight of the coupling agent or / and epoxy compound is 0.1 parts by weight, more preferably Is 1 part by weight, and the upper limit of the preferable addition amount is 50 parts by weight, more preferably 10 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

Moreover, these carboxylic acids or / and acid anhydrides may be used alone or in combination of two or more.
(Thermoplastic resin)
Various thermoplastic resins can be added to the curable composition of the present invention for the purpose of modifying the properties. Various thermoplastic resins can be used. For example, a homopolymer of methyl methacrylate or a polymethyl methacrylate resin such as a random, block or graft polymer of methyl methacrylate and other monomers (for example, Hitachi Chemical) Optretz, etc.), acrylic resins represented by polybutyl acrylate resins such as butyl acrylate homopolymers or random, block or graft polymers of butyl acrylate and other monomers, bisphenol A, 3, A polycarbonate resin such as a polycarbonate resin containing 3,5-trimethylcyclohexylidenebisphenol or the like as a monomer structure (for example, APEC manufactured by Teijin Limited), a norbornene derivative, a vinyl monomer, or the like is copolymerized alone or copolymerized. Cycloolefin resins such as fat, norbornene derivative ring-opening metathesis polymer, or hydrogenated products thereof (for example, APEL manufactured by Mitsui Chemicals, ZEONOR, ZEONEX manufactured by Nippon Zeon, ARTON manufactured by JSR, etc.), ethylene and Olefin-maleimide resins such as maleimide copolymers (eg TI-PAS manufactured by Tosoh Corporation), bisphenols such as bisphenol A and bis (4- (2-hydroxyethoxy) phenyl) fluorene, and diols such as diethylene glycol Polyester resins such as polyester obtained by polycondensation of phthalic acids and aliphatic dicarboxylic acids such as terephthalic acid and isophthalic acid (eg O-PET manufactured by Kanebo Co., Ltd.), polyethersulfone resins, polyarylate resins, polyvinyl acetal resins, Polyethylene resin Polypropylene resins, polystyrene resins, polyamide resins, silicone resins, other like fluorine resin, not natural rubber, but the rubber-like resin is exemplified such EPDM is not limited thereto.

  As a thermoplastic resin, you may have the carbon-carbon double bond or / and SiH group which have a reactivity with SiH group in a molecule | numerator. In the point that the obtained cured product tends to be tougher, the molecule has one or more carbon-carbon double bonds or / and SiH groups having reactivity with SiH groups in the molecule on average. It is preferable.

  The thermoplastic resin may have other crosslinkable groups. Examples of the crosslinkable group in this case include an epoxy group, an amino group, a radical polymerizable unsaturated group, a carboxyl group, an isocyanate group, a hydroxyl group, and an alkoxysilyl group. From the viewpoint that the heat resistance of the obtained cured product tends to be high, it is preferable to have one or more crosslinkable groups in one molecule on average.

  The molecular weight of the thermoplastic resin is not particularly limited, but the number average molecular weight is preferably 10,000 or less in that the compatibility with the component (A) or the component (B) tends to be good. The following is more preferable. On the contrary, the number average molecular weight is preferably 10,000 or more, and more preferably 100,000 or more in that the obtained cured product tends to be tough. The molecular weight distribution is not particularly limited, but the molecular weight distribution is preferably 3 or less, more preferably 2 or less, in that the viscosity of the mixture tends to be low and the moldability tends to be good. More preferably, it is as follows.

  The blending amount of the thermoplastic resin is not particularly limited, but a preferable lower limit of the amount used is 5% by weight of the entire curable composition, more preferably 10% by weight, and a preferable upper limit of the amount used is in the curable composition. Is 50% by weight, more preferably 30% by weight. When the addition amount is small, the obtained cured product tends to be brittle, and when it is large, the heat resistance (elastic modulus at high temperature) tends to be low.

  A single thermoplastic resin may be used, or a plurality of thermoplastic resins may be used in combination.

  The thermoplastic resin may be dissolved in the component (A) or / and the component (B) and mixed in a uniform state, pulverized and mixed in a particle state, or dissolved in a solvent and mixed. It may be in a dispersed state. In the point that the obtained hardened | cured material tends to become more transparent, it is preferable to melt | dissolve in (A) component or / and (B) component, and to mix as a uniform state. Also in this case, the thermoplastic resin may be directly dissolved in the component (A) or / and the component (B), or may be mixed uniformly using a solvent or the like, and then the solvent is removed and uniform dispersion is performed. It is good also as a state or / and a mixed state.

When the thermoplastic resin is dispersed and used, the average particle diameter can be variously set, but the lower limit of the preferable average particle diameter is 10 nm, and the upper limit of the preferable average particle diameter is 10 μm. There may be a distribution of the particle system, which may be monodispersed or have a plurality of peak particle diameters, but from the viewpoint that the viscosity of the curable composition is low and the moldability tends to be good. The coefficient of variation is preferably 10% or less.
(Filler)
You may add a filler to the curable composition of this invention as needed.

  Various fillers are used. For example, silica-based fillers such as quartz, fume silica, precipitated silica, silicic anhydride, fused silica, crystalline silica, ultrafine powder amorphous silica, silicon nitride, silver powder, etc. Inorganic fillers such as alumina, aluminum hydroxide, titanium oxide, glass fiber, carbon fiber, mica, carbon black, graphite, diatomaceous earth, clay, clay, talc, calcium carbonate, magnesium carbonate, barium sulfate, inorganic balloon As a filler for a conventional sealing material such as an epoxy-based filler, generally used and / or proposed fillers can be mentioned.

(Anti-aging agent)
You may add antioxidant to the curable composition obtained by this invention. Examples of the anti-aging agent include citric acid, phosphoric acid, sulfur-based anti-aging agent and the like in addition to the anti-aging agents generally used such as hindered phenol type.

  As the hindered phenol-based anti-aging agent, various types such as Irganox 1010 available from Ciba Specialty Chemicals are used.

  Sulfur-based antioxidants include mercaptans, mercaptan salts, sulfide carboxylic acid esters, sulfides including hindered phenol sulfides, polysulfides, dithiocarboxylates, thioureas, thiophosphates, sulfonium Examples thereof include compounds, thioaldehydes, thioketones, mercaptals, mercaptols, monothioacids, polythioacids, thioamides, and sulfoxides.

Moreover, these anti-aging agents may be used independently and may be used together 2 or more types.
(Radical inhibitor)
You may add a radical inhibitor to the curable composition obtained by this invention. Examples of the radical inhibitor include 2,6-di-t-butyl-3-methylphenol (BHT), 2,2′-methylene-bis (4-methyl-6-t-butylphenol), tetrakis (methylene- Phenol radical inhibitors such as 3 (3,5-di-t-butyl-4-hydroxyphenyl) propionate) methane, phenyl-β-naphthylamine, α-naphthylamine, N, N′-secondary butyl-p- Examples include amine radical inhibitors such as phenylenediamine, phenothiazine, N, N′-diphenyl-p-phenylenediamine, and the like.

Moreover, these radical inhibitors may be used alone or in combination of two or more.
(UV absorber)
You may add a ultraviolet absorber to the curable composition obtained by this invention. Examples of the ultraviolet absorber include 2 (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, bis (2,2,6,6-tetramethyl-4-piperidine) sebacate and the like. Can be mentioned.

Moreover, these ultraviolet absorbers may be used independently and may be used together 2 or more types.
(Other additives)
The curable composition of the present invention includes other ions such as a colorant, a release agent, a flame retardant, a flame retardant aid, a surfactant, an antifoaming agent, an emulsifier, a leveling agent, an anti-fogging agent, and antimony-bismuth. Trapping agent, thixotropic agent, tackifier, storage stability improver, ozone degradation inhibitor, light stabilizer, thickener, plasticizer, reactive diluent, antioxidant, heat stabilizer, conductivity The purpose and effect of the present invention include an imparting agent, an antistatic agent, a radiation shielding agent, a nucleating agent, a phosphorus peroxide decomposing agent, a lubricant, a pigment, a metal deactivator, a thermal conductivity imparting agent, and a physical property modifier. It can be added as long as it is not impaired.
(solvent)
The curable composition obtained in the present invention can be used by dissolving in a solvent. Solvents that can be used are not particularly limited, and specific examples include hydrocarbon solvents such as benzene, toluene, hexane, heptane, tetrahydrofuran, 1,4-dioxane, 1,3-dioxolane, diethyl ether, and the like. An ether solvent, a ketone solvent such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, and a halogen solvent such as chloroform, methylene chloride, and 1,2-dichloroethane can be preferably used.

  As the solvent, toluene, tetrahydrofuran, 1,3-dioxolane and chloroform are preferable.

  Although the amount of solvent to be used can be set as appropriate, the lower limit of the preferred amount of use with respect to 1 g of the curable composition to be used is 0.1 mL, and the upper limit of the preferred amount of use is 10 mL. If the amount used is small, it is difficult to obtain the effect of using a solvent such as a low viscosity, and if the amount used is large, the solvent tends to remain in the material, causing problems such as thermal cracks, and also from a cost standpoint. It is disadvantageous and the industrial utility value decreases.

  These solvents may be used alone or as a mixed solvent of two or more.

  The curable composition or cured product of the present invention can be used for various applications.

  Examples thereof include materials used for liquid crystal display devices such as a color filter protective film, a TFT flattening film, and a substrate material, and materials used for light emitting diodes (LEDs) such as a sealant and a die bond agent.

  Furthermore, substrate materials, light guide plates, prism sheets, deflector plates, retardation plates, viewing angle correction films, polarizer protective films, color filters, etc., and various coating agents, protective films, sealants used in them in the liquid crystal display field Also, an adhesive and the like can be mentioned.

  Also, LED element molding agents used in LED display devices, LED sealants, front glass protective films, front glass substitute materials and various coating agents, protective films, sealants, adhesives, etc. used therefor Also mentioned.

  Also, color PDP (plasma display) anti-reflection film, optical correction film, housing material, front glass protective film, front glass substitute material and various coating agents, protective film, sealant, adhesive, etc. Also mentioned. In addition, substrate materials, light guide plates, prism sheets, deflector plates, retardation plates, viewing angle correction films, polarizer protective films and various coating agents, protective films, and sealants used in plasma addressed liquid crystal (PALC) displays Also, an adhesive and the like can be mentioned. Moreover, the protective film of the front glass in an organic EL (electroluminescence) display, a front glass substitute material, various coating agents used for them, a protective film, a sealing agent, an adhesive agent, etc. are mentioned. Moreover, various film substrates in a field emission display (FED), a front glass protective film, a front glass substitute material, and various coating agents, protective films, sealants, adhesives and the like used therefor.

  In addition, in the optical recording field, VD (video disk), CD / CD-ROM, CD-R / RW, DVD-R / DVD-RAM, MO / MD, PD (phase change disk), disk substrate for optical cards. Examples include materials, pickup lenses, protective films, and various coating agents, protective films, sealants, adhesives and the like used for them.

  In the field of optical equipment, a steel camera lens material, a finder prism, a target prism, a finder cover, a light receiving sensor unit, and various coating agents, protective films, sealants, adhesives, and the like used for them. In addition, a video camera photographing lens, a finder, and various coating agents, protective films, sealants, adhesives and the like used for them can also be used. Moreover, the projection lens of a projection television, a protective film, the various coating agent used for them, a protective film, a sealing agent, an adhesive agent, etc. are mentioned. Examples of the lens materials for optical sensing devices, various films, and various coating agents, protective films, sealants, adhesives and the like used therefor.

  In the field of optical components, fiber materials, lenses, waveguides, elements and various coating agents, protective films, sealants, adhesives and the like used in the vicinity of optical switches in optical communication systems are also included. Examples also include optical fiber materials around the optical connector, ferrules, various coating agents used for them, protective films, sealing agents, and adhesives. In the case of optical passive components and optical circuit components, lenses, waveguides, various coating agents, protective films, sealants, adhesives and the like used for them are also included. Examples also include substrate materials around the optoelectronic integrated circuit (OEIC), fiber materials, and various coating agents, protective films, sealants, adhesives and the like used for them.

  In the field of optical fibers, illuminations and light guides for decorative displays, sensors for industrial use, displays and signs, etc., optical fibers for communication infrastructure and home use, and various coating agents and protective films used for them. , Sealants, adhesives and the like.

Examples of peripheral materials for semiconductor integrated circuits include resist materials for microlithography for LSI and VLSI materials.
In the field of automobiles and transport equipment, lamp materials such as automotive headlamps, tail lamps, and interior lamps, lamp reflectors, lamp lenses, exterior and interior products such as exterior panels and interior panels, glass substitutes, and various coating agents used for them , Protective film, sealant, adhesive and the like. Moreover, exterior parts for railway vehicles, glass substitutes, and various coating agents, protective films, sealants, adhesives and the like used for them are also included. In addition, aircraft exterior parts, glass substitutes, and various coating agents, protective films, sealants, adhesives and the like used for them are also included.

  In the construction field, glass intermediate films, glass substitutes, solar cell peripheral materials, various coating agents used for them, protective films, sealants, adhesives, and the like are also included.

  For agriculture, a house covering film is also included.

  Next-generation optical / electronic functional organic materials include organic EL element peripheral materials, organic photorefractive elements, optical amplification elements that are light-to-light conversion devices, optical arithmetic elements, substrate materials around organic solar cells, fiber materials, elements And various coating agents, protective films, sealants, adhesives and the like used therefor.

  Examples and Comparative Examples of the present invention are shown below, but the present invention is not limited to the following.

In the synthesis examples, ¹ H-NMR measurement and viscosity measurement of the reaction product were performed as follows.
⁽¹ H-NMR)
A 300 MHz NMR apparatus manufactured by Varian Technologies Japan Limited was used.
The allyl group value of the reaction product was determined by measuring ¹ H-NMR of the reaction solution diluted to about 1% with deuterated chloroform, and the peak of the methylene group derived from the unreacted allyl group and the peak of the methylene group derived from the reacted allyl group. Calculated from Moreover, as the SiH group value of the reaction product, the SiH group value (mmol / g) in terms of dibromoethane was determined.
(Viscosity measurement)
The viscosity of the reaction product was measured under the condition of 23 ° C. using an E-type viscometer manufactured by Tokyo Keiki Co., Ltd.

(Synthesis Example 1)
A 2 L autoclave was charged with 602 g of toluene and 626 g of 1,3,5,7-tetramethylcyclotetrasiloxane, and the gas phase portion was replaced with nitrogen, followed by heating and stirring at a jacket temperature of 105 ° C. A mixed liquid of 90 g of triallyl isocyanurate, 90 g of toluene and 0.057 g of a xylene solution of platinum divinyltetramethyldisiloxane complex (containing 3 wt% as platinum) was added dropwise over 40 minutes. Four hours after the completion of the dropwise addition, it was confirmed by ¹ H-NMR that the reaction rate of the allyl group was 95% or more, and the reaction was terminated by cooling. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure to obtain a colorless and transparent liquid (reaction product).
The viscosity of the obtained reaction product was 1.9 Pa · s. When the obtained reaction product was measured by GPC, a multimodal chromatogram was obtained, suggesting that it was a mixture. From the measurement of ¹ H-NMR, the obtained reaction product was obtained by reacting part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane with the allyl group of triallyl isocyanurate (“partial reaction”). It was found to contain a 9.3 mmol / g SiH group. It confirmed that "partial reactant S1" contained the (B) component which has the following structural formula as a main component from GC / MS.

（合成例２）
２Ｌ４ツ口フラスコにトルエン６００ｇ、「部分反応物Ｓ１」３００ｇを入れ、気相部を窒素置換した後、内温が１００℃になるように加熱、撹拌した。内温が安定した後、ビニルトリメトキシシラン１３７．４ｇ、トルエン６８．７１ｇ、白金ジビニルテトラジシロキサン錯体のキシレン溶液（白金として３ｗｔ％含有）０．０３０ｇの混合溶液を１時間かけて滴下した。滴下終了から４５分後に¹Ｈ−ＮＭＲ測定でビニル基の消失を確認した後、反応液を冷却した。この反応液を脱揮することにより、無色透明の液体（反応物）を得た。

(Synthesis Example 2)
Into a 2 L four-necked flask, 600 g of toluene and 300 g of “partial reactant S1” were placed, and the gas phase portion was purged with nitrogen, and then heated and stirred so that the internal temperature became 100 ° C. After the internal temperature was stabilized, a mixed solution of 137.4 g of vinyltrimethoxysilane, 68.71 g of toluene, and 0.030 g of a xylene solution of platinum divinyltetradisiloxane complex (containing 3 wt% as platinum) was added dropwise over 1 hour. 45 minutes after the completion of dropping, disappearance of the vinyl group was confirmed by ¹ H-NMR measurement, and then the reaction solution was cooled. The reaction solution was devolatilized to obtain a colorless and transparent liquid (reaction product).

The viscosity of the obtained reaction product was 3.7 Pa · s. When the obtained reaction product was measured by GPC, a multimodal chromatogram was obtained, suggesting that it was a mixture. From the ¹ H-NMR measurement, a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane reacted with the allyl group of triallyl isocyanurate and vinyltrimethoxysilane. (Referred to as “partial reactant S2”) and was found to contain 4.1 mmol / g SiH groups. The “partial reactant S2” has an average composition of the following structural formula in which vinyltrimethoxysilane has reacted on an average of 3 moles with respect to 1 mole of the “partial reactant S1”, and has at least two SiH groups in one molecule and This corresponds to the component (B1) which is a compound having at least one hydrolyzable silicon group in one molecule.

（実施例１）
トリアリルイソシアヌレート２４．４重量部、「部分反応物Ｓ２」７５．６重量部、１−エチニルシクロヘキサノール０．１重量部、白金ジビニルテトラジシロキサン錯体のキシレン溶液（白金として３ｗｔ％含有）０．１重量部を秤取攪拌混合し、硬化性組成物を得た。
得られた硬化性組成物を用いて５０μｍ厚の塗膜を作製し、そこに２×２×０．１ｍｍのガラス板をスタンプして、ガラス板に硬化性組成物を付着させた。このガラス板を、あらかじめ表面をアセトンで脱脂しておいたアルミニウム板およびガラス繊維強化エポキシ樹脂（ＦＲＰ）板に載せ、７０℃２時間、８０℃１時間、１００℃１時間、１２０℃１時間、１５０℃１時間、１８０℃３０分間で硬化させてダイシェア試験片を作製した。このダイシェア試験片について、Ｄａｇｅ社製ダイシェア試験機４０００−ＤＳ１００ＫＧを用いてダイシェア強度を測定した。その結果を表１に示す。

Example 1
24.4 parts by weight of triallyl isocyanurate, 75.6 parts by weight of “partial reaction product S2”, 0.1 part by weight of 1-ethynylcyclohexanol, xylene solution of platinum divinyltetradisiloxane complex (containing 3 wt% as platinum) 0 1. 1 part by weight was weighed and mixed to obtain a curable composition.
A 50 μm-thick coating film was prepared using the obtained curable composition, a 2 × 2 × 0.1 mm glass plate was stamped thereon, and the curable composition was adhered to the glass plate. This glass plate was placed on an aluminum plate and a glass fiber reinforced epoxy resin (FRP) plate whose surfaces were previously degreased with acetone, 70 ° C. for 2 hours, 80 ° C. for 1 hour, 100 ° C. for 1 hour, 120 ° C. for 1 hour, A die shear test piece was prepared by curing at 150 ° C. for 1 hour and 180 ° C. for 30 minutes. About this die shear test piece, die shear strength was measured using the die shear tester 4000-DS100KG made from Dage. The results are shown in Table 1.

(Examples 2 to 4)
Weigh the amounts shown in Table 1 for triallyl isocyanurate, “partial reactant S2”, “partial reactant S1”, 1-ethynylcyclohexanol, and xylene solution of platinum divinyltetradisiloxane complex (containing 3 wt% as platinum). The mixture was stirred and mixed to obtain a curable composition. In the same manner as in Example 1, the die shear strength of the aluminum plate and the FRP plate was measured. The results are shown in Table 1.

(Comparative Example 1)
Trial isocyanurate, “partial reaction product 1”, 1-ethynylcyclohexanol, and xylene solution of platinum divinyltetradisiloxane complex (containing 3 wt% as platinum) are weighed and mixed in the amount shown in Table 1, and curable composition I got a thing. In the same manner as in Example 1, the die shear strength of the aluminum plate and the FRP plate was measured. The results are shown in Table 1.

以上の結果より、（Ａ）ＳｉＨ基と反応性を有する炭素−炭素二重結合を１分子中に少なくとも２個有する有機化合物、（Ｂ）ＳｉＨ基を１分子中に少なくとも２個有する化合物、（Ｃ）ヒドロシリル化触媒を必須成分として含有する硬化性組成物において、（Ｂ）成分中に（Ｂ１）ＳｉＨ基を１分子中に少なくとも２個および加水分解性ケイ素基を１分子中に少なくとも１個有する化合物を含有することにより、得られる硬化物の接着性が向上することがわかる。

From the above results, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups in one molecule, (B) a compound having at least two SiH groups in one molecule, ( C) In a curable composition containing a hydrosilylation catalyst as an essential component, (B1) at least two SiH groups in one molecule and at least one hydrolyzable silicon group in one molecule in component (B) It turns out that the adhesiveness of the hardened | cured material obtained improves by containing the compound which has.

Claims (6)

(A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups in one molecule;
(B) a compound having at least two SiH groups in one molecule;
(C) A curable composition containing a hydrosilylation catalyst as an essential component, wherein (B) component,
(B1) A curable composition comprising a compound having at least two SiH groups in one molecule and at least one alkoxysilyl group in one molecule ,
(B1) component is
An organic compound (α1 ′) having at least two carbon-carbon double bonds reactive with SiH groups in one molecule;
A compound (α2 ′) having at least one carbon-carbon double bond reactive with a SiH group in one molecule and at least one alkoxysilyl group in one molecule; and
A curable composition, which is a compound obtained by subjecting a cyclic polyorganosiloxane (β1 ′) having at least three SiH groups in one molecule to a hydrosilylation reaction . The curable composition according to claim 1, wherein the alkoxysilyl group in the component (B1) is a methoxysilyl group and / or an ethoxysilyl group. The compound (α2 ′) having at least one carbon-carbon double bond reactive with the SiH group in one molecule and at least one alkoxysilyl group in one molecule is trimethoxyvinylsilane, methyldimethoxyvinylsilane, The curable composition according to claim 1 or 2 , which is at least one selected from the group consisting of dimethylmethoxyvinylsilane, triethoxyvinylsilane, methyldiethoxyvinylsilane, and dimethylethoxyvinylsilane. The carbon having an SiH group reactive - organic compound having at least two carbon double bonds in one molecule ([alpha] 1 ') is triallyl isocyanurate and / or diallyl monoglycidyl isocyanurate, claim 1 The curable composition as described in any one of -3 . The curing according to any one of claims 1 to 4 , wherein the silicon compound (β1 ') having at least three SiH groups in one molecule is 1,3,5,7-tetramethylcyclotetrasiloxane. Sex composition. The curable composition according to any one of claims 1 to 5 , wherein the content of the component (B1) in the component (B) is 5% by weight or more.