WO2011002881A1 - Plaquette de polissage dotée d'un réseau de segments abrasifs montés à la cardan - Google Patents

Plaquette de polissage dotée d'un réseau de segments abrasifs montés à la cardan Download PDF

Info

Publication number
WO2011002881A1
WO2011002881A1 PCT/US2010/040595 US2010040595W WO2011002881A1 WO 2011002881 A1 WO2011002881 A1 WO 2011002881A1 US 2010040595 W US2010040595 W US 2010040595W WO 2011002881 A1 WO2011002881 A1 WO 2011002881A1
Authority
WO
WIPO (PCT)
Prior art keywords
abrasive
substrate
members
article
abrasive article
Prior art date
Application number
PCT/US2010/040595
Other languages
English (en)
Inventor
Zine-Eddine Boutaghou
Original Assignee
Zine-Eddine Boutaghou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zine-Eddine Boutaghou filed Critical Zine-Eddine Boutaghou
Publication of WO2011002881A1 publication Critical patent/WO2011002881A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/16—Bushings; Mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00—Subject matter not provided for in other groups of this subclass
    • B24D99/005—Segments of abrasive wheels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Article abrasif doté d'un réseau d'éléments abrasifs indépendamment montés sur cardan et susceptibles de venir sélectivement au contact d'aspérités nanométriques et/ou micrométriques sur les surfaces de substrats. Chaque élément abrasif maintient un palier fluide (l'air étant le fluide caractéristique) avec le substrat. Les éléments abrasifs peuvent être réglés en espacement et en pas de façon à épouser la topographie du substrat de manière à éliminer une couche généralement uniforme de matière, à venir au contact des pics du substrat pour réduire la rugosité et/ou à éliminer les débris et contaminants de la surface du substrat.
PCT/US2010/040595 2009-06-30 2010-06-30 Plaquette de polissage dotée d'un réseau de segments abrasifs montés à la cardan WO2011002881A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US22155409P 2009-06-30 2009-06-30
US61/221,554 2009-06-30
US24819409P 2009-10-02 2009-10-02
US61/248,194 2009-10-02

Publications (1)

Publication Number Publication Date
WO2011002881A1 true WO2011002881A1 (fr) 2011-01-06

Family

ID=42712712

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/040595 WO2011002881A1 (fr) 2009-06-30 2010-06-30 Plaquette de polissage dotée d'un réseau de segments abrasifs montés à la cardan

Country Status (2)

Country Link
US (1) US20100330890A1 (fr)
WO (1) WO2011002881A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9941148B2 (en) 2014-11-23 2018-04-10 M Cubed Technologies, Inc. Wafer pin chuck fabrication and repair
US10702968B2 (en) 2015-08-14 2020-07-07 M Cubed Technologies, Inc. Machine for finishing a work piece, and having a highly controllable treatment tool
US10790181B2 (en) 2015-08-14 2020-09-29 M Cubed Technologies, Inc. Wafer chuck featuring reduced friction support surface
US10792778B2 (en) 2015-08-14 2020-10-06 M Cubed Technologies, Inc. Method for removing contamination from a chuck surface
US10953513B2 (en) 2015-08-14 2021-03-23 M Cubed Technologies, Inc. Method for deterministic finishing of a chuck surface

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110104989A1 (en) * 2009-04-30 2011-05-05 First Principles LLC Dressing bar for embedding abrasive particles into substrates
US8801497B2 (en) 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
US9221148B2 (en) 2009-04-30 2015-12-29 Rdc Holdings, Llc Method and apparatus for processing sliders for disk drives, and to various processing media for the same
US9343084B2 (en) * 2012-03-14 2016-05-17 Western Digital Technologies, Inc. Systems and methods for correcting slider parallelism error using compensation lapping
JP6447472B2 (ja) 2015-11-26 2019-01-09 株式会社Sumco ウェーハ研磨方法
US20220396723A1 (en) * 2021-06-11 2022-12-15 Sponge-Jet, Inc. Abrasive media blends and related methods

Citations (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3683562A (en) 1970-09-24 1972-08-15 Spitfire Tool & Machine Co Inc Means for applying a liquid abrasive over the surface of a rotatable lapping table of a lapping machine
US3921342A (en) 1973-12-17 1975-11-25 Spitfire Tool & Machine Co Inc Lap plate
US4821461A (en) 1987-11-23 1989-04-18 Magnetic Peripherals Inc. Textured lapping plate and process for its manufacture
US4980536A (en) 1987-07-02 1990-12-25 International Business Machines Corporation Removal of particles from solid-state surfaces by laser bombardment
US5024968A (en) 1988-07-08 1991-06-18 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5099557A (en) 1988-07-08 1992-03-31 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5152917A (en) 1991-02-06 1992-10-06 Minnesota Mining And Manufacturing Company Structured abrasive article
WO1995007797A1 (fr) 1993-09-13 1995-03-23 Minnesota Mining And Manufacturing Company Article abrasif, son procede de fabrication, son procede d'utilisation pour la finition, et outil de production
US5435816A (en) 1993-01-14 1995-07-25 Minnesota Mining And Manufacturing Company Method of making an abrasive article
US5437754A (en) 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
WO1995022436A1 (fr) 1994-02-22 1995-08-24 Minnesota Mining And Manufacturing Company Article abrasif, son procede de fabrication, et son procede d'utilisation dans le finissage d'une surface
US5454844A (en) 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
US5489235A (en) 1993-09-13 1996-02-06 Minnesota Mining And Manufacturing Company Abrasive article and method of making same
US5774305A (en) 1995-06-07 1998-06-30 Seagate Technology, Inc. Head gimbal assembly to reduce slider distortion due to thermal stress
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
JPH10286777A (ja) * 1997-04-09 1998-10-27 Nikon Corp 研磨工具皿
US5849135A (en) 1996-03-12 1998-12-15 The Regents Of The University Of California Particulate contamination removal from wafers using plasmas and mechanical agitation
US5856896A (en) 1996-12-04 1999-01-05 Seagate Technology, Inc. Gimbal suspension for supporting a head in a disc drive assembly
CN1222431A (zh) * 1997-11-05 1999-07-14 阿普莱克斯公司 包括静压流体轴承支承的剖光系统
US6069771A (en) 1996-11-04 2000-05-30 Seagate Technology, Inc. Gimbal micropositioning device
US6092253A (en) 1996-12-30 2000-07-25 Intel Corporation Flexible-leaf substrate edge cleaning apparatus
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6194317B1 (en) 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US6273793B1 (en) * 1998-09-23 2001-08-14 Seagate Technology Llc Apparatus and method for reducing disc surface asperities to sub-microinch height
US6334229B1 (en) 1996-05-01 2002-01-01 Lam Research Corporation Apparatus for cleaning edges of contaminated substrates
WO2002029813A2 (fr) * 2000-10-03 2002-04-11 Seagate Technology Llc Tete de brunissage/polissage hybride avec rails de regulation avancee de la hauteur de survol d'un support pneumatique
US6459260B1 (en) 2001-06-12 2002-10-01 Seagate Technology Llc Head suspension assembly for testing a slider
US6493192B2 (en) 2000-06-22 2002-12-10 Seagate Technology Llc Disc drive with improved head pitch adjustment
US20030096558A1 (en) * 2001-11-20 2003-05-22 Zheng Guo Qiang Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating. such as during dynamic electrical testing
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US20040040575A1 (en) 2002-08-28 2004-03-04 Alexander Tregub Brush for cleaning/scrubbing a substrate
US6714386B1 (en) 1998-12-07 2004-03-30 Seagate Technology Llc Disc drive having a suspension limiter for improved shock performance
US20040072510A1 (en) 2000-12-21 2004-04-15 Toshiya Kinoshita Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
US6744602B2 (en) 2001-08-22 2004-06-01 Seagate Technology Llc Modified gimbal tongue designs to reduce particle sensitivity
US6805137B2 (en) 2001-08-27 2004-10-19 Applied Materials, Inc. Method for removing contamination particles from substrates
US6811467B1 (en) 2002-09-09 2004-11-02 Seagate Technology Llc Methods and apparatus for polishing glass substrates
US6821189B1 (en) 2000-10-13 2004-11-23 3M Innovative Properties Company Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
US6872127B2 (en) 2002-07-11 2005-03-29 Taiwan Semiconductor Manufacturing Co., Ltd Polishing pad conditioning disks for chemical mechanical polisher
US6875086B2 (en) 2003-01-10 2005-04-05 Intel Corporation Surface planarization
US6952330B1 (en) 1999-06-11 2005-10-04 Seagate Technology Llc Dynamic flying attitude control using augmented gimbal
US20050287032A1 (en) 2004-06-24 2005-12-29 Alexander Tregub Anti-bacterial protection to improve performance of post CMP clean brush
DE102004058797A1 (de) * 2004-06-12 2006-01-05 IGAM Ingenieurgesellschaft für angewandte Mechanik mbH Verfahren und Werkzeug zur Bearbeitung von Funktionselementen mit gekrümmten Oberflächen
US7057856B2 (en) 2003-11-06 2006-06-06 Seagate Technology Llc Gimbal strut shape to increase buckling load
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US7185384B2 (en) 2002-08-29 2007-03-06 Intel Corporation Wafer cleaning brush
US7189333B2 (en) 2002-09-18 2007-03-13 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US7203033B2 (en) 2002-10-02 2007-04-10 Seagate Technology Llc Head gimbal assembly with an integrated mechanical and electrical attachment and a stiff plate
US7218478B2 (en) 2004-09-28 2007-05-15 Hitachi Global Storage Technologies Netherlands B.V. Disk drive with negative-pitch slider having protrusion pad contacting the disk when the disk is rotating at operating speed
US20070107317A1 (en) 2003-10-22 2007-05-17 Japan Science And Technology Agency Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components
US20080004743A1 (en) 2006-06-28 2008-01-03 3M Innovative Properties Company Abrasive Articles, CMP Monitoring System and Method
US20080053000A1 (en) 2006-08-30 2008-03-06 3M Innovative Properties Company Extended life abrasive article and method
US7367875B2 (en) 2003-07-25 2008-05-06 Morgan Advanced Ceramics, Inc. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US7404756B2 (en) 2004-10-29 2008-07-29 3M Innovative Properties Company Process for manufacturing optical and semiconductor elements
US7469443B2 (en) 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4219898A (en) * 1979-02-14 1980-09-02 Presby Harry A Floating brush floor cleaner
US4614380A (en) * 1983-11-03 1986-09-30 The Boeing Company Power driven rotary floor preparation device
GB8818478D0 (en) * 1988-08-03 1988-09-07 B A Power Tool Ltd Grinding machine
US5014468A (en) * 1989-05-05 1991-05-14 Norton Company Patterned coated abrasive for fine surface finishing
US5209760A (en) * 1990-05-21 1993-05-11 Wiand Ronald C Injection molded abrasive pad
US5083839A (en) * 1990-06-27 1992-01-28 Rick Younger Apparatus for grooving or grinding pavement
US5081734A (en) * 1990-10-09 1992-01-21 The Re Partnership Floor scraping machine
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
US5441598A (en) * 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
US5683143A (en) * 1996-01-11 1997-11-04 Pearl Abrasive Company Abrasive surface treatment apparatus having removable blocks
US5800248A (en) * 1996-04-26 1998-09-01 Ontrak Systems Inc. Control of chemical-mechanical polishing rate across a substrate surface
WO1998019829A1 (fr) * 1996-11-06 1998-05-14 Minnesota Mining And Manufacturing Company Ensemble et procede d'abrasion multiple
EA003437B1 (ru) * 1997-09-05 2003-04-24 Государственное Унитарное Предприятие "Центральный Научно-Исследовательский Институт Материалов" Способ изготовления композиционного материала алмаз-карбид кремния-кремний и композиционный материал, изготовленный этим способом
US6780095B1 (en) * 1997-12-30 2004-08-24 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
US6139402A (en) * 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
US5927264A (en) * 1998-01-08 1999-07-27 Worley; Kenneth Extended wear stone polishing disk
US6102789A (en) * 1998-03-27 2000-08-15 Norton Company Abrasive tools
US6328632B1 (en) * 1999-08-31 2001-12-11 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
JP2001219379A (ja) * 2000-02-09 2001-08-14 Dyuuku Planning:Kk 研磨具
US6607425B1 (en) * 2000-12-21 2003-08-19 Lam Research Corporation Pressurized membrane platen design for improving performance in CMP applications
ES2287242T3 (es) * 2001-03-05 2007-12-16 Elm Inc. Dispositivo para limpiar discos opticos.
US7314402B2 (en) * 2001-11-15 2008-01-01 Speedfam-Ipec Corporation Method and apparatus for controlling slurry distribution
US6833014B2 (en) * 2002-07-26 2004-12-21 3M Innovative Properties Company Abrasive product, method of making and using the same, and apparatus for making the same
JP2004291213A (ja) * 2003-03-28 2004-10-21 Noritake Super Abrasive:Kk 研削砥石
US7393371B2 (en) * 2004-04-13 2008-07-01 3M Innovative Properties Company Nonwoven abrasive articles and methods
US7169029B2 (en) * 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
US8257142B2 (en) * 2008-04-15 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method

Patent Citations (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3683562A (en) 1970-09-24 1972-08-15 Spitfire Tool & Machine Co Inc Means for applying a liquid abrasive over the surface of a rotatable lapping table of a lapping machine
US3921342A (en) 1973-12-17 1975-11-25 Spitfire Tool & Machine Co Inc Lap plate
US4980536A (en) 1987-07-02 1990-12-25 International Business Machines Corporation Removal of particles from solid-state surfaces by laser bombardment
US4821461A (en) 1987-11-23 1989-04-18 Magnetic Peripherals Inc. Textured lapping plate and process for its manufacture
US5024968A (en) 1988-07-08 1991-06-18 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5099557A (en) 1988-07-08 1992-03-31 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5304223A (en) 1991-02-06 1994-04-19 Minnesota Mining And Manufacturing Company Structured abrasive article
US5152917A (en) 1991-02-06 1992-10-06 Minnesota Mining And Manufacturing Company Structured abrasive article
US5437754A (en) 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
US5435816A (en) 1993-01-14 1995-07-25 Minnesota Mining And Manufacturing Company Method of making an abrasive article
WO1995007797A1 (fr) 1993-09-13 1995-03-23 Minnesota Mining And Manufacturing Company Article abrasif, son procede de fabrication, son procede d'utilisation pour la finition, et outil de production
US5489235A (en) 1993-09-13 1996-02-06 Minnesota Mining And Manufacturing Company Abrasive article and method of making same
US5454844A (en) 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
WO1995022436A1 (fr) 1994-02-22 1995-08-24 Minnesota Mining And Manufacturing Company Article abrasif, son procede de fabrication, et son procede d'utilisation dans le finissage d'une surface
US5774305A (en) 1995-06-07 1998-06-30 Seagate Technology, Inc. Head gimbal assembly to reduce slider distortion due to thermal stress
US5849135A (en) 1996-03-12 1998-12-15 The Regents Of The University Of California Particulate contamination removal from wafers using plasmas and mechanical agitation
US6334229B1 (en) 1996-05-01 2002-01-01 Lam Research Corporation Apparatus for cleaning edges of contaminated substrates
US6069771A (en) 1996-11-04 2000-05-30 Seagate Technology, Inc. Gimbal micropositioning device
US5856896A (en) 1996-12-04 1999-01-05 Seagate Technology, Inc. Gimbal suspension for supporting a head in a disc drive assembly
US6092253A (en) 1996-12-30 2000-07-25 Intel Corporation Flexible-leaf substrate edge cleaning apparatus
JPH10286777A (ja) * 1997-04-09 1998-10-27 Nikon Corp 研磨工具皿
CN1222431A (zh) * 1997-11-05 1999-07-14 阿普莱克斯公司 包括静压流体轴承支承的剖光系统
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US7198553B2 (en) 1998-04-15 2007-04-03 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6194317B1 (en) 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US6273793B1 (en) * 1998-09-23 2001-08-14 Seagate Technology Llc Apparatus and method for reducing disc surface asperities to sub-microinch height
US6714386B1 (en) 1998-12-07 2004-03-30 Seagate Technology Llc Disc drive having a suspension limiter for improved shock performance
US6952330B1 (en) 1999-06-11 2005-10-04 Seagate Technology Llc Dynamic flying attitude control using augmented gimbal
US6493192B2 (en) 2000-06-22 2002-12-10 Seagate Technology Llc Disc drive with improved head pitch adjustment
WO2002029813A2 (fr) * 2000-10-03 2002-04-11 Seagate Technology Llc Tete de brunissage/polissage hybride avec rails de regulation avancee de la hauteur de survol d'un support pneumatique
US6821189B1 (en) 2000-10-13 2004-11-23 3M Innovative Properties Company Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
US20040072510A1 (en) 2000-12-21 2004-04-15 Toshiya Kinoshita Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6459260B1 (en) 2001-06-12 2002-10-01 Seagate Technology Llc Head suspension assembly for testing a slider
US6744602B2 (en) 2001-08-22 2004-06-01 Seagate Technology Llc Modified gimbal tongue designs to reduce particle sensitivity
US6805137B2 (en) 2001-08-27 2004-10-19 Applied Materials, Inc. Method for removing contamination particles from substrates
US20030096558A1 (en) * 2001-11-20 2003-05-22 Zheng Guo Qiang Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating. such as during dynamic electrical testing
US6872127B2 (en) 2002-07-11 2005-03-29 Taiwan Semiconductor Manufacturing Co., Ltd Polishing pad conditioning disks for chemical mechanical polisher
US20040040575A1 (en) 2002-08-28 2004-03-04 Alexander Tregub Brush for cleaning/scrubbing a substrate
US7185384B2 (en) 2002-08-29 2007-03-06 Intel Corporation Wafer cleaning brush
US6811467B1 (en) 2002-09-09 2004-11-02 Seagate Technology Llc Methods and apparatus for polishing glass substrates
US7189333B2 (en) 2002-09-18 2007-03-13 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US7203033B2 (en) 2002-10-02 2007-04-10 Seagate Technology Llc Head gimbal assembly with an integrated mechanical and electrical attachment and a stiff plate
US6875086B2 (en) 2003-01-10 2005-04-05 Intel Corporation Surface planarization
US7367875B2 (en) 2003-07-25 2008-05-06 Morgan Advanced Ceramics, Inc. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US20070107317A1 (en) 2003-10-22 2007-05-17 Japan Science And Technology Agency Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components
US7057856B2 (en) 2003-11-06 2006-06-06 Seagate Technology Llc Gimbal strut shape to increase buckling load
DE102004058797A1 (de) * 2004-06-12 2006-01-05 IGAM Ingenieurgesellschaft für angewandte Mechanik mbH Verfahren und Werkzeug zur Bearbeitung von Funktionselementen mit gekrümmten Oberflächen
US20050287032A1 (en) 2004-06-24 2005-12-29 Alexander Tregub Anti-bacterial protection to improve performance of post CMP clean brush
US7218478B2 (en) 2004-09-28 2007-05-15 Hitachi Global Storage Technologies Netherlands B.V. Disk drive with negative-pitch slider having protrusion pad contacting the disk when the disk is rotating at operating speed
US7404756B2 (en) 2004-10-29 2008-07-29 3M Innovative Properties Company Process for manufacturing optical and semiconductor elements
US7469443B2 (en) 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer
US20080004743A1 (en) 2006-06-28 2008-01-03 3M Innovative Properties Company Abrasive Articles, CMP Monitoring System and Method
US20080053000A1 (en) 2006-08-30 2008-03-06 3M Innovative Properties Company Extended life abrasive article and method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9941148B2 (en) 2014-11-23 2018-04-10 M Cubed Technologies, Inc. Wafer pin chuck fabrication and repair
US10242905B2 (en) 2014-11-23 2019-03-26 M Cubed Technologies, Inc. Wafer pin chuck fabrication and repair
US10702968B2 (en) 2015-08-14 2020-07-07 M Cubed Technologies, Inc. Machine for finishing a work piece, and having a highly controllable treatment tool
US10790181B2 (en) 2015-08-14 2020-09-29 M Cubed Technologies, Inc. Wafer chuck featuring reduced friction support surface
US10792778B2 (en) 2015-08-14 2020-10-06 M Cubed Technologies, Inc. Method for removing contamination from a chuck surface
US10953513B2 (en) 2015-08-14 2021-03-23 M Cubed Technologies, Inc. Method for deterministic finishing of a chuck surface

Also Published As

Publication number Publication date
US20100330890A1 (en) 2010-12-30

Similar Documents

Publication Publication Date Title
US8808064B2 (en) Abrasive article with array of composite polishing pads
US20100330890A1 (en) Polishing pad with array of fluidized gimballed abrasive members
US20110159784A1 (en) Abrasive article with array of gimballed abrasive members and method of use
US5769697A (en) Method and apparatus for polishing semiconductor substrate
TWI748222B (zh) 拋光物和用於製造化學機械拋光物的整合系統
EP2025459B1 (fr) Grille revêtue de filament pour polissage mécanique et chimique
JP3823086B2 (ja) 研磨パッド及び研磨方法
US7807252B2 (en) Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
KR101091030B1 (ko) 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
KR101674058B1 (ko) 패드 컨디셔닝 디스크, 및 프리 컨디셔너 유닛을 포함하는 ｃｍｐ 장치
US9221148B2 (en) Method and apparatus for processing sliders for disk drives, and to various processing media for the same
US20110027549A1 (en) Method and apparatus for embedding abrasive particles into substrates
US20080292869A1 (en) Methods of bonding superabrasive particles in an organic matrix
JP2001062701A (ja) 固定研磨部材のプレコンディショニング
TW201206632A (en) Ethod and apparatus for trimming the working layers of a double-side grinding apparatus
JP2001338901A (ja) 平坦化加工方法及び、装置並びに，半導体装置の製造方法
US20110143638A1 (en) Method and apparatus for manufacturing a polishing article with uniform height abrasive particles
KR100536046B1 (ko) 연마 패드 컨디셔너 및 이를 갖는 화학적 기계적 연마장치
US20110256803A1 (en) Fluidized web polishing apparatus and method using contact pressure feedback
JPH1174242A (ja) 半導体装置の製造方法
US20110034107A1 (en) Method and apparatus for reciprocal polishing
JP2005131779A (ja) 研磨用複合素材工具プレート
JP2022534384A (ja) 研磨プラテン及び研磨プラテンの製造方法
KR101178281B1 (ko) 감소된 마찰력을 갖는 패드 컨디셔너

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10729772

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10729772

Country of ref document: EP

Kind code of ref document: A1