WO2010114300A2 - Procédé de fabrication d'un film feuilleté métallique mince - Google Patents

Procédé de fabrication d'un film feuilleté métallique mince Download PDF

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Publication number
WO2010114300A2
WO2010114300A2 PCT/KR2010/001968 KR2010001968W WO2010114300A2 WO 2010114300 A2 WO2010114300 A2 WO 2010114300A2 KR 2010001968 W KR2010001968 W KR 2010001968W WO 2010114300 A2 WO2010114300 A2 WO 2010114300A2
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Prior art keywords
metal
film
printing
resin
coating
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PCT/KR2010/001968
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English (en)
Korean (ko)
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WO2010114300A3 (fr
Inventor
정광춘
조현남
조남부
유지훈
Original Assignee
주식회사 잉크테크
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Publication of WO2010114300A2 publication Critical patent/WO2010114300A2/fr
Publication of WO2010114300A3 publication Critical patent/WO2010114300A3/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D

Definitions

  • the present invention relates to a method for manufacturing a thin metal laminate film, and more particularly, to a resin layer formed on a release film or a release paper, and a thin film having a high shield metal layer as a basic configuration. It relates to a method for producing a metal laminated film.
  • Electromagnetic waves generated from internal devices of electronic devices such as mobile phones, digital cameras, notebook PCs, office equipment, and medical devices have been reported to affect various diseases such as headaches, poor vision, brain tumors, and circulatory problems. There is a growing controversy over the hazards to humans.
  • electromagnetic noise generated from each component may cause peripheral devices to malfunction, causing device failure. Therefore, in recent years, regulations on the emission of electromagnetic interference (EMI) and radio frequency interference (RFI) as well as the strengthening of shielding standards for electromagnetic waves generated from home, office, and industrial electronic products such as computers, mobile phones, medical devices, and multimedia players
  • measures to shield electromagnetic waves of various electronic devices and components have emerged as important issues.
  • FPCBs flexible printed wiring boards having a narrow and complicated structure
  • FPCB is used to attach a shield film (shield film) for blocking electromagnetic noise.
  • shield film shield film
  • Repeated bending electrical circuits such as FPCB require a high degree of flexibility to withstand repeated bending in addition to good shielding effects.
  • a base film and a conductive layer laminated thereon have a basic structure.
  • a reinforcement film for workability is used for this basic structure, and a protective film is used for the conductive layer, and it is used.
  • Japanese Laid-Open Patent Publication No. 5-3395 describes a method of using a metal thin film to obtain excellent shielding effect and high bendability
  • Japanese Laid-Open Patent Publication No. 7-122882 combines a conductive adhesive layer using a metal filler and a metal thin film.
  • the present invention can greatly improve the heat resistance, adhesion, and bendability of the thin film metal laminate film, as well as to ensure the shielding of the high frequency with a thin film, and shorten the production process time It is possible to provide a method of manufacturing a thin film metal laminate film having advantages of mass production and cost reduction.
  • the present invention relates to a method for manufacturing a thin metal laminate film, and more particularly, a resin having excellent heat resistance is coated on a release film and then cured to form a resin layer of a thin film, and a metal ink is applied thereon to laminate a metal.
  • a method for producing a film Removing the release film of the metal laminated film is characterized by improving the properties of high heat resistance and high flexibility to the laminated film of a thin film, the present invention will be described in more detail below.
  • the thin film metal-laminated film formed by the present invention is formed by coating a resin having excellent heat resistance and adhesion with a metal on a base film 1 coated with a release agent 1 'or a release paper. It consists of a resin layer 2 to be formed, and a metal layer 3 of a thin film formed by coating a metal ink composition having excellent conductivity.
  • the base film coated with the release agent is a concept including a release paper, hereinafter referred to as a release film.
  • the thin film metal laminate film prepared as described above has a feature of providing a thin film metal laminate film to improve the characteristics of high heat resistance and high flexibility by removing the release film when applied to electronic components or devices.
  • This step is to prepare a release film
  • the release film for forming the resin layer is polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether sulfone (PES), nylon ( Nylon), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polycarbonate (PC), polyarylate (PAR), etc.
  • plastic film or paper (Paper) can be used, and the release agent Use treated film or paper.
  • the release film is not particularly limited to those mentioned above and may be selectively used according to the characteristics of the film according to the heat treatment temperature described below.
  • This step is to form a resin layer having a high heat resistance and excellent adhesion to the metal on the release film.
  • the resin composition coated on the release film is a heat-resistant resin as an essential component, and if necessary, a solvent, a stabilizer, a surfactant, a wetting agent, an adhesion promoter, a hardener, a thixotropic agent ( thixotropic agents) or additives such as leveling agents.
  • resin of the said composition is excellent in heat resistance and the adhesive force with a metal layer.
  • Resins usable herein include epoxy resins, melamine resins, phenolic resins, phenol modified alkyd resins, epoxy modified alkyd resins, silicone modified alkyd resins, acrylic melamine resins, polyimide resins, and precursors. It is not limited to this.
  • the epoxy resin used in the present invention preferably contains an aromatic, and various epoxy resins can be used.
  • a glycidyl ether type epoxy resin a glycidyl ester type epoxy resin, a glycidyl amine type epoxy etc.
  • glycidyl ether type epoxy resins include bisphenol A type, bisphenol F type, brominated bisphenol A type, bisphenol S type, bisphenol AF type, bisphenyl type, naphthalene type, phenol novolak type, cresol novolak type, DPP novolak type, and tris Hydroxyphenylmethane type, tetraphenylethane type, etc. can be illustrated.
  • Examples of the glycidyl ester epoxy resins include hexahydrophthalic acid ester type and phthalic acid ester type.
  • Examples of the glycidyl amine epoxy resins include tetraglycidyl diaminophenylmethane, aminophenol type, aniline type and toluidine type.
  • phosphoric acid containing a hydroxyl group may be added and used to improve adhesion and flexibility of the resin layer and heat resistance.
  • phosphoric acid, phosphonoacetic acid, normal phosphonomethylglycine, normal phosphonomethylglycine, normal phosphonomethyliminodiacetic acid, 4-phosphonoxytempohydrate, 3-phosphonopropionic acid, phosphoene Norpyruvic acid monosodium salt, etc. can be used.
  • the coverlay composition may need a solvent to form a uniform thin film as needed, and solvents that may be used may include ethanol, isopropanol, alcohols such as butanol, glycols such as ethylene glycol, glycerin, and ethyl acetate.
  • Acetates such as butyl acetate, methoxypropyl acetate, carbitol acetate, ethyl carbitol acetate, methyl cersolve, butyl cellosolve, diethyl ether, ethers such as tetrahydrofuran, dioxane, methyl ethyl ketone Ketones such as acetone, dimethylformamide, 1-methyl-2-pyrrolidone, hydrocarbons such as hexane, heptane, dodecane, paraffin oil, mineral split, aromatics such as benzene, toluene, xylene, and chloroform Halogen substituted solvents such as methylene chloride, carbon tetrachloride, acetonitrile, dimethyl sulfoxide or These mixed solvents and the like can be used.
  • the coating method of the resin composition thus obtained may be a known general film forming method, and does not need to be particularly limited in accordance with the features of the present invention.
  • spin coating, roll coating, spray coating, dip coating, flow coating, doctor blade and dispensing, inkjet printing, offset printing It is possible to select and use screen printing, pad printing, gravure printing, flexography printing, stencil printing, imprinting, methods and the like.
  • the heat treatment of the resin composition should be applied in accordance with the heat resistance temperature of the release film and the curing conditions of the resin composition, usually between 100 ⁇ 300 °C, preferably 120 ⁇ 250 °C, more preferably 150 ⁇ 200 °C heat thin film Good for physical properties.
  • heat treatment of two or more steps at low and high temperatures within the above range is also good for the uniformity of the thin film. For example, it is good to process for 1 to 30 minutes at 80-150 degreeC, and to process for 1 to 30 minutes at 150-200 degreeC.
  • the thickness of the resin layer does not need to be largely limited, the thickness of the resin layer is preferably 0.1 ⁇ m to 10 ⁇ m, preferably 0.5 ⁇ m to 7 ⁇ m, more preferably 1 ⁇ m to 5 ⁇ m. Too thin or too thick may cause problems with adhesion, flexibility and heat resistance.
  • This step is to form a thin film metal layer by coating or printing a metal ink composition on the resin layer.
  • the type of the metal ink is not particularly limited, and in particular, the use of a metal ink containing an organometallic complex compound having a special structure as filed by the applicant of the Patent Application No. 2005-34371 has a uniform thickness of the metal thin film. And good conductivity, and also low firing temperature, and there is no residue other than the conductive material after the suit.
  • the metal ink can be prepared by reacting the metal ink with one or two or more mixtures selected from a metal compound, an ammonium carbamate compound, an ammonium carbonate compound or an ammonium bicarbonate compound. Ammonium carbonate-based compound or ammonium bicarbonate-based compound] to prepare a composite, and to prepare a metal ink containing the same, the same production method was used in the present invention.
  • the metal ink composition used in the present invention includes an organometallic complex compound or a metal conductor or metal precursor, and additives such as solvents, stabilizers, leveling agents and thin film aids, which are already known as necessary, may be used. It may be included in the metal ink composition.
  • the metal conductor does not need to be particularly limited. That is, any known one may be used as long as it is suitable for the purpose of the invention. That is, as the type of conductor, for example, Ag, Au, Cu, Zn, Ni, Co, Pd, Pt, Ti, V, Mn, Fe, Cr, Zr, Nb, Mo, W, Ru, Cd, Ta, Selected from the group of transition metals such as Re, Os, Ir, or a group of metals such as Al, Ga, Ge, In, Sn, Sb, Pb, Bi, or lanthanides such as Sm, Eu, At least one metal selected from the group of actinides-based metals, or alloys or alloy oxides thereof is included.
  • the type of conductor for example, Ag, Au, Cu, Zn, Ni, Co, Pd, Pt, Ti, V, Mn, Fe, Cr, Zr, Nb, Mo, W, Ru, Cd, Ta, Selected from the group of transition metals such as Re, Os,
  • the metal precursor is not particularly limited. That is, it can be used when the purpose of the present invention is met, and in particular, it is more preferable to exhibit conductivity through heat treatment, oxidation or reduction treatment, infrared ray, ultraviolet ray, electron beam, laser treatment, and the like.
  • Carboxylic acid metals such as zinc citrate, silver nitrate, copper cyanide, cobalt carbonate, platinum chloride, gold chloride, tetrabutoxy titanium, dimethoxyzirconium dichloride, aluminum isopropoxide, tin tetrafluoroborate, Metal compounds such as vanadium oxide, indium-tin oxide, tantalum methoxide, bismuth acetateo, dodecyl mercetoxide, indium acetylacetonate, and the like.
  • the shape of the metal conductor and the metal precursor may be spherical, linear, plate-shaped, or a mixture thereof, and may be in the form of particles containing nanoparticles, powder, flake, colloid ( It can be used in various states such as colloid, hybrid, sol, solution, or a mixture of one or more of them.
  • the size or the amount of the metal conductor or the metal precursor need not be particularly limited as long as it meets the ink characteristics of the present invention. That is, the size is preferably 10 microns or less, more preferably 1 nanometer (nm) or more and 1 micron or less, considering the uniformity of the coating film after firing, the amount of use does not exceed a certain limit so that the firing temperature is too high or printing process If you do not have a problem. Usually, the amount thereof is preferably in the range of 1 to 95 percent, more preferably 10 to 50 percent by weight, based on the total ink composition.
  • the solvent contained in the metal ink composition may be selected from water, alcohols, glycols, acetates, ethers, ketones, aliphatic hydrocarbons, aromatic hydrocarbons or halogenated hydrocarbon-based solvents, specifically, water, methanol, ethanol, isopropanol, 1 Methoxypropanol, butanol, ethylhexyl alcohol, terpineol, ethylene glycol, glycerin, ethyl acetate, butyl acetate, methoxypropyl acetate, carbitol acetate, ethyl carbitol acetate, methyl cellosolve, butyl cellosolve, Diethyl ether, tetrahydrofuran, dioxane, methyl ethyl ketone, acetone, dimethylformamide, 1-methyl-2-pyrrolidone, dimethyl sulfoxide, hexane, heptane, do
  • the printing method of the metal ink composition is spin coating, roll coating, spray coating, dip coating, flow coating, comma coating, respectively, depending on the properties of the ink and the properties of the resin layer. Key coating, die coating, doctor blade, dispensing, inkjet, offset, screen, pad, gravure, flexography, etc. It is not specifically limited to this.
  • the printing method may be applied two or more times to form a pattern. For example, in detail, a 0.1 um particle size metal ink composition is formed using a micro gravure coater to form a conductive pattern having a thickness of 0.3 um, and a 0.2 um particle size metal ink composition is placed on the upper layer using a silk screen. A conductive pattern can be formed in thickness.
  • the post-treatment step may be heat treated under a normal inert atmosphere, but may be processed in air, nitrogen, carbon monoxide, or even a mixed gas of hydrogen and air or another inert gas, if necessary.
  • the heat treatment is usually performed at 80 to 400 ° C, preferably at 90 to 300 ° C, more preferably at 100 to 250 ° C.
  • heat treatment of two or more steps at low and high temperatures within the above range is also good for the uniformity of the thin film. For example, it is good to process for 1 to 30 minutes at 80-150 degreeC, and to process for 1 to 30 minutes at 150-300 degreeC.
  • the thickness of the metal layer after heat treatment is preferably between 0.05 and 2 microns, and the conductivity of the metal layer is preferably between 1 mPa / ⁇ and 1 kPa / ⁇ , preferably 10 mPa / ⁇ to 500 mPa / ⁇ . If the conductivity exceeds 500m ⁇ / ⁇ , the electromagnetic shielding characteristics are lowered, and if the shielding performance is less than 10m ⁇ / ⁇ , the shielding performance is improved, but manufacturing costs are increased.
  • the thin film metal-laminated film according to the present invention can greatly improve heat resistance, adhesion, and bendability, and can not only secure high frequency shielding properties with a thin film, but also shorten the production process time, thereby reducing mass production and cost. Has the advantage.
  • a 300 mm wide and 200 m long PET film having a release agent coating was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a rate of 150 °C heat treated to prepare a coverlay film with a thickness of 3 ⁇ m on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long PET film having a release agent coating was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a speed, heat-treated at 150 °C to prepare a coverlay film with a thickness of 3 ⁇ m on the surface of PET, and using a rotary screen coater on it, 10M / min.
  • the conductive metal ink 2 was coated at a speed to prepare a metal laminate film having a thickness of 0.8 ⁇ m.
  • Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long PET film having a release agent coating was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a rate of 150 °C heat treated to prepare a coverlay film having a thickness of 1 ⁇ m on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long PET film having a release agent coating was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a rate of 150 °C heat treatment to prepare a coverlay film of 5 ⁇ m thickness on the PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long paper was prepared with a release agent coating. Then, the gravure coating machine was used to apply the resin ink composition 1 to 10 M / min. After coating at a rate of 150 °C heat treated to prepare a coverlay film with a thickness of 3 ⁇ m on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long PET film with a release agent coating was prepared, and then the resin ink composition 2 was prepared using a gravure coating machine. After coating at a rate of 150 °C heat treated to prepare a coverlay film with a thickness of 3 ⁇ m on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long PET film with a release agent coating was prepared, and then the resin ink composition 2 was prepared using a gravure coating machine. After coating at a speed, heat-treated at 150 °C to prepare a coverlay film with a thickness of 3 ⁇ m on the surface of PET, and using a rotary screen coater on it, 10M / min. The conductive metal ink 2 was coated at a speed to prepare a metal laminate film having a thickness of 0.8 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long PET film with a release agent coating was prepared, and then the resin ink composition 2 was prepared using a gravure coating machine. After coating at a rate of 150 °C heat treated to prepare a coverlay film having a thickness of 1 ⁇ m on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long PET film with a release agent coating was prepared, and then the resin ink composition 2 was prepared using a gravure coating machine. After coating at a rate of 150 °C heat treatment to prepare a coverlay film of 5 ⁇ m thickness on the PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 300 mm wide and 200 m long paper was prepared with a release agent coating, and then the resin ink composition 2 was applied to the resin ink composition 2 using a gravure coater. After coating at a rate of 150 °C heat treated to prepare a coverlay film with a thickness of 3 ⁇ m on PET surface using a microgravure coating machine on top of 20M / min.
  • the conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m.
  • Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • a 12 ⁇ thick, 300 mm wide, 200 m long PI film was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a rate of 150 °C heat treated to prepare a coverlay film with a thickness of 3 ⁇ m on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 ⁇ m. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.
  • Example 1 Metal Laminated Film Thickness ( ⁇ m) Surface resistance (m ⁇ / ⁇ ) Flexibility ( ⁇ 1,000 Cycle) Adhesive force (N / cm) Shielding property
  • Example 1 3.2 200 12 10 50 Comparative Example 1 15.2 200 7 10 50
  • Example 2 3.8 1,000 5 7 15
  • Example 3 1.2 150 9 8 53
  • Example 4 5.2 250 10 10 45
  • Example 5 3.2 200 12 10 50
  • Example 6 3.2 210 10 9 48
  • Example 8 1.2 160 8 7 52 Example 9 5.2 260 7 10 45
  • Example 10 3.2 210 10 10 48
  • Adhesion KS M ISO 8510-2, measured through 180-degree peeling.
  • the thin film metal-laminated film according to the present invention can greatly improve heat resistance, adhesion, and bendability, so that a thin film can not only secure high frequency shielding properties, but also a simple process and a short production time. Mass production is possible, so the economic effect of cost reduction is big.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un film feuilleté métallique mince. En particulier, l'invention concerne un procédé de fabrication d'un film feuilleté métallique mince comportant une couche métallique fortement blindée, qui sert de matière de configuration de base. Ce procédé consiste à former une couche de résine sur un film traité de manière atypique (film séparé) ou papier atypique. Le film feuilleté métallique mince selon l'invention permet d'augmenter la résistance à la chaleur, la force d'adhésion et la souplesse du film mince, et ainsi de conférer des propriétés élevées de blindage contre les hautes fréquences au film mince. En outre, le film feuilleté métallique mince peut être produit par une production de masse et à coût réduit, grâce à une réduction du temps de production.
PCT/KR2010/001968 2009-03-31 2010-03-31 Procédé de fabrication d'un film feuilleté métallique mince WO2010114300A2 (fr)

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KR1020090027734A KR101388972B1 (ko) 2009-03-31 2009-03-31 박막 금속적층필름의 제조방법
KR10-2009-0027734 2009-03-31

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WO2014129852A1 (fr) * 2013-02-21 2014-08-28 (주)삼원에스티 Capteur de panneau tactile et son procédé de fabrication
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KR101381240B1 (ko) * 2013-04-05 2014-04-04 와이엠티 주식회사 터치 스크린 패널의 제조 방법 및 이에 의하여 제조된 터치 스크린 패널
KR101688986B1 (ko) * 2013-04-19 2016-12-23 주식회사 잉크테크 디스플레이용 투명전극 필름 제조방법 및 디스플레이용 투명전극 필름
US9831487B2 (en) 2013-05-16 2017-11-28 Inktec Co., Ltd. Method for manufacturing transparent electrode film
KR101403543B1 (ko) * 2013-05-20 2014-06-03 (주)삼원에스티 터치패널센서 및 그 제조방법
KR101643411B1 (ko) * 2014-02-28 2016-07-27 (주)삼원에스티 터치패널센서 및 그 제조방법
KR101735917B1 (ko) 2014-06-03 2017-05-15 주식회사 엘지화학 이형처리 표면 마킹용 잉크 조성물 및 이를 포함하는 보호 필름
WO2015186926A1 (fr) * 2014-06-03 2015-12-10 주식회사 엘지화학 Composition d'encre pour marquer une surface traitée antiadhésive et film protecteur la contenant

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