WO2010091531A1 - 半导体水雾式空调装置 - Google Patents
半导体水雾式空调装置 Download PDFInfo
- Publication number
- WO2010091531A1 WO2010091531A1 PCT/CN2009/000143 CN2009000143W WO2010091531A1 WO 2010091531 A1 WO2010091531 A1 WO 2010091531A1 CN 2009000143 W CN2009000143 W CN 2009000143W WO 2010091531 A1 WO2010091531 A1 WO 2010091531A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- water
- semiconductor
- cooling
- heat
- aluminum
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 102
- 238000004378 air conditioning Methods 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 267
- 238000001816 cooling Methods 0.000 claims abstract description 126
- 239000003595 mist Substances 0.000 claims abstract description 41
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 8
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 88
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 43
- 229910052782 aluminium Inorganic materials 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 238000005485 electric heating Methods 0.000 claims description 19
- 229910000838 Al alloy Inorganic materials 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 9
- 239000000341 volatile oil Substances 0.000 claims description 8
- 239000006260 foam Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 241001417523 Plesiopidae Species 0.000 claims description 3
- 230000009849 deactivation Effects 0.000 claims description 3
- 238000007667 floating Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 238000005192 partition Methods 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 11
- 238000009692 water atomization Methods 0.000 abstract 2
- 239000003570 air Substances 0.000 description 96
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 16
- 238000000889 atomisation Methods 0.000 description 11
- 239000003507 refrigerant Substances 0.000 description 10
- 230000009471 action Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 239000003245 coal Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000003205 fragrance Substances 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005437 stratosphere Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F6/00—Air-humidification, e.g. cooling by humidification
- F24F6/02—Air-humidification, e.g. cooling by humidification by evaporation of water in the air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Definitions
- the present invention relates to a semiconductor water mist type air conditioner, and more particularly to a device for adjusting the temperature of a room. Background technique
- air-conditioning equipment mainly refers to air-conditioning equipment, and the operation structure and operation mode of air-conditioning are usually compressed by a compressor into a high-pressure high-temperature gas refrigerant, which is sent to a condenser to cool the refrigerant, and the refrigerant is cooled by high-pressure and high-temperature heat. It becomes a high-pressure low-temperature liquid refrigerant, and then stores excess refrigerant through a refrigerant storage bottle.
- the other refrigerant is decompressed into a low-pressure low temperature at the expansion valve, and then flows to the evaporator, and the low-temperature low-temperature gaseous refrigerant can absorb the temperature of the room, and After absorbing heat through the low-temperature refrigerant, it is blown into the indoor space by power to cause a cold room effect.
- the present invention relates to a semiconductor water mist type air conditioner, the main purpose of which is by semiconductor electronic refrigeration (The above and below refrigeration, relatively hot, the following unified cooling to the cold source or the heat source generated by the heat source and the heat source, through the cooling sheet to enlarge the cooling area.
- the atomized water particles formed by the electron atomizing wafer are used as a medium for conducting cold or heat (the principle is that the heat conductivity of the atomized water particles of lum ⁇ 3 m is better than that of the general air), and the atomized water particles pass through the first fan.
- the purpose of generating cold air or hot air is achieved by the group of the cooling fins under the action of heat exchange and heat conduction.
- the technical means used in the present invention are mainly designed to include a uniform cold chamber having a cold side of a semiconductor cooling sheet; a uniform cold sheet group, a cooling sheet group and a semiconductor refrigeration unit.
- the cold side of the sheet is adjacent to each other; an electric heating tube, the electric heating tube is also adjacent to the cooling sheet group; the cooling sheet group can enlarge the cooling area of the semiconductor cooling sheet and the electric heating tube; an atomizing water particle inlet,
- the plurality is preferably as the atomized water particles enters the inlet of the refrigeration chamber;
- a first fan is adjacent to the group of the cooling fins to form a blown drive of cold (hot) air;
- the condensate collecting tray is used for collecting the condensed water generated in the cooling sheet group during the cooling process, and the atomizing water particle inlet port is arranged on the bottom of the condensed water collecting tray; Reflective and composite of heat and thermal insulation materials are isolated from other components.
- a semiconductor fin cooling chamber the semiconductor fin cooling chamber is provided with a heat sink group, the heat sink group is adjacent to the hot side of the semiconductor fin; and a second fan forms heat dissipation with the heat sink group.
- An atomizing water tank wherein the atomizing water tank is provided with an electron atomizing wafer, and the atomized water particles formed by the electron atomizing wafer; an atomizing water particle outlet port, the plurality is preferably, the atomized water particle outlet is arranged in the mist
- the water tank is connected to one end of the mist water particle tube, and the other end of the atomized water particle tube is connected to the atomized water particle inlet port on the condensate water collecting tray in the cooling chamber, and the water is atomized by the electron atomizing wafer.
- an air inlet port is preferably a plurality, and the air inlet port is disposed on the atomizing water tank to balance the air in the atomizing water tank Pressure; a water inlet, the water inlet is located on the atomizing water tank, as a water injection port of the atomizing water tank.
- the atomized water particles are driven by the first fan, and the atomized water particle tube enters the cooling chamber, and the semiconductor cooling fin in the cooling chamber Or the electric heating tube generates cold or heat, and the cooling sheet group enlarges the cooling area, and the atomized water particles are driven by the first fan to pass through the cooling sheet group, and under the action of heat exchange, the purpose of generating cold air or hot air is achieved.
- the heat generated by the semiconductor cooling fin during the cooling process needs to be discharged from the semiconductor water mist type air conditioner, so that a heat sink unit and a second fan are formed on the hot side of the semiconductor cooling fin, and heat generated by the heat dissipation is discharged to discharge the semiconductor water.
- Fog air conditioning unit The heat generated by the semiconductor cooling fin during the cooling process needs to be discharged from the semiconductor water mist type air conditioner, so that a heat sink unit and a second fan are formed on the hot side of the semiconductor cooling fin, and heat generated by the heat dissipation is discharged to discharge the semiconductor water.
- the second object of the present invention is to control the humidity of the environment, that is, the function of humidifying and dehumidifying the air. Since the present invention generates cold air or hot gas, the atomized water particles are used as a medium for transmitting the cold source and the heat source instead of the general air. The atomized water particles increase the humidity of the air. Therefore, the present invention is also an air humidifier in the process of generally generating cold air or hot air.
- This part is different from the conventional air conditioner which causes the environment humidity to be too low during operation;
- the electron atomizing wafer is not activated during the cold process, that is, the general air is used as the conduction cold source medium, and dry cold air and condensed water are generated at this time, that is, when the mode is cooled, the hot and humid air in the environment is first.
- the fan drive is sucked into the cooling chamber, and the hot and humid air contacts the cooling fin group under the action of heat exchange, except that the air temperature is lowered and condensed water is generated on the cooling fin group, which is generated under the first fan blowing drive.
- ⁇ 1 may be condensed water generated by the condensed water on the drain pan means concentrated, water atomized particles by the inlet into the fog Tank, so that the present invention is herein also a mode of operation in addition to an air-dehumidifier air conditioner; two modes of operation of the present invention, by switching to control the ambient humidity.
- Another object of the present invention is to control the temperature and humidity level and the size of the wind by using a control circuit, and adjust the cooling temperature or electric heating of the semiconductor cooling plate by controlling the wafer to adjust the current through the circuit control board.
- the tube heating temperature, the first fan wind level, the second fan on and off, and the electronic atomization wafer activation or deactivation can also be set to activate and deactivate the air conditioner through the control wafer and the temperature and humidity sensing component.
- Another object of the present invention is to design a cryostat mechanism for amplifying the cooling (area) of the semiconductor cooling fin and the electric heating tube to increase the heat exchange efficiency with the atomized water particles or air, and the mechanism is composed of two sets of heat sinks.
- the group is connected by a plurality of solid or hollow threaded heat-cooling fins of aluminum rods or red copper rods; two sets of fins, one set of a plurality of mountain fin fins, the mountain fins
- the heat sink is adjacent to the cold side of the semiconductor cooling fin, and is made of aluminum or aluminum alloy or copper.
- the fins on the fin fins have a thickness of 1 to 2 legs, and the two fins are spaced apart from the heat sink.
- one set is a plurality of flat type heat sinks, the material is aluminum or aluminum alloy or copper, the flat type heat sinks are made of aluminum frame as a support frame, and the support frame is parallelly welded with dozens of rectangular strip heat sinks.
- the heat sink is made of aluminum or aluminum alloy or copper.
- the thickness of the rectangular strip is 0.5 leg to 1 mm. The distance between the two fins is 2 awake to 4 legs.
- the heat sink group is used for discharging heat generated by the cooling process of the semiconductor cooling plate, and the heat radiating block is made of aluminum or aluminum alloy or copper and a flat plate type.
- the heat sink group is connected by a plurality of solid or hollow threaded heat sink heat pipes, and is made of aluminum rod, copper rod or red copper rod, and the heat sink is adjacent to the hot side of the semiconductor cooling sheet;
- the heat sink group is made of aluminum or aluminum alloy or copper.
- the flat heat sink group uses aluminum frame as the support frame, and supports three parallel strips of heat sinks in parallel between the aluminum frames.
- the heat sink is made of aluminum or aluminum. Alloy sheet or copper sheet, strip heat sink thickness is 0.5 ⁇ 1 leg, heat sink parallel spacing is 2 mn! ⁇ 4 wake up.
- Another object of the present invention is to design a mechanism for waterproofing adjacent to the cold side of the cooling fin group and the cold side of the semiconductor cooling sheet. Since the medium is atomized as a heat-conducting medium, the semiconductor cooling sheet is damaged, so it is designed to be used.
- a mountain fin fin that is larger than the area of the semiconductor fin, and a waterproof rubber strip is disposed adjacent to the bottom of the mountain fin fin and the cooling chamber to form a non-depleting semiconductor fin cooling efficiency and waterproof sealing contact surface.
- Another object of the present invention is to design a material for the inner layer of the cooling chamber. Since the cooling chamber needs to avoid heat consumption and concentration of heat radiation and heat-insulating heat insulation during the cooling and heating process, the inner layer of the cooling chamber is The bright surface can be heat-reflected and composed of heat-resistant and heat-insulating materials. The bright surface can be heat-reflected and the heat-resistant material can be aluminum foil or aluminum sheet. The heat insulation material can be low temperature insulation such as PUR foam or PE foam. Material.
- Another object of the present invention is that the first fan and the second fan are designed to be straight fans or straight fans.
- the fan type design of different types can be used to make the semiconductor water mist type air conditioners have different shapes. Different occasions and spaces.
- the semiconductor water mist type air conditioner can be of an upright type and a horizontal type design by The combination of the cooling chamber and the semiconductor cooling fins and the different positions of the atomizing water tank can make the semiconductor water mist type air conditioners have different shapes, so that they can be applied to different occasions and spaces.
- Another object of the present invention is to design an atomizing water particle outlet port of the atomizing water tank and a mechanism for preventing air from overflowing in the air inlet port, in order to avoid water in the atomizing water tank by atomizing water particle outlet port and air inlet port
- the spillage damages other electrical components, so the unidirectional design is adopted, that is, only the atomized water particles and air can be allowed to enter and exit, and the water in the atomized water tank cannot overflow from the atomized water particle outlet and the air inlet.
- Another object of the present invention is to design a water inlet mechanism for the atomization water tank.
- a one-way design is adopted, that is, only water is allowed to enter.
- the water in the atomized water tank cannot overflow from the water inlet; in addition, in the process of converting the water into atomized water particles, the electron atomizing wafer needs to reserve air and space to convert water into atomized water particles, so the atomizing water tank is In the process of water injection, the water cannot be filled.
- the atomization water particle conversion space is reserved by the water inlet installation position, and the floating ball full water level water stop valve design in the water inlet is used to avoid the fog.
- the water tank is overfilled with no space to convert water into atomized water particles.
- Another object of the present invention is to design an electronic atomization wafer to automatically stop at a low water level in the atomizing water tank. Since the electronic atomizing wafer may continue to operate under water conditions, there is a danger of burning, so the design of the atomizing refrigerator is At low water levels, the electron atomizing wafer automatically stops moving to avoid the risk of electronic atomization of the wafer.
- Another object of the present invention is to add a plant essential oil to the atomizing water tank to change the semiconductor water mist type air conditioner into an air cleaner and an air aroma machine, since the electron atomizing wafer converts water into atomized water by using 1.6 million vibrations. Particles, a large amount of negative ions are generated during the conversion process, and the water particles carrying the negative ions can absorb the dust in the air to achieve the purpose of purifying the air; if the plant essential oil is added to the electronic atomizing wafer during the action, the plant essential oil will also be used. It is transformed into a particulate molecule that can float in the air, and the indoor air reaches the fragrance with the blowing of the first fan.
- Figure 1 is a schematic plan view of the present invention
- Figure 2 is a three view of the refrigeration/heating sheet set of the present invention.
- Figure 3 is a cooling/heating sheet set of the present invention and a first fan straight fan
- Figure 4 is a cooling/heating sheet set of the present invention and a first fan straight tube fan
- Figure 5 is a three-view and a perspective view of the water collecting tray of the present invention.
- Figure 6 is a cross-sectional view of the frame wall of the refrigeration/heating chamber of the present invention.
- Figure 7 is a view showing the installation position of the waterproof rubber strip of the present invention
- Figure 8 is a cross-sectional view of the atomized water particle tube of the present invention
- Figure 9 is a three-view view of the heat sink assembly of the present invention.
- Figure 11 is a heat sink group and a second fan straight fan of the present invention.
- Figure 12 is a three-view and perspective view of the water tank of the present invention.
- Figure 13 is a circuit diagram of an electronic atomizing wafer and a water level switch of the present invention.
- Figure 14 is a cross-sectional view of the water inlet of the present invention.
- Figure 15 is a cross-sectional view of the air intake port of the present invention.
- 16 is a schematic plan view showing the structure of a control circuit of the present invention.
- Figure 17 is a diagram 1 of various structural combinations of the present invention.
- Figure 18 is a second structural diagram of various structures of the present invention.
- Figure 19 is a diagram 3 of various structural combinations of the present invention.
- Refrigeration chamber A Semiconductor cooling fin cooling chamber
- A5A Bright surface heat reflective material A5B. Insulation material
- Cooling film group 11. Mountain fin heat sink
- Atomized water particle inlet 81 Air inlet 81 A. Hollow base 81B. Solid rubber ball
- Atomized water particle tube 83 Atomized water particle outlet
- the present invention mainly relates to a semiconductor water mist type air conditioner, which is surrounded by a frame wall A3 and is defined by a frame wall A3 as a uniform cold chamber A and a semiconductor.
- the inside of the refrigerating chamber A includes a cold side of the semiconductor refrigerating sheet 4, a uniform cold sheet group 1, an electric heating tube 2, a plurality of atomized water particle inlet ports 8, a first fan 3, and a condensed water collecting tray. 6.
- the semiconductor fin cooling chamber A1 includes a heat sink group 5, a second fan 31, and a thermal side of the semiconductor fin 4 .
- the atomizing water tank A2 includes an electron atomizing wafer 72, a plurality of atomized water particle outlets 83, a plurality of air inlet ports 81, and a water inlet port 9. Further, the atomized water particle outlet port 83 is connected to the atomized water particle tube 82, and is connected to the atomized water particle inlet port 8 on the condensate collecting tray 6 in the cooling chamber A.
- the inner layer of the refrigerating chamber A is thermally reflective and has a heat-resistant and heat-insulating material A5 to block the heat generated by the hot side of the semiconductor refrigerating sheet 4, thereby avoiding the cooling effect of the refrigerating chamber A.
- the cold side of the semiconductor cooling fin 4 is electrically connected to the power source 76, and is powered by the power source 76 to drive refrigeration.
- the cooling sheet group 1 has two mechanism components.
- the heat sink group is connected by a plurality of cooling fin heat pipes 13 of solid or hollow thread material made of aluminum rods or red copper rods; two sets of heat sink groups, one set of a plurality of mountain fin fins 11, each of which The bottom of the mountain fin heat sink 11 is adjacent to the cold side of the semiconductor cooling fin 4, and is made of aluminum or aluminum alloy or copper, and the heat dissipation on the mountain fin fins 11
- the thickness of the sheet is 1 to 2 legs, and the two fins are spaced apart from the heat sink by 2 to 4 legs; one set is a plurality of flat fins 12, and the plurality of flat fins are adjacent to the electric heating tube 2, and the material thereof
- the flat fins 12 are made of aluminum frame as a supporting frame, and the supporting frame 12
- a first fan 3 is a first fan 3
- the flat type fin group 13 adjacent to the fin group 1 and the blower group forming the air with the fin group 1 may be the first fan 3 of the same type or Straight-type first fan 3 ⁇ ;
- the semiconductor water mist type air conditioner can produce different shapes so that it can be applied to different occasions and spaces.
- An electric heating tube 2 is a thermoelectric heating tube 2
- the flat type fin group 13 adjacent to the fin group 1 is electrically connected to the power source 76 and is driven by the power source 76 to generate heat.
- a condensate collecting tray 6 is provided.
- the position device is disposed at the bottom of the cooling chamber to collect the condensed water generated by the cooling fin group 1 during the cooling process; and the bottom of the condensed water collecting tray 6 is provided.
- the plurality of atomized water particles inlet 8; the condensed water generated by the cooling plate group 1, the condensed water collected by the condensate collecting plate 6 is concentrated at the bottom of the condensate collecting tray 6, and borrowed
- the atomized water tank inlet port 8 flows into the atomizing water tank A2.
- the inner surface of the frame wall A3 of the refrigerating chamber A can be thermally reflected and composed of heat-resistant and heat-insulating material A5, which is isolated from other components; heat and heat insulation
- the composite composition of material A5 is composed of the outer surface of the bright surface heat-reflectable material A5A and the inner layer of heat-insulating material A5B.
- the bright surface can be heat-reflected and the heat-resistant material A6 can be aluminum foil or aluminum sheet.
- A7 can be low temperature insulation material such as PUR foam or PE foam.
- the inner surface of the frame wall A3 of the refrigerating chamber A is heat-reflectable and is designed for heat-resisting and heat-insulating materials. The purpose is to avoid the cooling efficiency caused by the leakage of the cold source during the cooling process of the semiconductor cooling fins 4, Or in the heating tube 2, the heat radiation can be concentrated in the heating process to increase the heating effect.
- each of the mountain fin fins 11 in the composition of the cold fin group 1 is larger than the area of the fin surface of the semiconductor fin 4, and the mountain fin fins are
- the bottom of the 11 is adjacent to the cooling chamber A and is provided with a waterproof rubber strip A4, thereby forming a waterproof sealing contact surface which does not deplete the cooling efficiency of the semiconductor cooling fin; the purpose is to prevent the thermally conductive medium from atomizing the water particles, resulting in a semiconductor The cooling piece is damaged.
- the plurality of atomized water particles inlet port 8 serves as an inlet of the atomized water particles into the cooling chamber A; the atomized water particle inlet port 8 is connected to the atomized water particle tube 82, and the atomized water particle tube 82 is connected to the atomization
- the atomized water particle outlet 83 on the water tank A2; the atomized water particle tube 82 is composed of a long small diameter pipe connected with a short large diameter pipe, and the small diameter pipe is connected to the atomized water particles.
- the gas port 8 the large diameter pipe is connected to the atomized water particle outlet 83, and the large diameter pipe has a solid rubber ball 84; the solid rubber ball 84 has a diameter larger than the small diameter pipe on the mechanism, but smaller than the atomized water particle outlet 83 To prevent the solid rubber ball 84 from falling off; in normal normal conditions, the atomized water particles can normally lead to the cooling chamber A.
- the solid rubber ball 84 will atomize the water particle inlet 8 Blocking, to prevent the water in the atomizing water tank A2 from being damaged by the water particle inlet 8 and other electrical components of the semiconductor water mist type air conditioner.
- A1 Semiconductor Cooling Plate Heat Dissipation Chamber
- a heat sink set 5 is :
- the mechanism is composed of a heat dissipating block 51 and a flat fin group 53.
- the heat dissipating block 51 is made of aluminum. Or aluminum alloy or copper, which are connected by a plurality of solid or hollow threaded fin heat pipes 52, made of aluminum rods or copper rods or red copper rods; flat fin type 53 is made of aluminum or aluminum
- the alloy or copper, the flat type heat sink group 53 has an aluminum frame as a supporting frame, and the supporting aluminum frame 54 is parallelly welded with dozens of strip-shaped fins in the middle: 55, and the heat sink is made of aluminum or aluminum alloy or copper.
- the strip fins 55 are 0.5 mn thick! ⁇ 1 dish, heat sink parallel spacing of 2 mm ⁇ 4 let.
- the second fan 31 is adjacent to the flat fin group 53 in the heat sink group 5 and forms heat dissipation with the heat sink group 5 , and may be a second fan 31 or a straight tube.
- the second type fan 31A using different types of fan selection design, the semiconductor water mist type air conditioner can produce different shapes so that it can be applied to different occasions and spaces.
- the basic components of the atomization tank A2 include:
- the electronic atomizing wafer 72 is installed in the bottom of the atomizing water tank A2, and is electrically connected with the water level switch 71, and is powered by the power source 76; when the water level inside the atomizing water tank A2 passes The low-time electron atomizing wafer 72 can automatically stop the operation, thereby preventing the electronic atomizing wafer 72 from being burnt.
- the circuit diagram of the electronic atomizing wafer 72 and the water level switch 71 is shown in FIG.
- a water inlet 9 is a water inlet 9:
- the water inlet 9 is installed on the atomizing water tank A2, and is an atomizing water tank A2.
- the atomized "water" particle conversion space is reserved by the water inlet 9 installation position; the water inlet 9 mechanism is composed of two large and small hollow tubes, and the large diameter tube has a large diameter tube.
- the hollow rubber ball 91 has a hollow base 92 at the bottom of the large diameter tube to prevent the hollow rubber ball 91 from falling off.
- the hollow rubber ball 91 has a larger diameter than the small diameter hollow tube but smaller than the large diameter hollow tube, and the small diameter hollow tube end is provided with a water inlet. Cover 93; When the water is injected into the expected water level, the hollow rubber ball 91 floats due to the water buoyancy and blocks the water inlet 9 so that the excess water can no longer be injected, thereby preventing the atomized water tank A2 from being overfilled without space. The problem of converting water into atomized water particles.
- the atomizing water tank A2 is provided with a plurality of air inlets 81 as the air pressure in the balanced atomizing tank A2.
- the mechanism is composed of two hollow tubes of large and small diameters. There is a solid rubber ball 81B in the diameter tube, and a hollow base 81A is arranged at the bottom of the large diameter tube to prevent the solid rubber ball 81B from falling off.
- the solid rubber ball 81B is larger in diameter than the small diameter hollow tube but smaller than the large diameter hollow tube; the air can be normal under normal conditions.
- the solid rubber ball 81B blocks the air inlet 81 to prevent the water of the atomizing water tank A2 from being overflowed by the air inlet 81 and the semiconductor water mist type.
- Other electrical components of air conditioning units are also known as the semiconductor water mist type air conditioner.
- another atomized water tank A2 is provided with a plurality of atomized water particles outlet port 83, and the atomized water particle outlet port 83 is connected with the atomized water particle tube 82 for atomizing water particles to the cooling chamber A. Entrance.
- the atomized water particles are sucked and driven by the first fan 3, and enter the cooling chamber A through the atomized "water” particle tube 82, and the cooling chamber
- the semiconductor cooling plate 4 or the electric heating tube 2 in A generates cold or heat
- the cooling sheet group 1 enlarges the cooling area
- the atomized water particles are driven by the suction of the first fan 3 through the cooling sheet group 1, in the heat exchange. Under the action of the purpose, to achieve the purpose of generating cold air or hot air.
- the heat generated by the semiconductor cooling plate 4 during the cooling process needs to be discharged from the semiconductor water mist type air conditioner, so that a heat sink unit 5 and a second fan 31 on the hot side of the semiconductor cooling fin 4 are formed to generate heat.
- the heat is discharged from the semiconductor water mist type air conditioner.
- the present invention can control the ambient humidity by activating and deactivating two working modes of the electronic atomizing wafer 72.
- the present invention generally generates a cold air or hot gas process, and uses atomized water particles as a medium for conducting a cold source and a heat source.
- the atomized wafer 72 is activated, and the atomized water particles increase the humidity of the air.
- the present invention is also an air humidifier in the process of generally generating cold air or hot gas; when the electronic atomizing wafer 72 is in a closed state, that is, ordinary air As a conduction cold source medium, dry cold air and condensed water are generated at this time, that is, when it is cooled in this mode, the hot and humid air in the environment is driven to be sucked into the cooling chamber A by the first fan 3, and the hot and humid air is connected.
- the cold film group 1 is touched, under the action of heat exchange, in addition to lowering the air temperature and generating condensed water on the cooling fin group 1, the cold air generated by the first fan 3 is also reduced in the ambient air.
- Humidity, and the generated condensed water can be concentrated by the condensed water collecting tray 6 on the device, and flows into the atomizing water tank A2 from the atomized water particle inlet 81, so that the present invention operates in this mode as a cooling air.
- the air conditioner is also a dehumidifier; the invention can control the humidity in the environment by switching between two operation modes.
- the circuit control board 7 can be used to control the temperature and humidity level and the size of the wind, and the current can be adjusted through the control chip 73 in the circuit board 7. Adjusting the cooling temperature of the semiconductor cooling plate 4 or the heating temperature of the electric heating tube 2, the wind power of the first fan 3 and the opening and closing of the second fan 31, and the activation or shutdown of the electronic atomizing wafer 72, or through the control wafer 73
- the temperature sensing component 74 and the humidity sensing component 75 set the activation and deactivation of the air conditioner.
- the semiconductor water mist type air conditioner of the present invention can be of an upright type and a horizontal type design, and the cooling chamber A and the semiconductor cooling fin heat dissipating chamber A1 and the atomizing water tank A2 are provided.
- the combination of different positions allows the semiconductor water mist air conditioner to produce different shapes, so that it can be applied to different occasions and spaces.
- the plant essential oil can be added to the atomizing water tank A2 of the present invention to change the semiconductor water mist type air conditioner into an air cleaner and an air aroma machine, since the electron atomizing wafer 72 converts water into atomized water by using 1.6 million vibrations. Particles, a large amount of negative ions are generated during the conversion process, and water particles carrying negative ions can absorb the dust in the air to achieve the purpose of purifying the air; if the plant essential oil is added to the atomizing water tank A2, the electron atomizing wafer 72 is also in action. The plant essential oil is converted into a particulate molecule in a floating air, and the indoor air is aromaned by the blowing of the first fan 3.
- the invention adopts a semiconductor cooling plate and an electric heating tube as a cold source and a heat source, and uses the atomized water particles generated by the electron atomizing wafer as a heat conduction medium, thereby generating cold air and heating; the invention can also be electronically
- the atomizing wafer is turned on and off to control the high and low ambient humidity.
- the invention is not only a new invention, but also an environmentally-friendly air conditioner which does not use the conventional cold coal, and is also a four-in-one air-conditioning device for air-conditioning, heating, dehumidification and humidification.
- the invention can use artificial intelligence to control the wafer to achieve the purpose of controlling temperature and humidity.
- a set value such as a set temperature of 30 degrees Celsius
- the power switch of the controller circuit board is automatically activated to activate the semiconductor water mist type.
- Air conditioning unit The semiconductor water-cooled air conditioner is automatically turned off when the temperature is low to the set value (for example, the set temperature is 20 degrees Celsius).
- the invention can adjust the temperature.
- the present invention can adjust the size of the wind. 5.
- the invention can adjust the humidity to be high and low.
- the invention can be applied to different types of fans by using different types of fans and by different positions of the cooling chamber and the semiconductor cooling fin heat dissipating chamber and the atomizing water tank, so that the semiconductor water mist type air conditioner can produce different shapes, so that it can be applied to different Occasion and space.
- the present invention can incorporate a plant essential oil to convert a semiconductor water mist type air conditioner into an air cleaner and an air fragrance machine.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Description
半导体水雾式空调装置
技术领域
本发明关于一种半导体水雾式空调装置， 尤其指一种对于室内温度形成调节 的装置。 背景技术
一般空调设备， 主要指冷气设备， 而冷气的运转构造以及运转方式， 通常是 透过压缩机将冷媒压缩成高压高温的气体冷媒， 传送到冷凝器将冷媒冷却， 冷媒 由高压高温放热冷却后， 成为高压低温的液态冷媒， 再经由冷媒蓄瓶储存多余的 冷媒， 其它冷媒在膨胀阀处减压成低压低温， 再流到蒸发器， 透过低压低温的气 态冷媒可以吸收室内的温度， 并透过低温冷媒吸热后， 藉由动力吹至室内空间， 造成冷室效果。 然而， 先前技术存有严重的弊端， 主要由于冷煤含有氟氯碳化物 (CFCs), 在大自然中不容易分解， 而其累积的含量与特性会消耗平流层中的臭氧， 使得臭氧含量日渐降低， 形成地球保护的缺洞， 而紫外线在无阻碍的情况直接照 射地球， 除了对人类及生物容易造成各种病变， 且对于生态环境而言， 亦会产生 气候变迁及生态调节失衡的严重后果。 发明内容
有鉴于先前技术使用冷媒作为空调的原料所产生的严重问题， 本发明者认为 应有一种可以改善弊端的构造， 本发明关于一种半导体水雾式空调装置， 主要目 的藉由半导体电子致冷 (以上及以下的致冷， 相对为致热， 以下统一以致冷称)或电 热管致热所产生冷源与热源， 经由致冷片做放大致冷面积。 再利用电子雾化晶片 所形成的雾化水微粒做为传导冷或热的介质 (其原理为 l u m~3 m 的雾化水微粒 热传导率优于一般空气)， 雾化水微粒经第一风扇带动经过致冷片组在热交换与热 传导的作用下， 达到产生冷气或热气的目的。
而为达成前述目的， 本发明所使用的技术手段， 主要设计构成包括一致冷室， 该致冷室内部设有一半导体致冷片的冷侧； 一致冷片组， 致冷片组与半导体致冷 片的冷侧相邻接； 一电热管， 电热管亦与致冷片组相邻接； 致冷片组可放大半导 体致冷片与电热管致冷面积； 一雾化水微粒进气口， 复数为较佳， 做为雾化水微 粒进入致冷室入口； 一第一风扇， 邻近于致冷片组， 形成冷 (热)空气的吹驱； 一冷
凝水集水盘， 做为搜集致冷过程中在致冷片组所产生的冷凝水， 雾化水微粒进气 口装置于冷凝水集水盘底部上面； 致冷室内层采亮面可热反射且为耐热及隔热材 质复合组成与其它构成相隔离。 一半导体致冷片散热室， 该半导体致冷片散热室 设有一散热片组， 散热片组邻近于半导体致冷片的热侧； 一第二风扇， 与散热片 组形成散热。 一雾化水箱， 该雾化水箱内设有一电子雾化晶片， 电子雾化晶片形 成的雾化水微粒； 一雾化水微粒出气口， 复数为较佳， 雾化水微粒出气口设于雾 化水箱上， 并连接至雾水微粒管一端， 雾化水微粒管另一端连接至致冷室内的冷 凝水集水盘上的雾化水微粒进气口， 水经电子雾化晶片产生雾化水微粒， 雾化水 微粒经雾化水微粒管通往致冷室； 一空气进气口， 复数为较佳， 该空气进气口设 于雾化水箱上， 做为平衡雾化水箱中空气压力； 一进水口， 进水口设于雾化水箱 上， 做为雾化水箱注水口。
当雾化水箱里的水经过电子雾化晶片产生雾化水微粒， 雾化水微粒在第一风 扇吸入驱动作用， 经雾化水微粒管进入致冷室， 致冷室里的半导体致冷片或电热 管产生冷或热， 经致冷片组放大致冷面积， 雾化水微粒在第一风扇的吸入驱动经 过致冷片组， 在热交换的作用下， 达到产生冷气或热气的目的。
而半导体致冷片在致冷过程产生的热需要排出半导体水雾式空调装置， 故在 半导体致冷片的热侧装置一散热片组与一第二风扇， 形成散热将产生的热排出半 导体水雾式空调装置。
本发明次一目的是可控制环境湿度即对空气有加湿与除湿的功能， 由于本发 明在产生冷气或热气过程， 是以雾化水微粒为传导冷源及热源的介质而非一般空 气， 而雾化水微粒会增加空气湿度， 所以本发明在一般产生冷气或热气过程时亦 为空气加湿机， 此部分有别于传统空调在工作时会造成环境湿度过低的弊病； 当 本装置在致冷过程中不激活电子雾化晶片， 即以一般空气做为传导冷源介质， 此 时会产生干冷空气与冷凝水， 即当以此模式致冷时， 过程中环境里的湿热空气在 第一风扇驱动吸入至致冷室， 湿热空气在接触致冷片组时在热交换的作用下， 除 会降低空气温度并会在致冷片组上产生冷凝水， 在第一风扇吹驱下即产生冷气亦 会降低环境空气中的湿度， 而^ 1产生的冷凝水可藉由装置上的冷凝水集水盘集中 后， 并由雾化水微粒进气口流入雾化水箱， 故本发明在此模式运作除为一冷气空 调机亦为一除湿机； 本发明藉两种运作模式切换即可控制环境中的湿度。
本发明另一目的在于可利用控制电路， 控制温度及湿度的高低与风力的大小， 藉透过电路控制板控制晶片调整电流大小即可调整半导体致冷片制冷温度或电热
管致热温度， 与第一风扇风力大小、 第二风扇开启关闭， 以及电子雾化晶片激活 或关闭， 亦可透过控制晶片与温湿度感测组件设定空调的激活与关闭。
本发明另一目的在于致冷片组机构设计， 做为放大半导体致冷片及电热管致 冷 (面积)来增加与雾化水微粒或空气的热交换效率，其机构组成为两组散热片组并 以数根实心或空心螺紋材质为铝棒或红铜棒的致冷片组热导管相连接； 两组散热 片组， 一组为复数山型鳍式散热片， 该各山型鳍式散热片与半导体致冷片的冷侧 相邻接， 其材质为铝或铝合金或铜， 该各型鳍式散热片上的散热片厚度为 1 鍾〜 2 腿， 两散热片与散热片相间隔为 2 M！〜 4 腿； 一组为复数平板型散热片， 其材质为 铝或铝合金或铜， 该各平板型散热片以铝框做为支撑框架， 支撑框架中间平行焊 接数十片长方形条状散热片， 该各散热片材质为铝片或铝合金片或铜片， 长方形 条状散热片厚度为 0.5 腿〜 1 mm, 该两散热片平行间隔为 2 醒〜 4腿。
本发明另一目的在于散热片组机构设计， 散热片组是做为排出半导体致冷片 致冷过程所产生的热， 其机构组成为一散热块材质为铝或铝合金或铜及一平板型 散热片组， 两者并以数根实心或空心螺紋的散热片组热导管相连接， 材质为铝棒、 铜棒或红铜棒， 散热块与半导体致冷片的热侧相邻接； 平板型散热片组其材质为 铝或铝合金或铜， 平板型散热片组以铝框做为支撑框架， 支撑铝框中间平行焊接 数十片长条状散热片， 散热片材质为铝片或铝合金片或铜片， 长条状散热片厚度 为 0.5 誦〜 1 腿， 散热片平行间隔为 2 mn！〜 4 醒。
本发明另一目的在于致冷片组与半导体致冷片的冷侧相邻接防水的机构设 计， 由于做为热传导的介质雾化水微粒， 会造成半导体致冷片损坏， 故设计来取 使用大于半导体致冷片面积的山型鳍式散热片， 并在山型鳍式散热片的底部与致 冷室相邻接处装置防水橡胶条， 形成不损耗半导体致冷片致冷效率防水密闭接触 面。
本发明另一目的在于致冷室内层所披覆的材质设计， 由于在致冷与致热过程 中致冷室需避免热消耗以及热辐射的集中与耐热隔热问题， 故致冷室内层采亮面 可热反射且为耐热及隔热材质复合组成， 亮面可热反射且为耐热材质可为铝箔片 或铝片， 隔热材质可为 PUR泡棉或 PE泡棉等低温保温材质。
本发明另一目的在于第一风扇与第二风扇选用设计可为直式风扇或直筒式风 扇， 利用不同形式的风扇选用设计， 可使半导体水雾式空调装置产生不同外型如 此即可适用在不同场合与空间。
本发明另一目的在于半导体水雾式空调装置可为直立式以及横式设计， 藉由
致冷室与半导体致冷片散热^:以及雾化水箱不同的位置组合， 可使半导体水雾式 空调装置产生不同外型如此即可可适用在不同场合与空间。
本发明另一目的在于装置雾化水箱的雾化水微粒出气口以及空气进气口防止 水溢出的机构设计， 为避免雾化水箱里的水藉由雾化水微粒出气口以及空气进气 口溢出损及其它电性机构组件， 故采取单向设计， 即只允许雾化水微粒与空气可 进出， 雾化水箱里的水无法从雾化水微粒出气口以及空气进气口溢出。
本发明另一目的在于装置于雾化水箱的进水口机构设计， 为避免雾化水箱里 的水藉由进水口溢出损及其它电性机构组件， 故采取单向设计， 即只允许水进入， 雾化水箱里的水无法从进水口溢出； 另外电子雾化晶片在转化水为雾化水微粒过 程中， 需预留空气与空间来做为水转化为雾化水微粒， 故雾化水箱在注水过程中 不能将水注满， 在本发明的进水口设计藉由进水口安装位置来预留雾化水微粒转 化空间， 并配合进水口内的浮球满水位止水阀设计， 来避免雾化水箱注水过满无 空间来将水转化为雾化水微粒的问题。
本发明又一目的在于雾化水箱里在低水位时电子雾化晶片自动停止动作设 计， 由于电子雾化晶片若在无水状况下继续动作会有烧毁的危险， 故设计雾化氷 箱里在低水位时电子雾化晶片自动停止动作， 来避免电子雾化晶片烧毁的危险。
本发明再一目的在于雾化水箱里可加入植物香精油使半导体水雾式空调装置 变为空气清净机与空气芳香机， 由于电子雾化晶片是利用 160万次震动将水转化 成雾化水微粒， 转化过程中会产生大量负离子， 携带负离子的水微粒可吸附空气 中的粉尘从而达到清净空气的目的； 若水箱里加入植物香精油在电子雾化晶片在 动作时， 亦会将植物香精油转化成可漂浮空中的微粒分子， 随第一风扇的吹驱而 达到室内空气达到芳香的目的。 附图说明
图 1为本发明平面结构示意图；
图 2为本发明的致冷 /致热片组三视图；
图 3为本发明的致冷 /致热片组与第一风扇直式风扇；
图 4为本发明的致冷 /致热片组与第一风扇直筒式风扇；
图 5为本发明的集水盘三视图及立体图；
图 6为本发明的致冷 /致热室框壁剖面图；
图 7为本发明的防水橡胶条安装位置图；
图 8为本发明的雾化水微粒管剖面图；
图 9为本发明的散热片组三视图；
图 10为本发明的散热片组与第二风扇直式风扇三视图;
图 11为本发明的散热片组与第二风扇直筒式风扇；
图 12为本发明的水箱三视图与立体图；
图 13为本发明的电子雾化晶片与水位开关电路图；
图 14为为本发明的进水口剖面图；
图 15为本发明的空气进气口剖面图；
图 16为本发明的控制电路的架构平面示意图；
图 17为本发明的各种结构组合图例一；
图 18为本发明的各种结构组合图例二；
图 19为本发明的各种结构组合图例三。
其中
A.致冷室 A1.半导体致冷片散热室
A2.雾化水箱 A3.框壁
A4.防水橡胶条 A5.亮面可热反射且为耐热及隔热材质
A5A.亮面可热反射材质 A5B.隔热材质
1.致冷片组 11.山型鳍式散热片
12.平板型散热片 12A.支撑铝框
12B.长条状散热片 13.致冷片组热导管
2.电热管 3.第一风扇
3A.第一风扇 (直筒式风扇） 31.第二风扇
31A.第二风扇 (直筒式风扇） 4.半导体致冷片
5.散热片组 51.散热块
52.散热片组热导管 53.平板型散热片组
54.支撑铝框 55.长条状散热片
6.冷凝水集水盘 7.电路控制板
71.水位开关 72.电子雾化晶片
73.控制晶片 74.温度感测组件
75.湿度感测组件 76.电源
8.雾化水微粒进气口 81.空气进气口
81 A.中空底座 81B.实心橡胶球
82.雾化水微粒管 83.雾化水微粒出气口
84.实心橡胶球 9.进水口
91.空心橡胶球 92.中空底座
93.进水口盖 具体实施方式
以下藉由图式说明本发明的构造、 特点以及实施例， 俾使 贵审査人员对于本 发明有更进一步的理解。
请参阅图 1与图 16所示， 本发明主要关于一种半导体水雾式空调装置， 由一 框壁 A3为外部的概略框围，并且以框壁 A3分隔界定为一致冷室 A与一半导体致 冷片散热室 A1以及一雾化水箱 A2。
该致冷室 A内部包括有一半导体致冷片 4的冷侧、一致冷片组 1、一电热管 2、 复数雾化水微粒进气口 8、 一第一风扇 3、 一冷凝水集水盘 6。
该半导体致冷片散热室 A1则包括， 一散热片组 5、 一第二风扇 31、一半导体 致冷片 4的热侧。
该雾化水箱 A2包括有一电子雾化晶片 72、 复数雾化水微粒出气口 83、 复数 空气进气口 81、一进水口 9。 另外雾化水微粒出气口 83连接雾化水微粒管 82， 接 至致冷室 A内的冷凝水集水盘 6上的雾化水微粒进气口 8。
另外致冷室 A内层铺以亮面可热反射且为耐热及隔热材质 A5 , 以阻隔半导体 制冷片 4的热侧所产生的热， 避免降低致冷室 A致冷效果。
至于致冷室 A内部基本的构件包括有：
一半导体致冷片 4的冷侧： 、
请配合图 16所示， 该半导体致冷片 4的冷侧与电源 76构成电性连接， 并由 电源 76供电驱动致冷。
一致冷片组 1 :
请配合图 2所示， 邻近于半导体致冷片 4的冷侧与电热管 2， 可放大半导体制 冷片 4以及电热管 2的致冷 /致热面积； 致冷片组 1其机构组成为两组散热片组并 以数根实心或空心螺纹材质为铝棒或红铜棒的致冷片组热导管 13连接； 两组散热 片组， 一组为复数山型鳍式散热片 11， 该各山型鳍式散热片 11底部与半导体致冷 片 4 的冷侧相邻接， 其材质为铝或铝合金或铜， 该各山型鳍式散热片 11上的散热
片厚度为 1 麵〜 2腿， 两散热片与散热片相间隔为 2 麵〜 4腿； 一组为复数平板型 散热片 12， 该复数平板型散热片与电热管 2相邻接， 其材质为铝或铝合金或铜， 该各平板型散热片 12以铝框做为支撑框架，支撑框架 12A中间平行焊接数十片长 条状散热片 12B， 散热片材质为铝片或铝合金片或铜片， 长条状散热片 12B厚度 为 0.5 議〜 1 誦， 散热片平行间隔为 2 ran！〜 4 ππη。
一第一风扇 3 :
. 请参阅图 3与图 4所示， 邻近于致冷片组 1中的平板型散热片组 13， 与致冷 片组 1形成空气的吹驱， 可为一直式的第一风扇 3或为直筒式的第一风扇 3Α; 利 用不同形式的风扇选用设计， 可使半导体水雾式空调装置产生不同外型如此即可 适用在不同场合与空间。
一电热管 2:
邻近于致冷片组 1中的平板型散热片组 13， 与电源 76构成电性连接， 并由电 源 76供电驱动致热。
一冷凝水集水盘 6:
请参阅图 1及图 5所示， 其位置装置于致冷室 Α底部， 做为搜集致冷过程中 在致冷片组 1所产生的冷凝水； 又冷凝水集水盘 6底部上面， 装置复数雾化水微 粒进气口 8; 致冷片组 1所产生的冷凝水， 因冷凝水集水盘 6采斜面设计故所搜集 的冷凝水会集中在冷凝水集水盘 6底部， 并藉由雾化水微粒进气口 8流入雾化水 箱 A2。
请同时参阅图 1及图 6所示， 致冷室 A的框壁 A3内层采亮面可热反射且为 耐热及隔热材质 A5复合组成， 与其它构成相隔离； 耐热及隔热材质 A5的复合组 成， 分别由外层的亮面可热反射材质 A5A与内层的隔热材质 A5B所构成，亮面可 热反射且为耐热材质 A6可为铝箔或铝片， 隔热材质 A7可为 PUR泡棉或 PE泡棉 等低温保温材质。 致冷室 A的框壁 A3 内层采亮面可热反射且为耐热及隔热材质 的设计， 其目的是在半导体致冷片 4致冷过程避免因冷源外泄影响致冷效率， 或 者在电热管 2在致热过程能集中热辐射， 增加致热效果。
请参阅图 7所示， 另致冷片组 1构成中的的该各山型鳍式散热片 11底部面积 需大于半导体致冷片 4致冷面面积， 并且在该各山型鳍式散热片 11的底部与致冷 室 A相邻接处装置防水橡胶条 A4， 以此形成不损耗半导体致冷片致冷效率的防水 密闭接触面； 其目的在于防止热传导的介质雾化水微粒， 造成半导体致冷片损坏。
请同时参阅图 1及图 5及图 8所示， 在致冷室 A底部的冷凝水集水盘 6装置
复数雾化水微粒进气口 8， 做为雾化水微粒进入致冷室 A的入口； 雾化水微粒进 气口 8连接雾化水微粒管 82， 雾化水微粒管 82接至雾化水箱 A2上的雾化水微粒 出气口 83;雾化水微粒管 82其机构由一支长的小直径管子与一支短的大直径管子 所连接组成， 小直径管子连接至雾化水微粒进气口 8， 大直径管子连接至雾化水微 粒出气口 83， 大直径管子内有一颗实心橡胶球 84; 实心橡胶球 84直径大于机构 上的小直径管子， 但小于雾化水微粒出气口 83， 以防止实心橡胶球 84脱落； 在一 般正常状况雾化水微粒可正常通往致冷室 A， 当半导体水雾式空调装置倾倒时实 心橡胶球 84便会将雾化水微粒进气口 8阻塞， 避免雾化水箱 A2的水由水微粒进 气口 8溢出损及半导体水雾式空调装置其它电性组件。
半导体致冷片散热室 A1内部基本的构件包括有：
一散热片组 5 :
请参阅图 9所示， 邻近于半导体致冷片 4的热侧， 与第二风扇 31形成散热； 其机构组成为一散热块 51及一平板型散热片组 53， 其中散热块 51材质为铝或铝 合金或铜， 两者并以数根实心或空心螺紋的散热片组热导管 52相连接， 材质为铝 棒或铜棒或红铜棒； 平板型散热片组 53其材质为铝或铝合金或铜， 平板型散热片 组 53以铝框做为支撑框架， 支撑铝框 54中间平行焊接数十片长条状散热片 :55， 散热片材质为铝片或铝合金片或铜片， 长条状散热片 55厚度为 0.5 mn！〜 1 皿， 散 热片平行间隔为 2 mm〜4讓。
一第二风扇 31 :
请参阅图 10与图 11所示， 该第二风扇 31邻近于散热片组 5中的平板型散热 片组 53， 与散热片组 5形成散热， 可为一直式的第二风扇 31或为直筒式的第二风 扇 31A; 利用不同形式的风扇选用设计， 可使半导体水雾式空调装置产生不同外 型如此即可适用在不同场合与空间。
雾化水箱 A2内部基本的构件包括有：
一电子雾化晶片 72:
请参阅图 1与图 12所示， 该电子雾化晶片 72安装于雾化水箱 A2内底部， 与 水位开关 71形成电性连接， 并由电源 76供电驱动； 当雾化水箱 A2内部的水位过 低时电子雾化晶片 72可自动停止动作， 以此避免电子雾化晶片 72烧毁， 电子雾 化晶片 72与水位开关 71电路图请参阅图 13所示。
一进水口 9:
请参阅图 12图 14所示， 该进水口 9安装于雾化水箱 A2上， 为雾化水箱 A2
的注水入口； 由于电子雾化晶片 72在转化水为雾化水微粒过程中， 需预留空气与 空间来做为水转化为雾化水微粒， 故雾化水箱 A2在注水过程中不能将水注满， 在 本发明的进水口 9设计藉由进水口 9安装位置来预留雾化 "水"微粒转化空间； 进水口 9机构组成由大小直径两段中空管子连结而成， 大直径管内有一空心橡胶 球 91， 大直径管底部有一中空底座 92 以防止空心橡胶球 91脱落， 空心橡胶球 91 直径大于小直径中空管但小于大直径中空管， 小直径中空管端设一进水口盖 93 ; 当水注入至预计水位时， 空心橡胶球 91便因水浮力浮起将进水口 9阻塞住让多余 的水无法再注入，藉此来避免雾化水箱 A2注水过满无空间来将水转化为雾化水微 粒的问题。
请参阅图 12图 15所示， 此外雾化水箱 A2上设有复数空气进气口 81， 做为 平衡雾化水箱 A2中空气压力； 其机构组成由大小直径两段中空管子连结而成， 大 直径管内有一实心橡胶球 81B, 大直径管底部有一中空底座 81A以防止实心橡胶 球 81B脱落， 实心橡胶球 81B直径大于小直径中空管但小于大直径中空管； 在一 般正常状况空气可正常通往雾化水箱 A2， 当半导体水雾式空调装置倾倒时实心橡 胶球 81B便会将空气进气口 81阻塞，避免雾化水箱 A2的水由空气进气口 81溢出 损及半导体水雾式空调装置其它电性组件。
参阅图 8所示， 另雾化水箱 A2上设有复数雾化水微粒出气口 83， 雾化水微 粒出气口 83与雾化水微粒管 82连接， 为雾化水微粒通往致冷室 A的入口。
当雾化水箱 A2里的水经过电子雾化晶片 72产生雾化微粒， 雾化水微粒在第 —风扇 3吸入驱动作用， 经雾化『水』微粒管 82进入致冷室 A, 致冷室 A里的半 导体致冷片 4或电热管 2产生冷或热， 经致冷片组 1放大致冷面积， 雾化水微粒 在第一风扇 3的吸入驱动经过致冷片组 1， 在热交换的作用下， 达到产生冷气或热 气的目的。 而半导体致冷片 4在致冷过程产生的热需要排出半导体水雾式空调装 置， 故在半导体致冷片 4的的热侧装置一散热片组 5与一第二风扇 31， 形成散热 将产生的热排出半导体水雾式空调装置。
本发明可藉由电子雾化晶片 72激活与关闭两种工作模式来控制环境湿度； 本 发明一般在产生冷气或热气过程， 是以雾化水微粒为传导冷源及热源的介质， 此 时电子雾化晶片 72是激活的， 而雾化水微粒会增加空气湿度， 所以本发明在一般 产生冷气或热气过程时亦为空气加湿机； 当电子雾化晶片 72在关闭状态下， 即以 一般空气做为传导冷源介质， 此时会产生干冷空气与冷凝水， 即当以此模式致冷 时， 过程中环境里的湿热空气在第一风扇 3驱动吸入至致冷室 A, 湿热空气在接
触致冷片组 1时在热交换的作用下， 除会降低空气温度并会在致冷片组 1上产生 冷凝水， 在第一风扇 3 吹驱下即产生冷气亦会降低环境空气中的湿度， 而所产生 的冷凝水可藉由装置上的冷凝水集水盘 6 集中后，并由雾化水微粒进气口 81流入 雾化水箱 A2， 故本发明在此模式运作除为一冷气空调机亦为一除湿机； 本发明藉 两种运作模式切换即可控制环境中的湿度。
请参阅图 1与图 16所示， 本发明可利用电路控制板 7， 设定控制温度及湿度 的高低与风力的大小， 即可透过电路控制板 7中的控制晶片 73调整电流大小即可 调整半导体致冷片 4致冷温度或电热管 2致热温度， 与第一风扇 3风力大小及第 二风扇 31开启关闭， 以及电子雾化晶片 72激活或关闭， 亦可透过控制晶片 73与 温度感测组件 74及湿度感测组件 75设定空调的激活与关闭。
请参阅图 17及图 18及图 19所示， 本发明的半导体水雾式空调装置可为直立 式以及横式设计，藉由致冷室 A与半导体致冷片散热室 A1以及雾化水箱 A2不同 的位置组合， 可使半导体水雾式空调装置产生不同外型， 如此即可适用各式不同 场合与空间。
又本发明的雾化水箱 A2 里可加入植物香精油使半导体水雾式空调装置变为 空气清净机与空气芳香机， 由于电子雾化晶片 72是利用 160万次震动将水转化成 雾化水微粒， 转化过程中会产生大量负离子， 携带负离子的水微粒可吸附空气中 的粉尘从而达到清净空气的目的；若雾化水箱 A2里加入植物香精油在电子雾化晶 片 72在动作时， 亦会将植物香精油转化成可漂浮空中的微粒分子， 随第一风扇 3 的吹驱而达到室内空气达到芳香的目的。
本发明的功效可以达到：
一、 本发明采以半导体致冷片与电热管为冷源及热源， 并利用电子雾化晶片 所产生的雾化水微粒为热传导介质， 藉此产生冷气与暖气； 本发明亦可藉由电子 雾化晶片开启与关闭， 来控制环境湿度高与低。 本发明除为一新发明不使用传统 冷煤的环保空调装置， 亦为冷气、 暖气、 除湿、 加湿四合一全方位空调装置。
二、 本发明可利用人工智能控制晶片达到控制温度与湿度的目的， 当温度高 到设定值 (如设定温度摄氏 30度)即自动激活控器电路板的电源开关， 激活半导体 水雾式空调装置。 当温度低到设定值 (如设定温度摄氏 20度)即自动关闭半导体水 雾式空调装置。
三、 本发明可以调整温度。
四、 本发明可以调整风力大小。
五、 本发明可以调整湿度高与低。
六、 本发明可藉使用不同形式风扇及藉由致冷室与半导体致冷片散热室以 及雾化水箱不同的位置组合， 可使半导体水雾式空调装置产生不同外型如此即可 适用在不同场合与空间。
七、 本发明可加入植物香精油使半导体水雾式空调装置变为空气清净机与 空气芳香机。
综上所述， 本发明具备实用效果， 未见于刊物或公开使用， 符合专利要件， 依法提出专利申请。 上述所陈， 为本发明产业上一较佳实施例， 举凡依本发明申 请专利范围所作的等效变化， 皆属本案申请专利范围之列。
Claims
1、 一种半导体水雾式空调装置， 括由一框壁框围， 且内部隔为：
'一致冷室：
内部设有一半导体致冷片的冷侧， 以及一致冷片组： 该致冷片组与该半导体 致冷片的冷侧相邻接， 以及设一电热管， 该电热管与该致冷片组相邻接， 藉以放 大该半导体致冷片与该电热管致冷面积； 设一第一风扇， 邻近于该致冷片组， 形 成冷 /热空气的吹驱； 该致冷室底部设一冷凝水集水盘； 且该冷凝水集水盘底部设 有一雾化水微粒进气口；
一半导体致冷片散热室：
内部设有一散热片组， 该散热片组邻近于半导体致冷片的热侧； 以及设一第 二风扇， 可供对该散热片组形成散热；
一雾化水箱：
内部设有一电子雾化晶片， 可供水形成雾化水微粒； 以及设有一雾化水微粒 出气口， 该雾化水微粒出气口连通一雾化水微粒管， 该雾化水微粒管则连通该雾 化水微粒进气口， 雾化水微粒经雾化水出气口通往致冷室； 以及一空气进气口， 供平衡雾化水箱中空气压力； 以及设一进水口， 提供注水。
2、 如权利要求 1所述的半导体水雾式空调装置， 其中该致冷室内层采亮面可 热反射且为耐热及隔热材质复合组成， 且与其它构成相隔离。
3、 如权利要求 1所述的半导体水雾式空调装置， 其中更设一控制电路， 可 供控制温度及湿度的高低与风力的大小， 藉透过电路控制板控制晶片调整电流大 小即可调整半导体致冷片制冷^度或电热管致热温度， 与第一风扇风力大小、 第 二风扇开启关闭， 以及电子雾化晶片激活或关闭， 亦可透过控制晶片与温湿度感 测组件设定空调的激活与关闭。
4、 如权利要求 1所述的半导体水雾式空调装置， 其中该致冷片组为两组散 热片组， 并以数根实心或空心螺纹材质为铝棒或红铜棒的致冷片组热导管相连接。
5、 如权利要求 4所述的半导体水雾式空调装置， 其中该两组散热片组，' 一 组为复数山型鳍式散热片， 该各山型鳍式散热片与半导体致冷片的冷侧相邻接， 其材质为铝或铝合金或铜， 该各山型鳍式散热片上的散热片厚度为 1皿〜 2ππη， 且 该两散热片相间隔为 2皿〜 4mm; —组为复数平板型散热片， 其材质为铝或铝合金 或铜， 该各平板型散热片以铝框做为支撑框架， 支撑框架中间平行焊接数十片长 方形条状散热片， 该各散热片材质为铝片或铝合金片或铜片， 长方形条状散热片 厚度为 0.5麵〜 1醒， 且该两散热片平行间隔为 2賺〜 4醒。
6、 如权利要求 1所述的半导体水雾式空调装置， 其中该散热片组为一散热 块材质为铝或铝合金或铜及一平板型散热片组， 两者并以数根实心或空心螺紋的 散热片组热导管相连接， 材质为铝棒或铜棒或红铜棒， 散热块与半导体致冷片的 热侧相邻接； 平板型散热片组其材质为铝或铝合金或铜， 平板型散热片组以铝框 做为支撑框架， 支撑铝框中间平行焊接数十片长条状散热片， 散热片材质为铝片 或铝合金片或铜片， 长条状散热片厚度为 0.5πιπ！〜 1薩， 散热片平行间隔为 2M！〜 4
7、 权利要求 1所述的半导体水雾式空调装置， 其中于致冷片组与半导体致 冷片的冷侧相邻接设一防水机构， 该防水机构使用大于半导体致冷片面积的山型 鳍式散热片， 并在山型鳍式散热片的底部与致冷室相邻接处装置防水橡胶条， 形 成不损耗半导体致冷片致冷效率的防水密闭接触面。
8、 如权利要求 2所述的半导体水雾式空调装置， 其中该致冷室内层为铝箔 或铝片， 且该隔热材质可为 PUR泡棉或 PE泡棉等低温保温材质。
9、 如权利要求 1所述的半导体水雾式空调装置， 其中该第一风扇与第二风 扇选用设计可为直式风扇或直筒式风扇。
1 0、 如权利要求 1所述的半导体水雾式空调装置， 其中该框壁为直立式或 横式设计。
1 1、 如权利要求 1所述的半导体水雾式空调装置， 其中该雾化水箱的雾化 水微粒出气口以及空气进气口防止水溢出的机构设计， 其设计采取单向设计， 即 只允许雾化水微粒与空气可进出， 雾化水箱里的水无法从雾化水微粒出气口以及 空气进气口溢出。
1 2、 如权利要求 1所述的半导体水雾式空调装置， 其中该雾化水箱的进水 口机构设计， 即只允许水进入， 雾化水箱里的水无法从进水口溢出； 以及藉由进 水口安装位置来预留雾化水微粒转化空间， 并配合进水口内的浮球满水位止水阔 设计， 来避免雾化水箱注水过满无空间来将水转化为雾化水微粒的问题。
1 3、 如权利要求 1所述的半导体水雾式空调装置， 其中该电子雾化晶片可 受雾化水箱内的水位控制。
1 4、 如权利要求 1所述的半导体水雾式空调装置， 其中该雾化水箱里内可 加入植物香精油。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2009/000143 WO2010091531A1 (zh) | 2009-02-10 | 2009-02-10 | 半导体水雾式空调装置 |
| CN200980155731.0A CN102301192B (zh) | 2009-02-10 | 2009-02-10 | 半导体水雾式空调装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2009/000143 WO2010091531A1 (zh) | 2009-02-10 | 2009-02-10 | 半导体水雾式空调装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2010091531A1 true WO2010091531A1 (zh) | 2010-08-19 |
Family
ID=42561354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2009/000143 WO2010091531A1 (zh) | 2009-02-10 | 2009-02-10 | 半导体水雾式空调装置 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102301192B (zh) |
| WO (1) | WO2010091531A1 (zh) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8015724B2 (en) * | 2004-04-23 | 2011-09-13 | Panasonic Electric Works Co., Ltd. | Heating blower with electrostatic atomizing device |
| CN103791575A (zh) * | 2014-02-12 | 2014-05-14 | 丹东星光电器有限公司 | 电子空调式负离子加湿风扇 |
| CN106642371A (zh) * | 2016-09-30 | 2017-05-10 | 芜湖美智空调设备有限公司 | 空调器、空调器的壳体组件及壳体组件的装配方法 |
| CN106642372A (zh) * | 2016-09-30 | 2017-05-10 | 芜湖美智空调设备有限公司 | 用于桌面空调的壳体组件及桌面空调 |
| CN110375408A (zh) * | 2019-08-19 | 2019-10-25 | 深圳市一粒创新设计有限公司 | 一种出风装置 |
| EP3578889A4 (en) * | 2017-12-14 | 2020-12-23 | Chau, Siu Tai | SEMI-CONDUCTOR COOLING OR AIR CONDITIONING SYSTEM |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103868212B (zh) * | 2012-12-17 | 2016-07-06 | 格力电器（中山）小家电制造有限公司 | 空气调节装置的加水装置、加湿器及空调扇 |
| CN103822343B (zh) * | 2014-02-14 | 2017-02-08 | 美的集团股份有限公司 | 空调蓄湿加湿装置及应用该装置的空调室内机和空调系统 |
| CN104180436A (zh) * | 2014-04-08 | 2014-12-03 | 中国计量学院 | 高等级的由水淋以及制冷制热程序组成的空气净化装置 |
| CN105916346B (zh) * | 2016-05-13 | 2019-01-08 | 浙江理工大学 | 一种集成式电源箱 |
| CN107514715A (zh) * | 2016-06-15 | 2017-12-26 | 奇岩电子股份有限公司 | 空调装置 |
| CN110940000A (zh) * | 2019-12-20 | 2020-03-31 | 合肥天鹅制冷科技有限公司 | 一种小型化电子机柜除湿装置 |
| CN111529224B (zh) * | 2020-05-11 | 2022-04-12 | 青岛大学附属医院 | 一种防疫医疗车用隔离装置 |
| CN112696751A (zh) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | 一种基于3d均温板模组的空调装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1392372A (zh) * | 2002-07-02 | 2003-01-22 | 海尔集团公司 | 具有加湿功能的柜式空调器 |
| CN1851359A (zh) * | 2006-06-05 | 2006-10-25 | 邱洁华 | 可调节空气综合质量的电子空调器 |
| US20080041066A1 (en) * | 2006-08-21 | 2008-02-21 | Chin-Kuang Luo | Air cooling/heating device |
| JP2008144991A (ja) * | 2006-12-06 | 2008-06-26 | Hitachi Appliances Inc | ヒートポンプ式空気調和機 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1078796A (zh) * | 1993-03-10 | 1993-11-24 | 吴祖发 | 半导体制冷冷热机 |
| CN1186570C (zh) * | 2003-03-28 | 2005-01-26 | 陈定弟 | 装有半导体制冷器的超声波空调扇 |
| KR100557982B1 (ko) * | 2004-01-14 | 2006-03-06 | 세실실업 주식회사 | 열전반도체를 이용한 에어컨 |
-
2009
- 2009-02-10 CN CN200980155731.0A patent/CN102301192B/zh not_active Expired - Fee Related
- 2009-02-10 WO PCT/CN2009/000143 patent/WO2010091531A1/zh active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1392372A (zh) * | 2002-07-02 | 2003-01-22 | 海尔集团公司 | 具有加湿功能的柜式空调器 |
| CN1851359A (zh) * | 2006-06-05 | 2006-10-25 | 邱洁华 | 可调节空气综合质量的电子空调器 |
| US20080041066A1 (en) * | 2006-08-21 | 2008-02-21 | Chin-Kuang Luo | Air cooling/heating device |
| JP2008144991A (ja) * | 2006-12-06 | 2008-06-26 | Hitachi Appliances Inc | ヒートポンプ式空気調和機 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8015724B2 (en) * | 2004-04-23 | 2011-09-13 | Panasonic Electric Works Co., Ltd. | Heating blower with electrostatic atomizing device |
| CN103791575A (zh) * | 2014-02-12 | 2014-05-14 | 丹东星光电器有限公司 | 电子空调式负离子加湿风扇 |
| CN106642371A (zh) * | 2016-09-30 | 2017-05-10 | 芜湖美智空调设备有限公司 | 空调器、空调器的壳体组件及壳体组件的装配方法 |
| CN106642372A (zh) * | 2016-09-30 | 2017-05-10 | 芜湖美智空调设备有限公司 | 用于桌面空调的壳体组件及桌面空调 |
| CN106642371B (zh) * | 2016-09-30 | 2022-08-02 | 芜湖美智空调设备有限公司 | 空调器、空调器的壳体组件及壳体组件的装配方法 |
| CN106642372B (zh) * | 2016-09-30 | 2022-08-02 | 芜湖美智空调设备有限公司 | 用于桌面空调的壳体组件及桌面空调 |
| EP3578889A4 (en) * | 2017-12-14 | 2020-12-23 | Chau, Siu Tai | SEMI-CONDUCTOR COOLING OR AIR CONDITIONING SYSTEM |
| CN110375408A (zh) * | 2019-08-19 | 2019-10-25 | 深圳市一粒创新设计有限公司 | 一种出风装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102301192B (zh) | 2013-04-17 |
| CN102301192A (zh) | 2011-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2010091531A1 (zh) | 半导体水雾式空调装置 | |
| JP5613155B2 (ja) | 直冷式空調システム及びそれに用いる熱交換天井板 | |
| CN103542467A (zh) | 空调冷凝水利用装置 | |
| WO2015158186A1 (zh) | 一种复合结构湿膜表冷器 | |
| CN110748963B (zh) | 空调器系统、空调及空调的控制方法 | |
| CN110748964B (zh) | 空调器系统、空调及空调的控制方法 | |
| CN101329098A (zh) | 利用超声波雾化技术的制冷制热双效空调系统 | |
| TW201610373A (zh) | 廚房空調 | |
| KR200423366Y1 (ko) | 실외기가 없는 이동식 냉온풍기 | |
| CN201909410U (zh) | 一种半导体空调器 | |
| CN105091094A (zh) | 恒湿空调机 | |
| CN101922769B (zh) | 水蒸发式环保制冷空调及其制冷方法 | |
| CN110454899A (zh) | 一种温度调节器 | |
| TW201024636A (en) | Semiconductor mist type air conditioning device | |
| CN216790414U (zh) | 一种混合制冷系统 | |
| JP2013087956A (ja) | 冷房装置及び垂直壁面熱交換器 | |
| CN205481611U (zh) | 冷却装置及具该冷却装置的空调 | |
| CN201448957U (zh) | 水蒸发式环保制冷空调 | |
| CN203907775U (zh) | 恒湿空调机 | |
| JP2001090990A (ja) | 除湿機 | |
| CN101782255A (zh) | 一种可调温冷风机 | |
| US20080283235A1 (en) | Apparatus and a method for cooling a condenser of an air conditioner | |
| CN201293412Y (zh) | 利用超声波雾化技术的制冷制热双效空调系统 | |
| CN106931565A (zh) | 冷却装置及具该冷却装置的空调 | |
| KR100896805B1 (ko) | 항온항습 기능을 갖는 증기식 공기조화기 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 200980155731.0 Country of ref document: CN |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09839854 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 09839854 Country of ref document: EP Kind code of ref document: A1 |