WO2010087539A1 - Système de connecteur pour dispositif d'essai de semi-conducteurs - Google Patents

Système de connecteur pour dispositif d'essai de semi-conducteurs Download PDF

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Publication number
WO2010087539A1
WO2010087539A1 PCT/KR2009/000495 KR2009000495W WO2010087539A1 WO 2010087539 A1 WO2010087539 A1 WO 2010087539A1 KR 2009000495 W KR2009000495 W KR 2009000495W WO 2010087539 A1 WO2010087539 A1 WO 2010087539A1
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WO
WIPO (PCT)
Prior art keywords
main body
connector system
connector
flexible
contact
Prior art date
Application number
PCT/KR2009/000495
Other languages
English (en)
Korean (ko)
Inventor
박준언
Original Assignee
Park Joon Eon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Park Joon Eon filed Critical Park Joon Eon
Priority to PCT/KR2009/000495 priority Critical patent/WO2010087539A1/fr
Publication of WO2010087539A1 publication Critical patent/WO2010087539A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/853—Fluid activated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits

Definitions

  • the present invention relates to a connector system for use in a semiconductor test apparatus for determining the quantity or failure of a device under test based on an output signal from a device under test obtained by providing a test signal to an IC or LSI, which is a device under test. More specifically, it is a structure in which the conductor portion to which the electrical connection is made is not exposed to the outside, and a restoring means such as a spring is not required, which simplifies the structure, facilitates manufacturing, reduces contact resistance, and reduces the exposure of the conductor portion.
  • the present invention relates to a connector system used in a semiconductor test apparatus in which impedance can be reduced because it can be minimized.
  • a semiconductor test apparatus applies an electrical signal, which is a test signal, to an IC or an LSI, which is a device under test (DUT), and operates on the basis of an output from the device under test generated by operation by the electrical signal. It is configured to pass or fail the test apparatus.
  • FIG. 1 schematically shows the structure of a semiconductor test apparatus according to the prior art to which the present invention can be applied.
  • the semiconductor test apparatus 1 includes a test head 10, a contact ring 40, a probe card 43, and a prober 70, as shown in FIG. 1.
  • the probe card 43 has a plurality of probe pins arranged in accordance with the arrangement of the electrode portions of the device under test 50, and is electrically connected to the device under test 50 through these probe pins.
  • the contact ring 40 is a mechanism in which a plurality of pogo pins 41 are formed on the surface and the back thereof so as to protrude elastically with springs. Is connected.
  • a first connector 150 (ZIF (Zero Insertion Force) Connector) is connected to the opposite surface of the contact ring 40 through the cable 30.
  • the test head 10 includes a plurality of pin electronics boards mounted on a plate, in addition to a circuit for generating an electrical signal applied to the device under test 50 and a plurality of LCD pin cards, to evaluate the device under test 50. Configuration.
  • the test head 10 is provided with a second connector 101 to connect with the first connector 150.
  • Reference numeral 60 in FIG. 1 shows a stage.
  • a performance board (not shown), which is a printed board connected to the test head 10 and the contact ring 40 and connected to the ZIF connector, may be installed and connected between the test head 10 and the contact ring 40. Since the contents are described in the related patents 10-0636303, detailed descriptions of the test head 10, the contact ring 40, and the performance board will be omitted.
  • the present invention relates to a connector system (ZIF (Zero Insertion Force) Connector System) used when connecting the test head 10 and the contact ring 40, or when a performance board is installed and connected. Explain with emphasis.
  • ZIF Zero Insertion Force
  • FIG. 2 is an enlarged partial perspective view of part A of FIG. 1
  • FIG. 3 is a partial cross-sectional perspective view of the second connector
  • FIGS. 4 and 5 are views for explaining the operation of the connector according to the prior art.
  • the connector system 100 used in the semiconductor test apparatus includes a first connector 150 connected to a cable 30 and a test head connected to the first connector 150. It consists of the 2nd connector 101 fixedly attached to the 10.
  • the first connector 150 includes a main body 151 to which the cable 30 is fixedly connected, and an inserting portion 161 having a pattern 171 made of a conductor on the outside thereof is formed in the main body (see FIG. 2). Extending downward from 151. In the main body 151, the conductor of the cable 30 and the pattern 171 are electrically connected to each other by soldering or the like.
  • the second connector 101 is coupled to each other by one or more coupling screws 102 and fixed fixing protrusions extending to be fixed to the test head 10 at the bottom thereof. It consists of a pair of body parts 110 having 117. In the main body 110, a guide groove 115, a sliding groove 113, and a fixing groove 111 are sequentially formed in the longitudinal direction from the top.
  • a guide member 125 having a partition wall 126 is inserted into the guide groove 115 at a predetermined interval in the longitudinal direction.
  • the pins 140 are installed to be electrically isolated from each other between the partition walls 126.
  • the sliding member 113 is provided with a sliding member 132 and the pressure block 131 is inserted.
  • the fixing groove 111 is provided with a plurality of pins 140 in opposite directions in which the fixing member 121 is inserted and inserted, and the spacer 123 is disposed between the pins 140 and the pins 140 facing each other. ) Is installed.
  • the pin 140 is generally made of copper.
  • the sliding member 132 is provided with a pull handle 133 to one side in order to slide the sliding member 132 in the sliding groove 113, as shown in FIG.
  • the sliding member 132 is alternately formed with a recess 134 and a protrusion 136.
  • the recess 133 and the protrusion 135 are sequentially formed in the direction in which the pressing block 131 is in contact with the sliding member 132.
  • the pressing block 131 is limited to the movement in the left and right directions in FIG. 4, and is movable only in the up and down direction, and the sliding member 132 is installed in a state capable of sliding left and right in FIG. 4. As shown in FIG.
  • the recess 134 of the sliding member 132 contacts the protrusion 135 of the pressing block 131
  • the protrusion 136 of the sliding member 132 is the recess of the pressing block 131.
  • reference numeral 13 denotes a fixing hole for fixing the second connector 101.
  • reference numeral 118 denotes a fastening hole formed in the fixing protrusion 117.
  • the pin 140 is in contact with the pattern 171 of the insertion portion 160 while the pin 140 is in contact with the pattern 11 of the test head 10 (contact at two points).
  • the resistance is large, and the exposed portions of the conductors (patterns 11, 171, and pin 140) are large in the state in which the connector system 100 is connected, so that impedance increase by exposure is essential, and the pattern 171 is always external Since the structure is exposed to the outside, there is a possibility of damage caused by contact with an external object, and a protrusion 141 having a spring-like structure must be formed in the pin 140 to prevent a poor contact of the contact portion 143 of the pin 140. Thus complicating the structure and manufacturing This was not easy issues.
  • the present invention has been proposed to solve the problems of the connector system used in the conventional semiconductor test apparatus as described above, by using a flexible PCB and using its own elasticity, by pressing a flexible spring with a flexible tube Good electrical contact can be made even when it is not provided or does not form a structure such as a protrusion, and it is easy to manufacture. Since the structure does not expose any conductor to the outside, damage of the conductor can be prevented, and even when repeated use It is an object of the present invention to provide a connector system for use in a semiconductor test apparatus that does not have this possibility.
  • the present invention includes a cable and a test head to connect the cable and the test head of the semiconductor test device for testing the device under test;
  • a first connector portion connected to the cable and a second connector portion fixed to the test head and connecting the first connector portion and the test head;
  • the first connector portion includes a plurality of main bodies to which the cables are fixedly installed, and a plurality of flexible PCs electrically connected to the cables and fixed to be in contact with each of the main bodies;
  • the second connector part provides a connector system for a semiconductor test apparatus, comprising a plurality of main body parts formed with installation grooves facing each other, and a plurality of tubes installed in the installation grooves of the main body part.
  • the main body of the first connector portion is provided with a contact surface that the flexible PCB contact, and one or more installation projections inserted into one or more installation holes formed in the flexible PCB to one side of the contact surface, a plurality of cable seating A cable groove is formed;
  • the flexible PC is provided with a plurality of installation holes to be inserted into the installation projections, a portion of one side of the flexible PC is installed in each main body while contacting the contact surface;
  • a first elastic body positioned between the flexible PCs and contacting a part of the flexible PCs to both sides to closely contact the flexible PCs to the contact surface; It provides a connector system for a semiconductor test device further comprises a plurality of coupling screws for coupling the plurality of the main body.
  • the main body has an inclined portion extending inclined in a direction away from the flexible PC, and a pressing portion extending from the inclined portion and the mounting groove is formed inward, the seating portion is in contact with the outside of the flexible PC
  • a connector system for a semiconductor test apparatus provided with an elastic body.
  • the present invention has a branching body is connected to the supply pipe to one side of the main body portion and the branch pipe is formed on both sides, and has an insertion tube into which one end of the tube provided in the installation groove is fitted, communicating with the insertion tube And a plurality of branch blocks having branched holes inserted into branch pipes of branch bodies between the main body portions;
  • a first gripping block having an embossed curved surface formed on both sides to press each tube inserted into the insertion tube to the body portion to prevent leakage between the insertion tube and the tube is adjacent to the branch block between the body portions.
  • a second holding block having a convex surface formed with a plurality of holding projections in both directions is provided between the main body portion;
  • the main body portion is provided with a connector system for a semiconductor test device is formed embossed gripping grooves corresponding to the convex surface.
  • the present invention is a plurality of upper grooves and lower grooves are formed in a direction facing the main body portion up and down the installation groove;
  • One or more protrusions are formed above and below the support block, the first gripping block, and the second gripping block, and each of the protrusions provides a connector system for a semiconductor test apparatus to be seated in the upper groove and the lower groove.
  • the present invention provides a connector system for a semiconductor test apparatus, wherein both sides of the main body protrude from the guide protrusion in the longitudinal direction, and both sides of the main body protrude from the guide part in which the guide groove is formed toward the main body.
  • the present invention provides a connector system for a semiconductor test apparatus having one or more contacts in each pattern in the pattern, wherein the contacts increase in thickness in an upward direction.
  • the electrical connection such as the patterns 271 and 11 provided in the test head 10 as well as the first connector 250 may be prevented. Because the structure is not exposed to the outside, there is no fear of contact with the outside of this object, there is no fear of damage caused by the contact, and because it is a structure that is electrically controlled using the elasticity of the flexible PC 270 itself, such as spring restoring It is not necessary to change the structure to provide a means or to generate a restoring force, so the structure is simple, the manufacturing is easy, the operation is improved, and the electrical contact part by the connector system 200 is made in only one part.
  • FIG. 1 is a schematic structural diagram showing a semiconductor test apparatus having a connector system according to the prior art.
  • FIG. 2 is a perspective view illustrating a connector system according to the related art, in which the 'A' part of FIG. 1 is enlarged.
  • FIG 3 is a cross-sectional perspective view showing a portion of a second connector in the connector system according to the prior art.
  • 4 and 5 are schematic diagrams for explaining the operation of the connector system according to the prior art.
  • FIG. 6 is an exploded perspective view of the connector system according to the present invention included in the semiconductor test apparatus, corresponding to FIG. 2.
  • FIG. 7 is a cross-sectional perspective view showing a portion of the first connector portion in the connector system of the present invention.
  • FIG. 8 is an exploded perspective view showing a part of the first connector portion shown in FIG. 7.
  • FIG. 9 is a sectional perspective view showing a part of a second connector portion in the connector system of the present invention.
  • FIG. 10 is an exploded perspective view of the second connector unit illustrated in FIG. 9.
  • 11 and 12 are cross-sectional views for explaining the operation of the connector system of the present invention.
  • FIG. 13 is an enlarged view of a portion A of FIG. 7.
  • second connector portion 210 main body portion
  • main body 263 inclined portion
  • first elastic body 283 second elastic body
  • FIG. 6 is an exploded perspective view of the connector system according to the present invention provided in the semiconductor test apparatus, and corresponds to FIG. 2.
  • FIG. 7 is a cross-sectional perspective view showing a part of the first connector part in the connector system of the present invention. 7 is an exploded perspective view showing a part of the first connector part shown in FIG. 7,
  • FIG. 9 is a cross-sectional perspective view showing a part of the second connector part in the connector system of the present invention, and
  • FIG. 10 is a second connector part shown in FIG. 9.
  • 11 and 12 are cross-sectional views for explaining the operation of the connector system of the present invention. 13 is an enlarged view of a portion A of FIG. 7.
  • the connector system 200 As shown in FIG. 6, the connector system 200 according to the present invention used in the semiconductor test apparatus functions to connect the first connector 250 and the first connector 250 to the test head 10. Consisting of a second connector portion 201.
  • the cable 30 is fixedly connected to the first connector 250 as in the related art, and the second connector 201 is fixed to the test head 10, but the present invention is not limited thereto. It is not intended to be connected to various connection parts to perform a connecting action.
  • the first connector part 250 is formed in a form in which two main bodies 260 are coupled to each other, and FIG. 6 illustrates a state in which the main body 260 is coupled to the coupling screw 251.
  • FIG. 6 illustrates a state in which the main body 260 is coupled to the coupling screw 251.
  • Detailed forms of the main body 260 may not be identical to each other, but may be formed without major differences in main functions and forms, and thus the same reference numerals are used.
  • a plurality of cable grooves 267 on which the cable 30 fixedly connected to the main body 260 is seated is formed on an upper portion of the main body 260, and one of the flexible PCs 270 is disposed below the cable grooves 267.
  • a contact surface 255 is formed to which part of the side contacts.
  • One or more installation protrusions 269 inserted into one or more installation holes 275 formed in the flexible PC 270 are protruded to one side of the contact surface 255.
  • the conductor of the cable 30 seated in the cable recess 267 is in contact with and electrically connected to the pattern 271 of the flexible PC 270 facing in the opposite direction of the contact surface 255.
  • the conductor of the cable 30 and the pattern 271 of the flexible PC 270 may be soldered to each other.
  • the flexible PC 270 may be fixed to the contact surface 255 by applying a double-sided tape or an adhesive to a portion of the flexible PC 270 in contact with the contact surface 255.
  • the pair of main bodies 260 to which the flexible PC 270 and the cable 30 are connected are oriented in a direction in which the patterns 271 of the flexible PC 270 face each other, and between the main bodies 260.
  • the first elastic bodies 281 are interposed therebetween.
  • 253 illustrates a screw hole for joining a pair of main bodies 260
  • 251 shows a coupling screw inserted into the screw hole
  • 252 shows a nut screwed to the coupling screw.
  • the main body 260 extends in the vertical direction perpendicular to the longitudinal direction, and is formed to be inclined in a direction away from the flexible PC 270 provided in the main body 260, and from the inclined part 263. It is preferable to have a pressing part 265 extending downward and having a seating groove 265a formed in a direction toward the flexible PC 270. In the state where the inclined portion 263 and the pressing portion 265 are provided, the second elastic body 283 is inserted into the mounting groove 265a.
  • the second elastic body 283 may be installed to be in contact with the flexible PCB 270, or may be installed to have a gap with the flexible PCB 270.
  • the flexible PC 270 is provided with the inclined portion 263 and the pressing portion 265 and the tube 231 is pressed through the pressing portion 265, the flexible PC 270 is evenly distributed along the length. It is possible to apply a distributed load. Therefore, a uniform pressure is generated between the conductor (for example, the pattern 11 of the test head 10 shown in FIG. 6) in contact with the contact 273 of the flexible PCB 270 pattern 271. In case of repeated use, there is no fear of poor contact.
  • reference numeral 261 denotes a guide protrusion extending in the longitudinal direction of the main body 260
  • 268 shows a coupling protrusion.
  • the second connector portion 201 includes two main body portions 210 coupled to each other, as shown in FIGS. 6, 9, and 10.
  • reference numeral 202 shows a coupling screw for coupling the main body 210.
  • the main body 210 has an installation groove 213 formed in the longitudinal direction, and has one or more fixing protrusions 217 formed in a direction perpendicular to the longitudinal direction.
  • the tube 231 is installed in the installation groove 213.
  • the tube 231 is preferably made of an elastic body such as silicone rubber.
  • One side of the body portion 210 between the body portion 210 has one side is connected to the supply pipe 232 is supplied with air and has a branch body 233 is formed with a branch pipe (233b) on both sides;
  • It has an insertion tube 235 is inserted into the inside of one end of the tube 231 provided in the installation groove 213, and communicates with the insertion tube 235 and the branch pipe 233b of the branch body 233 is inserted
  • Branch blocks 234 having branch holes 234b are installed between the main body 210.
  • reference numeral 233a illustrates a supply pipe connection part inserted into the supply pipe.
  • a structure such as an O-ring may be installed in the branch hole 234b to prevent leakage of air.
  • the branch block 234 is preferably formed as a pair of separate types to facilitate assembly as shown in FIG.
  • the surface of the insertion tube 235 is preferably formed in an embossed shape, as shown in Figure 10, the insertion tube 235
  • the first gripping block 236, which contacts the outer surface of the inserted tube 231 and has the concave curved surface 236a of the embossed surface on both sides, is adjacent to the branch block 234 between the main body 210. It is desirable to install.
  • the curved surface 236a and the main body 210 are pressurized from both sides to allow the insertion pipe 235 and It is possible to prevent the leakage of air between the tubes (231).
  • the second gripping block 237 is provided on the opposite side to which the branch block 234 is installed.
  • the second gripping block 237 is formed to be convex toward both sides of the main body 210, and has a plurality of gripping protrusions 237a on the convex surface.
  • the gripping groove 216 is formed in the body portion 210 corresponding to the convex surface. Therefore, while the second gripping block 237 is installed, the tube 231 is pressurized between the convex gripping protrusion 237a and the gripping groove 216 to block air leakage from the end of the tube 231.
  • a plurality of upper grooves 218a and lower grooves 218b are formed above and below the installation groove 213, and the branch block 234 is formed.
  • protrusions 234c, 236c, and 237b are formed on upper and lower portions of the first and second gripping blocks 236 and 237, respectively, and the protrusions 234c, 236c, and 237b are upper grooves 218a when assembled.
  • reference numeral 203 denotes a nut fastened to the coupling bolt
  • 205 denotes a coupling hole into which the coupling bolt is inserted
  • 211 a guide portion, and 211a, a guide protrusion 211 formed in the guide portion 211.
  • a guide groove for guiding 261 is shown
  • 212 is a bottom surface of the installation groove 213
  • 214 is a recess corresponding to the insertion tube 235.
  • the first connector part 250 is moved into the second connector part 201 in a state where air is not pressurized by the tube 231 of the second connector part 201 installed in the test head 10.
  • the inclined portion 263 and the pressing portion 265 of the first connector portion 250 are positioned between the tube 231 while being guided to the inner surface of the main body portion 210 of the second connector portion 201. .
  • the tube 231 expands in the same state as in FIG.
  • the pattern 271 of the flexible PC 270 and the pattern 11 of the test head 10 come into contact with each other and are electrically connected to each other by pushing 270.
  • the contact When air is discharged from the tube 231, the contact is terminated while restoring to the state as shown in FIG. As shown in FIGS. 11 and 12, when the tube 231 is contacted by pressurization and the air introduced into the tube 231 is discharged from the tube 231 after the termination, the contact is caused by the elasticity of the flexible PC 270. Since it is terminated, it is not necessary to have a spring-like configuration in order to terminate the contact, so that the structure is simple and the operation is assured.
  • the thicker the contact 273 provided in the pattern 271 can make the contact state better in relation to the contacting pattern 11.
  • the connector system 200 provided in the semiconductor test apparatus according to the present invention has a simple structure, is easy to manufacture, and improves reliability in operation, and the electrical contact portion by the connector system 200 is formed in only one part. As a result, contact resistance is reduced, and the external exposure distance of the pattern 271 is shortened at the time of connection by the first elastic body 281 provided between the flexible PCs 270, thereby reducing impedance due to exposure.

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Abstract

L'invention porte sur de connecteur (200) reliant un câble (30) à la tête d'essai (10) d'un dispositif d'essai de semi-conducteurs comprenant: une carte sonde (43) reliée électriquement au dispositif (50) à essayer, et un anneau collecteur (40) muni d'aiguilles Pogo, relié d'un côté à la carte sonde (43) et de l'autre côté au câble (30) pour être connecté électriquement à la tête d'essai (10), la tête d'essai (10) étant reliée à l'anneau collecteur (40) pour procéder à l'essai du dispositif (50) à essayer. Le système de connecteur évite le risque de contact avec des objets étrangers extérieurs et supprime le besoin d'une unité de rappel telle qu'un ressort, ou la nécessité de convertir système de connecteur en structure créant une force de rappel, puisque le système est commandé électriquement à l'aide de l'auto élasticité d'un PCB souple PCB (270), ce qui simplifie la structure, facilite la fabrication et améliore la fiabilité de fonctionnement. Ledit système a en outre pour effet: de réduire la résistance des contacts puisque seule une de ses parties est en contact électrique, de réduire l'impédance due à l'exposition, puisque la distance de l'exposition externe d'un motif (271) est raccourcie pendant la connexion, d'éliminer la possibilité d'une fuite d'air dans la partie en contact avec un tube (231), d'éliminer la possibilité d'une erreur due à la pression de l'air après assemblage. et d'éliminer la possibilité de déformation et d'erreur due à la pression de l'air.
PCT/KR2009/000495 2009-02-02 2009-02-02 Système de connecteur pour dispositif d'essai de semi-conducteurs WO2010087539A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2009/000495 WO2010087539A1 (fr) 2009-02-02 2009-02-02 Système de connecteur pour dispositif d'essai de semi-conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2009/000495 WO2010087539A1 (fr) 2009-02-02 2009-02-02 Système de connecteur pour dispositif d'essai de semi-conducteurs

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WO2010087539A1 true WO2010087539A1 (fr) 2010-08-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111067515A (zh) * 2019-12-11 2020-04-28 中国人民解放军军事科学院军事医学研究院 一种基于闭环控制技术的智能气囊头盔系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003123931A (ja) * 2001-10-17 2003-04-25 Sony Corp 電気的接続の良否確認方法、光学機器の検査方法及び検査システム、光学機器
KR100379593B1 (ko) * 1995-05-17 2003-09-29 에이티앤드티 아이피엠 코포레이션 커넥터모듈
KR20060046874A (ko) * 2004-11-12 2006-05-18 주식회사 세지 반도체 웨이퍼 검사기의 프로브장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100379593B1 (ko) * 1995-05-17 2003-09-29 에이티앤드티 아이피엠 코포레이션 커넥터모듈
JP2003123931A (ja) * 2001-10-17 2003-04-25 Sony Corp 電気的接続の良否確認方法、光学機器の検査方法及び検査システム、光学機器
KR20060046874A (ko) * 2004-11-12 2006-05-18 주식회사 세지 반도체 웨이퍼 검사기의 프로브장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111067515A (zh) * 2019-12-11 2020-04-28 中国人民解放军军事科学院军事医学研究院 一种基于闭环控制技术的智能气囊头盔系统
CN111067515B (zh) * 2019-12-11 2022-03-29 中国人民解放军军事科学院军事医学研究院 一种基于闭环控制技术的智能气囊头盔系统

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