WO2010052770A1 - Dispositif à semi-conducteurs - Google Patents

Dispositif à semi-conducteurs Download PDF

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Publication number
WO2010052770A1
WO2010052770A1 PCT/JP2008/070125 JP2008070125W WO2010052770A1 WO 2010052770 A1 WO2010052770 A1 WO 2010052770A1 JP 2008070125 W JP2008070125 W JP 2008070125W WO 2010052770 A1 WO2010052770 A1 WO 2010052770A1
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WO
WIPO (PCT)
Prior art keywords
external device
chip
processing unit
antenna
terminal
Prior art date
Application number
PCT/JP2008/070125
Other languages
English (en)
Japanese (ja)
Inventor
裕孝 西沢
浩典 岩崎
順 三宅
真一 深澤
環 和田
茂雅 塩田
秀雄 小池
Original Assignee
株式会社ルネサステクノロジ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ルネサステクノロジ filed Critical 株式会社ルネサステクノロジ
Priority to PCT/JP2008/070125 priority Critical patent/WO2010052770A1/fr
Publication of WO2010052770A1 publication Critical patent/WO2010052770A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10237—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves the reader and the record carrier being capable of selectively switching between reader and record carrier appearance, e.g. in near field communication [NFC] devices where the NFC device may function as an RFID reader or as an RFID tag
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/14—Details of telephonic subscriber devices including a card reading device

Definitions

  • the present invention relates to a technology for adding functions to mobile devices such as a mobile phone and a PDA (Personal Digital Assistant), and more particularly to a technology effective for improving communication quality in short-range wireless communication.
  • mobile devices such as a mobile phone and a PDA (Personal Digital Assistant)
  • PDA Personal Digital Assistant
  • an antenna coil is provided inside a SIM (Subscriber Identity Module) card.
  • SIM Subscriber Identity Module
  • a structure having a distance wireless communication function see Patent Document 1, an antenna coil provided in the cover portion of the mobile phone and the inside of the SIM card, and realizing a short distance wireless communication function by resonating with each other (patent)
  • a master IC card corresponding to a SIM card having a configuration in which an NFC chip and an antenna are mounted in an opening (space) for accommodating a second integrated circuit see Patent Document 3).
  • JP 2004-56413 A Japanese Patent Laid-Open No. 2003-223618 JP 2006-217586 A
  • An object of the present invention is to provide a technology capable of realizing stable and high communication quality when a short-range wireless communication function is added to a mobile device such as a mobile phone.
  • the present invention is a semiconductor device that is connected to an external device that communicates with another external device by transmitting and receiving a high-frequency signal, and adds a short-range wireless communication function to the external device.
  • the semiconductor device has a secure function of decrypting encrypted data received from a server and sending it to the external device, and encrypting unencrypted data received from the external device and sending it to the server
  • a short-range wireless communication function can be easily added to an external device.
  • FIG. 5 is a five-side view when the extension part of FIG. 1 is inserted into the SIM card socket part of FIG. 4.
  • FIG. 5 is a terminal layout diagram of the SIM card socket part of FIG. 4.
  • FIG. 2 is a connection diagram when the extension unit of FIG. 1 is connected to an external device via a SIM card.
  • FIG. 5 is an explanatory diagram illustrating a detailed example when the extension unit of FIG. 1 is connected to an external device via the SIM card socket unit of FIG. 4.
  • FIG. 3 is an equivalent circuit diagram of a general analog signal connection method examined by the present inventors.
  • FIG. 10 is an equivalent circuit diagram of the digital signal connection method of FIG. 9.
  • FIG. 5 is an explanatory diagram illustrating details when the extension unit of FIG. 1 is connected to an external device via the SIM card socket unit of FIG. 4.
  • FIG. 13 is an equivalent circuit diagram of the digital signal connection method of FIG. 12.
  • FIG. 9 is an explanatory diagram illustrating another example when the extension unit of FIG. 1 is connected to an external device via the SIM card socket unit of FIG. 4. It is a perspective view of the expansion part by Embodiment 2 of this invention.
  • FIG. 17 is a five-side view when the extension part of FIG. 16 is inserted into the SIM card socket part of FIG. 4.
  • FIG. 17 is a perspective view when the extension part of FIG. 16 is inserted into the SIM card socket part of FIG. 4.
  • FIG. 5 shows the expansion part by Embodiment 5 of this invention.
  • FIG. 16 is an explanatory diagram illustrating details of a communication state between the extension unit and the reader / writer illustrated in FIG. 15. It is a figure which shows the detail of the communication state between the expansion part of FIG. 22, and a reader / writer. It is a perspective view of the expansion part by Embodiment 6 of this invention.
  • FIG. 26 is a perspective view of the extended portion of FIG. 25. It is a perspective view of the expansion part by Embodiment 7 of this invention.
  • FIG. 28 is a perspective view of the extension part of FIG. 27. It is a 5th page figure of the expansion part by Embodiment 8 of this invention. It is explanatory drawing which shows the detail of the main surface side before the expansion part of FIG. 29 is inserted in a SIM card socket part.
  • FIG. 16 is an explanatory diagram illustrating details of a communication state between the extension unit and the reader / writer illustrated in FIG. 15. It is a figure which shows the detail of the communication state between the expansion part of FIG. 22, and a reader
  • FIG. 30 is a five-side view of the semiconductor device when the extension portion of FIG. 29 is inserted into the SIM card socket portion.
  • FIG. 30 is a perspective view of the semiconductor device when the extension part of FIG. 29 is inserted into the SIM card socket part.
  • It is explanatory drawing which shows the detail of the back surface side before the expansion part of FIG. 29 is inserted in a SIM card socket part.
  • It is explanatory drawing which shows an example when the external apparatus with which the semiconductor device by Embodiment 9 of this invention is integrated performs near field communication with a reader / writer.
  • It is explanatory drawing which shows an example when the external apparatus with which the semiconductor device by Embodiment 10 of this invention is integrated performs near field communication with a reader / writer.
  • FIG. 1 is a five-side view of an extension portion according to Embodiment 1 of the present invention
  • FIG. 2 is a perspective view of the extension portion of FIG. 1
  • FIG. 3 is a perspective view of the extension portion of FIG. 1
  • FIG. FIG. 5 is an external view of the SIM card socket unit according to the first embodiment of the invention
  • FIG. 5 is an explanatory diagram showing details of a process of inserting the expansion card of the expansion unit of FIG. 1 into the SIM card socket unit
  • FIG. FIG. 7 is a terminal layout diagram of the SIM card socket part of FIG. 4
  • FIG. 8 is a diagram of the SIM card socket part when the extension part is inserted into the SIM card socket part of FIG.
  • FIG. 1 is a five-side view of an extension portion according to Embodiment 1 of the present invention
  • FIG. 2 is a perspective view of the extension portion of FIG. 1
  • FIG. 3 is a perspective view of the extension portion of FIG. 1
  • FIG. 5 is an external view of the
  • FIG. 9 is an explanatory diagram showing a detailed example when the extension unit of FIG. 1 is connected to the external device via the SIM card socket unit of FIG. 4, and FIG. Is an equivalent circuit diagram of a general analog signal connection method investigated by the present inventors, and FIG. 12 is an equivalent circuit diagram of the digital signal connection method, FIG. 12 is an explanatory diagram showing details when the extension part of FIG. 1 is connected to an external device via the SIM card socket part of FIG. 4, and FIG. FIG. 14 is an explanatory diagram showing another example when the extension part of FIG. 1 is connected to an external device via the SIM card socket part of FIG.
  • the semiconductor device includes an extension part A shown in FIG. 1 and a SIM card socket part 14 shown in FIG.
  • the expansion unit A includes a SIM card tray 2 and an expansion card 3.
  • the SIM card tray 2 has the same outer shape as the card tray for storing the SIM card provided in the external device H (FIG. 8) which is a mobile device such as a mobile phone or a PDA (Personal Digital Assistant). .
  • the external device H communicates with other external devices such as a base station, a server, a mobile phone, and a PDA by transmitting and receiving a high-frequency signal.
  • the expansion card 3 includes a semiconductor chip, a component, and the like for expanding the function in an external device that does not have a near field communication (NFC) function.
  • NFC near field communication
  • the SIM card stored in the SIM card tray 2 is a contractor that is used to identify a user by inserting it into a mobile phone of a system such as GSM (Global System for Mobile Communications) or W-CDMA (Wideband-Code Division Multiple Access).
  • GSM Global System for Mobile Communications
  • W-CDMA Wideband-Code Division Multiple Access
  • This is an IC card on which information is recorded. Even if different types of telephones are used, a common IC card can be replaced and used so that telephone numbers and billing information can be used as they are.
  • the ID-000 format of 15 mm x 25 mm x 0.76 mm is used for the external dimensions of the SIM card. That is, the planar dimensions are 15 mm ⁇ 25 mm, and the thickness is about 0.76 mm.
  • External interface terminals (hereinafter simply referred to as “ISO terminals”) defined by ISO / IEC 7816-3 terminal positions and functional standards are arranged on the surface.
  • the SIM card tray 2 is formed of a substantially frame-like rectangle, and a frame-like frame 4 is formed.
  • a guide portion 5 for placing a SIM card socket portion 14 (FIG. 4) described later is formed on the inner peripheral portion of the frame 4.
  • the guide part 5 supports the back surface of the SIM card socket part 14, and the frame 4 is configured to hold the side surface of the SIM card socket part 14.
  • a protrusion 6 is formed at any one corner portion of the frame 4 to prevent erroneous insertion of the SIM card socket portion 14 such as front-back inversion or front-back inversion.
  • a substantially rectangular expansion card 3 is provided so as to extend from one short side of the frame-shaped SIM card tray 2 toward the center of the SIM card tray 2.
  • the short side portion of the SIM card tray 2 in which the expansion card 3 extends becomes a handle portion 2a, which becomes a handle when the semiconductor device is taken in and out of the external device H.
  • SIM card tray 2 is often made of plastic or thermoplastic resin. In order to increase the strength, glass fiber or the like may be mixed.
  • the extension card 3 is provided with a rectangular wiring board 7 as shown in FIG.
  • the wiring pattern of the wiring board 7 is formed of copper (Cu) or the like.
  • a plurality of external terminals 8 serving as first terminals are formed on both the main surface and the back surface of the wiring substrate 7 in the vicinity of the two long sides of the wiring substrate 7.
  • the external terminals 8 are provided on both surfaces, but may be provided on only one of the surfaces.
  • the external terminal 8 is electrically connected to the above-described wiring pattern and is often formed of the same copper (Cu) as the wiring pattern.
  • gold (Au) plating or the like is often performed on copper (Cu) via nickel (Ni).
  • the arrangement direction of the external terminals 8 here is the same as the insertion direction when the expansion card 3 is inserted into the SIM card socket section 14.
  • the external terminal 8 becomes a terminal that is electrically connected to a socket terminal 18 described later of the SIM card socket unit 14.
  • a semiconductor chip 9 is mounted on the main surface of the wiring board 7.
  • a plurality of electrode portions that are electrically connected to the wiring pattern are formed in the peripheral portion on the main surface of the semiconductor chip 9. These electrode portions and the pad portions formed on the semiconductor chip 9 are electrically connected via bonding wires 10 made of a material such as gold (Au), copper (Cu), or aluminum (Al).
  • bonding wires 10 made of a material such as gold (Au), copper (Cu), or aluminum (Al).
  • passive components such as a chip capacitor 11 and a chip resistor 12 for tuning are also mounted. These passive components are also electrically connected to the electrode portions formed on the main surface of the wiring substrate 7 via solder, conductive paste, or the like.
  • an antenna 13 formed by spiraling the wiring pattern is provided on the main surface of the wiring board 7.
  • the antenna 13 is shown as being formed by the wiring pattern of the wiring board 7.
  • the antenna 13 may be a structure in which a suitable wire (metal wire) is spirally soldered to the wiring of the wiring board 7. Good.
  • the semiconductor chip 9 mounted on the main surface of the wiring board 7 is a non-contact card RF chip and an NFC chip integrated into one chip here.
  • the non-contact card RF chip converts a digital signal received from an NFC chip into an analog signal and sends it to another external device via an antenna. Also, an analog signal received from another external device via an antenna is converted into a digital signal and sent to the NFC chip.
  • the RF chip for contactless card can be said to be a high-frequency processing unit for performing analog / digital conversion of data transmitted / received via an antenna.
  • the NFC chip is for performing a non-encryption process on data encrypted according to the short-range wireless communication standard received from the RF chip for contactless cards. Further, the non-encrypted data is encrypted according to the short-range wireless communication standard and sent to the RF chip for contactless card.
  • the NFC chip is a wireless communication processing unit that performs encryption and non-encryption processing according to the short-range wireless communication standard for data transmitted and received with the RF chip (high frequency processing unit) for contactless cards.
  • the semiconductor chip 9, the antenna 13, the chip capacitor 11, the chip resistor 12, and the external terminal 8 are electrically connected through the wiring pattern of the wiring board 7. Further, the main surface of the wiring board 7 on which the semiconductor chip 9, the antenna 13, the chip capacitor 11, and the chip resistor 12 are mounted is made of a material such as a curable epoxy resin so that the external terminals 8 are exposed, It is sealed by a sealing portion X formed by a molding method or the like. The semiconductor chip 9, the antenna 13, and the like are protected from external electrical and mechanical impacts by the sealing portion X.
  • FIG. 4 is an external view of the SIM card socket unit 14.
  • the outer shape of the SIM card socket unit 14 is the same as that of the SIM card. That is, the planar dimensions are 15 mm ⁇ 25 mm, and the thickness is about 0.76 mm.
  • the main surface of the SIM card socket portion 14 has a card slot 15 into which the expansion card 3 is inserted, and guide portions 16 are formed at both ends thereof. Yes.
  • the guide portion 16 has a “U” shape in cross section.
  • the guide portion 16 has a role of smoothly inserting the card when the expansion card 3 is inserted into the card slot 15 of the SIM card socket portion 14 and a role of holding the outer peripheral edge portion of the expansion card 3 from the vertical direction after the insertion. Have.
  • a plurality of openings 17 are provided in the peripheral part of the guide part 16, and socket terminals 18 serving as second terminals are respectively arranged in the openings 17. These socket terminals 18 are respectively connected to the external terminals 8 of the expansion card 3 when the SIM card socket part 14 is mounted on the SIM card tray 2.
  • the socket terminal 18 is made of, for example, a U-shaped metal member, and has a structure in which the external terminal 8 of the expansion card 3 is sandwiched vertically. A notch 19 is formed at an optional corner near the socket terminal 18. Further, the upper end of the socket terminal 18 has the same height as the surface of the SIM card socket portion 14 or a height less than that.
  • a SIM secure chip having a secure function used for, for example, a SIM card is incorporated in a thick portion where the expansion card 3 is not inserted.
  • an ISO terminal 20 having eight terminals is arranged on the back surface of the SIM card socket section 14.
  • the arrangement position of the ISO terminal 20 with respect to the SIM card socket 14 is the same as that of the standardized SIM card.
  • FIG. 5 is a diagram showing details of the process of inserting the expansion card 3 into the SIM card socket unit 14.
  • the expansion card 3 When the expansion card 3 is inserted into the SIM card socket part 14, as shown in FIG. 5A, the shape of the notch 19 of the SIM card socket part 14 and the protrusion 6 of the SIM card tray 2 is matched. Insert into. As a result, as shown in FIG. 5B and FIG. 6, after insertion, the external terminal 8 of the expansion card 3 is connected so as to be sandwiched between the U-shaped socket terminal 18.
  • an opening Z is provided on the back surface of the SIM card tray 2 so that the ISO terminal 20 formed on the back surface of the SIM card socket portion 14 is exposed. Since the ISO terminal 20 is exposed from the opening Z, the corresponding terminal provided in the external device H and the ISO terminal 20 can be electrically connected.
  • the semiconductor device 1 has a structure in which the SIM card socket portion 14 on which the SIM secure chip is mounted and the extension portion A having a short-range wireless communication function can be separated (detached).
  • the function can be easily added (retrofitted) to the external apparatus H that does not have the distance wireless communication function by the following method.
  • the external device H is used in combination with the tray attached to the external device H and the SIM card socket unit 14 in which a blank card (hole filling card) is inserted.
  • the tray attached to the external device H is replaced with the extension part A having the same outer shape, and the extension part A is inserted into the SIM card socket part 14 from which the blank card is removed.
  • FIG. 7 is an explanatory diagram showing an example of terminal arrangement in the SIM card tray 2 in which the SIM card socket unit 14 is mounted.
  • the clock terminal MMC_CLK In the socket terminal 18 on the main surface of the SIM card tray 2, the clock terminal MMC_CLK, the input / output terminal I / O, the clock terminal CLK, the USB terminal USB (D +), from the upper side to the lower side on the left side in FIG. And a USB terminal USB (D-) is arranged.
  • the clock terminal MMC_CLK is a clock signal of an MMC (MultiMedia Card) interface that is a communication interface, and the input / output terminal I / O is a terminal for a serial data signal.
  • the clock terminal is a clock signal terminal for the CLK wave generator, and the USB terminal USB (D +) and the USB terminal USB (D ⁇ ) are terminals for USB (Universal Serial Bus) communication signals.
  • a command terminal MMC_CMD a data terminal MMC_DATA, a reset terminal RES, a ground terminal VSS, and a power supply terminal VCC are arranged from the upper side to the lower side on the right side in FIG.
  • the command terminal MMC_CMD is a command signal terminal in the MMC interface
  • the data terminal MMC_DATA is a data signal terminal of the MMC interface.
  • the reset terminal RES is a reset signal terminal
  • the ground terminal VSS is a terminal connected to a reference potential.
  • a power supply voltage is supplied to the power supply terminal VCC.
  • terminals C1 to C4 are arranged from the lower left to the right in FIG. 7B, and above these terminals C1 to C4, the left to the right Terminals C5 to C8 are arranged.
  • the terminal C1 is a power supply terminal to which the power supply voltage VCC is supplied, and the terminal C2 is a reset signal terminal.
  • the terminal C3 is a synchronous clock signal terminal, and the terminal C4 is a USB (D +) communication signal terminal.
  • the terminal C5 is a terminal connected to the reference potential VSS, and the terminal C6 is a terminal for a SWP (Single Wire Protocol) interface that is a communication interface.
  • the terminal C7 is a serial data signal terminal, and the terminal C8 is a USB (D ⁇ ) communication signal terminal.
  • the clock terminal MMC_CLK, the command terminal MMC_CMD, and the data terminal MMC_DATA are examples in which an expansion card interface is realized by having an MMC interface in addition to the ISO7816 interface.
  • FIG. 8 is a connection diagram illustrating an example of a connection relationship with the expansion unit A, the SIM card socket unit 14, and the external device H.
  • the external device H includes mobile devices such as a mobile phone and a PDA, and includes the mobile RF unit 23 and the host MPU 21.
  • the portable RF unit 23 performs high-frequency power amplification for outputting a high-frequency signal for performing wireless communication via the antenna, signal processing for transmitting a signal received from the antenna by wireless communication to the host MPU 21, and the like.
  • the host MPU 21 is connected to the portable RF unit 23, and performs processing of signals sent from the portable RF unit 23 and signals sent to the portable RF unit 23. Further, although not shown, the host MPU 21 is often connected to a memory and other functional units. The host MPU 21 manages all control in the external device H.
  • the host MPU 21 provided in the external device H and the SIM secure chip 22 of the SIM card socket unit 14 are connected via terminals C1 to C3, C5, and C7 (FIG. 7). Since the terminals C4, C6 and C8 are optional, FIG. 8 shows an example in which they are not connected.
  • the SIM secure chip 22 decrypts the encrypted data received from the server and sends it to the host MPU 21 and the NFC chip 9a.
  • unencrypted data received from the host MPU 21 or the NFC chip 9a is encrypted and sent to the server.
  • the SIM secure chip is a SIM secure processing unit.
  • the ISO terminal 22 may be connected to a memory or the like in the external device H.
  • the system may be configured using optional terminals as necessary.
  • the external device H is not limited to a so-called mobile phone or PDA, but may refer to the host MPU 21 or a memory.
  • the SIM secure chip 22 in the SIM card socket section 14 and the NFC chip 9a in the semiconductor chip 9 are a power terminal VCC, a ground terminal VSS, a reset terminal RES, a clock terminal CLK, an input / output terminal I / O at the socket terminal 18.
  • a clock terminal MMC_CLK is connected through a clock terminal MMC_CLK, a data terminal MMC_DATA, and a command terminal MMC_CMD.
  • the NFC chip 9a is connected to the RF chip 9b for contactless card, and the antenna 13 is connected to the RF chip 9b for contactless card.
  • a chip capacitor 11 that is a tuning capacitor is connected to both ends of the antenna 13.
  • the NFC chip 9a receives the data from the contactless card RF chip 9b and processes the data encrypted according to the short-range wireless communication standard. Further, the non-encrypted data is encrypted in accordance with the short-range wireless communication standard and sent to the non-contact card RF chip 9b.
  • the power supply to the NFC chip 9a and the RF chip 9b for contactless card is performed via the ISO terminal 20 and the SIM secure chip 22 as shown in FIG. ), Or a power supply bus common to the SIM secure chip 22 may be provided, and power may be directly supplied from the power supply bus.
  • the power supply to the NFC chip 9a and the contactless card RF chip 9b may be managed by, for example, the SIM secure chip 22.
  • the power supply to the NFC chip 9a and the RF chip 9b for contactless card is stopped, or the minimum that can immediately respond to the short-range wireless communication operation By supplying only power, it is possible to achieve low power consumption of the external device H and long battery life.
  • the host MPU 21 may perform power management. Since power management including the SIM secure chip 22 can be performed, the power consumption of the external device H can be further reduced and the battery length can be reduced compared to the case where power management is performed using the SIM secure chip 22 described above. Life expectancy can be realized.
  • FIG. 9 is a block diagram when the semiconductor device 1 is mounted on the external device H.
  • the host MPU 21 of the external device H and the SIM card socket unit 14 of the semiconductor device 1 are connected via an ISO terminal 20.
  • the separation between the extension part A and the SIM card socket part 14 is performed between the SIM secure chip 22 and the NFC chip 9a of the semiconductor device 1.
  • FIG. 10 is an equivalent circuit diagram of a general antenna connection method.
  • an analog connection method is often used in which separation is performed between the antenna unit 50 that transmits and receives analog signals and the RF chip 51 for contactless cards.
  • the antenna unit 50 and the non-contact card RF chip 51 are connected via, for example, a connector.
  • the structure which connects the LC resonance circuit which comprises the antenna part 50 via a connector etc. as mentioned above. Therefore, the resonance frequency shift due to the stray capacitance Cs or the like of the connection portion in the connector and the capacitance value decrease due to the contact resistance Rs of the connector are likely to occur, often resulting in a decrease in communication quality.
  • the present invention is configured to separate between the NFC chip 9a and the SIM secure chip 22 as shown in the equivalent circuit diagram of FIG. Since the signal transmitted / received between the NFC chip 9a and the SIM secure chip 22 is a digital signal, the present invention can be said to be a digital connection system in contrast to the analog connection system described above.
  • the LC resonance circuit constituting the antenna is integrated with the antenna 13, the NFC chip 9a, and the RF chip 9b for contactless cards. Turn into. For this reason, the influence of the stray capacitance Cs and the contact resistance Rs generated at the connection portion of the connector is less than or equal to the threshold value of the digital signal. Therefore, the influence on the communication quality compared to the analog connection method. Will be less.
  • the present invention of the digital system that separates between the NFC chip 9a and the SIM secure chip 22 is compared with the analog connection system that separates between the antenna unit 50 and the RF chip 51 for contactless cards. Since it is less affected by stray capacitance Cs and contact resistance Rs generated at the connector connection, communication quality can be improved.
  • the expansion card 3 is inserted into the SIM card socket portion 14.
  • it may be mounted on the main surface of the wiring board 7 so as to be sandwiched between the SIM secure chip 22 in the SIM card socket portion 14 and the antenna 13.
  • the semiconductor chip 9 is mounted on the main surface of the wiring board 7 so that the area that controls the function of the NFC chip 9a is closer to the SIM secure chip 22 than the area that controls the function of the RF chip 9b for contactless cards. Good. By doing so, the flow of data transmitted and received in the semiconductor chip 9 and the mounting direction of the semiconductor chip 9 can be aligned.
  • the configuration for separating the NFC chip 9a and the SIM secure chip 22 shown in FIG. 11 has been described.
  • the NFC chip 9a and the contactless card RF chip 9b may be separated. By doing so, the mounting area of the NFC chip 9a becomes unnecessary, and the expansion card 3 can be made smaller.
  • the contact card RF chip 9b is provided in the expansion card 3 of the SIM card tray 2, and the SIM card socket unit 14 includes the SIM secure chip 22 and the NFC chip 9a.
  • the SIM secure chip 22 and the NFC chip 9a may be a single chip.
  • the influence of the stray capacitance Cs, the contact resistance Rs, etc. generated in the connection portion of the connector is Since the influence is less than the threshold value of the digital data, the influence on the communication quality is reduced as compared with the analog connection method as in the case of FIG.
  • the antenna 13 is formed on the wiring board 7 .
  • the antenna 13 is configured to be provided outside the semiconductor device 1 as shown in FIG. You may make it provide as.
  • the antenna size can be made larger than that provided in the external device H, so that transmission / reception sensitivity can be improved.
  • a semiconductor device that adds a short-range wireless communication function to an external device includes an NFC chip for extending the short-range wireless communication function, an RF chip for a contactless card, and an extension unit including an antenna; It is a structure that can be separated (detached) from a SIM card socket on which a SIM secure chip is mounted.
  • the external device is used in combination with the tray attached to the external device and the SIM card socket in which the blank card is inserted while the short-range wireless communication function is not required.
  • the tray attached to the external device is replaced with the extension portion of the present invention having the same outer shape, and this extension portion is attached to the SIM card socket portion from which the blank card is removed.
  • the inserted semiconductor device can be attached to an external device. Accordingly, the function can be easily added to an external device that does not have the short-range wireless communication function.
  • NFC chip 9a that transmits and receives data using a digital signal and the SIM secure chip 22 are separated (detached).
  • the influence of the stray capacitance Cs, the contact resistance Rs, etc. generated in the connection portion of the connector provided in the detachable portion becomes (becomes considered) below the threshold value of the digital signal. Compared to the above, the influence on the communication quality can be reduced.
  • the shape of the SIM card tray 2 of the semiconductor device has been described with respect to the shape shown in FIGS. 1 and 2, but can be variously changed according to the design of each external device.
  • the features related to the antenna arrangement and the like may be applied to an integrated type instead of the extension unit and the SIM card socket unit described here. The same applies to embodiments described later.
  • FIG. 15 is a perspective view of the extension according to the second embodiment of the present invention.
  • the difference between the extended portion of the semiconductor device in the second embodiment of the present invention and the first embodiment is that two semiconductor chips, an NFC chip 9a and a non-contact card RF chip 9b, are mounted on the main surface of the wiring board 7.
  • the structure of the antenna 13 is changed.
  • the chip size is small and the area of the main surface of the wiring board 7 has a sufficient margin, two semiconductor chips may be mounted in this way.
  • the antenna 13 according to the second embodiment is configured to be housed in the handle 2a (FIG. 1) of the SIM card tray 2.
  • the antenna 13 includes a ferrite core 13a and a coil 13b.
  • the ferrite core 13a has a quadrangular prism shape, and a coil 13b is wound around the short side of the ferrite core 13a.
  • the number of turns of the coil 13b is determined in consideration of inductance and the like.
  • the coil 13b is fixed to the wiring board 7 with solder, conductive paste, or the like, and is electrically connected to the RF chip 9b for non-contact card.
  • the antenna 13 is arranged in a direction away from the internal circuit of the external device H, so that the high speed transmitted in the internal circuit is high. It can be made less susceptible to noise from various signals and clocks, and communication sensitivity can be improved.
  • the NFC chip 9a is more secure than the non-contact card RF chip 9b in the SIM secure chip 22 in the SIM card socket section 14. It is arranged on the main surface of the wiring board 7 so as to be close to. By doing so, the flow of data transmitted and received in the SIM secure chip 22, the NFC chip 9a, the contactless card RF chip 9b, and the antenna 13 and the arrangement of each mounted component coincide with each other. Can be shortened.
  • FIG. 3 is a five-side view of the extension unit according to the third embodiment of the present invention
  • FIG. 17 is a perspective view of the extension unit of FIG. 16
  • FIG. 18 is an extension unit of FIG. 16 inserted into the SIM card socket unit.
  • FIG. 19 is a perspective view when the extension part of FIG. 16 is inserted into the SIM card socket part.
  • the difference of the semiconductor device 1 of the third embodiment from the first embodiment is that the mounting position of the expansion card 3 mounted on the SIM card tray 2 is different.
  • the expansion card 3 of the semiconductor device 1 according to the third embodiment is provided on the short side facing the short side of the frame 4 on which the protrusions 6 are provided. Therefore, the insertion direction of the expansion card 3 with respect to the SIM card socket portion 14 is the opposite direction to that of the first embodiment. That is, the expansion card 3 is a card that is inserted into the SIM card socket portion 14 at the short side of the projection 6 of the frame 4 and extends to the short side opposite to the short side of the projection 4 of the frame 4. Will be inserted.
  • the insertion direction of the expansion card 3 into the SIM card socket unit 14 may be determined in consideration of the arrangement of the semiconductor chip, the structure of the antenna 13, and the like.
  • FIG. 20 is an explanatory diagram showing a process in which the semiconductor device according to the fourth embodiment of the present invention is inserted into the mobile phone
  • FIG. 21 is a diagram when the semiconductor device according to the fourth embodiment of the present invention is inserted into the mobile phone. It is explanatory drawing which shows another example.
  • the semiconductor device 1 described in the first to third embodiments is inserted into, for example, the mobile phone 24 serving as the external device H will be described.
  • the semiconductor device 1 has an outer shape so as to be mounted in a SIM card tray slot 25 provided in a mobile phone. Then, as shown in FIG. 20B, the semiconductor device 1 is inserted into the SIM card tray slot 25, and the semiconductor device 1 is mounted into the SIM card tray slot 25 of the mobile phone 24.
  • the short-range wireless communication function can be added without changing the appearance of the mobile phone 24.
  • the antenna 13 is provided at a position close to the handle portion 2a, that is, away from the internal circuit of the mobile phone 24, radio waves transmitted and received from the antenna 13 during communication are transmitted through the internal circuit. Can be made less susceptible to noise from high-speed signals and clocks.
  • FIG. 21 it is good also as a structure which makes the handle part 2a project from the mobile telephone 24. Compared with the case where the projection is not performed, the distance is further away from the internal circuit, so that it is possible to reduce the influence of noise received from high-speed signals and clocks transmitted through the internal circuit.
  • the structure shown in FIG. 21 is more effective in improving the sensitivity in the case of the structure in which the antenna 13 is housed in the handle portion 2a of the SIM card tray 2 (FIG. 15).
  • FIG. 5 is a perspective view of the extension unit according to the fifth embodiment of the present invention
  • FIG. 23 is an explanatory diagram showing details of a communication state between the extension unit and the reader / writer shown in FIG. 15, and FIG. It is a figure which shows the detail of the communication state between an extension part of this and a reader / writer.
  • the difference between the semiconductor device of the fifth embodiment and the second embodiment is that the coil 13b is wound in the short side direction of the ferrite core 13a constituting the antenna 13 as shown in FIG.
  • the coil 13b is wound around the longitudinal direction of the ferrite core 13a.
  • the chip capacitor 11 and the chip resistor 12 are respectively mounted on the main surface of the wiring board 7 and sealed by the sealing portion X, but they are housed in the handle portion 2a together with the antenna 13. It has been.
  • the semiconductor chip 9 mounted on the main surface of the wiring board 7 is an NFC chip and a non-contact card RF chip formed into one chip, and is sealed by a sealing portion X.
  • Other configurations are the same as those in FIG. 15 of the second embodiment.
  • FIG. 23 is an explanatory diagram showing an example of a communication state between the antenna 13 and the reader / writer RW when the coil 13b is wound in the short side direction of the ferrite core 13a (Embodiment 2).
  • These are explanatory drawings showing an example of a communication state between the antenna 13 and the reader / writer RW when the coil 13b is wound in the long side direction of the ferrite core 13a.
  • communication is performed by electromagnetic induction between an antenna 13 provided on the SIM card tray 2 and an antenna unit ANT provided on the reader / writer RW.
  • the magnetic field lines J generated by electromagnetic induction pass through the center of the ferrite core 13a, that is, the coil 13b wound in the short side direction.
  • FIG. 25 is a perspective view of the extension part according to the sixth embodiment of the present invention
  • FIG. 26 is a perspective view of the extension part of FIG.
  • the antenna 13 is disposed at or near the handle portion 2a of the SIM card tray 2 has been described.
  • the antenna 13 is disposed outside the SIM card tray 2. Shall be provided.
  • the handle portion 2a in the SIM card tray 2 is provided with an antenna storage portion 26 as shown in FIG.
  • the antenna housing portion 26 is formed of a plate-like rectangle, is made of the same material as the SIM card tray 2 (for example, plastic or thermoplastic resin), and is often integrally molded.
  • a coil 13b is formed inside the antenna housing portion 26, and the coil 13b is electrically connected to the wiring board 7 by, for example, solder or conductive paste.
  • the area (area) through which the magnetic lines of force pass becomes larger than when the antenna 13 is provided inside the SIM card tray 2.
  • communication sensitivity can be improved.
  • FIG. 27 is a perspective view of the extension portion according to the seventh embodiment of the present invention
  • FIG. 28 is a perspective view of the extension portion of FIG.
  • the antenna 13 has an antenna coil 28 formed on a film substrate (flexible substrate) 27 such as a polyimide material or a PET (Polyethylene Terephthalate) material by wiring made of, for example, copper (Cu). It is the structure of the formed film antenna.
  • a film substrate flexible substrate
  • PET Polyethylene Terephthalate
  • the wiring board 7 is electrically connected by, for example, a conductive film such as ACF (Anisotropic Conductive Film) or a conductive paste such as ACP (Anisotropic Conductive Paste).
  • a conductive film such as ACF (Anisotropic Conductive Film) or a conductive paste such as ACP (Anisotropic Conductive Paste).
  • the antenna 13 composed of a film antenna is thin and flexible, and can be bent freely.
  • the antenna 13 can be used by being attached to the casing of a mobile phone or sandwiched between a battery and a casing cover. can do.
  • FIG. 29 is a five-side view of the extension unit according to the eighth embodiment of the present invention
  • FIG. 30 is an explanatory view showing details of the main surface side before the extension unit of FIG. 29 is inserted into the SIM card socket unit
  • 31 is a five-side view of the semiconductor device when the extension portion of FIG. 29 is inserted into the SIM card socket portion
  • FIG. 32 is a perspective view of the semiconductor device when the extension portion of FIG. 29 is inserted into the SIM card socket portion.
  • FIGS. 33A and 33B are explanatory diagrams showing details on the back side before the extension part of FIG. 29 is inserted into the SIM card socket part.
  • the difference of the semiconductor device 1 in the eighth embodiment from the first embodiment is that an external terminal 8 is provided on the back surface of the expansion card 3 as shown in FIG.
  • the external terminal 8 is provided in the vicinity of the short side of the wiring board 7 facing the handle portion 2a on the back side of the expansion card 3. Accordingly, the socket terminal 18 of the SIM card socket portion 14 is formed near one short side of the SIM card socket portion 14 as shown in FIG. 30, and the SIM card socket portion 14 is attached to the expansion portion A. In this case, as shown in FIGS. 31 and 32, the external terminal 8 of the expansion card 3 and the socket terminal 18 of the SIM card socket section 14 are electrically connected to each other.
  • FIG. 33 is the same as the arrangement shown in FIG. 4 of the first embodiment.
  • the external terminals 8 on the back surface of the expansion card 3
  • the terminals arranged on the main surface of the wiring board 7 are eliminated, so that the mounting area for mounting the semiconductor chip and components can be expanded.
  • FIG. 34 is an explanatory diagram showing an example when the external device incorporating the semiconductor device according to the ninth embodiment of the invention performs short-distance wireless communication with the reader / writer.
  • a data flow when the semiconductor device 1 of the present invention is incorporated in an external device H such as a mobile phone and communicates with another external device (for example, a reader / writer RW) will be described.
  • the external device H receives data from the server SV via the portable antenna ANT.
  • This data is user management information such as personal information of the user of the external device H, electronic money (charge) information, and entry / exit information.
  • the data received by the external device H is held in the register reg1 provided in the SIM secure chip 22 via the portable RF unit 23, the host MPU 21, and the ISO terminal 20.
  • the SIM secure chip 22 exchanges data held in the register reg1 with the host MPU 21 of the main body of the external device H, a memory (not shown) or the like via the ISO terminal 20. I do.
  • the data held in the register reg1 of the SIM secure chip 22 is moved to the register reg2 of the NFC chip 9a.
  • the data holding of the register reg2 of the NFC chip 9a when the same data is shared between the register reg1 of the SIM secure chip 22 and the register reg2 of the NFC chip 9a, or when the data is transferred from the server SV to the SIM secure chip 22 In some cases, the data is passed (through) and directly written to the register reg2 of the NFC chip 9a.
  • the data held in the register reg2 of the NFC chip 9a by the short-range wireless communication is transmitted via the non-contact card RF chip 9b and the antenna 13 via the LAN (Local The data is sent to a reader / writer RW connected to a network NT such as Area Network or WAN (Wide Area Network).
  • a network NT such as Area Network or WAN (Wide Area Network).
  • the data received by the reader / writer RW from the external device H is sent to the NFC processing MPU 33 via the antenna 31 of the reader / writer RW and the RF unit 32 for contactless card and processed (mutual authentication processing).
  • This processing is, for example, fare calculation / fee settlement in the case of a traffic / ticket gate system, payment / payment settlement in the case of an electronic money settlement system, and entry / exit records / doors in an entrance / exit management system. Corresponds to open / close control.
  • the register reg1 of the SIM secure chip 22 holds data. In other words, it is necessary to hold data in the register reg2 of the NFC chip 9a only when short-range wireless communication is performed.
  • the hardware separation between the SIM secure chip 22 and the NFC chip 9a can be made in order to meet the necessity / non-necessity of the short-range wireless communication function.
  • convenient For example, a handheld mobile phone does not have a short-range wireless communication function, and a user who wants the function is not required to purchase a new model.
  • the semiconductor device of the present invention the user can easily use the handheld mobile phone later. Functions can be added.
  • the semiconductor device of the present invention is not a conventional analog connection method but a digital connection method as described in the first embodiment, high communication quality can be ensured.
  • FIG. 35 is an explanatory diagram showing an example when the external device incorporating the semiconductor device according to the tenth embodiment of the present invention performs near field communication with the reader / writer.
  • FIG. 35 is a diagram showing details when the external device H in which the semiconductor device according to the tenth embodiment of the present invention is incorporated and the external device H1 perform short-range wireless communication.
  • deposit information is stored in the register reg2 of the NFC chip 9a of the external device H.
  • deposit information is stored in the register reg2 of the NFC chip 9a of the external device H.
  • the deposit (charge) information held in the register reg2 of the NFC chip 9a of the external device H is sent to the external device H2 via the RF chip 9b for the non-contact card of the external device H and the antenna 13.
  • the external device H1 writes the received information to the register reg3 of the NFC chip 9a1 via the antenna 13a of the external device H1 and the RF chip 9b1 for non-contact card, thereby completing the transfer.
  • the present invention may be applied to an extension unit and a SIM card socket unit that are not separated but integrated.
  • the short-range wireless communication function is added as the function added to the external device has been described as an example, but another function may be newly added.
  • the present invention is suitable for a communication stabilization technique in an external device having a configuration in which an antenna for wireless communication such as NFC is removable.

Abstract

La présente invention concerne un dispositif externe (H) tel qu'un téléphone mobile ou un dispositif de communication numérique comprenant un module radiofréquence mobile (23) et un microprocesseur hôte (21). Le module radiofréquence mobile (23) exécute, d'une part une amplification de puissance haute fréquence de façon à produire en sortie un signal haute fréquence permettant d'effectuer une communication radio via une antenne, et d'autre part un traitement de signal de façon à transmettre le signal reçu par l'antenne pendant la communication radio à destination du microprocesseur hôte (21), et analogue. Le microprocesseur hôte (21) exécute toutes les commandes dans le dispositif externe (H). Le microprocesseur hôte (21) est connecté par connecteur ISO (20) au module base de carte SIM (14) inséré dans le dispositif à semi-conducteurs (1). Le module base de carte SIM (14) peut être retiré du dispositif à semi-conducteur (1) au point de connexion entre un microcircuit de sécurité pour carte SIM (22) et un microcircuit de communication en champ proche ou "NFC" (9a) du dispositif à semi-conducteurs (1).
PCT/JP2008/070125 2008-11-05 2008-11-05 Dispositif à semi-conducteurs WO2010052770A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/070125 WO2010052770A1 (fr) 2008-11-05 2008-11-05 Dispositif à semi-conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/070125 WO2010052770A1 (fr) 2008-11-05 2008-11-05 Dispositif à semi-conducteurs

Publications (1)

Publication Number Publication Date
WO2010052770A1 true WO2010052770A1 (fr) 2010-05-14

Family

ID=42152586

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070125 WO2010052770A1 (fr) 2008-11-05 2008-11-05 Dispositif à semi-conducteurs

Country Status (1)

Country Link
WO (1) WO2010052770A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2797035A4 (fr) * 2011-12-19 2015-07-29 Sk C&C Co Ltd Carte à puce intelligente comprenant un tiroir intégré et dispositif mobile adoptant celle-ci
JP2016501485A (ja) * 2013-06-09 2016-01-18 シャオミ・インコーポレイテッド マルチターンコイルマルチプレクス回路、マルチターンコイルマルチプレクス回路の制御方法、装置、プログラム及び記録媒体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008522466A (ja) * 2004-11-25 2008-06-26 テレコム・イタリア・エッセ・ピー・アー 移動体通信機器用の共用ｉｃカード及び無線トランシーバモジュール
JP2008259200A (ja) * 2007-03-28 2008-10-23 Inside Contactless 非接触型集積回路をｎｆｃ素子に結合するための方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008522466A (ja) * 2004-11-25 2008-06-26 テレコム・イタリア・エッセ・ピー・アー 移動体通信機器用の共用ｉｃカード及び無線トランシーバモジュール
JP2008259200A (ja) * 2007-03-28 2008-10-23 Inside Contactless 非接触型集積回路をｎｆｃ素子に結合するための方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2797035A4 (fr) * 2011-12-19 2015-07-29 Sk C&C Co Ltd Carte à puce intelligente comprenant un tiroir intégré et dispositif mobile adoptant celle-ci
US9396427B2 (en) 2011-12-19 2016-07-19 Sk Holdings Co., Ltd. Removable tray integrated smart card and mobile terminal adopting the same
JP2016501485A (ja) * 2013-06-09 2016-01-18 シャオミ・インコーポレイテッド マルチターンコイルマルチプレクス回路、マルチターンコイルマルチプレクス回路の制御方法、装置、プログラム及び記録媒体
US9930239B2 (en) 2013-06-09 2018-03-27 Xiaomi Inc. Multi-turn coil multiplex circuit and method and device for controlling multi-turn coil multiplex circuit

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