WO2010034312A1 - Boîtier de pompe pour une pompe électromagnétique et procédé d’assemblage d’un circuit de refroidissement comportant le boîtier de pompe - Google Patents

Boîtier de pompe pour une pompe électromagnétique et procédé d’assemblage d’un circuit de refroidissement comportant le boîtier de pompe Download PDF

Info

Publication number
WO2010034312A1
WO2010034312A1 PCT/DK2009/000210 DK2009000210W WO2010034312A1 WO 2010034312 A1 WO2010034312 A1 WO 2010034312A1 DK 2009000210 W DK2009000210 W DK 2009000210W WO 2010034312 A1 WO2010034312 A1 WO 2010034312A1
Authority
WO
WIPO (PCT)
Prior art keywords
pump housing
pipe
base part
pipes
pump
Prior art date
Application number
PCT/DK2009/000210
Other languages
English (en)
Inventor
Martin Kloster
Original Assignee
Danamics Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danamics Aps filed Critical Danamics Aps
Publication of WO2010034312A1 publication Critical patent/WO2010034312A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
    • F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006—Micropumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/20—Other positive-displacement pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K44/00—Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
    • H02K44/02—Electrodynamic pumps
    • H02K44/04—Conduction pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a pump housing for an electromagnetic pump for the propulsion of an electrically conductive liquid in pipes, in particular for the cooling of electric components, wherein the pump housing, together with the pipes, forms a closed circuit with which a heat exchanger and a cooling plate are connected, and wherein the pump housing comprises a base part and a lid part, and the base part additionally comprises at least two pipe inlet openings and at least two pipe outlet openings arranged at opposed ends of the base part.
  • the interior of the base part is divided into a plurality of channels of inwardly protruding barriers, and each channel extends between a pipe inlet opening and a pipe outlet opening.
  • the barriers extend between the channels from the two ends of the base part, where the pipe openings are arranged, and inwards toward the centre of the base part, wherein the electrodes are arranged on opposed sides of the base part perpendicularly to the channels.
  • the invention relates to a method of assembling a cooling circuit in which the pump housing according to the invention is incorporated.
  • the inventor's own Danish Patent Application PA 2007 01817 discloses an electromagnetic pump comprising a pump housing which is adapted to be inserted into a cooling circuit.
  • the pump housing is equipped with channels, barriers and electrodes.
  • the pipe connections of the pump housing are arranged on opposed sides of the housing, and the liquid flow runs in a straight line from a pipe con- nection on one side, through a channel, to a pipe connection on the other side. It has been found that precisely this configuration of the housing is not very desirable for reasons of function and production.
  • the small dimensions of the housing mean that there is an undesired power loss to the pipes, which causes an increased load of the power supply to the IC circuits.
  • the patent document US 2007/0053153 relates to an electromagnetic pump, where the pump is used in a cooling circuit for the cooling of electric components, where the liquid flow runs in a straight line from a pipe connection on one side of the pump housing, through a channel, to a pipe connection on the other side of the pump housing.
  • the cooling circuit com- prises pipe bends and a plurality of solder joints and is therefore expensive to produce.
  • the patent document US 6,146,103 relates to an electromagnetic micro- pump, where the pipe inlet and the pipe outlet are arranged on a side face of the pump housing at a right angle into the channel.
  • the micropump is made of special materials and by a special method and is designed to serve as a microactuator, such as a micropump, micromixer, microvalve, or as a sensor, such as a microflow meter or viscosity meter.
  • the pump is unsuitable for operation in a cooling circuit.
  • This structure of the pump housing moreover means that the pump housing has a size which at least corresponds to the spacing between associated inlet and outlet openings, thereby proportionately increasing the resistance in the bottom and the walls of the housing from the electrodes and out to the pipe inlet and pipe outlet, such that the flow will run through the circulating liquid between the electrodes to a greater degree.
  • an angle between the pipe openings and the channels of the housing greater than ninety degrees, but smaller than one hundred and twenty degrees may be selected, it will be possible to configure the housing with a curvature.
  • the lid part is equipped with deflection devices immediately above each pipe inlet and pipe outlet, it is ensured that the liquid may more readily pass the bend between pipes and channels. This ensures that the liquid flow runs without any turbulence of importance.
  • the electrodes are configured as outwardly ex- tending pins, one of which is configured as a pipe, it is ensured that good flow connection options are provided, and simultaneously that a filling pipe for the conductive cooling liquid is at disposal.
  • the base part and the lid part are made of stainless steel, it is ensured that the housing is resistant to corrosive gases and liquids, and it is moreover ensured that the housing may be made with the desired tolerances by means of machine tools.
  • the base part is injection-moulded in stainless steel, it is ensured that larger batches of the housing may be produced at considerably reduced costs.
  • the base part and the lid part are made of sintered metal, it is ensured that larger batches of the housing may be pro-luded at considerably reduced costs.
  • the base part and the lid part are made of pressed metal sheeting, the advantages stated with respect to claim 5 or 6 are achieved, and it is moreover ensured that the manufacturing costs may be reduced.
  • Fig. 1a shows a perspective view of a cooling circuit which is driven by an electromagnetic pump having a pump housing accord- ing to the invention
  • Fig. 1 b shows a lateral view of fig. 1a
  • Fig. 2 shows a lateral view of a cooling circuit having an electromag- netic pump according to the prior art
  • Fig. 3 shows a perspective view of the base part for the pump housing according to the invention.
  • Fig. 4 shows a section through a channel in the base part and the lid part for the pump housing, seen from the side.
  • Fig. 1 shows a perspective view of a cooling circuit having an electromagnetic pump 2 equipped with a pump housing 1 according to the invention.
  • the circuit is shown assembled, and, in addition to the pump housing, the figure shows a plurality of pipes 3, a cooling plate 5 and a heat exchanger 4.
  • the pump housing consists of a base part 6 and a lid part 7. All joints with connection to the coolant must be made hermetically.
  • the pipes 3 are made of a relatively soft metal alloy having good heat con- ductive properties and are cut to the desired length before being bent into U-shape.
  • the pipe ends 16 shown in fig. 1 b, which are to be mounted in the pipe openings in the base part of the pump housing, are deburred and cleaned of impurities, so that a soldering/gluing process may be performed in connection with the assembly of the cooling circuit.
  • the cooling plate 5 is made of a metal alloy having good heat conductive properties, such as e.g. a copper alloy. Grooves dimensioned to receive the cooling pipes 3 are milled in the plate.
  • the heat exchanger 4 consists of a plurality of punched cooling fins of aluminium, which are hooked together to a stack by means of locking devices punched in the edges of the fins.
  • the heat exchanger is equipped with a plurality of punched and pressed holes, so that the stack may be pressed at the same time down over the pipe ends 16 of the pipes when the cooling circuit is assembled.
  • Fig. 2 shows the prior art with a cooling circuit having an electromagnetic pump.
  • the cooling circuit includes three lengths of pipe, all of which are equipped with a bend, and which require a joint just above the cooling plate.
  • the shown configuration of pump housing and pipe system tells that assembly of this circuit involves a plurality of working operations which are time-consuming.
  • the pump housing according to the invention is shown in fig. 3 and fig. 4.
  • the housing 1 comprises a base part 6 and a lid part 7.
  • the base part is provided with a recess 17, which is configured to receive the lid part.
  • a plu- rality of pipe inlet openings 8 and pipe outlet openings 9 are provided on the lower side 14 of the base part.
  • the openings 8, 9 are configured to receive the pipe ends 16 of the pipes 3 and lead into channels 10 at an essentially right angle.
  • the interior of the base part is divided into a plurality of channels 10 of inwardly extending barriers 11. Each channel runs between associated pipe openings 8, 9.
  • the barriers extend between the channels from the two ends of the base part, where the pipe openings are provided, and inwards toward the centre of the base part, where support for two electrodes 12, 13 is shown.
  • the barriers are interrupted here, so that the flow path I between the electrodes, which are arranged on opposed sides of the base part perpendicularly to the channels, is unobstructed.
  • the lid part 7 is equipped with deflection devices 15, which are arranged on the lid part in a position which is directly above the pipe openings.
  • the deflection devices are introduced to reduce the flow resistance and turbulence, if any, when the liquid passes through an angular bend of ninety degrees from the pipes and into the channels.
  • the pump housing is configured as described above, it is ensured that the costs of manufacturing cooling circuits having an electromagnetic pump are reduced, and that the undesired flow losses are reduced at the same time.
  • the pump housing 1 is shown and described as a plane housing, but, in another embodiment, the housing may be configured so as to have a curvature, thereby imparting to the assembled cooling circuit a geometric shape which approximates a circle.
  • the angle between the channels 10 and the pipe openings 8, 9 is changed hereby from being essentially perpendicular to an angle which is greater than ninety degrees, but smaller than one hundred and twenty degrees.
  • the location of the pipe openings 8, 9 on the lower side of the base part allows manufacture of the pipes for the cooling circuit in a simple and inex- pensive manner, as the pipes merely have to be cut and deburred and then bent into U-shape.
  • the selected configuration of the pump housing means that the pump housing has a size which at least corresponds to the spacing be- tween associated inlet and outlet openings, thereby proportionally increasing the resistance in the bottom and the walls of the housing from the electrodes and out to the pipe inlet and pipe outlet, such that the flow will run through the circulating liquid between the electrodes to a greater degree.
  • the cooling circuit is normally powered from the power supply to the electronic components which are to be cooled. Therefore, it is desirable to reduce the power load originating from the cooling circuit as much as possible.
  • the pump housing 1 may be made of stainless steel.
  • the housing is constructed by milling on a machine tool and may be made with fine tolerances. This manufacturing method is expensive and not very expedient for real batch production of the housing.
  • the housing may also be injection-moulded in stainless steel by means of the known MIM (metal injection moulding) process, so that it is possible to manufacture greater batches of the pump housing, while reducing the employed amount of material significantly.
  • MIM metal injection moulding
  • the housing may also be made of a suitable sintered metal. Sintering is a suitable process for the manufacture of the housing in large numbers.
  • the housing may be made of pressed metal sheeting, where the base part and the lid part of the housing are pressed as two halves, which are joined subsequently by suitable methods.
  • the joint between the base part and the lid part of the pump housing and between the pump housing and the U-pipes must be carried out hermetically.
  • a plurality of suitable joining methods are available for this, it being advantageously possible to use soldering materials having a higher melting point than the melting point of the cooling fins on the heat exchanger, which cooling fins will primarily be made of an aluminium alloy.
  • Such an advantageous soldering material is silver.
  • An alternative soldering material having a melting point lower than the melting point of the cooling fins on the heat exchanger may be used on all solder joints, whereby all solderings on the entire cooling circuit may be made in one heating at the same time.
  • Suitable joining methods are inter alia induction soldering or resistance sol- dering.
  • solder point In induction soldering, the solder point is subjected to a high frequency signal, whereby the solder point is heated strongly, such that a solder brick of e.g. silver solder arranged on the solder point melts and adheres to the faces on the solder point.
  • electrodes are arranged on their respective sides of the solder point, and a current is passed through the area, heating the solder point strongly so that a solder brick of e.g. silver solder melts and adheres to the faces on the solder point.
  • a combination of soft soldering and hard soldering where the joints between cooling plate and U-pipes and between heat exchanger and U-pipes are carried out as a soft soldering at a low temperature, and where the joint between the housing and the U-pipes is carried out e.g. by induction sol- dering, where the heat is supplied locally, provides the possibility of locally using soldering materials having a high strength, density and melting temperature.
  • a method of assembling a cooling circuit having an electromagnetic pump comprising a pump housing as described above will therefore include:
  • the components are then joined by a relevant joining method.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un procédé selon lequel: l’assemblage d’un boîtier de pompe (1) pour une pompe électromagnétique (2) destinée à un circuit de refroidissement est réalisé de sorte qu’une partie de base (6) du boîtier de pompe soit équipée d’ouvertures pour une conduite (8, 9), sortant depuis la face inférieure (14) de la partie de base perpendiculairement pour pénétrer dans des canaux (10) du boîtier de pompe, en s’assurant que le circuit de refroidissement puisse être installée avec une seule longueur de conduite (3), dont les extrémités (16) sont introduites dans les ouverture de conduite (8, 9) et sont soudées. Dans le même temps, on s’assure que le circuit puisse être installé avec seulement deux soudures. Le procédé permet une nette réduction de coûts de fabrication d’un circuit de refroidissement.
PCT/DK2009/000210 2008-09-29 2009-09-18 Boîtier de pompe pour une pompe électromagnétique et procédé d’assemblage d’un circuit de refroidissement comportant le boîtier de pompe WO2010034312A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DKPA200801351 2008-09-29
DKPA200801351A DK200801351A (da) 2008-09-29 2008-09-29 Pumpehus til elektromagnetisk pumpe og fremgangsmåde til samling af et kølekredsløb omfattende pumpehuset

Publications (1)

Publication Number Publication Date
WO2010034312A1 true WO2010034312A1 (fr) 2010-04-01

Family

ID=41504466

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK2009/000210 WO2010034312A1 (fr) 2008-09-29 2009-09-18 Boîtier de pompe pour une pompe électromagnétique et procédé d’assemblage d’un circuit de refroidissement comportant le boîtier de pompe

Country Status (2)

Country Link
DK (1) DK200801351A (fr)
WO (1) WO2010034312A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103796492A (zh) * 2014-01-25 2014-05-14 清华大学 热收集端

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6447265A (en) * 1987-08-12 1989-02-21 Toshiba Corp Farady type electromagnetic pump
EP0838988A2 (fr) * 1996-10-23 1998-04-29 Asea Brown Boveri AG Dispositif de refroidissement par un liquide d'un module semi-conducteur de forte puissance
WO2004106738A1 (fr) * 2003-05-22 2004-12-09 Nanocoolers, Inc. Pompes magneto-hydrodynamiques pour fluides non conducteurs
US20070139879A1 (en) * 2005-12-21 2007-06-21 Sun Microsystems, Inc. Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits
US20080010998A1 (en) * 2006-07-17 2008-01-17 Sun Microsystems, Inc. Thermal-electric-MHD cooling
WO2008128539A2 (fr) * 2007-04-20 2008-10-30 Danamics Aps Pompe électromagnétique

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6447265A (en) * 1987-08-12 1989-02-21 Toshiba Corp Farady type electromagnetic pump
EP0838988A2 (fr) * 1996-10-23 1998-04-29 Asea Brown Boveri AG Dispositif de refroidissement par un liquide d'un module semi-conducteur de forte puissance
WO2004106738A1 (fr) * 2003-05-22 2004-12-09 Nanocoolers, Inc. Pompes magneto-hydrodynamiques pour fluides non conducteurs
US20070139879A1 (en) * 2005-12-21 2007-06-21 Sun Microsystems, Inc. Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits
US20080010998A1 (en) * 2006-07-17 2008-01-17 Sun Microsystems, Inc. Thermal-electric-MHD cooling
WO2008128539A2 (fr) * 2007-04-20 2008-10-30 Danamics Aps Pompe électromagnétique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103796492A (zh) * 2014-01-25 2014-05-14 清华大学 热收集端

Also Published As

Publication number Publication date
DK200801351A (da) 2010-03-30

Similar Documents

Publication Publication Date Title
JP6106679B2 (ja) 電気エネルギアキュムレータ
EP1276362B1 (fr) Plaque froide en forme de tube aplati pour le refroidissement liquide de composants électriques
JP4797077B2 (ja) 半導体パワーモジュール、電力変換装置、および、半導体パワーモジュールの製造方法
EP2578982A1 (fr) Échangeur de chaleur et procédé pour sa fabrication
CN111108819A (zh) 具有集成的冷却装置的功率模块
US11699820B2 (en) Battery module with bimetallic terminal busbar and adaptable connector interface
EP0212878A1 (fr) Echangeur de chaleur à plaques et à courant croisé
KR20120082891A (ko) 핀이 구비된 냉각 판
US4546820A (en) Method and apparatus for forming heat exchanger assemblies with bendable tube sheet flanges
WO2018021009A1 (fr) Appareil de refroidissement
JP4962290B2 (ja) 電力変換装置
EP2676094B1 (fr) Procédé de fabrication d'un échangeur de chaleur et échangeur de chaleur
KR101065734B1 (ko) 열전모듈용 열교환기
WO2010034312A1 (fr) Boîtier de pompe pour une pompe électromagnétique et procédé d’assemblage d’un circuit de refroidissement comportant le boîtier de pompe
GB2536051A (en) Heatsink
JP2012160688A (ja) ヒートシンク及びその製造方法
EP2580552B1 (fr) Échangeur de chaleur
EP3979395A1 (fr) Système de refroidissement de batterie
JP2005203732A (ja) 冷却器
CN203708742U (zh) 散热装置
JP6868415B2 (ja) 熱交換器用ヒートシンク及び熱交換器
CN114730970A (zh) 电池组和方法
JP6406125B2 (ja) 流体輸送装置および流体輸送装置を製造する方法
JP7499689B2 (ja) 波型伝熱フィン
EP4175434A1 (fr) Ensemble électronique de puissance refroidi par liquide et air combiné

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09776201

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 09776201

Country of ref document: EP

Kind code of ref document: A1