WO2010016370A1 - Microchip, microchip manufacturing method and microchip manufacturing device - Google Patents
Microchip, microchip manufacturing method and microchip manufacturing device Download PDFInfo
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- WO2010016370A1 WO2010016370A1 PCT/JP2009/062879 JP2009062879W WO2010016370A1 WO 2010016370 A1 WO2010016370 A1 WO 2010016370A1 JP 2009062879 W JP2009062879 W JP 2009062879W WO 2010016370 A1 WO2010016370 A1 WO 2010016370A1
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- microchip
- hole
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- manufacturing
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Definitions
- the present invention relates to a microchip, a microchip manufacturing method, and a microchip manufacturing apparatus.
- Such a microchip has two substrates formed of a resin or the like, and after performing microfabrication such as a through hole or a channel for liquid sample injection on one substrate, It is manufactured by sandwiching a substrate between hot plates and performing heat bonding (see, for example, Patent Document 1).
- the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a microchip, a microchip manufacturing method, and a microchip manufacturing apparatus that can prevent a reduction in dimensional accuracy.
- the method of manufacturing a microchip in which two substrates that are stacked and have a flow path formed inside are sandwiched between two hot plates facing each other and heat bonded.
- a flow channel substrate in which a through hole communicating with the flow channel is formed in the thickness direction, and a cover that covers one opening of the through hole with a bonding surface that is heat-bonded to the flow channel substrate Using the substrate, When at least one of the two heat plates is brought into contact with the flow path substrate or the cover substrate, an opening is formed on the contact surface with the flow path substrate or the cover substrate.
- the method includes a bonding step of heating and bonding the two substrates.
- the two hot plates at least one of the hot plates in contact with the cover substrate has the communication hole, and the hole diameter X of the opening of the communication hole satisfies the following expression (1). Is preferred.
- a microchip in a microchip, It is manufactured by the method for manufacturing a microchip of the present invention.
- Heat bonding is performed while sandwiching the two substrates so as to face each other, and at least one has an opening on the contact surface with the substrate when it contacts the substrate, and the contact surface and the outside air And two hot plates having communication holes that communicate with each other.
- the communication hole having an opening on the contact surface with the substrate and communicating the contact surface with the outside air
- the two substrates are heated and bonded in a state where the positions of the through hole of the flow path substrate and the opening of the communication hole correspond to each other, so that heating by two hot plates and subsequent cooling It is possible to suppress the expansion / contraction of one or both of the air in the gap and the through hole between the cover substrate and the hot plate. Therefore, deformation of the cover substrate can be suppressed, and deterioration of dimensional accuracy can be prevented.
- the hole diameter X of the communication hole of one of the heat plates in contact with the cover substrate is more preferably X ⁇ Y with respect to the hole diameter Y of the through hole of the flow path substrate. Since X ⁇ Y ⁇ 0.4 is used, it is possible to prevent the occurrence of a region where the contact surface of the hot plate does not come into contact with the required surface of the microchip. Generation
- production of an unjoined part can be prevented.
- one of the hot plates in contact with the cover substrate has a hole diameter X of the opening portion of the communication hole satisfying X> Y ⁇ 0.5, the heating by the two hot plates and the subsequent cooling are performed.
- the diameter of the deformation trace is not significantly different from the hole diameter Y of the through hole of the flow path substrate. It is possible to prevent the deformation trace from being noticeable by being distorted into the opening shape of the through hole.
- FIG. 4 is a cross-sectional view of the microchip according to the present invention, and is a cross-sectional view taken along the line IV-IV in FIG. It is a top view of the resin-made board
- It is a conceptual diagram which shows schematic structure of the manufacturing apparatus of the microchip which concerns on this invention.
- It is a conceptual diagram which shows schematic structure of the modification of the manufacturing apparatus of the microchip which concerns on this invention.
- FIG. 1 is a top view of a microchip 1 according to the present invention
- FIG. 2 is a cross-sectional view taken along the line IV-IV of FIG. 1
- FIG. 3 is a top view of a resin substrate 10 constituting the microchip 1.
- the microchip 1 includes two rectangular plate-like resin substrates 10 and 20 bonded to each other.
- the resinous substrate 10 has linear flow channel grooves 12 and 13 formed on one surface (the upper surface in FIG. 2). Further, as shown in FIG. 3, through holes 14 penetrating in the thickness direction of the resin substrate 10 are respectively formed at both ends of the flow path grooves 12 and 13.
- the other surface of the resin substrate 10 (the surface where the channel grooves 12 and 13 are not formed) is smooth. Further, the channel groove 12 and the channel groove 13 in the present embodiment are formed orthogonal to each other, but may be formed without being orthogonal to each other.
- the resin substrate 10 is a flow path substrate in the present invention.
- the resin substrate 20 is a member having a smooth surface, and is bonded to the formation surface of the flow path grooves 12 and 13 in the resin substrate 10.
- the resin substrate 20 functions as a cover (cover) for the flow path grooves 12 and 13 and the through hole 14, and the fine flow path 15 is formed between the flow path grooves 12 of the resin substrate 10 and the flow path.
- a fine channel 16 is formed between the groove 13 and the through hole 14 to form an opening 17.
- the resin substrate 20 is a cover substrate in the present invention.
- the shape of the microchannels 15 and 16 (channel grooves 12 and 13) takes into consideration the fact that the amount of analysis sample and reagent used can be reduced, the fabrication accuracy of molds, transferability and mold release properties.
- the width and depth are preferably in the range of 10 ⁇ m to 200 ⁇ m, but are not particularly limited, and may be determined according to the use of the microchip. And may be the same or different.
- the cross-sectional shape of the microchannels 15 and 16 is a rectangular shape, but this shape is an example, and other shapes such as a circular shape may be used.
- the opening 17 formed by the through hole 14 is connected to the fine flow paths 15 and 16. .
- the opening 17 is a hole for introducing, storing, and discharging a gel, a sample, and a buffer solution, and is connected to a tube or nozzle provided in an analyzer (not shown). Thus, a gel, a sample, a buffer solution, or the like is introduced into or discharged from the fine channels 15 and 16.
- the shape of the opening 17 (through hole 14) is not limited to a circular shape, and may be various other shapes such as a rectangular shape.
- the inner diameter of the opening 17 (through hole 14) may be adjusted to the analysis method or the analysis apparatus, and is preferably about 2 mm, for example.
- the shape of the resin substrates 10 and 20 may be any shape as long as it is easy to handle and analyze. For example, a shape such as a square, a rectangle, and a circle is preferable.
- the size of the resin substrates 10 and 20 is preferably about 10 mm square to 200 mm square, and more preferably 10 mm square to 100 mm square.
- the plate thickness of the resin substrate 10 on which the channel grooves 12 and 13 are formed is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability.
- the plate thickness of the resin substrate 20 functioning as a lid (cover) is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability.
- a film may be used as the resin substrate 20 instead of a plate member.
- the thickness of the film is preferably 30 ⁇ m to 300 ⁇ m, and more preferably 50 ⁇ m to 150 ⁇ m.
- the resin substrate 20 is thinner than the resin substrate 10.
- resin is used as the material for the resin substrates 10 and 20.
- this resin those having good moldability (transferability, releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light are preferable.
- thermoplastic resins are used.
- thermoplastic resin examples include polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, polyamide, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethylsiloxane, and cyclic polyolefin. Etc. are preferably used. It is particularly preferable to use polymethyl methacrylate and cyclic polyolefin.
- the resin substrate 10 and the resin substrate 20 may be made of the same material or different materials.
- thermosetting resin for the resin substrate 20 in which the channel groove is not formed, a thermosetting resin or an ultraviolet curable resin may be used in addition to the thermoplastic resin.
- thermosetting resin it is preferable to use polydimethylsiloxane.
- the resin substrate 10 on which the channel grooves 12 and 13 are formed is preferably formed by an injection molding method or a press molding method, and the resin substrate 20 on which the channel groove is not formed is an extrusion molding method. It may be produced by a method other than an injection molding method such as a T-die molding method, an inflation molding method, or a calendar molding method, or by an injection molding method.
- FIG. 4 is a conceptual diagram showing a schematic configuration of a microchip manufacturing apparatus (hereinafter referred to as a manufacturing apparatus) 5.
- a manufacturing apparatus a microchip manufacturing apparatus
- the microchip 1 is shown in a simplified manner.
- the manufacturing apparatus 5 includes two hot plates 51 and 52 that are disposed vertically opposite to each other.
- the hot plates 51 and 52 are plate-like members that sandwich and heat-bond the resin substrates 10 and 20, and are moved in the contact / separation direction (vertical direction in the figure) by the moving means 53.
- the moving means 53 may move the hot plates 51 and 52, respectively, or only one of them.
- a conventionally known apparatus can be used.
- the resin substrate 10 is disposed on the lower side and the resin substrate 20 is disposed on the upper side between the hot plates 51 and 52 so that the resin substrates 10 and 20 are sandwiched between them. This will be explained.
- communication holes 510 and 520 are formed, respectively. As shown in the figure, these communication holes 510 and 520 have contact surfaces 51a and 52a (when the hot plates 51 and 52 are brought into contact with the resin substrates 20 and 10, respectively. Opening portions 510a and 520a are provided on the lower surface of the heat plate 51 and the upper surface of the heat plate 52, and the contact surfaces 51a and 52a are communicated with the outside air. Further, the opening 510a and the opening 520a open at positions facing each other in the contact surfaces 51a and 52a, and the positions of the through holes 14 when the resin substrates 10 and 20 are heat-bonded. Are provided at positions corresponding to the through-holes 14 respectively. In the present embodiment, the contact surfaces 51a and 52a of the hot plates 51 and 52 are smooth at portions other than the communication holes 510 and 520. In addition, at least one of the communication holes 510 and 520 may be formed.
- the upper limit of the hole diameter X of the opening 510a of the communication hole 510 opened on the contact surface 51a of the hot plate 51 is preferably X ⁇ Y with respect to the hole diameter Y of the through hole 14 of the resin substrate 10. [Mm], and more preferably X ⁇ Y ⁇ 0.4 [mm].
- the lower limit of the pore diameter X is preferably X> Y ⁇ 0.5 [mm].
- the shape of the hole is not particularly limited to this. That is, even if it is not circular shape, the shape obtained by offsetting a through-hole other than rectangular shape and polygonal shape may be sufficient. Further, the hole diameter X in these cases refers to the length of the longest diagonal line.
- a release agent (not shown) for preventing the resin substrates 20 and 10 from sticking is applied to the contact surfaces 51a and 52a of the two hot plates 51 and 52 (application process).
- a conventionally known release agent can be used as such a release agent.
- the resin substrates 20 and 10 are stacked one above the other with the formation surfaces of the flow path grooves 12 and 13 on the resin substrate 10 facing inward (upper side), and disposed between the hot plates 51 and 52. To do.
- the hot plates 51 and 52 are brought close to the moving means 53 so that the resin substrates 20 and 10 are sandwiched in the thickness direction by the hot plates 51 and 52 while pressing the resin substrates 20 and 10 in this state.
- Heat joining joining process
- the positions of the through holes 14 of the resin substrate 10 and the openings 510a and 520a of the communication holes 510 and 520 of the heat plates 51 and 52 opened in the contact surfaces 51a and 52a correspond to each other, that is, In the state where the through hole 14 and the openings 510a and 520a overlap each other when viewed from the top, the resin substrates 20 and 10 are heat bonded by the hot plates 51 and 52.
- the through hole 14 and the openings 510a and 520a are substantially concentric in a top view.
- the resin substrates 20 and 10 are heated in a state where the positions of the through hole 14 of the resin substrate 10 and the opening 510a of the communication hole 510 of the heat plate 51 opened on the contact surface 51a correspond to each other.
- the expansion / contraction of the air in the slight gap between the resin substrate 20 and the hot plate 51 above the through hole 14 can be suppressed.
- the positions of the through hole 14 of the resin substrate 10 and the opening portion 520a of the communication hole 520 of the heat plate 52 opened in the contact surface 52a correspond to each other, that is, the through hole 14 and the communication hole 520
- the expansion / expansion of the air in the through-hole 14 is performed without sealing the through-hole 14. Shrinkage can be suppressed.
- the bonding of the resin substrate 10 and the resin substrate 20 is performed by heat welding such as thermocompression bonding or heat lamination.
- thermocompression bonding or heat laminating By applying thermocompression bonding or heat laminating to the resin substrates 10 and 20, the resin on the bonding surface of the resin substrates 10 and 20 is melted, and the resin substrate 10 and the resin substrate 20 are bonded to each other. Chip 1 is formed.
- the heating temperature for example, a temperature of 70 ° C. to 200 ° C. can be used.
- the microchip 1 is manufactured by peeling the resin substrate 20 or the resin substrate 10 attached to the hot plate 51 or the hot plate 52 (peeling step).
- the upper limit of the hole diameter X of the opening 510a of the communication hole 510 opened on the contact surface 51a of the hot plate 51 is preferably X ⁇ Y with respect to the hole diameter Y of the through hole 14 of the resin substrate 10. [Mm], and more preferably X ⁇ Y ⁇ 0.4 [mm], thereby preventing the occurrence of a region where the contact surface of the hot plate 51 does not contact the required joint surface of the microchip 1. It is possible to prevent the occurrence of an unjoined portion around the through hole 14.
- the lower limit of the hole diameter X of the opening 510a of the communication hole 510 opened on the contact surface 51a of the hot plate 51 is preferably X> Y with respect to the hole diameter Y of the through hole 14 of the resin substrate 10. Since the thickness is ⁇ 0.5 [mm], a slight deformation trace of the hole diameter X following the opening shape of the opening 510a of the communication hole 510 is observed during the heating by the hot plates 51 and 52 and the subsequent cooling. 20, since the diameter of the deformation trace is not significantly different from the hole diameter Y of the through hole 14 of the resin substrate 10, the deformation trace is lost to the opening shape of the through hole 14 to prevent it from being noticeable. can do. [Modification] Then, the modification of the manufacturing method of the microchip based on this invention is demonstrated. In addition, the same code
- the microchip manufacturing apparatus 5A in the present modification includes pressure sensors 61 and 62, pressure adjusting means 71 and 72, and control means 54. And.
- the pressure sensors 61 and 62 are disposed on the hot plates 51 and 52 so that each pressure in the communication holes 510 and 520 can be measured. Moreover, it connects so that a measured value may be output to the control means 54.
- FIG. 1 A pressure sensor 61 and 62 is disposed on the hot plates 51 and 52 so that each pressure in the communication holes 510 and 520 can be measured. Moreover, it connects so that a measured value may be output to the control means 54.
- the pressure adjusting means 71 and 72 are pumps connected to the open air openings of the communication holes 510 and 520 by pipes so that the insides of the communication holes 510 and 520 can be pressurized and depressurized. Further, it is connected to the control means 54 and its drive is controlled.
- the control means 54 is connected to the pressure sensors 61 and 62 and the pressure adjustment means 71 and 72, and the pressure adjustment means according to the measured values from the pressure sensors 61 and 62 so that the communication holes 510 and 520 have a predetermined pressure. 71 and 72 are controlled.
- a release agent is applied to the contact surfaces 51a and 52a of the hot plates 51 and 52 (application process).
- condition setting process the joining conditions in the joining process are set (condition setting process).
- the pressure adjusting means 71 and 72 of the pressure plate 71 and 72 are set so that the pressure in the communication hole 510 of the hot plate 51 and the pressure in the through hole 14 of the resin substrate 10 are substantially the same.
- Determine the driving state More specifically, the resin substrates 20 and 10 are sandwiched and heated by the hot plates 51 and 52 in the same manner as in the subsequent bonding step, and in this state, the control unit 54 controls the driving of the pressure adjusting units 71 and 72.
- the measured values of the pressure sensor 61 and the pressure sensor 62 are made substantially the same.
- the drive state of the pressure adjusting means 71 and 72 where the measured values of the pressure sensor 61 and the pressure sensor 62 are substantially the same is stored in the control means 54.
- the hot plates 51 and 52 are separated (separation process), and the microchip 1 used for setting the conditions in the condition setting process is separated (peeling process).
- the new resin substrates 20 and 10 are sandwiched by the hot plates 51 and 52 and heat-bonded (bonding step).
- the driving state of the pressure adjusting means 71 and 72 stored in the condition setting step is reproduced by the control means 54.
- the heat bonding of the resin substrates 10 and 20 can be performed in a state where the pressure in the communication hole 510 of the hot plate 51 and the pressure in the through hole 14 of the resin substrate 10 are substantially the same.
- the resin substrate 20 or the resin substrate 10 is peeled from the hot plate 51 or the hot plate 52 (peeling step).
- the manufacturing apparatus 5A by providing the condition setting step before the bonding step, the pressure in the communication hole 510 of the hot plate 51 and the penetration of the resin substrate 10 in the bonding step. Since the resin substrates 10 and 20 can be heat-bonded in a state where the pressure in the hole 14 is substantially the same, the same effect as in the above embodiment can be obtained more reliably.
- the condition setting process does not need to be repeated, and the driving state of the pressure adjusting means 71 and 72 determined in the initial condition setting process is changed to each joining process.
- the microchip 1 has been described as including the resin substrate 10 in which the non-formation surfaces of the flow path grooves 12 and 13 are smooth, but the resin substrate as illustrated in FIG. 40 may be provided instead of the resin substrate 10.
- the resin substrate 40 is formed with flow channel grooves 12 and 13 on one surface, and a cylindrical protrusion 41 is provided around each through hole 14 on the other surface.
- These protrusions 41 surround the through-holes 14 and protrude in the thickness direction of the resin substrate 40 and are fitted into tubes and nozzles of an analyzer (not shown) to introduce and discharge samples and the like. To do.
- Such a protrusion 41 may have a cylindrical shape, or may have another shape such as a polygonal shape.
- the concavo-convex member provided on the non-formation surface of the flow path grooves 12 and 13 in the resin substrate 40 is not limited to the protrusion 41, and for example, for controlling the flow of the sample flowing in the fine flow path. It may be a switch or a lens for collecting light from the analyzer.
- condition setting step is described as being performed before the bonding step.
- the pressure in the communication hole 510 of the hot plate 51 and the pressure in the through hole 14 of the resin substrate 10 are described.
- driving of the pressure adjusting means 71 and 72 may be controlled so as to be substantially the same.
Abstract
Provided are microchip manufacturing method and manufacturing device capable of preventing a reduction in the dimensional accuracy of a microchip. The manufacturing method and manufacturing device use, as resinous substrates (10, 20), the resinous substrate (10) in which a through hole (14) is formed in the thickness direction and the resinous substrate (20) which covers one opening of the through hole (14) with a bonded surface thermally bonded to the resinous substrate (10); use, as at least one of hot plates (51, 52), one that comprises an opening (510a) or an opening (520a) in a contact surface (51a) or a contact surface (52a) and comprises a communication hole (510) or a communication hole (520) for communicating the contact surface (51a) or the contact surface (52a) with outside air when being brought into contact with the resinous substrate (20) or the resinous substrate (10); and are provided with a bonding step for thermally bonding the resinous substrates (20, 10) while the resinous substrates (20, 10) are sandwiched between the hot plates (51, 52) in such a manner that the positions of the through hole (14) and the communication hole (510) or the communication hole (520) correspond to each other.
Description
本発明は、マイクロチップ、マイクロチップの製造方法及びマイクロチップの製造装置に関する。
The present invention relates to a microchip, a microchip manufacturing method, and a microchip manufacturing apparatus.
従来、微小空間内で核酸、タンパク質、血液などの液体試料の化学反応や分離、分析などを行う技術分野においては、内部に微細な流路や回路を形成したマイクロチップが実用化されている。
Conventionally, in a technical field where chemical reaction, separation, and analysis of a liquid sample such as nucleic acid, protein, and blood are performed in a minute space, a microchip having a minute channel or circuit formed therein has been put into practical use.
このようなマイクロチップは、樹脂などで形成された２つの基板を有しており、一方の基板に対して液体試料注入用の貫通孔や流路等の微細加工を施した後、これら２つの基板を熱板の間に挟んで加熱接合する等によって製造されている（例えば、特許文献１参照）。
Such a microchip has two substrates formed of a resin or the like, and after performing microfabrication such as a through hole or a channel for liquid sample injection on one substrate, It is manufactured by sandwiching a substrate between hot plates and performing heat bonding (see, for example, Patent Document 1).
しかしながら、上記特許文献１に記載の技術では、一方の基板に設けた貫通孔が、この基板に当接する熱板と他方の基板とで封止されるため、熱板による加熱及びその後の冷却の際に、他方の基板と熱板との間隙及び貫通孔内の空気が膨張・収縮することで他方の基板を変形させてしまい、寸法精度を損なうことがあった。
However, in the technique described in Patent Document 1, the through hole provided in one substrate is sealed by the hot plate contacting the substrate and the other substrate, so that heating by the hot plate and subsequent cooling are performed. At this time, the space between the other substrate and the hot plate and the air in the through hole expand and contract, which causes the other substrate to be deformed, which may impair dimensional accuracy.
本発明は、上記事情を鑑みてなされたもので、寸法精度の低下を防止することのできるマイクロチップ、マイクロチップの製造方法及びマイクロチップの製造装置の提供を課題とする。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a microchip, a microchip manufacturing method, and a microchip manufacturing apparatus that can prevent a reduction in dimensional accuracy.
本発明の第１の側面によれば、積層されて内側に流路を形成した２つの基板を、互いに対向する２枚の熱板で挟持して加熱接合するマイクロチップの製造方法において、
前記２つの基板として、前記流路に連通する貫通孔が厚さ方向に形成された流路基板と、当該流路基板と加熱接合される接合面で前記貫通孔の一方の開口部を覆うカバー基板とを用い、
前記２枚の熱板のうち、少なくとも一方の熱板として、前記流路基板又は前記カバー基板と当接させたときに、当該流路基板又は当該カバー基板との当接面に開口部を有して当該当接面と外気とを連通する連通孔を有するものを用い、
前記貫通孔と前記連通孔の前記開口部との互いの位置が対応するよう、前記２枚の熱板で前記２つの基板を厚さ方向に挟持させた状態で、前記２枚の熱板によって前記２つの基板を加熱接合する接合工程を備えることを特徴とする。 According to the first aspect of the present invention, in the method of manufacturing a microchip, in which two substrates that are stacked and have a flow path formed inside are sandwiched between two hot plates facing each other and heat bonded.
As the two substrates, a flow channel substrate in which a through hole communicating with the flow channel is formed in the thickness direction, and a cover that covers one opening of the through hole with a bonding surface that is heat-bonded to the flow channel substrate Using the substrate,
When at least one of the two heat plates is brought into contact with the flow path substrate or the cover substrate, an opening is formed on the contact surface with the flow path substrate or the cover substrate. Using a communication hole that communicates the contact surface and the outside air,
With the two hot plates being sandwiched in the thickness direction by the two hot plates so that the positions of the through holes and the openings of the communication holes correspond to each other, The method includes a bonding step of heating and bonding the two substrates.
前記２つの基板として、前記流路に連通する貫通孔が厚さ方向に形成された流路基板と、当該流路基板と加熱接合される接合面で前記貫通孔の一方の開口部を覆うカバー基板とを用い、
前記２枚の熱板のうち、少なくとも一方の熱板として、前記流路基板又は前記カバー基板と当接させたときに、当該流路基板又は当該カバー基板との当接面に開口部を有して当該当接面と外気とを連通する連通孔を有するものを用い、
前記貫通孔と前記連通孔の前記開口部との互いの位置が対応するよう、前記２枚の熱板で前記２つの基板を厚さ方向に挟持させた状態で、前記２枚の熱板によって前記２つの基板を加熱接合する接合工程を備えることを特徴とする。 According to the first aspect of the present invention, in the method of manufacturing a microchip, in which two substrates that are stacked and have a flow path formed inside are sandwiched between two hot plates facing each other and heat bonded.
As the two substrates, a flow channel substrate in which a through hole communicating with the flow channel is formed in the thickness direction, and a cover that covers one opening of the through hole with a bonding surface that is heat-bonded to the flow channel substrate Using the substrate,
When at least one of the two heat plates is brought into contact with the flow path substrate or the cover substrate, an opening is formed on the contact surface with the flow path substrate or the cover substrate. Using a communication hole that communicates the contact surface and the outside air,
With the two hot plates being sandwiched in the thickness direction by the two hot plates so that the positions of the through holes and the openings of the communication holes correspond to each other, The method includes a bonding step of heating and bonding the two substrates.
このマイクロチップの製造方法においては、
前記２枚の熱板として、少なくとも前記カバー基板と当接する一方の熱板に前記連通孔を有するとともに、当該連通孔の前記開口部の孔径Ｘが以下の（１）式を満たすものを用いることが好ましい。 In this microchip manufacturing method,
As the two hot plates, at least one of the hot plates in contact with the cover substrate has the communication hole, and the hole diameter X of the opening of the communication hole satisfies the following expression (1). Is preferred.
前記２枚の熱板として、少なくとも前記カバー基板と当接する一方の熱板に前記連通孔を有するとともに、当該連通孔の前記開口部の孔径Ｘが以下の（１）式を満たすものを用いることが好ましい。 In this microchip manufacturing method,
As the two hot plates, at least one of the hot plates in contact with the cover substrate has the communication hole, and the hole diameter X of the opening of the communication hole satisfies the following expression (1). Is preferred.
Ｘ＜Ｙ ［ｍｍ］ （１）
（但し、Ｙ：前記流路基板の前記貫通孔の孔径［ｍｍ］）
また、このマイクロチップの製造方法においては、
前記２枚の熱板のうち、前記カバー基板と当接する一方の熱板として、前記連通孔の前記開口部の孔径Ｘが以下の（２）式を満たすものを用いることが好ましい。 X <Y [mm] (1)
(However, Y: Hole diameter [mm] of the through hole of the flow path substrate)
Moreover, in this microchip manufacturing method,
Of the two hot plates, it is preferable to use one of the two hot plates that abuts the cover substrate so that the hole diameter X of the opening of the communication hole satisfies the following expression (2).
（但し、Ｙ：前記流路基板の前記貫通孔の孔径［ｍｍ］）
また、このマイクロチップの製造方法においては、
前記２枚の熱板のうち、前記カバー基板と当接する一方の熱板として、前記連通孔の前記開口部の孔径Ｘが以下の（２）式を満たすものを用いることが好ましい。 X <Y [mm] (1)
(However, Y: Hole diameter [mm] of the through hole of the flow path substrate)
Moreover, in this microchip manufacturing method,
Of the two hot plates, it is preferable to use one of the two hot plates that abuts the cover substrate so that the hole diameter X of the opening of the communication hole satisfies the following expression (2).
Ｘ＜Ｙ－０．４ ［ｍｍ］ （２）
また、このマイクロチップの製造方法においては、
前記２枚の熱板のうち、前記カバー基板と当接する一方の熱板として、前記連通孔の前記開口部の孔径Ｘが以下の（３）式を満たすものを用いることが好ましい。 X <Y-0.4 [mm] (2)
Moreover, in this microchip manufacturing method,
Of the two hot plates, it is preferable to use one of the two hot plates that abuts the cover substrate so that the hole diameter X of the opening of the communication hole satisfies the following expression (3).
また、このマイクロチップの製造方法においては、
前記２枚の熱板のうち、前記カバー基板と当接する一方の熱板として、前記連通孔の前記開口部の孔径Ｘが以下の（３）式を満たすものを用いることが好ましい。 X <Y-0.4 [mm] (2)
Moreover, in this microchip manufacturing method,
Of the two hot plates, it is preferable to use one of the two hot plates that abuts the cover substrate so that the hole diameter X of the opening of the communication hole satisfies the following expression (3).
Ｘ＞Ｙ－０．５ ［ｍｍ］ （３）
また、このマイクロチップの製造方法においては、
前記２枚の熱板として、何れにも前記連通孔を有するものを用い、
前記接合工程の前に、
前記２枚の熱板による加熱の際に、前記カバー基板と当接する一方の熱板が有する前記連通孔内の圧力と前記貫通孔内の圧力とが略同一となるよう、前記接合工程における接合条件を設定する条件設定工程を備えることが好ましい。 X> Y-0.5 [mm] (3)
Moreover, in this microchip manufacturing method,
As the two heat plates, one having the communication hole in both,
Before the joining process,
Joining in the joining step so that the pressure in the communication hole and the pressure in the through hole of one of the hot plates in contact with the cover substrate are substantially the same when heated by the two hot plates. It is preferable to provide a condition setting step for setting conditions.
また、このマイクロチップの製造方法においては、
前記２枚の熱板として、何れにも前記連通孔を有するものを用い、
前記接合工程の前に、
前記２枚の熱板による加熱の際に、前記カバー基板と当接する一方の熱板が有する前記連通孔内の圧力と前記貫通孔内の圧力とが略同一となるよう、前記接合工程における接合条件を設定する条件設定工程を備えることが好ましい。 X> Y-0.5 [mm] (3)
Moreover, in this microchip manufacturing method,
As the two heat plates, one having the communication hole in both,
Before the joining process,
Joining in the joining step so that the pressure in the communication hole and the pressure in the through hole of one of the hot plates in contact with the cover substrate are substantially the same when heated by the two hot plates. It is preferable to provide a condition setting step for setting conditions.
本発明の第２の側面によれば、マイクロチップにおいて、
本発明のマイクロチップの製造方法によって製造されたことを特徴とする。 According to a second aspect of the present invention, in a microchip,
It is manufactured by the method for manufacturing a microchip of the present invention.
本発明のマイクロチップの製造方法によって製造されたことを特徴とする。 According to a second aspect of the present invention, in a microchip,
It is manufactured by the method for manufacturing a microchip of the present invention.
本発明の第３の側面によれば、２つの基板を加熱接合するマイクロチップの製造装置において、
互いに対向して前記２つの基板を挟持しつつ加熱接合するとともに、少なくとも一方には、前記基板と当接したときに当該基板との当接面に開口部を有して当該当接面と外気とを連通する連通孔を有する２枚の熱板を備えることを特徴とする。 According to a third aspect of the present invention, in a microchip manufacturing apparatus for heating and bonding two substrates,
Heat bonding is performed while sandwiching the two substrates so as to face each other, and at least one has an opening on the contact surface with the substrate when it contacts the substrate, and the contact surface and the outside air And two hot plates having communication holes that communicate with each other.
互いに対向して前記２つの基板を挟持しつつ加熱接合するとともに、少なくとも一方には、前記基板と当接したときに当該基板との当接面に開口部を有して当該当接面と外気とを連通する連通孔を有する２枚の熱板を備えることを特徴とする。 According to a third aspect of the present invention, in a microchip manufacturing apparatus for heating and bonding two substrates,
Heat bonding is performed while sandwiching the two substrates so as to face each other, and at least one has an opening on the contact surface with the substrate when it contacts the substrate, and the contact surface and the outside air And two hot plates having communication holes that communicate with each other.
本発明の第１の側面によれば、２枚の熱板のうち少なくとも一方の熱板として、基板との当接面に開口部を有して当該当接面と外気とを連通する連通孔を有するものを用い、流路基板の貫通孔と当該連通孔の開口部との互いの位置を対応させた状態で２つの基板を加熱接合するので、２枚の熱板による加熱及びその後の冷却におけるカバー基板と熱板との間隙及び貫通孔内の一方又は両方の空気の膨張・収縮を抑制することができる。したがって、カバー基板の変形を抑えて、寸法精度の低下を防止することができる。
According to the first aspect of the present invention, as at least one of the two heat plates, the communication hole having an opening on the contact surface with the substrate and communicating the contact surface with the outside air The two substrates are heated and bonded in a state where the positions of the through hole of the flow path substrate and the opening of the communication hole correspond to each other, so that heating by two hot plates and subsequent cooling It is possible to suppress the expansion / contraction of one or both of the air in the gap and the through hole between the cover substrate and the hot plate. Therefore, deformation of the cover substrate can be suppressed, and deterioration of dimensional accuracy can be prevented.
また、２枚の熱板として、カバー基板と当接する一方の熱板が有する連通孔の開口部の孔径Ｘが、流路基板の貫通孔の孔径Ｙに対し、Ｘ＜Ｙであり、より好ましくは、Ｘ＜Ｙ－０．４であるものを用いるので、マイクロチップの要接合面に対して、熱板の当接面が接触しない領域の発生を防止することができ、貫通孔周辺部に未接合部が発生することを防止できる。
Further, as the two heat plates, the hole diameter X of the communication hole of one of the heat plates in contact with the cover substrate is more preferably X <Y with respect to the hole diameter Y of the through hole of the flow path substrate. Since X <Y−0.4 is used, it is possible to prevent the occurrence of a region where the contact surface of the hot plate does not come into contact with the required surface of the microchip. Generation | occurrence | production of an unjoined part can be prevented.
これにより、２つの基板の接合強度を低下させることなく、寸法精度の低下を防止することができる。
This makes it possible to prevent a reduction in dimensional accuracy without reducing the bonding strength between the two substrates.
また、カバー基板と当接する一方の熱板として、連通孔の開口部の孔径Ｘが、Ｘ＞Ｙ－０．５であるものを用いるので、２枚の熱板による加熱及びその後の冷却の際に、連通孔の開口部の開口形状に倣った孔径Ｘの僅かな変形痕がカバー基板に残ったとしても、この変形痕の径は流路基板の貫通孔の孔径Ｙと大きな差異がないため、当該変形痕を貫通孔の開口形状に紛れさせて、目立つのを防止することができる。
In addition, since one of the hot plates in contact with the cover substrate has a hole diameter X of the opening portion of the communication hole satisfying X> Y−0.5, the heating by the two hot plates and the subsequent cooling are performed. In addition, even if a slight deformation trace having a hole diameter X following the opening shape of the opening of the communication hole remains on the cover substrate, the diameter of the deformation trace is not significantly different from the hole diameter Y of the through hole of the flow path substrate. It is possible to prevent the deformation trace from being noticeable by being distorted into the opening shape of the through hole.
以下、図面を参照しながら本発明の好ましい実施形態について説明する。
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
図１は本発明に係るマイクロチップ１の上面図であり、図２は図１のＩＶ－ＩＶ断面図であり、図３はマイクロチップ１を構成する樹脂製基板１０の上面図である。
1 is a top view of a microchip 1 according to the present invention, FIG. 2 is a cross-sectional view taken along the line IV-IV of FIG. 1, and FIG. 3 is a top view of a resin substrate 10 constituting the microchip 1.
これらの図に示すように、マイクロチップ１は、互いに貼合わせられた２枚の矩形板状の樹脂製基板１０、２０を備えている。
As shown in these drawings, the microchip 1 includes two rectangular plate- like resin substrates 10 and 20 bonded to each other.
このうち、樹脂製基板１０には、図２、図３に示すように、一方の表面（図２の上面）に直線状の流路用溝１２、１３が形成されている。また、図３に示すように、これら流路用溝１２、１３の両端部には、樹脂製基板１０の厚さ方向に貫通する貫通孔１４がそれぞれ形成されている。なお、本実施の形態においては、樹脂製基板１０における他方の表面（流路用溝１２、１３の形成されていない面）は平滑となっている。また、本実施形態における流路用溝１２と流路用溝１３とは、互いに直交して形成されているが、直交せずに形成されていても良い。また、この樹脂製基板１０は、本発明における流路基板である。
Among these, as shown in FIGS. 2 and 3, the resinous substrate 10 has linear flow channel grooves 12 and 13 formed on one surface (the upper surface in FIG. 2). Further, as shown in FIG. 3, through holes 14 penetrating in the thickness direction of the resin substrate 10 are respectively formed at both ends of the flow path grooves 12 and 13. In the present embodiment, the other surface of the resin substrate 10 (the surface where the channel grooves 12 and 13 are not formed) is smooth. Further, the channel groove 12 and the channel groove 13 in the present embodiment are formed orthogonal to each other, but may be formed without being orthogonal to each other. The resin substrate 10 is a flow path substrate in the present invention.
一方、図２に示すように、樹脂製基板２０は、表面の平滑な部材であり、樹脂製基板１０における流路用溝１２、１３の形成面に対して接合されている。この接合によって樹脂製基板２０は流路用溝１２、１３や貫通孔１４の蓋（カバー）として機能し、樹脂製基板１０の流路用溝１２との間に微細流路１５を、流路用溝１３との間に微細流路１６を、貫通孔１４とで開口部１７を形成している。なお、この樹脂製基板２０は、本発明におけるカバー基板である。
On the other hand, as shown in FIG. 2, the resin substrate 20 is a member having a smooth surface, and is bonded to the formation surface of the flow path grooves 12 and 13 in the resin substrate 10. By this bonding, the resin substrate 20 functions as a cover (cover) for the flow path grooves 12 and 13 and the through hole 14, and the fine flow path 15 is formed between the flow path grooves 12 of the resin substrate 10 and the flow path. A fine channel 16 is formed between the groove 13 and the through hole 14 to form an opening 17. The resin substrate 20 is a cover substrate in the present invention.
ここで、微細流路１５、１６（流路用溝１２、１３）の形状は、分析試料、試薬の使用量を少なくできること、成形金型の作製精度、転写性、離型性などを考慮して、幅、深さともに１０μｍ～２００μｍの範囲内の形状であることが好ましいが、特に限定されるものではなく、マイクロチップの用途によって決めれば良く、また、微細流路１５と微細流路１６とで同じであっても良いし、異なっていても良い。本実施の形態においては、微細流路１５、１６の断面の形状は矩形状となっているが、この形状は１例であり、円形状など、他の形状となっていても良い。
Here, the shape of the microchannels 15 and 16 (channel grooves 12 and 13) takes into consideration the fact that the amount of analysis sample and reagent used can be reduced, the fabrication accuracy of molds, transferability and mold release properties. The width and depth are preferably in the range of 10 μm to 200 μm, but are not particularly limited, and may be determined according to the use of the microchip. And may be the same or different. In the present embodiment, the cross-sectional shape of the microchannels 15 and 16 is a rectangular shape, but this shape is an example, and other shapes such as a circular shape may be used.
また、上述のように樹脂製基板１０の貫通孔１４は流路用溝１２、１３と繋がっているため、この貫通孔１４により形成される開口部１７は微細流路１５、１６に繋がっている。この開口部１７は、ゲル、試料、緩衝液の導入、保存、排出を行うための孔であり、分析装置（図示せず）に設けられたチューブやノズルに接続されて、このチューブやノズルを介してゲルや試料、緩衝液などを微細流路１５、１６に導入したり、微細流路１５、１６から排出したりする。なお、開口部１７（貫通孔１４）の形状は、円形状に限らず、矩形状など、他の様々な形状であっても良い。また、開口部１７（貫通孔１４）の内径は、分析手法や分析装置に合わせれば良く、例えば２ｍｍ程度であることが好ましい。
Since the through hole 14 of the resin substrate 10 is connected to the flow path grooves 12 and 13 as described above, the opening 17 formed by the through hole 14 is connected to the fine flow paths 15 and 16. . The opening 17 is a hole for introducing, storing, and discharging a gel, a sample, and a buffer solution, and is connected to a tube or nozzle provided in an analyzer (not shown). Thus, a gel, a sample, a buffer solution, or the like is introduced into or discharged from the fine channels 15 and 16. Note that the shape of the opening 17 (through hole 14) is not limited to a circular shape, and may be various other shapes such as a rectangular shape. Further, the inner diameter of the opening 17 (through hole 14) may be adjusted to the analysis method or the analysis apparatus, and is preferably about 2 mm, for example.
以上の樹脂製基板１０、２０の形状は、ハンドリング、分析しやすい形状であればどのような形状であっても良いが、例えば正方形、長方形、円形などの形状が好ましい。また、樹脂製基板１０、２０の大きさは、１０ｍｍ角～２００ｍｍ角程度が好ましく、１０ｍｍ角～１００ｍｍ角がより好ましい。また、流路用溝１２、１３が形成された樹脂製基板１０の板厚は、成形性を考慮して、０．２ｍｍ～５ｍｍ程度が好ましく、０．５ｍｍ～２ｍｍがより好ましい。蓋（カバー）として機能する樹脂製基板２０の板厚は、成形性を考慮して、０．２ｍｍ～５ｍｍ程度が好ましく、０．５ｍｍ～２ｍｍがより好ましい。但し、本実施の形態のように樹脂製基板２０に流路用溝を形成しない場合には、樹脂製基板２０として、板状の部材ではなく、フィルム（シート状の部材）を用いても良い。この場合、フィルムの厚さは、３０μｍ～３００μｍであることが好ましく、５０μｍ～１５０μｍであることがより好ましい。また、本実施の形態においては、樹脂製基板２０は、樹脂製基板１０に比べ、板厚が薄くなっている。
The shape of the resin substrates 10 and 20 may be any shape as long as it is easy to handle and analyze. For example, a shape such as a square, a rectangle, and a circle is preferable. The size of the resin substrates 10 and 20 is preferably about 10 mm square to 200 mm square, and more preferably 10 mm square to 100 mm square. Further, the plate thickness of the resin substrate 10 on which the channel grooves 12 and 13 are formed is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. The plate thickness of the resin substrate 20 functioning as a lid (cover) is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. However, when the channel groove is not formed in the resin substrate 20 as in the present embodiment, a film (sheet member) may be used as the resin substrate 20 instead of a plate member. . In this case, the thickness of the film is preferably 30 μm to 300 μm, and more preferably 50 μm to 150 μm. In the present embodiment, the resin substrate 20 is thinner than the resin substrate 10.
また、樹脂製基板１０、２０の材料には樹脂が用いられる。この樹脂としては、成形性（転写性、離型性）が良く、透明性が高く、紫外線や可視光に対する自己蛍光性が低いものが好ましく、例えば熱可塑性樹脂が用いられる。
Also, resin is used as the material for the resin substrates 10 and 20. As this resin, those having good moldability (transferability, releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light are preferable. For example, thermoplastic resins are used.
熱可塑性樹脂としては、例えば、ポリカーボネート、ポリメタクリル酸メチル、ポリスチレン、ポリアクリロニトリル、ポリ塩化ビニル、ポリエチレンテレフタレート、ポリアミド、ポリ酢酸ビニル、ポリ塩化ビニリデン、ポリプロピレン、ポリイソプレン、ポリエチレン、ポリジメチルシロキサン、環状ポリオレフィンなどを用いることが好ましい。特に好ましいのは、ポリメタクリル酸メチル、環状ポリオレフィンを用いることである。なお、樹脂製基板１０と樹脂製基板２０とで、同じ材料を用いても良いし、異なる材料を用いても良い。
Examples of the thermoplastic resin include polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, polyamide, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethylsiloxane, and cyclic polyolefin. Etc. are preferably used. It is particularly preferable to use polymethyl methacrylate and cyclic polyolefin. The resin substrate 10 and the resin substrate 20 may be made of the same material or different materials.
また、流路用溝が形成されない樹脂製基板２０には、熱可塑性樹脂の他、熱硬化性樹脂や紫外線硬化性樹脂などを用いても良い。熱硬化性樹脂としては、ポリジメチルシロキサンを用いることが好ましい。
Further, for the resin substrate 20 in which the channel groove is not formed, a thermosetting resin or an ultraviolet curable resin may be used in addition to the thermoplastic resin. As the thermosetting resin, it is preferable to use polydimethylsiloxane.
また、流路用溝１２、１３の形成される樹脂製基板１０は射出成型法又はプレス成形法によって形成されることが好ましく、流路用溝が形成されていない樹脂製基板２０は押出成形法、Ｔダイ成形法、インフレーション成形法、又はカレンダ成形法などの射出成形法以外の方法によって作製されていても良いし、射出成形法によって作製されていても良い。
The resin substrate 10 on which the channel grooves 12 and 13 are formed is preferably formed by an injection molding method or a press molding method, and the resin substrate 20 on which the channel groove is not formed is an extrusion molding method. It may be produced by a method other than an injection molding method such as a T-die molding method, an inflation molding method, or a calendar molding method, or by an injection molding method.
続いて、上記のマイクロチップ１の製造装置について説明する。
Then, the manufacturing apparatus of said microchip 1 is demonstrated.
図４は、マイクロチップの製造装置（以下、製造装置とする）５の概略構成を示す概念図である。なお、この図では、マイクロチップ１を簡略化して図示している。
FIG. 4 is a conceptual diagram showing a schematic configuration of a microchip manufacturing apparatus (hereinafter referred to as a manufacturing apparatus) 5. In this figure, the microchip 1 is shown in a simplified manner.
この図に示すように、製造装置５は、互いに対向して上下に配設された２枚の熱板５１、５２を備えている。
As shown in this figure, the manufacturing apparatus 5 includes two hot plates 51 and 52 that are disposed vertically opposite to each other.
熱板５１、５２は、樹脂製基板１０、２０を挟持して加熱接合する平板状の部材であり、移動手段５３によって接離方向（図中の上下方向）に移動するようになっている。なお、移動手段５３は、熱板５１、５２をそれぞれ移動させることとしても良いし、一方のみを移動させることとしても良い。このような移動手段５３としては、従来より公知の装置を用いることができる。また、以下の説明においては、熱板５１、５２の間には、樹脂製基板１０が下側、樹脂製基板２０が上側となるように配設されて、これら樹脂製基板１０、２０が挟まれることとして説明する。
The hot plates 51 and 52 are plate-like members that sandwich and heat-bond the resin substrates 10 and 20, and are moved in the contact / separation direction (vertical direction in the figure) by the moving means 53. The moving means 53 may move the hot plates 51 and 52, respectively, or only one of them. As such a moving means 53, a conventionally known apparatus can be used. Further, in the following description, the resin substrate 10 is disposed on the lower side and the resin substrate 20 is disposed on the upper side between the hot plates 51 and 52 so that the resin substrates 10 and 20 are sandwiched between them. This will be explained.
この熱板５１、５２には、連通孔５１０、５２０がそれぞれ形成されている。これら連通孔５１０、５２０は、図に示すように、熱板５１、５２を樹脂製基板２０、１０と当接させたときに、当該樹脂製基板２０、１０との当接面５１ａ、５２ａ（熱板５１の下面，熱板５２の上面）に開口部５１０ａ、５２０ａを有して当該当接面５１ａ、５２ａと外気とを連通するように形成されている。また、開口部５１０ａと開口部５２０ａとは、当接面５１ａ、５２ａ内において、互いに対向する位置に開口しているとともに、樹脂製基板１０、２０を加熱接合する際に各貫通孔１４の位置に配設されるよう、当該貫通孔１４と対応する位置にそれぞれ設けられている。なお、本実施の形態においては、熱板５１、５２の当接面５１ａ、５２ａは、連通孔５１０、５２０以外の部分で平滑となっている。また、連通孔５１０、５２０は、少なくとも何れか一方が形成されていればよい。
In the hot plates 51 and 52, communication holes 510 and 520 are formed, respectively. As shown in the figure, these communication holes 510 and 520 have contact surfaces 51a and 52a (when the hot plates 51 and 52 are brought into contact with the resin substrates 20 and 10, respectively. Opening portions 510a and 520a are provided on the lower surface of the heat plate 51 and the upper surface of the heat plate 52, and the contact surfaces 51a and 52a are communicated with the outside air. Further, the opening 510a and the opening 520a open at positions facing each other in the contact surfaces 51a and 52a, and the positions of the through holes 14 when the resin substrates 10 and 20 are heat-bonded. Are provided at positions corresponding to the through-holes 14 respectively. In the present embodiment, the contact surfaces 51a and 52a of the hot plates 51 and 52 are smooth at portions other than the communication holes 510 and 520. In addition, at least one of the communication holes 510 and 520 may be formed.
また、熱板５１の当接面５１ａに開口した連通孔５１０の開口部５１０ａの孔径Ｘは、その値の上限が、樹脂製基板１０の貫通孔１４の孔径Ｙに対し、好ましくはＸ＜Ｙ［ｍｍ］であり、より好ましくはＸ＜Ｙ－０．４［ｍｍ］である。孔径Ｘの下限は、好ましくはＸ＞Ｙ－０．５［ｍｍ］である。
The upper limit of the hole diameter X of the opening 510a of the communication hole 510 opened on the contact surface 51a of the hot plate 51 is preferably X <Y with respect to the hole diameter Y of the through hole 14 of the resin substrate 10. [Mm], and more preferably X <Y−0.4 [mm]. The lower limit of the pore diameter X is preferably X> Y−0.5 [mm].
なお、ここでは連通孔５１０として円形形状のものを用いて説明しているが、孔の形状は特にこれには限定されない。つまり、円形形状以外であっても、矩形形状や多角形形状の他、貫通孔をオフセットして得た形状などでもよい。また、これらの場合の孔径Ｘは、最も長い対角線の長さをいうものとする。
In addition, although the circular shape is used for the communication hole 510 here, the shape of the hole is not particularly limited to this. That is, even if it is not circular shape, the shape obtained by offsetting a through-hole other than rectangular shape and polygonal shape may be sufficient. Further, the hole diameter X in these cases refers to the length of the longest diagonal line.
続いて、マイクロチップ１の製造方法について説明する。
Subsequently, a manufacturing method of the microchip 1 will be described.
まず、２枚の熱板５１、５２の当接面５１ａ、５２ａに対し、樹脂製基板２０、１０の貼り付きを防止する剥離剤（図示せず）を塗布する（塗布工程）。なお、このような剥離剤としては、従来より公知のものを用いることができる。
First, a release agent (not shown) for preventing the resin substrates 20 and 10 from sticking is applied to the contact surfaces 51a and 52a of the two hot plates 51 and 52 (application process). A conventionally known release agent can be used as such a release agent.
次に、樹脂製基板１０における流路用溝１２、１３の形成面を内側（上側）に向けた状態で樹脂製基板２０、１０を上下に積層し、熱板５１、５２の間に配設する。
Next, the resin substrates 20 and 10 are stacked one above the other with the formation surfaces of the flow path grooves 12 and 13 on the resin substrate 10 facing inward (upper side), and disposed between the hot plates 51 and 52. To do.
次に、移動手段５３に熱板５１、５２を近接させることにより熱板５１、５２で樹脂製基板２０、１０を厚さ方向に挟持させ、この状態で樹脂製基板２０、１０を加圧しながら加熱接合する（接合工程）。
Next, the hot plates 51 and 52 are brought close to the moving means 53 so that the resin substrates 20 and 10 are sandwiched in the thickness direction by the hot plates 51 and 52 while pressing the resin substrates 20 and 10 in this state. Heat joining (joining process).
このとき、樹脂製基板１０の貫通孔１４と、当接面５１ａ、５２ａに開口した熱板５１、５２の連通孔５１０、５２０の開口部５１０ａ、５２０ａとの互いの位置が対応する状態、つまり、貫通孔１４と開口部５１０ａ、５２０ａとが上面視で互いに重なる状態で、熱板５１、５２によって樹脂製基板２０、１０を加熱接合する。但し、本実施の形態においては、貫通孔１４と開口部５１０ａ、５２０ａとが、上面視で略同心となっている。
At this time, the positions of the through holes 14 of the resin substrate 10 and the openings 510a and 520a of the communication holes 510 and 520 of the heat plates 51 and 52 opened in the contact surfaces 51a and 52a correspond to each other, that is, In the state where the through hole 14 and the openings 510a and 520a overlap each other when viewed from the top, the resin substrates 20 and 10 are heat bonded by the hot plates 51 and 52. However, in the present embodiment, the through hole 14 and the openings 510a and 520a are substantially concentric in a top view.
このように、樹脂製基板１０の貫通孔１４と、当接面５１ａに開口した熱板５１の連通孔５１０の開口部５１０ａとの互いの位置が対応した状態で樹脂製基板２０、１０を加熱接合することにより、熱板５１、５２による加熱及びその後の冷却において、貫通孔１４上方の樹脂製基板２０と熱板５１との僅かな間隙内の空気の膨張・収縮を抑制することができる。
In this way, the resin substrates 20 and 10 are heated in a state where the positions of the through hole 14 of the resin substrate 10 and the opening 510a of the communication hole 510 of the heat plate 51 opened on the contact surface 51a correspond to each other. By joining, in the heating by the hot plates 51 and 52 and the subsequent cooling, the expansion / contraction of the air in the slight gap between the resin substrate 20 and the hot plate 51 above the through hole 14 can be suppressed.
また、樹脂製基板１０の貫通孔１４と、当接面５２ａに開口した熱板５２の連通孔５２０の開口部５２０ａとの互いの位置が対応した状態、つまり貫通孔１４と連通孔５２０とが連通した状態で樹脂製基板２０、１０を加熱接合することにより、熱板５１、５２による加熱及びその後の冷却において、貫通孔１４を封止することなく、当該貫通孔１４内の空気の膨張・収縮を抑制することができる。
Further, the positions of the through hole 14 of the resin substrate 10 and the opening portion 520a of the communication hole 520 of the heat plate 52 opened in the contact surface 52a correspond to each other, that is, the through hole 14 and the communication hole 520 By heat-bonding the resin substrates 20 and 10 in a connected state, in the heating by the hot plates 51 and 52 and the subsequent cooling, the expansion / expansion of the air in the through-hole 14 is performed without sealing the through-hole 14. Shrinkage can be suppressed.
ここで、樹脂製基板１０と樹脂製基板２０との接合は、熱圧着又は熱ラミネートなどの加熱溶着によって行われる。樹脂製基板１０、２０に対して熱圧着又は熱ラミネートを施すことにより、樹脂製基板１０、２０の接合面における樹脂が溶融して、樹脂製基板１０と樹脂製基板２０とが接合されてマイクロチップ１が形成される。なお、加熱温度としては、例えば、７０℃～２００℃の温度を用いることができる。
Here, the bonding of the resin substrate 10 and the resin substrate 20 is performed by heat welding such as thermocompression bonding or heat lamination. By applying thermocompression bonding or heat laminating to the resin substrates 10 and 20, the resin on the bonding surface of the resin substrates 10 and 20 is melted, and the resin substrate 10 and the resin substrate 20 are bonded to each other. Chip 1 is formed. As the heating temperature, for example, a temperature of 70 ° C. to 200 ° C. can be used.
次に、移動手段５３に熱板５１、５２を互いに離間させる（離間工程）。
Next, the hot plates 51 and 52 are separated from the moving means 53 (separation step).
そして、熱板５１又は熱板５２に貼り付いた樹脂製基板２０又は樹脂製基板１０を剥離することにより（剥離工程）、マイクロチップ１が製造される。
Then, the microchip 1 is manufactured by peeling the resin substrate 20 or the resin substrate 10 attached to the hot plate 51 or the hot plate 52 (peeling step).
以上のマイクロチップの製造方法によれば、熱板５１、５２による加熱及びその後の冷却において、貫通孔１４上方の樹脂製基板２０と熱板５１との僅かな間隙及び貫通孔１４内の一方又は両方の空気の膨張・収縮を抑制することができるので、樹脂製基板２０の変形を抑えて、寸法精度の低下を防止することができる。
According to the microchip manufacturing method described above, in the heating by the hot plates 51 and 52 and the subsequent cooling, a slight gap between the resin substrate 20 and the hot plate 51 above the through hole 14 and one of the through holes 14 or Since the expansion / contraction of both airs can be suppressed, the deformation of the resin substrate 20 can be suppressed and the reduction of the dimensional accuracy can be prevented.
また、熱板５１の当接面５１ａに開口した連通孔５１０の開口部５１０ａの孔径Ｘは、その値の上限が、樹脂製基板１０の貫通孔１４の孔径Ｙに対し、好ましくはＸ＜Ｙ［ｍｍ］であり、より好ましくはＸ＜Ｙ－０．４［ｍｍ］であるので、マイクロチップ１の要接合面に対して、熱板５１の当接面が接触しない領域の発生を防止することができ、貫通孔１４周辺部に未接合部が発生することを防止できる。
The upper limit of the hole diameter X of the opening 510a of the communication hole 510 opened on the contact surface 51a of the hot plate 51 is preferably X <Y with respect to the hole diameter Y of the through hole 14 of the resin substrate 10. [Mm], and more preferably X <Y−0.4 [mm], thereby preventing the occurrence of a region where the contact surface of the hot plate 51 does not contact the required joint surface of the microchip 1. It is possible to prevent the occurrence of an unjoined portion around the through hole 14.
これにより、樹脂製基板１０、２０の接合強度を低下させることなく、寸法精度の低下を防止することができる。
Thus, it is possible to prevent a reduction in dimensional accuracy without reducing the bonding strength of the resin substrates 10 and 20.
また、熱板５１の当接面５１ａに開口した連通孔５１０の開口部５１０ａの孔径Ｘは、その値の下限が、樹脂製基板１０の貫通孔１４の孔径Ｙに対し、好ましくはＸ＞Ｙ－０．５［ｍｍ］であるので、熱板５１、５２による加熱及びその後の冷却の際に、連通孔５１０の開口部５１０ａの開口形状に倣った孔径Ｘの僅かな変形痕が樹脂製基板２０に残ったとしても、この変形痕の径は樹脂製基板１０の貫通孔１４の孔径Ｙと大きな差異がないため、当該変形痕を貫通孔１４の開口形状に紛れさせて、目立つのを防止することができる。
［変形例］
続いて、本発明に係るマイクロチップの製造方法の変形例について説明する。なお、上記の実施形態と同様の構成要素には同一の符号を付し、その説明を省略する。 Further, the lower limit of the hole diameter X of theopening 510a of the communication hole 510 opened on the contact surface 51a of the hot plate 51 is preferably X> Y with respect to the hole diameter Y of the through hole 14 of the resin substrate 10. Since the thickness is −0.5 [mm], a slight deformation trace of the hole diameter X following the opening shape of the opening 510a of the communication hole 510 is observed during the heating by the hot plates 51 and 52 and the subsequent cooling. 20, since the diameter of the deformation trace is not significantly different from the hole diameter Y of the through hole 14 of the resin substrate 10, the deformation trace is lost to the opening shape of the through hole 14 to prevent it from being noticeable. can do.
[Modification]
Then, the modification of the manufacturing method of the microchip based on this invention is demonstrated. In addition, the same code | symbol is attached | subjected to the component similar to said embodiment, and the description is abbreviate | omitted.
［変形例］
続いて、本発明に係るマイクロチップの製造方法の変形例について説明する。なお、上記の実施形態と同様の構成要素には同一の符号を付し、その説明を省略する。 Further, the lower limit of the hole diameter X of the
[Modification]
Then, the modification of the manufacturing method of the microchip based on this invention is demonstrated. In addition, the same code | symbol is attached | subjected to the component similar to said embodiment, and the description is abbreviate | omitted.
図５に示すように、本変形例におけるマイクロチップの製造装置５Ａは、上記の実施形態における製造装置５の構成に加え、圧力センサ６１、６２と、圧力調整手段７１、７２と、制御手段５４とを備えている。
As shown in FIG. 5, in addition to the configuration of the manufacturing apparatus 5 in the above embodiment, the microchip manufacturing apparatus 5A in the present modification includes pressure sensors 61 and 62, pressure adjusting means 71 and 72, and control means 54. And.
圧力センサ６１、６２は、連通孔５１０、５２０内の各圧力を計測可能なよう熱板５１、５２に配設されている。また、制御手段５４に計測値を出力するよう接続されている。
The pressure sensors 61 and 62 are disposed on the hot plates 51 and 52 so that each pressure in the communication holes 510 and 520 can be measured. Moreover, it connects so that a measured value may be output to the control means 54. FIG.
圧力調整手段７１、７２は、連通孔５１０、５２０の各外気開放口と配管接続されたポンプであり、連通孔５１０、５２０内を加圧・減圧できるようになっている。また、制御手段５４に接続され、その駆動を制御されるようになっている。
The pressure adjusting means 71 and 72 are pumps connected to the open air openings of the communication holes 510 and 520 by pipes so that the insides of the communication holes 510 and 520 can be pressurized and depressurized. Further, it is connected to the control means 54 and its drive is controlled.
制御手段５４は、圧力センサ６１、６２及び圧力調整手段７１、７２と接続され、連通孔５１０、５２０内を所定の圧力とするよう、圧力センサ６１、６２からの計測値に応じて圧力調整手段７１、７２を制御するようになっている。
The control means 54 is connected to the pressure sensors 61 and 62 and the pressure adjustment means 71 and 72, and the pressure adjustment means according to the measured values from the pressure sensors 61 and 62 so that the communication holes 510 and 520 have a predetermined pressure. 71 and 72 are controlled.
続いて、製造装置５Ａによるマイクロチップ１の製造方法について説明する。
Then, the manufacturing method of the microchip 1 by the manufacturing apparatus 5A is demonstrated.
まず、上記の実施形態と同様に、熱板５１、５２の当接面５１ａ、５２ａに対し剥離剤を塗布する（塗布工程）。
First, similarly to the above embodiment, a release agent is applied to the contact surfaces 51a and 52a of the hot plates 51 and 52 (application process).
次に、接合工程における接合条件を設定する（条件設定工程）。この工程では、後工程である接合工程において、熱板５１の連通孔５１０内の圧力と樹脂製基板１０の貫通孔１４内の圧力とが略同一となるように、圧力調整手段７１、７２の駆動状態を決定する。より詳細には、後工程の接合工程と同様に熱板５１、５２で樹脂製基板２０、１０を挟持して加熱し、この状態で制御手段５４に圧力調整手段７１，７２の駆動を制御させることにより、圧力センサ６１と圧力センサ６２との計測値を略同一にする。このとき、圧力センサ６１と圧力センサ６２との計測値が略同一となる圧力調整手段７１、７２の駆動状態を制御手段５４に記憶させておく。
Next, the joining conditions in the joining process are set (condition setting process). In this process, in the joining process, which is a subsequent process, the pressure adjusting means 71 and 72 of the pressure plate 71 and 72 are set so that the pressure in the communication hole 510 of the hot plate 51 and the pressure in the through hole 14 of the resin substrate 10 are substantially the same. Determine the driving state. More specifically, the resin substrates 20 and 10 are sandwiched and heated by the hot plates 51 and 52 in the same manner as in the subsequent bonding step, and in this state, the control unit 54 controls the driving of the pressure adjusting units 71 and 72. Thus, the measured values of the pressure sensor 61 and the pressure sensor 62 are made substantially the same. At this time, the drive state of the pressure adjusting means 71 and 72 where the measured values of the pressure sensor 61 and the pressure sensor 62 are substantially the same is stored in the control means 54.
次に、熱板５１、５２を離間させ（離間工程）、条件設定工程で条件出しに使用したマイクロチップ１を剥離させる（剥離工程）。
Next, the hot plates 51 and 52 are separated (separation process), and the microchip 1 used for setting the conditions in the condition setting process is separated (peeling process).
そして、再び熱板５１、５２の当接面５１ａ、５２ａに対し剥離剤を塗布する（塗布工程）。
Then, a release agent is applied again to the contact surfaces 51a and 52a of the hot plates 51 and 52 (application process).
次に、上記の実施形態と同様に、熱板５１、５２で新たな樹脂製基板２０、１０を挟持して加熱接合する（接合工程）。但し、この加熱接合の際に、制御手段５４により条件設定工程で記憶した圧力調整手段７１、７２の駆動状態を再現させる。これにより、熱板５１の連通孔５１０内の圧力と樹脂製基板１０の貫通孔１４内の圧力とを略同一とした状態で樹脂製基板１０、２０の加熱接合を行うことができる。
Next, similarly to the above-described embodiment, the new resin substrates 20 and 10 are sandwiched by the hot plates 51 and 52 and heat-bonded (bonding step). However, at the time of this heat bonding, the driving state of the pressure adjusting means 71 and 72 stored in the condition setting step is reproduced by the control means 54. Thereby, the heat bonding of the resin substrates 10 and 20 can be performed in a state where the pressure in the communication hole 510 of the hot plate 51 and the pressure in the through hole 14 of the resin substrate 10 are substantially the same.
次に、移動手段５３に熱板５１、５２を互いに離間させる（離間工程）。
Next, the hot plates 51 and 52 are separated from the moving means 53 (separation step).
そして、熱板５１又は熱板５２から樹脂製基板２０又は樹脂製基板１０を剥離させる（剥離工程）。
Then, the resin substrate 20 or the resin substrate 10 is peeled from the hot plate 51 or the hot plate 52 (peeling step).
以上のような製造装置５Ａによるマイクロチップの製造方法によれば、接合工程の前に条件設定工程を設けることにより、接合工程において熱板５１の連通孔５１０内の圧力と樹脂製基板１０の貫通孔１４内の圧力とを略同一にした状態で樹脂製基板１０、２０の加熱接合を行うことができるため、上記実施形態と同様の効果をより確実に得ることができる。
According to the microchip manufacturing method by the manufacturing apparatus 5A as described above, by providing the condition setting step before the bonding step, the pressure in the communication hole 510 of the hot plate 51 and the penetration of the resin substrate 10 in the bonding step. Since the resin substrates 10 and 20 can be heat-bonded in a state where the pressure in the hole 14 is substantially the same, the same effect as in the above embodiment can be obtained more reliably.
また、マイクロチップ１を繰り返し製造する、つまり接合工程を繰り返す場合であっても、条件設定工程は繰り返す必要なく、初回の条件設定工程で決定した圧力調整手段７１、７２の駆動状態を各接合工程で再現することで、上記の効果を繰り返し得ることができる。
Further, even when the microchip 1 is repeatedly manufactured, that is, when the joining process is repeated, the condition setting process does not need to be repeated, and the driving state of the pressure adjusting means 71 and 72 determined in the initial condition setting process is changed to each joining process. By reproducing the above, the above effect can be obtained repeatedly.
なお、本発明は上記の実施形態及び変形例に限定して解釈されるべきではなく、適宜変更・改良が可能であることはもちろんである。
It should be noted that the present invention should not be construed as being limited to the above-described embodiments and modifications, and of course can be changed or improved as appropriate.
例えば、上記実施形態及び変形例では、マイクロチップ１は、流路用溝１２、１３の非形成面が平滑な樹脂製基板１０を備えることとして説明したが、図６に示すような樹脂製基板４０を樹脂製基板１０の代わりに備えることとしても良い。ここで、樹脂製基板４０には、一方の表面に流路用溝１２、１３が形成されており、他方の表面のうち、各貫通孔１４の周囲に円筒状の突起部４１が設けられている。これらの突起部４１は、貫通孔１４を囲んで樹脂製基板４０の厚さ方向に突出しており、分析装置（図示せず）のチューブやノズルに嵌合されて、試料などの導入や排出を行うようになっている。このような突起部４１は円筒状の形状を有していても良いし、多角形状など、他の形状を有していても良い。但し、樹脂製基板４０における流路用溝１２、１３の非形成面に設けられる凹凸部材は、この突起部４１に限定されず、例えば、微細流路内を流れる試料の流動を制御するためのスイッチや、分析装置からの光を集光するためのレンズなどであっても良い。
For example, in the embodiment and the modification described above, the microchip 1 has been described as including the resin substrate 10 in which the non-formation surfaces of the flow path grooves 12 and 13 are smooth, but the resin substrate as illustrated in FIG. 40 may be provided instead of the resin substrate 10. Here, the resin substrate 40 is formed with flow channel grooves 12 and 13 on one surface, and a cylindrical protrusion 41 is provided around each through hole 14 on the other surface. Yes. These protrusions 41 surround the through-holes 14 and protrude in the thickness direction of the resin substrate 40 and are fitted into tubes and nozzles of an analyzer (not shown) to introduce and discharge samples and the like. To do. Such a protrusion 41 may have a cylindrical shape, or may have another shape such as a polygonal shape. However, the concavo-convex member provided on the non-formation surface of the flow path grooves 12 and 13 in the resin substrate 40 is not limited to the protrusion 41, and for example, for controlling the flow of the sample flowing in the fine flow path. It may be a switch or a lens for collecting light from the analyzer.
また、上記の変形例では、条件設定工程を接合工程の前に行うこととして説明したが、接合工程において、熱板５１の連通孔５１０内の圧力と樹脂製基板１０の貫通孔１４内の圧力とが略同一となるよう圧力調整手段７１、７２の駆動を制御してもよい。
In the above modification, the condition setting step is described as being performed before the bonding step. However, in the bonding step, the pressure in the communication hole 510 of the hot plate 51 and the pressure in the through hole 14 of the resin substrate 10 are described. And the driving of the pressure adjusting means 71 and 72 may be controlled so as to be substantially the same.
１ マイクロチップ
５、５Ａ 製造装置（マイクロチップの製造装置）
１０ 樹脂製基板（流路基板）
１４ 貫通孔
２０ 樹脂製基板（カバー基板）
５１、５２ 熱板
５１ａ、５２ａ 当接面
５１０、５２０ 連通孔
５１０ａ、５２０ａ 連通孔の開口部
Ｘ 孔径（連通孔の孔径）
Ｙ 孔径（貫通孔の孔径） 1Microchip 5, 5A Manufacturing equipment (Microchip manufacturing equipment)
10 Resin substrate (channel substrate)
14 Throughhole 20 Resin substrate (cover substrate)
51, 52 Heat plate 51a, 52a Contact surface 510, 520 Communication hole 510a, 520a Communication hole opening X Hole diameter (hole diameter of communication hole)
Y hole diameter (hole diameter of through hole)
５、５Ａ 製造装置（マイクロチップの製造装置）
１０ 樹脂製基板（流路基板）
１４ 貫通孔
２０ 樹脂製基板（カバー基板）
５１、５２ 熱板
５１ａ、５２ａ 当接面
５１０、５２０ 連通孔
５１０ａ、５２０ａ 連通孔の開口部
Ｘ 孔径（連通孔の孔径）
Ｙ 孔径（貫通孔の孔径） 1
10 Resin substrate (channel substrate)
14 Through
51, 52
Y hole diameter (hole diameter of through hole)
Claims (7)
- 積層されて内側に流路を形成した２つの基板を、互いに対向する２枚の熱板で挟持して加熱接合するマイクロチップの製造方法において、
前記２つの基板として、前記流路に連通する貫通孔が厚さ方向に形成された流路基板と、当該流路基板と加熱接合される接合面で前記貫通孔の一方の開口部を覆うカバー基板とを用い、
前記２枚の熱板のうち、少なくとも一方の熱板として、前記流路基板又は前記カバー基板と当接させたときに、当該流路基板又は当該カバー基板との当接面に開口部を有して当該当接面と外気とを連通する連通孔を有するものを用い、
前記貫通孔と前記連通孔の前記開口部との互いの位置が対応するよう、前記２枚の熱板で前記２つの基板を厚さ方向に挟持させた状態で、前記２枚の熱板によって前記２つの基板を加熱接合する接合工程を備えることを特徴とするマイクロチップの製造方法。 In a method of manufacturing a microchip, in which two substrates that are laminated and have a flow path formed inside are sandwiched between two hot plates facing each other and heat bonded,
As the two substrates, a flow channel substrate in which a through hole communicating with the flow channel is formed in the thickness direction, and a cover that covers one opening of the through hole with a bonding surface that is heat-bonded to the flow channel substrate Using the substrate,
When at least one of the two heat plates is brought into contact with the flow path substrate or the cover substrate, an opening is formed on the contact surface with the flow path substrate or the cover substrate. Using a communication hole that communicates the contact surface and the outside air,
With the two hot plates being sandwiched in the thickness direction by the two hot plates so that the positions of the through holes and the openings of the communication holes correspond to each other, A method of manufacturing a microchip, comprising a bonding step of heat-bonding the two substrates. - 請求項１に記載のマイクロチップの製造方法において、
前記２枚の熱板として、少なくとも前記カバー基板と当接する一方の熱板に前記連通孔を有するとともに、当該連通孔の前記開口部の孔径Ｘが以下の（１）式を満たすものを用いることを特徴とするマイクロチップの製造方法。
Ｘ＜Ｙ ［ｍｍ］ （１）
（但し、Ｙ：前記流路基板の前記貫通孔の孔径［ｍｍ］） In the manufacturing method of the microchip of Claim 1,
As the two hot plates, at least one of the hot plates in contact with the cover substrate has the communication hole, and the hole diameter X of the opening of the communication hole satisfies the following expression (1). A manufacturing method of a microchip characterized by the above.
X <Y [mm] (1)
(However, Y: Hole diameter [mm] of the through hole of the flow path substrate) - 請求項２に記載のマイクロチップの製造方法において、
前記２枚の熱板のうち、前記カバー基板と当接する一方の熱板として、前記連通孔の前記開口部の孔径Ｘが以下の（２）式を満たすものを用いることを特徴とするマイクロチップの製造方法。
Ｘ＜Ｙ－０．４ ［ｍｍ］ （２） In the manufacturing method of the microchip of Claim 2,
Of the two heat plates, a microchip using one of the two heat plates that contacts the cover substrate and having a diameter X of the opening of the communication hole satisfying the following expression (2): Manufacturing method.
X <Y-0.4 [mm] (2) - 請求項２又は３に記載のマイクロチップの製造方法において、
前記２枚の熱板のうち、前記カバー基板と当接する一方の熱板として、前記連通孔の前記開口部の孔径Ｘが以下の（３）式を満たすものを用いることを特徴とするマイクロチップの製造方法。
Ｘ＞Ｙ－０．５ ［ｍｍ］ （３） In the manufacturing method of the microchip of Claim 2 or 3,
Of the two heat plates, a microchip using one of the two heat plates that contacts the cover substrate and having a diameter X of the opening of the communication hole satisfying the following expression (3): Manufacturing method.
X> Y-0.5 [mm] (3) - 請求項１から４の何れか一項に記載のマイクロチップの製造方法において、
前記２枚の熱板として、何れにも前記連通孔を有するものを用い、
前記接合工程の前に、
前記２枚の熱板による加熱の際に、前記カバー基板と当接する一方の熱板が有する前記連通孔内の圧力と前記貫通孔内の圧力とが略同一となるよう、前記接合工程における接合条件を設定する条件設定工程を備えることを特徴とするマイクロチップの製造方法。 In the manufacturing method of the microchip as described in any one of Claim 1 to 4,
As the two heat plates, one having the communication hole in both,
Before the joining process,
Joining in the joining step so that the pressure in the communication hole and the pressure in the through hole of one of the hot plates in contact with the cover substrate are substantially the same when heated by the two hot plates. A microchip manufacturing method comprising a condition setting step for setting conditions. - 請求項１から５の何れか一項に記載のマイクロチップの製造方法によって製造されたことを特徴とするマイクロチップ。 A microchip manufactured by the method for manufacturing a microchip according to any one of claims 1 to 5.
- ２つの基板を加熱接合するマイクロチップの製造装置において、
互いに対向して前記２つの基板を挟持しつつ加熱接合するとともに、少なくとも一方には、前記基板と当接したときに当該基板との当接面に開口部を有して当該当接面と外気とを連通する連通孔を有する２枚の熱板を備えることを特徴とするマイクロチップの製造装置。 In a microchip manufacturing apparatus that heat-bonds two substrates,
Heat bonding is performed while sandwiching the two substrates so as to face each other, and at least one of the two substrates has an opening in the contact surface with the substrate, and the contact surface and the outside air A microchip manufacturing apparatus comprising two hot plates having communication holes communicating with each other.
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| JP2010523819A JP5251983B2 (en) | 2008-08-08 | 2009-07-16 | Microchip manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013044528A (en) * | 2011-08-22 | 2013-03-04 | Sumitomo Bakelite Co Ltd | Microchannel device |
| JP2014006049A (en) * | 2012-06-21 | 2014-01-16 | Sumitomo Bakelite Co Ltd | Method for manufacturing micro flow channel chip |
| FR3071763A1 (en) * | 2017-09-29 | 2019-04-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | METHOD FOR MANUFACTURING A MICROFLUIDIC CARD |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006225197A (en) * | 2005-02-17 | 2006-08-31 | Nippon Sheet Glass Co Ltd | Method of manufacturing micro-chemical chip |
| JP2008030285A (en) * | 2006-07-28 | 2008-02-14 | Nidec Sankyo Corp | Method for producing junction article made of resin |
-
2009
- 2009-07-16 JP JP2010523819A patent/JP5251983B2/en not_active Expired - Fee Related
- 2009-07-16 WO PCT/JP2009/062879 patent/WO2010016370A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006225197A (en) * | 2005-02-17 | 2006-08-31 | Nippon Sheet Glass Co Ltd | Method of manufacturing micro-chemical chip |
| JP2008030285A (en) * | 2006-07-28 | 2008-02-14 | Nidec Sankyo Corp | Method for producing junction article made of resin |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013044528A (en) * | 2011-08-22 | 2013-03-04 | Sumitomo Bakelite Co Ltd | Microchannel device |
| JP2014006049A (en) * | 2012-06-21 | 2014-01-16 | Sumitomo Bakelite Co Ltd | Method for manufacturing micro flow channel chip |
| FR3071763A1 (en) * | 2017-09-29 | 2019-04-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | METHOD FOR MANUFACTURING A MICROFLUIDIC CARD |
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| JP5251983B2 (en) | 2013-07-31 |
| JPWO2010016370A1 (en) | 2012-01-19 |
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