WO2010013992A1 - Bobine hélicoïdale en ruban mince flexible - Google Patents

Bobine hélicoïdale en ruban mince flexible Download PDF

Info

Publication number
WO2010013992A1
WO2010013992A1 PCT/MY2008/000077 MY2008000077W WO2010013992A1 WO 2010013992 A1 WO2010013992 A1 WO 2010013992A1 MY 2008000077 W MY2008000077 W MY 2008000077W WO 2010013992 A1 WO2010013992 A1 WO 2010013992A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
substrate
limited
ribbon
thin
Prior art date
Application number
PCT/MY2008/000077
Other languages
English (en)
Inventor
Eng Siang Koh
Original Assignee
Eng Siang Koh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eng Siang Koh filed Critical Eng Siang Koh
Priority to PCT/MY2008/000077 priority Critical patent/WO2010013992A1/fr
Publication of WO2010013992A1 publication Critical patent/WO2010013992A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/20—Resilient mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal

Definitions

  • This invention relates to a device for transmitting data information through radio frequency in wireless application; magnetic flux generation in confined space; common use in electronic circuitry such as inductor and choke coil.
  • a three-dimensional helical coil provides a more stable and reliable inductance suitable for high and low frequency application.
  • signal transmitting distance is depending on the coil's length over diameter; helical coil is still widely used in such as walkie-talkie antenna. But due to its space requirement; the present helical coil design is only suitable for more bulky device.
  • Metallic alloy such as nickel alloy of permalloy for example; and many other alloys such as amorphous and nanocrystalline; all having very superb permeability suitable for inductors and transformers improvement.
  • Such metallic alloy exists in ribbon form that is as thin as 15 micrometer or even lesser. In this new method of inductor and transformer manufacturing process that is going to be demonstrated, powder form and ribbon strip form of the metallic alloy shall be used.
  • a thin flexible substrate is needed to hold the wire windings.
  • a polymer base material is used as the substrate.
  • the strip is a flexible polymer ribbon that is very thin, can be as thin as 15 micrometer or lesser. Copper tracks are printed at one end of the strip.
  • the polymer is then printed with inductive enhancing material such as ferrite or amorphous powder on both sides. Thin layers of varnish are then printed on both sides of the substrate surface.
  • a ribbon of thin flexible substrate is completed and ready for next wire winding process.
  • the choice is open as to whether or not the substrate is to be printed with inductive enhancing compound; depending very much on application requirement.
  • a method is to wind an air coil with hollow internal space, attached to substrate on one side of the internal wall. Hollow internal space was created due to mandrel effect just like common air coil of large wire diameter. In this winding process, it is important to bond the wire winding to substrate before the wire winding exiting the mandrel.
  • the bonding process of wire to the substrate is achieved by heating up the varnish on the substrate and or the wire and then cooling it down. Alternatively, it could be cured by alcohol provided that the varnish coated on the wire and or the substrate is an alcohol-cured material. After The winding and the substrate exits from the mandrel, the opposite side of the coil wall that is not attached to the substrate is then press flat onto the substrate; and a second curing process is carried out. This flattening process causes the wire to be slanting (113). This laying flatten of wire winding process complete a first stage coil strip ribbon design (as in Fig. 2b); that is suitable for various kind of application.
  • the second curing process of flattening of wire is unique from conventional winding process on rigid core material that does not have a second curing process.
  • Conventional method winds the metallic wire directly to the final shape tightly against the bobbin or core; but can only be done if the core is bulky and rigid.
  • Such a coil strip is on its own, already able to function as an inductor, an antenna for radio frequency signal transmission.
  • Fig. 2b a mini low profile transformer given that a few coil strips are coupled together to form primary coil set and secondary coil set and so on.
  • the substrate is preferred to be printed with inductive enhancing compound such as ferrite powder compound of manganese zinc or nickel zinc; amorphous metallic alloy powder and nanocrystalline metallic alloy powder. If metallic ribbon strip is to be the substrate such as nanocrystalline alloy ribbon strip, then it is necessary to insulate the substrate by flexible non conductive material such as polymer base encapsulation for protection on wire.
  • a single coil strip is sufficient to act as the antenna.
  • helical shape may have its disadvantage.
  • the north and south pole of the antenna is rather weak in signal transmission.
  • a second coil strip ribbon or plurality of coil strips ribbon are placed perpendicular to the first coil strip or any other most suitable orientation such as a right angle L or T; Start and Delta combination.
  • the terminals of the coil strips are then interconnected in series, in parallel; or in a connection that form a center tap terminal with other two end terminals in a form of like a primary and secondary looping.
  • two substrates are aligned in series on the winding machine mandrel.
  • the substrates are inside one single air coil; leaving a larger winding pitch at the center where the substrates are joined and after completing pressing flat and the second curing process, the two substrate are then split and laid perpendicularly or any other suitable orientation.
  • it is similar to having two coil strips connected in series and the joining terminal wires of the two ribbon coils may become a center tap terminal. It is not limited to only two coil strips placement; a plurality of coil strips may be used to form various orientations that are necessary to obtain optimal performance.
  • the substrate is preferred to have inductive enhancing compound printed on it or a nanocrystalline alloy flexible metallic base ribbon; and the substrates are laid with ends overlapping one to the other.
  • a substrate or one of the substrates shall have a space allocated for integrated circuitry die attachment (120). Chip on board process of RFID chip die attachment together with wire bonding is then completed with epoxy moulding protection on the RFID chip. The plurality of coil strips are then lay onto adhesive thin label. Another thin layer of polymer is applied with adhesive is laid to cover the plurality antenna strips for protection purpose; follow by a layer of anti-stick paper laid to protect the exposed adhesive. This completes the whole design of RFID tag label sticker. By peeling off this anti-stick paper, the RFID tag sticker can be stick onto any clean surface.
  • Fig. 4 and Fig. 5 Both structures are a super low profile, flexible thin ribbon transformer. This design structure is more robust as the transformer is more resistance to drop breakage.
  • the conventional type low profile is usually built with soft ferrite core and it has the limitation to the core thickness. The Ferrite core is not able to withstand drop impact. It breaks easily.
  • a better method to construct a miniaturize transformer can also be achieved without external two stacks of ribbon substrates layers (129, 130) as demonstrated above. It is achieved by means of forming a complete looping shape core of ribbon substrates. In this method, the ribbon substrates layers are laid in the zigzag manner in air coil. The ribbon substrates could be arranged zigzag in every alternate ribbon substrate or every plurality of ribbon substrates of equal number (139, 140, 141 & 142) as in Fig. 6a. It is possible to have a single thin ribbon substrate provided that the substrate has very good permeability. The beauty of this design is that the wire winding process is linear whereby the winding process is much faster than conventional toroidal winding process.
  • the ribbon substrates that have flexibility property are bended into including but not limited to a round, a square or a rectangular shape; joining up the two zigzag ends of the ribbon substrates.
  • the joint location (144) is then bonded together by adhesive or epoxy compound.
  • the joining point may not be necessary in zigzag mannered, it could be in a simple two steps (139, 140) only.
  • the air gap (144) is drawn just for demonstration of joining point. In transformer application, it would be best not to have air gap and that the substrate ends are touching each other. To achieve this, the length of every piece of the substrates is slightly different. The one that is located at the inner circle will be shortest and the outer circle is the longest piece of substrate.
  • This miniature transformer design differentiate itself from common toroidal transformer is that the traditional method will have to form a round multi-layer ring coiling of a single long strip of substrate and follows with a slow wire winding process. Machine winding is difficult on traditional method when the toroidal core inner diameter is very small, in most case slow wire winding has to be done manually when the inner diameter of the core does not has enough space to accommodate the machine winding ring.
  • the new method of production process does not face this limitation.
  • This new design provides a way to mass production of the miniature transformer or in another word: a miniature voltage converter.
  • the miniature transformer is lesser flexible as the ribbon has been jointed up to form a ring.
  • it stills carry a little features of flexibility, due to the fact that the original substrate is flexible.
  • the shape can be changed to suit its environment to certain extend such as square and rectangular shape.
  • the coil design is suitable to be used as fluorescent lamp ballast.
  • ballast choke coil given that silicon steel is used as the substrate, in most cases, the plate would be thicker and the size of the coil is no longer miniature. It would probably ends up more bulky. However, the size of the coil will be smaller than the common resistance type fluorescent lamp ballast. This is the result of a round loop design.
  • the high permeability flexible ribbon substrate opens up a new production method; that has break free from the boundaries that existed in the conventional choke coil production method.
  • One additional important advantage of this design is that the choke coil noise is minimized. This is due to the reason that the original substrate is straight; when it is purposely bend, the inner ring will have a natural force pushing the next outer ring and so on. Therefore, every piece of the substrate in a way is automatically tightly packed as long as the most outer ring of the substrate is held in shape by a housing or collar such as 163, 164 in Fig. 7.
  • Fig. 1 illustrates a simple construction of a piece of ribbon substrate.
  • 101 being the thin ribbon polymer;
  • 102, 103, 104, 105 & 106 are groves for hooking wire during winding.
  • 107 is inductance enhancing compound printing on top and
  • 108 is inductance enhancing compound printing at the bottom surface of the substrate 109, 110 are preprinted solder pad.
  • Fig. 2 illustrates a wire winding method on flexible thin ribbon substrate from Fig. 1.
  • Fig. 2b shows a view of wire windings being press down flattened in slanting manner and bonded onto the substrate.
  • Fig. 3 illustrates a further variation from Fig. 2 design. It demonstrates two substrates in one winding process that construct a RFID strip.
  • Fig. 3a illustrates two pieces of substrates 117, 118; aligned in series leaving a gap 119 such that the wire excess is longer at this position.
  • Track 121, 122 links the solder pads to RFID chip die (120) soldering point that is embedded in the epoxy that protect the RPID chip die.
  • Enameled wire 123 laid inside of the wire windings.
  • Fig. 3b illustrates a possible orientation of two substrates with one substrate end overlapping the other.
  • Wire .124 being the bent shape of wire 123, hooked onto the groove of the first substrate.
  • Fig. 4 illustrates a method of constructing a flexible low profile miniature transformer.
  • Fig. 4a shows four pieces of flexible ribbon nanocrystalline substrate (125) insulated with a shrinkable tube, polymer tape or flexible epoxy coating (126); wound with wire also created hollow space due to mandrel effect. A few center taps of wire CAi, CA2 up to CAN are pulled out for multi-steps of voltage tapping.
  • Fig. 4b shows hollow space being eliminated by pressing flat the wire winding in slanting manner and bonded the wire to the substrate. Two pieces of polymer insulation (127, 128) each one on top and bottom is laid to protect the wire winding.
  • Fig. 4c shows additional two pieces of nanocrystalline substrates stacks on top (129) and another two pieces at the bottom (130); both bend at location 131, 132 and 134, 134 respectively for wire and insulation clearance. Two ends of the substrates are being held together by shrinkable tube collars (135, 136).
  • the assembly can be seated on the polymer casing ready with plurality of pin terminals for soldering.
  • Assembly of Fig. 4c may be encased by a metal case; whereby the two ends shrinkable tube (135 & 136) may not be needed anymore. However, doing so will result in the low profile transformer to lose its flexibility.
  • Fig. 5 illustrates alternative method of thin flexible profile transformer design making use of part of design structure in Fig. 4a; resulted in extra low profile design.
  • Fig. 5a illustrates the external square collar substrates. 171 being part of design in Fig. 4a which is already flattened the wire; being inserted into collar substrate 172. Air Gap 173 & 174 has to be minimized. The gap 173 & 174 between the substrate ribbon is filled up with flexible adhesive such as polyurethane adhesive or synthetic rubber adhesive mixed with inductive enhancing compound.
  • flexible adhesive such as polyurethane adhesive or synthetic rubber adhesive mixed with inductive enhancing compound.
  • Fig. 5b illustrates 4 pieces of substrate strip 175, 176, 177, 178 guiding the assembly in place to enhance magnetic flux flow; and shrinkable tube collar 179 & 180 aligning and holding the thin and flexible assembly.
  • Fig. 5 c illustrates structure of polymer case ready with solder pin pad CBi 5 CB2 up to CBN.
  • the solder pin pad is a C cap; 177 demonstrate the shape before the protruding bottom portion of the C cap is bent in as show by the arrow to form into the shape of pad CBi, CB2 up to CBN.
  • Fig. 5b The assembly illustrated in Fig. 5b by itself is a complete miniature transformer; or it could be fitted onto the polymer case of Fig. 5 c for easy soldering onto printed circuit board.
  • structure Fig. 5b could be embedded in an end product casing even if the end product casing shape is curvy, leaving the terminals wires protruding out of the casing for soldering onto the printed circuit board.
  • Fig. 6 illustrates another method of constructing a complete looping miniature transformer.
  • Fig. 6a shows four stacks of substrates (139, 140, 141, 142), with two pieces of substrates per stack. In actual fact, more pieces of substrate can be packed in every stack as each piece of the substrate is a very thin ribbon as thin as less than 15 micrometer.
  • Stacks of substrate are insulated by shrinkable tube, polymer tape or flexible epoxy coating (143) to form a multi-layer substrates core.
  • the core is wound with wire also created hollow space due to mandrel effect. A few center taps of wire CCi, CC2 up to CCN are pulled out for multi-steps of output voltage tapping.
  • Fig. 6b shows after the wire winding is flattened slanting and bonded to the substrate; the core is bent round to joint the two ends of the substrate as in joint 144.
  • the assembly can be seated on the polymer casing ready with plurality of pin terminals for soldering and the epoxy encapsulation is applied to fill up the cavity just like a common current sense coil.
  • Fig. 7 illustrates a method to make used of the design illustrated in Fig. 5 to produce a choke coil.
  • Fig. 7a illustrates 2 similar packs of substrate stacks 150, 151 but arranged in two steps.
  • Insulation 153 is completed at the center by shrinkable tube, flexible epoxy coating or polymer adhesive tape.
  • Plurality of bobbin or bobbin-less coils (example: two units as in drawing) are inserted. Both ends bend upward as in 157, 158 creating curve shape at 153.
  • the curve-shape 159 is maintained by a metal or polymer collar such as item 164 that is illustrated in Fig. 6c.
  • the two ends of the substrates are than insulated by shrinkable tube, flexible epoxy coating or polymer adhesive tape. After which, the two ends are bend either to form circle shape as in Fig. 7b or 7c; depending on the original length of the substrate and its arrangement. '
  • Fig. 7b illustrates a bent result from the substrate stacks different length of arrangement 150, 151 in Fig. 6a.
  • the two bent ends merged in to eliminate air gap.
  • a similar collar 164 shape will be needed to hold the two ends in shape.
  • Adhesive or flexible epoxy is applied on the matching ends of the substrates to hold the substrate to the collar.
  • Fig. 7c illustrates a bent result of single substrate stack 150 and the two ends are purposely maintains a sufficient air gap (162) to cater for current saturation effect. If necessary, the two ends of the substrates are cut such that the edges are even flatness.
  • a collar as in item 163 shape is used to maintain the curvy shape and air gap.
  • adhesive or flexible epoxy is applied on the near-matching ends of the substrates with " an air gap to hold the substrate to the collar.
  • Collar 164 is used to shape the other ends. And in the case of no air gap, then 2 units of collar 164 are used to maintain the bent shape of the substrates.
  • the collar 163 & 164 is used to maintain the bent shape of the substrate in Fig. 6b as well; whereas in this case, the collars may be touching each other and can be bonded together or a mould part of feature 163 and 164 or 2 units of 164 being mould into a single piece.
  • Fig. 8a illustrate the structure 181 (design as in Fig. 5b) with tapped out wires of CAi, CA2 up to CAN soldered to terminals of a metal stamping parts such as lead frame 182. Note that structure in Fig. 5b may be replaced by structure Fig. 4c.
  • Lead frame 182 is a thin stamped metal pre-tinted for improving solder ability; consist of plurality of cut pin strips of 183, 184 and 186 to 194. Structure 181 is place on two individual short pin strips 183 and 184. Pin strips 183 & 184 are bent a groove at the bottom to evade shrinkable tube such that both 183 & 184 touches the flexible ribbon strip of assembly 181 (substrate of 171 & 172 of Fig. 5a). 183 & 184 are bonded to the assembly 181 with heat conductive adhesive. Epoxy 185 is applied to bond the pin strip 184 to the structure 181; and another epoxy is applied to bond the pin strip 183 to structure 181. All terminal wires are pre-soldered, then hooked onto the pin strips 186 to 194, and soldered.
  • Fig. 8b illustrates the moulded product of miniature low profile transformer in the form of a module package just like a normal integrated circuitry chip.
  • the assembly structure of lead frame 182 and structure 181 is moulded with polymer compound in the injection mould machine.
  • Excess strip of 183, 184 are cut off after moulded as shown by 197.
  • the terminal pin strips 186 to 194 are cut and bent as shown by 198, a cut terminal pin and 199 shows the next process of bending. Bottom part of the pins 186 to 194 are exposed, suitable for soldering the terminals to the printed circuit board.
  • Excessive lead frame strip 183 & 184 (as in 197 shape) can be soldered to printed circuit board for dissipating heat from the miniature transformer.

Landscapes

  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention porte sur une bobine en ruban mince hélicoïdale flexible qui est construite par enroulement d'un film métallique sur le substrat en ruban qui est fixé à un mandrin. Un processus d'enroulement de fil crée un espace creux qui est éliminé par un processus d'aplatissement. La bobine en ruban est mince et flexible. Parce qu'il s'agit d'une bobine hélicoïdale, la bobine est tridimensionnelle. Cependant, la caractéristique mince et flexible amène la bobine en ruban à ressembler à une bobine plane bidimensionnelle. Elle est miniature, mais génère un flux magnétique bien plus fort qu'une bobine plane. Le concept de mise au point de bobine en ruban peut être amélioré par de nombreux autres processus et permettre d'obtenir de nombreuses autres bobines plus compliquées pour diverses applications. Avec une telle caractéristique mince et flexible, davantage d'espaces de dispositif sans fil miniaturisé et une miniaturisation supplémentaire de divers produits peuvent être explorés.
PCT/MY2008/000077 2008-07-31 2008-07-31 Bobine hélicoïdale en ruban mince flexible WO2010013992A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/MY2008/000077 WO2010013992A1 (fr) 2008-07-31 2008-07-31 Bobine hélicoïdale en ruban mince flexible

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/MY2008/000077 WO2010013992A1 (fr) 2008-07-31 2008-07-31 Bobine hélicoïdale en ruban mince flexible

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WO2010013992A1 true WO2010013992A1 (fr) 2010-02-04

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102799845A (zh) * 2012-05-29 2012-11-28 湖南爱瑞杰科技发展股份有限公司 远距离感应系统及方法
ES2428465A1 (es) * 2013-08-12 2013-11-07 Premo, S.L. Antena monolítica
WO2014142345A1 (fr) * 2013-03-15 2014-09-18 Ricoh Company, Ltd. Dispositif d'antenne
JP2014195137A (ja) * 2013-03-28 2014-10-09 Ricoh Co Ltd アンテナ装置
US9519037B2 (en) 2011-11-10 2016-12-13 Mayo Foundation For Medical Education And Research Spatially coincident MRI receiver coils and method for manufacturing
EP3073573A4 (fr) * 2013-11-18 2017-06-21 Ricoh Company, Ltd. Procédé de fabrication d'antenne bobine et procédé de fabrication de corps de montage d'antenne bobine
CN107257014A (zh) * 2013-08-09 2017-10-17 胜美达集团株式会社 天线线圈部件
CN108365325A (zh) * 2017-12-28 2018-08-03 中国电子科技集团公司第二十研究所 一种低频导航小型化磁阵列
EP3579336A1 (fr) * 2018-06-08 2019-12-11 Sivantos Pte. Ltd. Antenne ainsi qu'appareil doté d'une telle antenne
US11292135B2 (en) 2018-05-31 2022-04-05 Mako Surgical Corp. Rotating switch sensor for a robotic system
CN114709073A (zh) * 2019-08-31 2022-07-05 深圳硅基仿生科技有限公司 平面线圈的绕制方法
US11864852B2 (en) 2015-07-01 2024-01-09 Mako Surgical Corp. Robotic systems and methods for tool path generation and control based on bone density

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1601051A2 (fr) * 2002-06-27 2005-11-30 Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho Antenne cadre monopuce à plusieurs axes
US20060022886A1 (en) * 2003-01-23 2006-02-02 Herbert Hein Antenna core

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1601051A2 (fr) * 2002-06-27 2005-11-30 Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho Antenne cadre monopuce à plusieurs axes
US20060022886A1 (en) * 2003-01-23 2006-02-02 Herbert Hein Antenna core

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9519037B2 (en) 2011-11-10 2016-12-13 Mayo Foundation For Medical Education And Research Spatially coincident MRI receiver coils and method for manufacturing
CN102799845A (zh) * 2012-05-29 2012-11-28 湖南爱瑞杰科技发展股份有限公司 远距离感应系统及方法
WO2014142345A1 (fr) * 2013-03-15 2014-09-18 Ricoh Company, Ltd. Dispositif d'antenne
US10164337B2 (en) 2013-03-15 2018-12-25 Ricoh Company, Ltd. Antenna device
JP2014195137A (ja) * 2013-03-28 2014-10-09 Ricoh Co Ltd アンテナ装置
CN107257014A (zh) * 2013-08-09 2017-10-17 胜美达集团株式会社 天线线圈部件
CN107257014B (zh) * 2013-08-09 2021-01-26 胜美达集团株式会社 天线线圈部件
WO2015022000A1 (fr) * 2013-08-12 2015-02-19 Premo, S.L. Dispositif d'antenne et adaptateur pour un dispositif d'antenne
ES2428465A1 (es) * 2013-08-12 2013-11-07 Premo, S.L. Antena monolítica
EP3073573A4 (fr) * 2013-11-18 2017-06-21 Ricoh Company, Ltd. Procédé de fabrication d'antenne bobine et procédé de fabrication de corps de montage d'antenne bobine
US11864852B2 (en) 2015-07-01 2024-01-09 Mako Surgical Corp. Robotic systems and methods for tool path generation and control based on bone density
CN108365325A (zh) * 2017-12-28 2018-08-03 中国电子科技集团公司第二十研究所 一种低频导航小型化磁阵列
CN108365325B (zh) * 2017-12-28 2020-02-07 中国电子科技集团公司第二十研究所 一种低频导航小型化磁阵列
US11292135B2 (en) 2018-05-31 2022-04-05 Mako Surgical Corp. Rotating switch sensor for a robotic system
US12059812B2 (en) 2018-05-31 2024-08-13 Mako Surgical Corp. Rotating switch sensor for a robotic system
US10893368B2 (en) 2018-06-08 2021-01-12 Sivantos Pte. Ltd. Antenna and device with such an antenna
CN110581346A (zh) * 2018-06-08 2019-12-17 西万拓私人有限公司 天线和具有天线的设备
EP3579336A1 (fr) * 2018-06-08 2019-12-11 Sivantos Pte. Ltd. Antenne ainsi qu'appareil doté d'une telle antenne
CN114709073A (zh) * 2019-08-31 2022-07-05 深圳硅基仿生科技有限公司 平面线圈的绕制方法
CN114709073B (zh) * 2019-08-31 2024-05-17 深圳硅基仿生科技股份有限公司 平面线圈的绕制方法

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