WO2009157193A1 - Wafer frame - Google Patents

Wafer frame Download PDF

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Publication number
WO2009157193A1
WO2009157193A1 PCT/JP2009/002895 JP2009002895W WO2009157193A1 WO 2009157193 A1 WO2009157193 A1 WO 2009157193A1 JP 2009002895 W JP2009002895 W JP 2009002895W WO 2009157193 A1 WO2009157193 A1 WO 2009157193A1
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WO
WIPO (PCT)
Prior art keywords
lid
ceiling
wafer frame
upper lid
lower lid
Prior art date
Application number
PCT/JP2009/002895
Other languages
French (fr)
Japanese (ja)
Inventor
有泉孝
尾内真一
阿部正広
福田泰隆
豊岡高明
Original Assignee
Ｊｆｅテクノリサーチ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Ｊｆｅテクノリサーチ株式会社 filed Critical Ｊｆｅテクノリサーチ株式会社
Publication of WO2009157193A1 publication Critical patent/WO2009157193A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports

Definitions

  • the present invention relates to a frame (hereinafter referred to as a wafer frame) used for a processing operation (for example, dicing, expanding, etc.) or a transfer operation of a wafer (for example, a semiconductor wafer, a glass substrate wafer, etc.).
  • a processing operation for example, dicing, expanding, etc.
  • a transfer operation of a wafer for example, a semiconductor wafer, a glass substrate wafer, etc.
  • the wafer frame 10 for a semiconductor wafer is a metal wafer frame 10 that normally accommodates a semiconductor wafer W having a diameter of 150 mm (6 inches) to 300 mm (12 inches) shown in FIG. 20, and a dicing for holding the semiconductor wafer in the frame.
  • the film 31 is attached to the back surface of the wafer frame 10 in a peelable manner.
  • the semiconductor wafer W stuck on the dicing film 31 (FIG. 20) is cut (diced) into a plurality of dies D by the diamond blade 30 of the dicing machine.
  • FIG. 22 is a schematic view of a storage container (cassette) 9 in which a part of the storage container is enlarged.
  • the wafer frame 10 uses a conventional stainless steel plate (thickness of about 1.5 mm) cut into a predetermined shape (so-called solid material), the weight of the wafer frame 10 is a relatively large value.
  • the total weight of the (cassette) 9 is 18 kg or more in a 25-inch set for the 12 inch wafer frame 10, which is a heavy burden on the operator who transports and sets the storage container (cassette) 9 to the dicing machine. .
  • Patent Document 1 discloses a wafer frame made of resin. According to this technology, it is possible to reduce the weight of the wafer frame, but since resin is used, it is necessary to make the thickness thicker than the conventional material thickness of 1.5 mm in order to maintain rigidity, and it should be used for a long time. There is a problem that the characteristics change depending on. Furthermore, since heat is applied to the entire frame when the wafer is removed from the dicing film, the wafer frame is also required to have heat resistance.
  • An object of the present invention is to provide a lightweight wafer frame that prevents changes in characteristics and has sufficient rigidity and heat resistance.
  • the present invention provides a wafer frame and a method for manufacturing the wafer frame, comprising:
  • a wafer frame having a ceiling portion, a bottom portion and a side wall, and a space formed by the ceiling portion, the bottom portion and the side wall, made of a metal material.
  • the ceiling part is made of a flat upper plate
  • the bottom part is made of a flat lower plate
  • the side wall is made of a mold
  • the space is formed between the upper plate and the lower plate.
  • the wafer frame according to [1] which is provided by stacking frames.
  • the wafer frame according to [2] further including a beam provided on the mold.
  • the ceiling and the side wall form an upper lid in which a cross-sectional shape is integrally formed in a U-shape, and the bottom portion and the side wall are integrally formed in a U-shape in cross-section.
  • the wafer frame according to [4] further including a reinforcing member fixed between the upper lid and the lower lid.
  • one or more depressions are provided in the ceiling portion of the upper lid in the circumferential direction at arbitrary intervals, or one recess in contact with the bottom portion of the lower lid, or one in the circumferential direction at the bottom portion of the lower lid.
  • the wafer frame according to [4] which has a recess provided in contact with a ceiling portion of the upper lid.
  • one or more depressions are provided in the ceiling portion of the upper lid at an arbitrary interval in the circumferential direction and are in contact with the bottom portion of the lower lid, and one at an arbitrary interval in the circumferential direction at the bottom portion of the lower lid.
  • the wafer according to [4] having a recess in contact with the ceiling portion of the upper lid, provided so as to prevent the recess in contact with the bottom portion of the lower lid and the recess in contact with the ceiling portion of the upper lid from contacting each other. For frames.
  • the wafer frame according to [4] which has a continuous depression in contact with the portion.
  • one or more strips are provided on the entire top of the ceiling of the upper lid, and a continuous recess in contact with the bottom of the bottom lid, and a ceiling of the top of the top is provided on the bottom of the bottom lid.
  • the continuous depressions contacting the bottom part of the front lower lid and the bottoms of the continuous depressions contacting the ceiling part of the upper lid are in contact with each other. flame.
  • (B) It is AA sectional drawing.
  • (A) It is a top view of the flame
  • (B) It is BB sectional drawing.
  • (C) It is a schematic diagram which shows the state before the fitting in BB sectional drawing.
  • (A) It is a partially broken top view which shows the other example of the flame
  • B) It is BB sectional drawing.
  • C) It is a schematic diagram which shows the state before the fitting in BB sectional drawing.
  • A) It is a partially broken top view which shows the other example of the flame
  • (B) It is BB sectional drawing.
  • (C) It is a top view which shows the example of the external appearance of a reinforcement member.
  • A) It is a partially broken top view which shows the flame
  • B) It is BB sectional drawing.
  • A) It is a top view which shows the other example of the flame
  • B) It is BB sectional drawing.
  • A) It is a top view which shows the further another example of the frame for wafers concerning 3rd embodiment of this invention.
  • B) It is BB sectional drawing.
  • C) It is CC sectional drawing.
  • A) It is a top view which shows the other example of the flame
  • the shape of the wafer frame 10 of the present invention is not particularly limited, but the wafer frame in the present embodiment is a flexible dicing film 31 that detachably holds the semiconductor wafer W shown in FIG. 20 or FIG.
  • the ring-like frame 10 having the shape is similar in appearance to the ring-shaped frame 10, but it may be not only the shape of a standard product but also a shape such as a circle, a rectangle, or an ellipse.
  • the ceiling, bottom and side walls are made of a metal material, and a space is provided inside the frame.
  • a metal material By configuring the frame with a metal material, it is possible to maintain heat resistance and maintain sufficient strength and rigidity. Further, by providing a space inside, the weight of the wafer frame 10 can be reduced.
  • the metal material used in the wafer frame 10 of the present invention is preferably iron, stainless steel, aluminum, titanium, magnesium or the like, but at present, it is preferable to use a stainless steel plate from the viewpoint of heat resistance, corrosion resistance and cost balance. .
  • a wafer frame 10 according to a first embodiment includes a flat metal upper plate 1 having an outer shape shown in FIG. 1 and a flat metal lower plate 2 having the same shape as the upper plate 1. Is used.
  • the thicknesses of the upper plate 1 and the lower plate 2 are not particularly limited, and may be set as appropriate according to the dimensions of the wafer frame and the type of metal material.
  • the mold 3 shown in FIG. 2 or 3 is used as a member constituting the internal space 3c and the side wall 3a of the wafer frame. Since this mold 3 can be manufactured by punching or laser cutting a metal plate, the thickness of the mold 3 and the widths of the side walls 3a and beams 3b are not limited to those shown in FIGS. By setting appropriately according to the mass of the material and the dimensions of the wafer frame 10, it contributes to weight reduction of the frame 10.
  • the beams 3b are provided at regular intervals in the radial direction of the wafer frame 10 and also in the circumferential direction. Provided.
  • the beam 3b shown in FIGS. 2, 3, 4 and 5 is placed on the mold 3 at an arbitrary interval. It is good to provide.
  • the strength and rigidity of the wafer frame 10 is increased as compared with the mold 3 shown in FIG. 2, but the mass is also increased. Therefore, the beam 3b is required for the wafer frame 10. It is preferable to set appropriately according to rigidity and mass.
  • the positioning notch 26 is a positioning notch when the frame 10 is set on the dicing machine. Therefore, when the upper plate 1, the lower plate 2 and the mold 3 are stacked, the positioning notch 26 is located at the same position. It is necessary to pile up to come to.
  • FIG. 4A is a partially broken plan view of the wafer frame 10 of the present invention.
  • the wafer frame 10 is formed from an upper plate 1 and a lower plate 2 shown in FIG. 1 and a mold 3 shown in FIG. 2, and the mold 3 is a beam arranged at equal intervals in the radial direction of the side wall 3a and the frame. It consists of 3b.
  • FIG. 4B is a cross-sectional view taken along the line AA in FIG.
  • a space 3c is formed in a portion surrounded by the upper plate 1, the lower plate 2, the side wall 3a, and the beam 3b, and weight reduction is realized by this configuration.
  • what is necessary is just to select conventionally techniques, such as an adhesive agent, brazing, and welding, for the joining of the upper board 1, the lower board 2, and the formwork 3 suitably.
  • FIG. 5 shows a wafer frame according to another embodiment of the present invention, in which the mold 3 shown in FIG. FIG. 5A is a partially broken plan view of the wafer frame 10 of the present invention, and FIG. 5B is a cross-sectional view taken along the line AA of FIG. 5A.
  • the beams 3b are further added in the circumferential direction of the frame, and the spaces 3c are finely distributed, and the strength and rigidity are improved.
  • FIG. 6 shows a wafer frame 10 according to another embodiment of the present invention, which is an example in which the hollow metal body 4 is filled in the space 3c of the wafer frame 10 of the present invention shown in FIGS.
  • the use of the hollow metal body 4 can achieve further improvement in strength and rigidity while suppressing an increase in weight.
  • FIG. 6 (a) is a partially broken plan view of the wafer frame 10 of the present invention
  • FIG. 6 (b) is a cross-sectional view taken along line AA of FIG. 6 (a).
  • the material of the hollow metal body 4 is not particularly limited, but since it is hermetically stored inside the wafer frame, it is necessary to select a material that provides appropriate corrosion resistance and rigidity. In general, it is preferable to use a hollow iron ball that is easily available.
  • a spherical hollow metal body 4 such as a hollow iron ball
  • the spherical hollow metal body is used by being deformed, the contact area between the hollow metal body 4 and the upper plate 1 and the lower plate 2 is increased, so that significant rigidity improvement can be expected.
  • the use of the wafer frame 10 may cause the hollow metal body 4 to move and be unevenly distributed inside the wafer frame 10. Therefore, it is preferable to fix the hollow metal body using an adhesive or a brazing material.
  • an adhesive a thermosetting adhesive having both a specification that does not generate outgas and a heat resistance specification is suitable.
  • the brazing material used for brazing is preferably a copper-based brazing material or a nickel-based brazing material, and a low melting point metal material such as tin can be dissolved in the joint surface instead of brazing.
  • FIG. 7 shows a wafer frame 10 according to a second embodiment of the present invention.
  • FIG. 7A is a plan view showing the upper surface side of the wafer frame 10.
  • FIG. 7B is a sectional view taken along the line BB.
  • FIG. 7C is a schematic view showing a state before the upper lid 21 and the lower lid 22 are fitted in the BB cross section.
  • the top lid 21 has a ceiling 21b and a side wall 21a formed integrally from a flat plate, and the frame cross section (BB cross section) of the top lid 21 is substantially U-shaped.
  • the lower lid 22 has a bottom 22 b and a side wall 22 a integrally formed from a flat plate, and the frame cross section (BB cross section) of the lower lid 22 is also substantially U-shaped.
  • the upper lid 21 and the lower lid 22 can be fitted as shown in FIGS. 7B and 7C. can do. Since the cross section is formed into a box shape in this way, a structure resistant to twisting and warping can be obtained. Further, since the space 3c is formed inside the box, the weight of the frame can be reduced. Further, since the upper lid 21 is fitted inside the lower lid 22, the end portion of the side wall 21a of the upper lid 21 does not appear on the bottom portion 22b of the lower lid 22, so that the bottom portion 22b becomes a smooth surface. As shown in FIG. 3, the film is not damaged even if the dicing film 31 is affixed to the back side 22b of the wafer frame 10.
  • the fitting portions 21a and 22a between the upper lid 21 and the lower lid 22 are shown in a straight line shape in FIG. 7, but as shown in FIG.
  • the fitting strength can be made larger than that of the linear shape.
  • the fitting strength can also be increased by providing a bent portion at the tip of the lower lid side wall 22a.
  • the fitting portion can be joined by the welding portion 42 to further increase the strength.
  • a welding method a known welding method such as electron beam welding, laser welding, microplasma welding, or TIG welding can be appropriately applied.
  • brazing 43 can be used instead of welding.
  • a copper-based brazing material or a nickel-based brazing material is suitable, and instead of brazing, a low melting point metal material such as tin can be melted into the fitting surface.
  • thermosetting adhesive having both a specification that does not generate outgas and a heat-resistant specification is suitable.
  • the material before the upper lid and lower lid are integrally formed is a metal flat plate (a stainless steel plate is preferred for cost and convenience), but the thickness of the wafer frame 10 is obtained by press punching or laser cutting.
  • the processing method may be appropriately selected according to the dimensions.
  • the integral formation of the ceiling portion 21b or bottom portion 22b of the upper lid 21 and the lower lid 22 and the side walls 21a, 22a is produced by appropriately raising the side walls to the desired dimensions by pressing or spinning.
  • the press work is composed of a step of pressing and punching the upper lid and lower lid members from a metal flat plate and a press drawing step of forming a side wall portion from the members.
  • a press molding process for adjusting the overall shape may be added after the press drawing process.
  • an adhesive is applied to the bonding portion. Or, brazing, laser welding or the like may be taken in as appropriate.
  • FIG. 8 is a view showing another embodiment of the present invention, and the upper lid 21 and the lower lid 22 are integrally formed with the ceiling portion 21b and the side wall 21a, and the bottom portion 22b and the side wall 22a, as in FIG.
  • FIG. 8A is a partially broken plan view of the wafer frame 10 of the present invention
  • FIG. 8B is a cross-sectional view taken along the line BB of FIG. 8A
  • FIG. 8C is a schematic view showing a state before the upper lid 21 and the lower lid 22 are fitted in the BB cross section.
  • a beam 22c having a groove for accommodating a cutter for cutting an adhesive film (dicing film 31 on which the wafer W is mounted and held) affixed to the bottom 22b of the lower lid 22 Is integrally molded.
  • the beam 22c is provided in the circumferential direction of the bottom portion 22b of the wafer frame 10, and has a function as a beam that prevents torsion, warpage, and the like and adds rigidity. .
  • the beam 22c attaches an adhesive film (dicing film 31 for mounting and holding the wafer W) to the bottom 22b of the wafer frame 10, and when the adhesive film is cut according to the diameter of the wafer frame 10, the cutter 22 It is a groove that prevents the cutting edge from contacting the wafer frame 10. Accordingly, the groove width and depth, the inclination angle of the groove slope, and the like may be appropriately determined according to the dicing machine, the frame size, and the like. Further, when the groove for accommodating the cutter is not formed, the beam 22c may be integrally formed with the upper lid 21.
  • FIG. 9 is a view showing still another embodiment of the present invention, and the upper lid 21 and the lower lid 22 are integrally formed with the ceiling portion 21b and the side wall 21a, and the bottom portion 22b and the side wall 22a, as in FIG.
  • FIG. 9A is a partially broken plan view of the wafer frame 10 of the present invention
  • FIG. 9B is a cross-sectional view taken along line BB of FIG. 9A.
  • a reinforcing member 23 is fixed between the upper lid ceiling 21b and the lower lid bottom portion 22b.
  • the reinforcing member 23 is a reinforcing beam installed in a band shape in the circumferential direction of the width portion of the wafer frame 10 as shown in a plan view showing an example of an appearance in FIG.
  • the thickness of the frame 10 is increased and the rigidity is increased. This is an effective treatment if
  • the reinforcing member metal, particularly iron, stainless steel, aluminum, titanium, or the like is suitable, and any member that can hold a spring material such as a spring or a washer in the space may be used.
  • resin can also be used as a reinforcing member.
  • the resin may be formed in a ring shape, or a resin plate may be used for the whole or a part of the upper lid cross section.
  • the shape of the reinforcing member is not particularly limited.
  • FIG. 10 shows a wafer frame 10 according to a third embodiment of the present invention.
  • FIG. 10A is a plan view showing the upper surface side of the wafer frame 10.
  • FIG. 10B is a BB cross-sectional view.
  • the ceiling 21 b and the side wall 21 a are integrally formed from a flat plate.
  • a plurality of depressions 21 d in contact with the lower lid bottom portion 22 b are provided in the upper lid ceiling portion 21 b at arbitrary intervals.
  • the width and length of the recess 21d are arbitrary, but the depth is in contact with the lower lid bottom portion 22b and is arranged discontinuously with the peripheral length of the frame. It is preferable that the hollow is integrally formed with the upper lid.
  • the frame cross section (BB cross section) of the upper lid 21 is substantially U-shaped as in the second embodiment.
  • the lower lid 22 has a bottom 22 b and a side wall 22 a integrally formed from a flat plate, and the frame cross section (BB cross section) of the lower lid 22 is also substantially U-shaped.
  • a plurality of the recesses 21d are arranged evenly and discontinuously (disposed diagonally in FIG. 10) over the entire upper lid ceiling portion 21b.
  • the depression 21d is drawn at an acute angle in FIG. 10B, the wall surface may be inclined, the corner may be obtuse, or rounded.
  • the width and length may be appropriately determined in consideration of the size of the wafer frame 10 and necessary rigidity, twist, and warp characteristics.
  • the space 3c is formed inside the frame, the weight of the frame can be reduced. Further, since the upper lid 21 is fitted inside the lower lid 22, the end portion of the side wall 21a of the upper lid 21 does not appear on the bottom portion 22b of the lower lid 22, so that the bottom portion 22b becomes a smooth surface. As shown in FIG. 3, the film is not damaged even if the dicing film 31 is affixed to the back side 22b of the wafer frame 10.
  • FIG. 11 is an example in which a plurality of non-continuous depressions 22d are provided in the lower lid 22 as in FIG. 10, and the basic structure is the same as FIG.
  • both the upper and lower lids have depressions 21d and 22d, and a plurality of depressions 21d and 22d are arranged so as not to contact each other.
  • the number of the recesses 21d and 22d installed in each of the upper lid and the lower lid can be doubled as a whole for the wafer frame 10 even if the number is small. This case is effective in that the width of the wafer frame 10 is narrow and distortion is likely to occur during press forming of the recess, so that the number of recesses per upper and lower lid can be reduced.
  • FIG. 13 shows the recesses 21d and 22d installed in the upper and lower lids at the same position in the circumferential direction of the wafer frame 10 so that the bottoms of the recesses are in contact with each other.
  • This embodiment is effective when the depressions 21d and 22d cannot be deeply pressed. Since the recesses 21d and 22d are in contact with each other, it is effective in improving rigidity and preventing twisting.
  • FIG. 14 is an example in which a recess 21 d continuous in the circumferential length direction of the wafer frame 10 is arranged on one side of the upper lid 21 or the lower lid 22.
  • the width of the dent is arbitrary, and it may be narrow and two or more strips may be provided in the width direction.
  • the bottom of the depression is basically in contact with the top lid ceiling or bottom lid bottom, but may be in a floating state without contact if there is no problem with twisting or the like.
  • FIG. 15 is an example in which depressions 21 d and 22 d continuous in the circumferential length direction of the wafer frame 10 are arranged on both the upper lid 21 and the lower lid 22.
  • the bottoms of the recesses are in contact with each other.
  • Two or more cases may be installed in this case if the width of the frame allows.
  • FIG. 16 shows an example in which the hollow metal body 4 is filled in the space 3c inside the wafer frame 10 shown in FIGS. 7 to 15 in the same manner as the case of FIG. 6 in order to further improve the rigidity of the wafer frame 10.
  • . 16 (a) is a partially broken plan view of the wafer frame 10 of the present invention
  • FIG. 16 (b) is a cross-sectional view taken along the line BB of FIG. 16 (a).
  • Use of the hollow metal body 4 is preferable because an increase in rigidity can be achieved while suppressing an increase in weight.
  • the number of hollow metal bodies 4 to be filled can be appropriately set according to the size of the space inside the wafer frame 10 and the size of the hollow metal bodies 4. Therefore, the material and shape of the hollow metal body 4 are basically the same as those described in the description of FIG. 6 of the first embodiment.
  • a resin material can be used as a filler of the space 3c inside the wafer frame 10.
  • Resin materials include acrylic resin, epoxy resin, silicon resin, polycarbonate resin, nylon resin, polyester resin, polyimide resin, PBT resin (polybutylene terephthalate resin), PPS resin (polyphenylene sulfide resin), and ABS resin. Suitable as a filler.
  • the above-described resin material can be a resin material reinforced with glass fiber (hereinafter referred to as GFRP). In that case, it is preferable that a polycarbonate resin having no outgas and having a low linear expansion coefficient is used as a matrix, and glass fiber is contained in an amount of 10 to 20% by volume fraction. The glass fiber is more preferably used alone or in combination with a round or flat cross section.
  • the upper lid original plate is formed by press punching a metal flat plate (for example, a stainless steel sheet). Or create the lower plate.
  • the side walls 21a and 22a are formed on the punched upper lid original plate or lower plate original plate using a die drawing press.
  • the depression 21d shown in FIG. 10 is formed by drawing the depression after the side wall is formed in the die drawing press process, or forming the depression by the drawing press simultaneously with the side wall formation.
  • a thin steel pipe is bent in the pipe axis direction to create a substantially circular cylindrical body.
  • both end surfaces of the cylindrical body are joined by welding to form a ring shape.
  • a notch for positioning the wafer frame is formed by a press.
  • the cylindrical body is press-molded into a box frame shape.
  • the thin steel pipe is filled with a hollow metal body or a resin material before forming the cylindrical body in step (a). It is good to keep.
  • the weight of the wafer frame 10 was measured, and the ratio when the mass of the conventional wafer frame 10 was 100 was expressed as a mass ratio.
  • a mass ratio of less than 50 is indicated by ⁇
  • a mass ratio of 50 or more and less than 70 is indicated by ⁇
  • a mass ratio of 70 or more is indicated by ⁇ .
  • FIG. 23A is a schematic diagram for explaining a fixing method and a loading method of the wafer frame 10.
  • FIG. 23B is a plan view for explaining a fixing position of the wafer frame 10.
  • a deformation warp amount of less than 0.3 mm was indicated as ⁇
  • a deformation warp amount of 0.3 mm or more and less than 0.5 mm was indicated as ⁇
  • a deformation warp amount of 0.5 mm or more was indicated as ⁇ .
  • the flatness of less than 0.3 mm was indicated by ⁇ , the flatness of 0.3 mm or more and less than 0.4 mm by ⁇ , and the flatness of 0.4 mm or more by ⁇ .
  • Test No. 1 to 7 are embodiments corresponding to claims 1 to 3, and the upper plate 1 and the lower plate 2 having the shape shown in FIG. 1 are made of a stainless steel plate having a thickness of 0.20 mm, and the mold 3 is shown in FIG.
  • the shape (Table 1 core material: formwork A) or the shape shown in FIG. 3 (Table 1 core material: formwork B) is made from a 1.0 mm thick stainless steel plate, and the upper plate 1, lower plate 2 and formwork 3 was combined to produce a wafer frame (total thickness 1.5 mm) having an outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 1.5 mm.
  • the upper plate 1 and the mold 3 were joined, and the lower plate 2 and the mold 3 were joined by heat-resistant adhesive that does not generate outgas, brazing, and laser welding.
  • Test No. Nos. 8 to 21 are embodiments corresponding to claims 4 to 6, and the top cover and the bottom cover are made of 0.20 mm thick stainless steel plate, and the ceiling portion 21b and the side wall 21a are formed by press drawing and the bottom portion 22b. And the side wall 22a were integrally formed.
  • the height of the side wall is 1.3 mm for the upper lid and 1.5 mm for the lower lid.
  • the wafer frame has an outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 1.5 mm (total thickness of 1.5 mm). It was created.
  • a reinforcing member 23 core material: formwork C in Table 1) shown in FIGS. 13 to 16 in FIG. 9C is obtained by punching a ring having a center diameter of 370 mm and a width of 3 mm from a steel plate having a thickness of 1.0 mm. The inside of the frame was joined by an adhesive or brazing.
  • test no. The beam 22c having a groove for accommodating the cutter illustrated in FIGS. 17 to 21 in FIG. 8 was provided on the frame of the lower lid by press work before press drawing.
  • Test No. 22 to 33 are embodiments corresponding to claims 7 to 15, and the upper lid and lower lid are made of stainless steel plate having a thickness of 0.20 mm, and the upper lid side wall 21a, the upper lid ceiling 21b and the upper lid depression are formed by press drawing. 21d was integrally formed with the lower lid side wall 22a, the lower lid bottom portion 22b, and the lower lid recess 22d.
  • the height of the side wall is 1.3 mm for the upper lid and 1.5 mm for the lower lid.
  • the wafer frame has an outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 1.5 mm (total thickness of 1.5 mm). It was created.
  • the upper and lower lids and the hollow iron ball were joined with an adhesive.
  • Test No. 34 to 35 are embodiments corresponding to claims 16 to 17, in which the thin steel tube 41 is formed in a substantially circular shape in the tube axis direction, the end surfaces of the tubes are laser welded to form a cylindrical body, and the cylindrical body is flattened.
  • Test No. 36 is a conventional example, and a frame material for a wafer having a frame size outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 1.5 mm was prepared using a stainless steel plate having a thickness of 1.5 mm.
  • the mold A is The mold 3 shown in FIG. 2
  • the mold B means the mold 3 shown in FIG. 3
  • the mold C means the ring-shaped reinforcing member 23 shown in FIG. 9C.
  • the basic structure of the created wafer frame is listed in the “Frame structure corresponding to figure number” column in Table 1.
  • Nos. 1 to 7 have a structure in which molds are laminated on the upper and lower plates, and the structure shown in FIG. 1, 2 and 7, the structure shown in FIG. Tested at 3-6.
  • test No. 8-21 An example in which the upper lid, the lower lid and the side wall portion are integrally molded is shown in Test No. 8-21.
  • test No. Nos. 8 to 12 have the structure shown in FIG. 11 and 12 are further filled with hollow iron balls (FIG. 16).
  • Test No. Reference numerals 13 to 16 denote the structure shown in FIG. 9, and the structure shown in FIG. 7 is provided with the reinforcing member 23 of the wafer frame 10.
  • Test No. Reference numerals 17 to 21 denote the structure shown in FIG. 8, and a beam 22c having a groove for receiving a cutter for cutting the adhesive film 31 is provided on the frame of the lower lid.
  • Test No. In 18 and 20, the structure shown in FIG. 8 is further filled with a hollow iron ball 4.
  • Test No. 22-33 An example in which the upper lid, the lower lid, the side wall, and the recess were integrally formed was shown in Test No. 22-33.
  • Test No. Reference numerals 22 to 23 have the structure shown in FIG. 10, and the upper lid 21 is provided with a recess 21d in contact with the bottom 22b of the lower lid 22 in the circumferential length direction of the frame.
  • No. Reference numerals 24 to 25 denote the structure shown in FIG. 11, in which a recess 22d in contact with the ceiling 21b of the upper lid is provided in the lower lid 22 in the circumferential length direction of the frame.
  • No. 26 to 27 have the structure shown in FIG.
  • the upper lid 21 and the lower lid 22 have recesses 21d and 22d in the circumferential length direction of the frame, and the ceiling 21b of the upper lid 21 or the bottom 22b of the lower lid 22 at different locations. It is provided so that it may touch.
  • the upper lid 21 and the lower lid 22 are provided with depressions 21d and 22d so that the depressions are in contact with each other at the same position in the circumferential direction of the frame.
  • Reference numerals 30 to 31 denote the structure shown in FIG. 14, in which one recess 21 d is provided in the circumferential direction of the frame of the upper lid 21.
  • No. Reference numerals 32 to 33 each have a structure shown in FIG. 15, and each of the upper lid 21 and the lower lid 22 is provided with one strip so that the recesses 21d and 22d continuous in the circumferential length direction of the frame come into contact with each other.
  • Reference numerals 34 to 35 denote structures shown in FIG. 17, in which a thin steel pipe 41 is formed in a substantially circular shape in the direction of the pipe axis, the end surfaces of the pipes are laser welded 42 to form a cylindrical body, and the cylindrical body is further flattened. Molded.
  • the weight reduction rate is 48% to 62%. % Is reached.
  • the present invention provides a lightweight and excellent heat resistant frame, it can be applied to weight reduction of members having a frame structure.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

A wafer frame has a ceiling section, a bottom section and a side wall, which are composed of a metal material; and a space formed by the ceiling section, the bottom section and the side wall.  The wafer frame prevents characteristics from changing, has sufficient rigidity, heat resistance and light weight.

Description

ウェーハ用フレームWafer frame
本発明は、ウェーハ（例えば、半導体ウェーハ、ガラス基板ウェーハ等）の加工作業（例えばダイシング、エキスパンド等）や搬送作業に用いるフレーム（以下、ウェーハ用フレームという）に関するものである。 The present invention relates to a frame (hereinafter referred to as a wafer frame) used for a processing operation (for example, dicing, expanding, etc.) or a transfer operation of a wafer (for example, a semiconductor wafer, a glass substrate wafer, etc.).
　半導体ウェーハのウェーハ用フレーム１０は、通常図２０に図示した口径１５０ｍｍ（６ｉｎｃｈ）～３００ｍｍ（１２ｉｎｃｈ）の半導体ウェーハＷを収納する金属製のウェーハ用フレーム１０で、該フレームに半導体ウェーハを保持するダイシングフィルム３１をウェーハ用フレーム１０の裏面に剥離可能に貼付する構造となっている。 The wafer frame 10 for a semiconductor wafer is a metal wafer frame 10 that normally accommodates a semiconductor wafer W having a diameter of 150 mm (6 inches) to 300 mm (12 inches) shown in FIG. 20, and a dicing for holding the semiconductor wafer in the frame. The film 31 is attached to the back surface of the wafer frame 10 in a peelable manner.
　そして、図２１に図示するように、このダイシングフィルム３１（図２０）の上に貼付された半導体ウェーハＷがダイシングマシーンのダイヤモンドブレード３０により複数のダイＤに切断（ダイシング）される。 Then, as shown in FIG. 21, the semiconductor wafer W stuck on the dicing film 31 (FIG. 20) is cut (diced) into a plurality of dies D by the diamond blade 30 of the dicing machine.
　上述した半導体ウェーハ用フレーム１０にダイシングフィルム３１および半導体ウェーハＷが貼付された後、ダイシングマシーンに１枚ずつセットされるまでは、図２２に図示するような半導体ウェーハ用フレーム１０を複数枚単位で整列収納した収納容器（カセット）９に収納されて運搬される。なお、図２２は収納容器の一部を拡大表示した収納容器（カセット）９の概略図である。 After the dicing film 31 and the semiconductor wafer W are attached to the semiconductor wafer frame 10 described above, the semiconductor wafer frame 10 as shown in FIG. It is stored and transported in a storage container (cassette) 9 that is aligned and stored. FIG. 22 is a schematic view of a storage container (cassette) 9 in which a part of the storage container is enlarged.
ウェーハ用フレーム１０は、従来ステンレス鋼板（厚み１．５ｍｍ程度）を所定の形状に切り出したもの（いわゆる無垢材）を使用しているので、ウェーハ用フレーム１０の重量は比較的大きな値となる。 Since the wafer frame 10 uses a conventional stainless steel plate (thickness of about 1.5 mm) cut into a predetermined shape (so-called solid material), the weight of the wafer frame 10 is a relatively large value.
　近年大径のウェーハＷが生産されるようになり、ウェーハ用フレーム１０も大型化しており、ステンレス鋼板の無垢材からなるウェーハ用フレーム１０では、大型化によって重量が増大し、例えば、前記収納容器（カセット）９の総重量は、１２ｉｎｃｈウェーハ用フレーム１０では、２５枚セットで１８ｋｇ以上となり、ダイシングマシーンに収納容器（カセット）９を運搬し、セッティングする作業者には、大きな負担となっている。 In recent years, large-diameter wafers W have been produced, and the wafer frame 10 has also been increased in size. In the wafer frame 10 made of a solid stainless steel plate, the weight has increased due to the increase in size. The total weight of the (cassette) 9 is 18 kg or more in a 25-inch set for the 12 inch wafer frame 10, which is a heavy burden on the operator who transports and sets the storage container (cassette) 9 to the dicing machine. .
　そこで、ウェーハ用フレーム１０の軽量化を図る技術が種々検討されており、例えば、特許文献１には、樹脂からなるウェーハ用フレームが開示されている。この技術によればウェーハ用フレームの軽量化を達成できるが、樹脂を使用するため、剛性を保つには厚みを従来材の厚さ１．５ｍｍより厚くする必要があり、また長時間使用することによって特性が変化するという問題がある。さらに、ダイシングフィルムからウェーハを取り外す際に、フレーム全体に熱をかけるので、ウェーハ用フレームには耐熱性も求められる。 Therefore, various techniques for reducing the weight of the wafer frame 10 have been studied. For example, Patent Document 1 discloses a wafer frame made of resin. According to this technology, it is possible to reduce the weight of the wafer frame, but since resin is used, it is necessary to make the thickness thicker than the conventional material thickness of 1.5 mm in order to maintain rigidity, and it should be used for a long time. There is a problem that the characteristics change depending on. Furthermore, since heat is applied to the entire frame when the wafer is removed from the dicing film, the wafer frame is also required to have heat resistance.
特開２００７－４８８８５号公報JP 2007-48885 A
　本発明は、特性の変化を防止し、かつ十分な剛性と耐熱性を有する軽量のウェーハ用フレームを提供することを目的とする。 An object of the present invention is to provide a lightweight wafer frame that prevents changes in characteristics and has sufficient rigidity and heat resistance.
　前記目的を達成するために、本発明は、以下からなるウェーハ用フレームとウェーハ用フレームの製造方法を提供する。 In order to achieve the above object, the present invention provides a wafer frame and a method for manufacturing the wafer frame, comprising:
［１］　金属材料からなる、天井部、底部と側壁と、前記天井部、前記底部と前記側壁とで形成された空間と、を有するウェーハ用フレーム。
［２］　前記天井部が平坦な上板からなり、前記底部が平坦な下板からなり、前記側壁が型枠からなり、前記空間が、前記上板と前記下板との間に、前記型枠を積層することによって設けられている、［１］に記載のウェーハ用フレーム。
［３］　さらに、前記型枠に設けられた梁を有する［２］に記載のウェーハ用フレーム。
［４］　前記天井部と前記側壁とが断面形状がコの字形状に一体成形された上蓋を形成し、前記底部と前記側壁とが断面形状がコの字形状に一体成形された下蓋を形成し、前記空間が、前記上蓋と前記下蓋を嵌合することによって形成される、［１］に記載のウェーハ用フレーム。
［５］さらに、前記下蓋を一体成形して前記下蓋の底部に設けられた、粘着フィルム切断用カッタを収容する溝を持つ梁を有する［４］に記載のウェーハ用フレーム。
［６］さらに、前記上蓋と、前記下蓋との間に固着された補強部材を有する［４］に記載のウェーハ用フレーム。
［７］さらに、前記上蓋の天井部に周方向に任意の間隔で１個以上設けられた、下蓋の底部に接する窪み、または、前記下蓋の底部に周方向に任意の間隔で１個以上設けられた、上蓋の天井部に接する窪み、を有する［４］に記載のウェーハ用フレーム。
［８］さらに、前記上蓋の天井部に周方向に任意の間隔で１個以上設けられた、下蓋の底部に接する窪み、および、前記下蓋の底部に周方向に任意の間隔で１個以上設けられた、上蓋の天井部に接する窪み、を有し、前記下蓋の底部に接する窪みと上蓋の天井部に接する窪みが接触しないように形成されている、［４］に記載のウェーハ用フレーム。
［９］さらに、前記上蓋の天井部に周方向に任意の間隔で１個以上設けられた、下蓋の底部に接する窪み、および、前記下蓋の底部に周方向に任意の間隔で１個以上設けられた、上蓋の天井部に接する窪み、を有し、前記下蓋の底部に接する窪みと上蓋の天井部に接する窪みが接触するように形成されている、［４］に記載のウェーハ用フレーム。
［１０］さらに、前記上蓋の天井部に全周に１条以上設けられた、下蓋の底部に接する連続した窪み、または、前記下蓋の底部に全周に１条以上設けた上蓋の天井部に接する連続した窪み、を有する［４］に記載のウェーハ用フレーム。
［１１］さらに、前記上蓋の天井部に全周に１条以上設けられた、下蓋の底部に接する連続した窪み、および、前記下蓋の底部に全周に１条以上設けた上蓋の天井部に接する連続した窪み、を有し、前下蓋の底部に接する連続した窪みと上蓋の天井部に接する連続した窪みの底部同士が接するように形成された、［４］に記載のウェーハ用フレーム。
［１２］さらに、前記空間に充填された中空金属体と樹脂材料とからなるグループから選択された少なくとも一つを有する［１］乃至［１１］のいずれかに記載のウェーハ用フレーム。
［１３］前記中空金属体が、中空鉄球を押圧して変形させた中空金属体である［１２］に記載のウェーハ用フレーム。
［１４］上蓋用部材と下蓋用部材を金属平板からプレス打抜きするプレス打抜き加工工程と、前記上蓋用部材と下蓋用部材から側壁を成形するプレス絞り加工工程と、を有する請求項４に記載のウェーハ用フレームの製造方法。
［１５］さらに、プレス絞り加工工程に続いて、フレームの全体形状を成形するプレス成形工程を有する［１４］に記載のウェーハ用フレームの製造方法。
［１６］薄肉鋼管を管軸方向に略円形に成形して、管端面同士を溶接して円筒体を成形する工程と、前記円筒体にウェーハ用フレームの位置決め用ノッチを成形する工程と、前記円筒体を扁平プレス成形する工程と、を有するウェーハ用フレームの製造方法。
［１７］さらに、前記円筒体を成形する工程の前に、前記薄肉鋼管に中空金属体および／または樹脂材料を充填する工程を有する［１６］に記載のウェーハ用フレームの製造方法。 [1] A wafer frame having a ceiling portion, a bottom portion and a side wall, and a space formed by the ceiling portion, the bottom portion and the side wall, made of a metal material.
[2] The ceiling part is made of a flat upper plate, the bottom part is made of a flat lower plate, the side wall is made of a mold, and the space is formed between the upper plate and the lower plate. The wafer frame according to [1], which is provided by stacking frames.
[3] The wafer frame according to [2], further including a beam provided on the mold.
[4] The ceiling and the side wall form an upper lid in which a cross-sectional shape is integrally formed in a U-shape, and the bottom portion and the side wall are integrally formed in a U-shape in cross-section. The wafer frame according to [1], wherein the frame is formed by fitting the upper lid and the lower lid.
[5] The wafer frame according to [4], further comprising a beam having a groove for housing the adhesive film cutting cutter, which is integrally formed with the lower lid and provided at the bottom of the lower lid.
[6] The wafer frame according to [4], further including a reinforcing member fixed between the upper lid and the lower lid.
[7] Furthermore, one or more depressions are provided in the ceiling portion of the upper lid in the circumferential direction at arbitrary intervals, or one recess in contact with the bottom portion of the lower lid, or one in the circumferential direction at the bottom portion of the lower lid. [4] The wafer frame according to [4], which has a recess provided in contact with a ceiling portion of the upper lid.
[8] Furthermore, one or more depressions are provided in the ceiling portion of the upper lid at an arbitrary interval in the circumferential direction and are in contact with the bottom portion of the lower lid, and one at an arbitrary interval in the circumferential direction at the bottom portion of the lower lid The wafer according to [4], having a recess in contact with the ceiling portion of the upper lid, provided so as to prevent the recess in contact with the bottom portion of the lower lid and the recess in contact with the ceiling portion of the upper lid from contacting each other. For frames.
[9] Furthermore, one or more depressions in contact with the bottom of the lower lid provided at an arbitrary interval in the circumferential direction on the ceiling of the upper lid, and one at an arbitrary interval in the circumferential direction on the bottom of the lower lid The wafer according to [4], wherein the wafer has a recess in contact with the ceiling portion of the upper lid, and is formed so that the recess in contact with the bottom portion of the lower lid contacts the recess in contact with the ceiling portion of the upper lid. For frames.
[10] Furthermore, one or more continuous recesses in contact with the bottom of the lower lid provided on the ceiling of the upper lid, or a ceiling of the upper lid provided on the bottom of the lower lid with one or more on the entire circumference. The wafer frame according to [4], which has a continuous depression in contact with the portion.
[11] Furthermore, one or more strips are provided on the entire top of the ceiling of the upper lid, and a continuous recess in contact with the bottom of the bottom lid, and a ceiling of the top of the top is provided on the bottom of the bottom lid. For the wafer according to [4], wherein the continuous depressions contacting the bottom part of the front lower lid and the bottoms of the continuous depressions contacting the ceiling part of the upper lid are in contact with each other. flame.
[12] The wafer frame according to any one of [1] to [11], further including at least one selected from the group consisting of a hollow metal body filled in the space and a resin material.
[13] The wafer frame according to [12], wherein the hollow metal body is a hollow metal body that is deformed by pressing a hollow iron ball.
[14] A press punching process for pressing and punching the upper lid member and the lower lid member from a metal flat plate, and a press drawing process for forming a side wall from the upper lid member and the lower lid member. The manufacturing method of the flame | frame for wafers as described.
[15] The method for manufacturing a wafer frame according to [14], further including a press forming step of forming the entire shape of the frame following the press drawing step.
[16] A step of forming a thin steel pipe into a substantially circular shape in the pipe axis direction, welding the pipe end faces to form a cylindrical body, a step of forming a notch for positioning a wafer frame in the cylindrical body, And a step of flat press-molding the cylindrical body.
[17] The method for manufacturing a wafer frame according to [16], further including a step of filling the thin steel pipe with a hollow metal body and / or a resin material before the step of forming the cylindrical body.
　本発明によれば、フレームの強度、剛性、耐熱性を維持しつつ、従来品に比較して顕著に軽量化されたウェーハ用フレームを得ることができる。 According to the present invention, it is possible to obtain a wafer frame that is significantly lighter than conventional products while maintaining the strength, rigidity, and heat resistance of the frame.
ウェーハ用フレームの外観の例を示す平面図である。It is a top view which shows the example of the external appearance of the flame | frame for wafers. 本発明のウェーハ用フレームに使用する型枠の例を示す平面図である。It is a top view which shows the example of the formwork used for the flame | frame for wafers of this invention. 本発明のウェーハ用フレームに使用する型枠の他の例を示す平面図である。It is a top view which shows the other example of the mold used for the flame | frame for wafers of this invention. （ａ）本発明の第一の実施の形態に係るウェーハ用フレームの部分破断平面図である。（ｂ）Ａ－Ａ断面図である。(A) It is a partially broken top view of the flame | frame for wafers concerning 1st embodiment of this invention. (B) It is AA sectional drawing. （ａ）本発明の他の実施の形態に係るウェーハ用フレームの部分破断平面図である。（ｂ）Ａ－Ａ断面図である。(A) It is a partially broken top view of the frame for wafers concerning other embodiment of this invention. (B) It is AA sectional drawing. （ａ）本発明の中空金属体を充填したウェーハ用フレームの部分破断平面図である。（ｂ）Ａ－Ａ断面図である。(A) It is a partially broken top view of the flame | frame for wafers filled with the hollow metal body of this invention. (B) It is AA sectional drawing. （ａ）本発明の第二の実施の形態に係るウェーハ用フレームの平面図である。（ｂ）Ｂ－Ｂ断面図である。（ｃ）Ｂ－Ｂ断面図での嵌合前の状態を示す模式図である。(A) It is a top view of the flame | frame for wafers concerning 2nd embodiment of this invention. (B) It is BB sectional drawing. (C) It is a schematic diagram which shows the state before the fitting in BB sectional drawing. （ａ）本発明のウェーハ用フレームの他の例を示す部分破断平面図である。（ｂ）Ｂ－Ｂ断面図である。（ｃ）Ｂ－Ｂ断面図での嵌合前の状態を示す模式図である。(A) It is a partially broken top view which shows the other example of the flame | frame for wafers of this invention. (B) It is BB sectional drawing. (C) It is a schematic diagram which shows the state before the fitting in BB sectional drawing. （ａ）本発明のウェーハ用フレームの他の例を示す部分破断平面図である。（ｂ）Ｂ－Ｂ断面図である。（ｃ）補強部材の外観の例を示す平面図である。(A) It is a partially broken top view which shows the other example of the flame | frame for wafers of this invention. (B) It is BB sectional drawing. (C) It is a top view which shows the example of the external appearance of a reinforcement member. （ａ）本発明の第三の実施の形態に係るウェーハ用フレームを示す部分破断平面図である。（ｂ）Ｂ－Ｂ断面図である。(A) It is a partially broken top view which shows the flame | frame for wafers concerning 3rd embodiment of this invention. (B) It is BB sectional drawing. （ａ）本発明の第三の実施の形態に係るウェーハ用フレームの他の例を示す平面図である。（ｂ）Ｂ－Ｂ断面図である。(A) It is a top view which shows the other example of the flame | frame for wafers concerning 3rd embodiment of this invention. (B) It is BB sectional drawing. （ａ）本発明の第三の実施の形態に係るウェーハ用フレームの更に他の例を示す平面図である。（ｂ）Ｂ－Ｂ断面図である。（ｃ）Ｃ－Ｃ断面図である。(A) It is a top view which shows the further another example of the frame for wafers concerning 3rd embodiment of this invention. (B) It is BB sectional drawing. (C) It is CC sectional drawing. （ａ）本発明の第三の実施の形態に係るウェーハ用フレームの他の例を示す平面図である。（ｂ）Ｂ－Ｂ断面図である。(A) It is a top view which shows the other example of the flame | frame for wafers concerning 3rd embodiment of this invention. (B) It is BB sectional drawing. （ａ）本発明の第三の実施の形態に係る連続した窪みを有するウェーハ用フレームの例を示す平面図である。（ｂ）Ｂ－Ｂ断面図である。(A) It is a top view which shows the example of the flame | frame for wafers which has the continuous hollow which concerns on 3rd embodiment of this invention. (B) It is BB sectional drawing. （ａ）本発明の第三の実施の形態に係る連続した窪みを有するウェーハ用フレームの例を示す平面図である。（ｂ）Ｂ－Ｂ断面図である。(A) It is a top view which shows the example of the flame | frame for wafers which has the continuous hollow which concerns on 3rd embodiment of this invention. (B) It is BB sectional drawing. （ａ）本発明の中空金属体を充填したウェーハ用フレームの部分破断平面図である。（ｂ）Ｂ－Ｂ断面図である。(A) It is a partially broken top view of the flame | frame for wafers filled with the hollow metal body of this invention. (B) It is BB sectional drawing. 薄肉鋼管からのウェーハ用フレームの製造方法を説明する図である。It is a figure explaining the manufacturing method of the flame | frame for wafers from a thin steel pipe. 上蓋、下蓋の側壁形状を説明する図である。It is a figure explaining the side wall shape of an upper cover and a lower cover. 嵌合部の接合方法を説明する図である。It is a figure explaining the joining method of a fitting part. 半導体ウェーハのダイシング用フレームのダイシング作業状態を示す斜視図である。It is a perspective view which shows the dicing work state of the frame for dicing of a semiconductor wafer. 半導体ウェーハのダイシング用フレームをエキスパンド装置にセットした状態を示す図である。It is a figure which shows the state which set the flame | frame for dicing of a semiconductor wafer to the expanding apparatus. 半導体ウェーハの収納容器（カセット）の概略を示す図である。It is a figure which shows the outline of the storage container (cassette) of a semiconductor wafer. （ａ）荷重変形試験方法を説明する模式図である。（ｂ）フレームの固定位置を説明する平面図である。(A) It is a schematic diagram explaining the load deformation test method. (B) It is a top view explaining the fixed position of a flame | frame. 反り量と軽量化率（＝１００－質量比）との関係を示す図である。It is a figure which shows the relationship between the amount of curvature, and the weight reduction rate (= 100-mass ratio).
　以下、図面を参照して本発明の好ましい実施の形態を説明する。
本発明のウェーハ用フレーム１０の形状は、特に限定しないが、本実施の形態におけるウェーハ用フレームは、図２０または図２１に示す半導体ウェーハＷを着脱自在に粘着保持する可撓性のダイシングフィルム３１を備えたリング状のフレーム１０と外観上の形状は類似しているが、規格品の形状のみでなく円形、四角形や楕円形等の形状であってもよい。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
The shape of the wafer frame 10 of the present invention is not particularly limited, but the wafer frame in the present embodiment is a flexible dicing film 31 that detachably holds the semiconductor wafer W shown in FIG. 20 or FIG. The ring-like frame 10 having the shape is similar in appearance to the ring-shaped frame 10, but it may be not only the shape of a standard product but also a shape such as a circle, a rectangle, or an ellipse.
　本発明のウェーハ用フレーム１０では、天井部、底部および側壁が金属材料で構成され、かつフレーム内部に空間を設けている。フレームを金属材料で構成することによって、耐熱性を維持し、かつ十分な強度、剛性を保つことが可能となる。また内部に空間を設けることによってウェーハ用フレーム１０の軽量化を達成できる。 In the wafer frame 10 of the present invention, the ceiling, bottom and side walls are made of a metal material, and a space is provided inside the frame. By configuring the frame with a metal material, it is possible to maintain heat resistance and maintain sufficient strength and rigidity. Further, by providing a space inside, the weight of the wafer frame 10 can be reduced.
本発明のウェーハ用フレーム１０で使用する金属材料は、鉄、ステンレス鋼、アルミニウム、チタン、マグネシウム等が好ましいが、現状、耐熱性、耐食性とコストバランスの観点からはステンレス鋼板を使用するのが好ましい。 The metal material used in the wafer frame 10 of the present invention is preferably iron, stainless steel, aluminum, titanium, magnesium or the like, but at present, it is preferable to use a stainless steel plate from the viewpoint of heat resistance, corrosion resistance and cost balance. .
　第一の実施の形態
　第一の実施の形態に係るウェーハ用フレーム１０は図１に示す外観形状の平坦な金属製の上板１と上板１と同じ形状の平坦な金属製の下板２を用いる。上板１と下板２の厚みは特に限定せずウェーハ用フレームの寸法や金属材料の種類に応じて適宜設定すれば良い。 First Embodiment A wafer frame 10 according to a first embodiment includes a flat metal upper plate 1 having an outer shape shown in FIG. 1 and a flat metal lower plate 2 having the same shape as the upper plate 1. Is used. The thicknesses of the upper plate 1 and the lower plate 2 are not particularly limited, and may be set as appropriate according to the dimensions of the wafer frame and the type of metal material.
　さらにウェーハ用フレームの内部空間３ｃと側壁３ａを構成する部材として図２または図３に示す型枠３を使用する。本型枠３は、金属板を打抜き加工やレーザ切断加工によって製造できるので、型枠３の厚み、側壁３ａや梁３ｂの幅は図２や図３に限定されるものではなく、使用する金属材料の質量やウェーハ用フレーム１０の寸法に応じて適宜設定することによって、フレーム１０の軽量化に寄与する。 Further, the mold 3 shown in FIG. 2 or 3 is used as a member constituting the internal space 3c and the side wall 3a of the wafer frame. Since this mold 3 can be manufactured by punching or laser cutting a metal plate, the thickness of the mold 3 and the widths of the side walls 3a and beams 3b are not limited to those shown in FIGS. By setting appropriately according to the mass of the material and the dimensions of the wafer frame 10, it contributes to weight reduction of the frame 10.
　型枠３に梁部３ｂを設ける位置は特に限定しないが、例えば、図３に示す型枠３の形状では梁３ｂをウェーハ用フレーム１０の半径方向に一定間隔で設けるとともに、円周方向にも設けている。このように、使用する金属材料によってウェーハ用フレーム１０の強度、剛性を上昇させたい時は、図２、図３や図４、図５に示す梁３ｂを任意の間隔をおいて型枠３に設けるのが良い。しかし、図３に示す型枠３を使用すると、図２の型枠３に比べてウェーハ用フレーム１０の強度、剛性は高まるが、質量も大きくなるので、梁３ｂはウェーハ用フレーム１０に求められる剛性や質量に応じて適宜設定するのが好ましい。 For example, in the shape of the mold 3 shown in FIG. 3, the beams 3b are provided at regular intervals in the radial direction of the wafer frame 10 and also in the circumferential direction. Provided. Thus, when it is desired to increase the strength and rigidity of the wafer frame 10 depending on the metal material to be used, the beam 3b shown in FIGS. 2, 3, 4 and 5 is placed on the mold 3 at an arbitrary interval. It is good to provide. However, when the mold 3 shown in FIG. 3 is used, the strength and rigidity of the wafer frame 10 is increased as compared with the mold 3 shown in FIG. 2, but the mass is also increased. Therefore, the beam 3b is required for the wafer frame 10. It is preferable to set appropriately according to rigidity and mass.
　上記した上板１と下板２の間に型枠３を積層することによって、天井部１、底部２および側壁３ａが金属材料からなり、かつフレーム内部に空間を有するウェーハ用フレームが成形される。なお、位置決め用ノッチ２６は、フレーム１０をダイシングマシーンにセットするときの位置決め用のノッチであるので、上板１、下板２及び型枠３を積層するときは、位置決め用ノッチ２６が同じ位置に来るように重ねる必要がある。 By laminating the mold 3 between the upper plate 1 and the lower plate 2 described above, a wafer frame having the ceiling portion 1, the bottom portion 2 and the side wall 3a made of a metal material and having a space inside the frame is formed. . The positioning notch 26 is a positioning notch when the frame 10 is set on the dicing machine. Therefore, when the upper plate 1, the lower plate 2 and the mold 3 are stacked, the positioning notch 26 is located at the same position. It is necessary to pile up to come to.
　図４（ａ）は、本発明のウェーハ用フレーム１０の部分破断平面図である。
本ウェーハ用フレーム１０は図１に示す上板１、下板２と図２に示す型枠３から成形されており、型枠３は側壁３ａとフレームの半径方向に等間隔に配置された梁３ｂから成り立っている。　図４（ｂ）は図４（ａ）のＡ－Ａ断面図である。上板１、下板２と側壁３ａ、梁３ｂに囲まれた部位に空間３ｃが形成されており、本構成により軽量化が実現している。また、上板１、下板２と型枠３との接合は従来から知られている接着剤、ろう付け、溶接等の技術を適宜選択すれば良い。 FIG. 4A is a partially broken plan view of the wafer frame 10 of the present invention.
The wafer frame 10 is formed from an upper plate 1 and a lower plate 2 shown in FIG. 1 and a mold 3 shown in FIG. 2, and the mold 3 is a beam arranged at equal intervals in the radial direction of the side wall 3a and the frame. It consists of 3b. FIG. 4B is a cross-sectional view taken along the line AA in FIG. A space 3c is formed in a portion surrounded by the upper plate 1, the lower plate 2, the side wall 3a, and the beam 3b, and weight reduction is realized by this configuration. Moreover, what is necessary is just to select conventionally techniques, such as an adhesive agent, brazing, and welding, for the joining of the upper board 1, the lower board 2, and the formwork 3 suitably.
　図５は、本発明の他の実施の形態に係るウェーハ用フレームであり、型枠３として図３に示す型枠３を使用したものである。図５（ａ）は本発明のウェーハ用フレーム１０の部分破断平面図であり、図５（ｂ）は図５（ａ）のＡ－Ａ断面図である。本実施の形態では、図４の場合に比較して、さらにフレームの円周方向に梁３ｂが追加されて空間３ｃも細かく分布しており、強度、剛性が向上している。 FIG. 5 shows a wafer frame according to another embodiment of the present invention, in which the mold 3 shown in FIG. FIG. 5A is a partially broken plan view of the wafer frame 10 of the present invention, and FIG. 5B is a cross-sectional view taken along the line AA of FIG. 5A. In the present embodiment, as compared with the case of FIG. 4, the beams 3b are further added in the circumferential direction of the frame, and the spaces 3c are finely distributed, and the strength and rigidity are improved.
図６は、本発明の他の実施の形態に係るウェーハ用フレーム１０であり、図４、図５に示す本発明のウェーハ用フレーム１０の空間３ｃに中空金属体４を充填した例である。中空金属体４を使用することによって重量の増加を抑制しつつ、更なる強度、剛性の向上を達成することができる。 FIG. 6 shows a wafer frame 10 according to another embodiment of the present invention, which is an example in which the hollow metal body 4 is filled in the space 3c of the wafer frame 10 of the present invention shown in FIGS. The use of the hollow metal body 4 can achieve further improvement in strength and rigidity while suppressing an increase in weight.
　図６（ａ）は、本発明のウェーハ用フレーム１０の部分破断平面図であり、図６（ｂ）は図６（ａ）のＡ－Ａ断面図である。中空金属体４の材質は、特に限定しないが、ウェーハ用フレームの内部に密閉格納されるので、それなりの耐食性、剛性を得る材質を選択する必要がある。一般的には、入手が容易な中空鉄球を使用するのが好ましい。 6 (a) is a partially broken plan view of the wafer frame 10 of the present invention, and FIG. 6 (b) is a cross-sectional view taken along line AA of FIG. 6 (a). The material of the hollow metal body 4 is not particularly limited, but since it is hermetically stored inside the wafer frame, it is necessary to select a material that provides appropriate corrosion resistance and rigidity. In general, it is preferable to use a hollow iron ball that is easily available.
　中空鉄球等の球形の中空金属体４を使用する場合は、その球形の中空金属体４を予め押圧して変形させたものを使用するのが好ましい。球形のままで使用すると、中空金属体４と上板１、下板２とが点接触となるので安定性が悪く剛性向上の効果が得られ難いからである。球形の中空金属体を変形させて使用すると、中空金属体４と上板１、下板２との接触面積が増加するので、大幅な剛性向上が期待できる。 When a spherical hollow metal body 4 such as a hollow iron ball is used, it is preferable to use a spherical hollow metal body 4 that has been pressed and deformed in advance. This is because, when used in a spherical shape, the hollow metal body 4 and the upper plate 1 and the lower plate 2 are in point contact, resulting in poor stability and difficulty in obtaining rigidity. When the spherical hollow metal body is used by being deformed, the contact area between the hollow metal body 4 and the upper plate 1 and the lower plate 2 is increased, so that significant rigidity improvement can be expected.
　また、ウェーハ用フレーム１０の内部の空間に中空金属体４を充填する場合は、ウェーハ用フレーム１０を使用することによって、中空金属体４が移動してウェーハ用フレーム１０の内部で偏在する恐れがあるので、接着材あるいは、ろう材を用いて中空金属体を固定することが好ましい。接着剤は、アウトガスが発生しない仕様と耐熱仕様を兼ね備えた加熱硬化型の接着剤が好適である。また、ろう付けに用いるろう材は、銅系ろう材、ニッケル系ろう材が好適であり、ろう付けに代えて錫等の低融点金属材料を接合面に溶かし込むこともできる。 In addition, when the hollow metal body 4 is filled in the space inside the wafer frame 10, the use of the wafer frame 10 may cause the hollow metal body 4 to move and be unevenly distributed inside the wafer frame 10. Therefore, it is preferable to fix the hollow metal body using an adhesive or a brazing material. As the adhesive, a thermosetting adhesive having both a specification that does not generate outgas and a heat resistance specification is suitable. The brazing material used for brazing is preferably a copper-based brazing material or a nickel-based brazing material, and a low melting point metal material such as tin can be dissolved in the joint surface instead of brazing.
　第二の実施の形態
　次に本発明の第二の実施の形態に係るウェーハ用フレーム１０について説明する。 Second Embodiment Next, a wafer frame 10 according to a second embodiment of the present invention will be described.
　本発明に係る第二の実施の形態に係るウェーハ用フレーム１０を図７に示す。図７（ａ）はウェーハ用フレーム１０の上面側を示す平面図である。図７（ｂ）はＢ－Ｂ断面図である。図７（ｃ）はＢ－Ｂ断面での上蓋２１と下蓋２２の嵌合前の状態を示す模式図である。上蓋２１は天井２１ｂと側壁２１ａとが平板から一体成形されており、上蓋２１のフレーム断面（Ｂ－Ｂ断面）は略コの字型となっている。下蓋２２も底部２２ｂと側壁２２ａとが上蓋２１と同様に平板から一体成形されており、下蓋２２のフレーム断面（Ｂ－Ｂ断面）も略コの字型となっている。 7 shows a wafer frame 10 according to a second embodiment of the present invention. FIG. 7A is a plan view showing the upper surface side of the wafer frame 10. FIG. 7B is a sectional view taken along the line BB. FIG. 7C is a schematic view showing a state before the upper lid 21 and the lower lid 22 are fitted in the BB cross section. The top lid 21 has a ceiling 21b and a side wall 21a formed integrally from a flat plate, and the frame cross section (BB cross section) of the top lid 21 is substantially U-shaped. Similarly to the upper lid 21, the lower lid 22 has a bottom 22 b and a side wall 22 a integrally formed from a flat plate, and the frame cross section (BB cross section) of the lower lid 22 is also substantially U-shaped.
　上蓋２１と下蓋２２の断面を共に略コの字型に成形したので、図７（ｂ）、（ｃ）に示すように上蓋２１と下蓋２２を嵌合でき、その断面を箱型とすることができる。このように断面を箱型に成形したので捩れや反りに強い構造とできる。また箱内部は空間３ｃが成形されているのでフレームの軽量化が図れる。さらに上蓋２１が下蓋２２の内側に嵌合するようにしたので、下蓋２２の底部２２ｂには上蓋２１の側壁２１ａの端部が現れないので底部２２ｂは平滑な面となり、図２０、２１に示すようにダイシングフィルム３１をウェーハ用フレーム１０の裏面側２２ｂに貼付してもフィルムを傷つけることがない。 Since the cross sections of the upper lid 21 and the lower lid 22 are both formed into a substantially U-shape, the upper lid 21 and the lower lid 22 can be fitted as shown in FIGS. 7B and 7C. can do. Since the cross section is formed into a box shape in this way, a structure resistant to twisting and warping can be obtained. Further, since the space 3c is formed inside the box, the weight of the frame can be reduced. Further, since the upper lid 21 is fitted inside the lower lid 22, the end portion of the side wall 21a of the upper lid 21 does not appear on the bottom portion 22b of the lower lid 22, so that the bottom portion 22b becomes a smooth surface. As shown in FIG. 3, the film is not damaged even if the dicing film 31 is affixed to the back side 22b of the wafer frame 10.
　さらに、嵌合強度を上昇したい場合は、上蓋２１と下蓋２２との嵌合部２１ａ、２２ａは図７では、直線形状を図示したが、図１８（ａ）に示すように、上蓋側壁２１ａや下蓋側壁２２ａにノッチ形状の嵌合部を設けることによって直線形状よりも嵌合強度を大きくできる。また図１８（ｂ）に示すように、下蓋側壁２２ａ先端部に屈曲部を設けることによっても嵌合強度を上昇させることができる。さらに嵌合面に接着剤を塗布しても良い。 Further, when it is desired to increase the fitting strength, the fitting portions 21a and 22a between the upper lid 21 and the lower lid 22 are shown in a straight line shape in FIG. 7, but as shown in FIG. In addition, by providing a notch-shaped fitting portion on the lower lid side wall 22a, the fitting strength can be made larger than that of the linear shape. As shown in FIG. 18B, the fitting strength can also be increased by providing a bent portion at the tip of the lower lid side wall 22a. Furthermore, you may apply | coat an adhesive agent to a fitting surface.
また、図１９（ａ）、（ｂ）、（ｃ）に示すように嵌合部を溶接部４２で接合してさらに強度アップを図ることができる。溶接方法は、電子ビーム溶接、レーザ溶接、マイクロプラズマ溶接やTIG溶接等公知の溶接方法を適宜適用できる。 Further, as shown in FIGS. 19A, 19B, and 19C, the fitting portion can be joined by the welding portion 42 to further increase the strength. As a welding method, a known welding method such as electron beam welding, laser welding, microplasma welding, or TIG welding can be appropriately applied.
　また、図１９（ｄ）に示すように、溶接に代えてろう付け４３を用いることも可能である。ろう材としては、銅系ろう材やニッケル系ろう材が好適であり、ろう付けに代えて錫等の低融点金属材料を嵌合面に溶かし込むこともできる。 Also, as shown in FIG. 19 (d), brazing 43 can be used instead of welding. As the brazing material, a copper-based brazing material or a nickel-based brazing material is suitable, and instead of brazing, a low melting point metal material such as tin can be melted into the fitting surface.
　また、接着剤を用いる場合は、接着剤はアウトガスが発生しない仕様と耐熱仕様を兼ね備えた加熱硬化型の接着剤が好適である。 In the case where an adhesive is used, a thermosetting adhesive having both a specification that does not generate outgas and a heat-resistant specification is suitable.
　上蓋、下蓋の一体成形前の素材は金属平板（コスト、使い勝手面からはステンレス鋼板が好ましいがこれに限られるものではない）からプレス打抜き加工やレーザ切断加工により、ウェーハ用フレーム１０の肉厚、寸法に応じて適宜加工法を選択すれば良い。また、上蓋２１、下蓋２２の天井部２１ｂまたは底部２２ｂと側壁２１ａ、２２ａとの一体成形はプレス加工やスピニング加工等により側壁を目的寸法に適宜立ち上げて制作される。 The material before the upper lid and lower lid are integrally formed is a metal flat plate (a stainless steel plate is preferred for cost and convenience), but the thickness of the wafer frame 10 is obtained by press punching or laser cutting. The processing method may be appropriately selected according to the dimensions. Also, the integral formation of the ceiling portion 21b or bottom portion 22b of the upper lid 21 and the lower lid 22 and the side walls 21a, 22a is produced by appropriately raising the side walls to the desired dimensions by pressing or spinning.
　プレス加工は、上蓋、下蓋用部材を金属平板からプレス打抜きする工程と前記部材から側壁部を成形するプレス絞り加工工程とから成り立っている。本制作工程では、プレス絞り加工工程の後に全体の形状を整えるためのプレス成形工程を追加しても良い。さらに、上蓋、下蓋の嵌合部は嵌合精度が高い場合は、特に接合材を必要としない場合もあるが、洗浄水の侵入等を防止する観点からは、接合部に接着剤を塗布するか、ろう付け、レーザ溶接等を適宜取り入れるのが良い。 The press work is composed of a step of pressing and punching the upper lid and lower lid members from a metal flat plate and a press drawing step of forming a side wall portion from the members. In this production process, a press molding process for adjusting the overall shape may be added after the press drawing process. Furthermore, when the fitting accuracy of the upper and lower lids is high, there may be no need for a bonding material. However, from the viewpoint of preventing intrusion of cleaning water, etc., an adhesive is applied to the bonding portion. Or, brazing, laser welding or the like may be taken in as appropriate.
　図８は、本発明の他の実施の形態を示す図であり、上蓋２１、下蓋２２は図７と同様に天井部２１ｂと側壁２１ａ、底部２２ｂと側壁２２ａは一体成形されている。図８（ａ）は、本発明のウェーハ用フレーム１０の部分破断平面図であり、図８（ｂ）は図８（ａ）のＢ－Ｂ断面図である。図８（ｃ）はＢ－Ｂ断面での上蓋２１と下蓋２２の嵌合前の状態を示す模式図である。 FIG. 8 is a view showing another embodiment of the present invention, and the upper lid 21 and the lower lid 22 are integrally formed with the ceiling portion 21b and the side wall 21a, and the bottom portion 22b and the side wall 22a, as in FIG. FIG. 8A is a partially broken plan view of the wafer frame 10 of the present invention, and FIG. 8B is a cross-sectional view taken along the line BB of FIG. 8A. FIG. 8C is a schematic view showing a state before the upper lid 21 and the lower lid 22 are fitted in the BB cross section.
　本実施の形態は、図８（ｂ）に示すように下蓋２２の底部２２ｂに貼付された粘着フィルム（ウェーハＷを搭載保持するダイシングフィルム３１）を切断するカッタを収容する溝を有する梁２２ｃを一体成形したことである。該梁２２ｃは図８（ａ）に示すようにウェーハ用フレーム１０の底部２２ｂの円周方向に設けられており、捩れ、反り等を防止し剛性を付加する梁としての機能を有している。また前記梁２２ｃはウェーハ用フレーム１０の底部２２ｂに粘着フィルム（ウェーハＷを搭載保持するダイシングフィルム３１）を貼付し、ウェーハ用フレーム１０の径に合わせて前記粘着フィルムを切断する際に、カッタの刃先が前記ウェーハ用フレーム１０に接触するのを防止する溝である。従って、溝の幅、深さ、溝斜面の傾斜角度等はダイシングマシーンやフレームサイズ等に合わせて適宜決定すれば良い。また、カッタを収容する溝を作らない場合は、梁２２ｃは上蓋２１に一体成形しても良い。 In the present embodiment, as shown in FIG. 8B, a beam 22c having a groove for accommodating a cutter for cutting an adhesive film (dicing film 31 on which the wafer W is mounted and held) affixed to the bottom 22b of the lower lid 22 Is integrally molded. As shown in FIG. 8A, the beam 22c is provided in the circumferential direction of the bottom portion 22b of the wafer frame 10, and has a function as a beam that prevents torsion, warpage, and the like and adds rigidity. . The beam 22c attaches an adhesive film (dicing film 31 for mounting and holding the wafer W) to the bottom 22b of the wafer frame 10, and when the adhesive film is cut according to the diameter of the wafer frame 10, the cutter 22 It is a groove that prevents the cutting edge from contacting the wafer frame 10. Accordingly, the groove width and depth, the inclination angle of the groove slope, and the like may be appropriately determined according to the dicing machine, the frame size, and the like. Further, when the groove for accommodating the cutter is not formed, the beam 22c may be integrally formed with the upper lid 21.
　図９は、本発明のさらに他の実施の形態を示す図であり上蓋２１、下蓋２２は図７と同様に天井部２１ｂと側壁２１ａ、底部２２ｂと側壁２２ａは一体成形されている。図９（ａ）は、本発明のウェーハ用フレーム１０の部分破断平面図であり、図９（ｂ）は図９（ａ）のＢ－Ｂ断面図である。 FIG. 9 is a view showing still another embodiment of the present invention, and the upper lid 21 and the lower lid 22 are integrally formed with the ceiling portion 21b and the side wall 21a, and the bottom portion 22b and the side wall 22a, as in FIG. FIG. 9A is a partially broken plan view of the wafer frame 10 of the present invention, and FIG. 9B is a cross-sectional view taken along line BB of FIG. 9A.
　本実施の形態は、図９（ｂ）に図示すように上蓋天井２１ｂと下蓋底部２２ｂとの間に補強部材２３を固着する構造である。補強部材２３は図９（ｃ）に外観の例を示す平面図に図示するようにウェーハ用フレーム１０の幅部の円周方向にバンド状に設置した補強用梁である。本実施の形態は、ウェーハ用フレーム１０が大型化した場合にフレーム１０の肉厚を増加させて剛性を上げるより、肉厚は小径サイズと同じにして本補強部材２３を１枚固着するほうが軽量化できる場合に有効な処置となる。 In the present embodiment, as shown in FIG. 9B, a reinforcing member 23 is fixed between the upper lid ceiling 21b and the lower lid bottom portion 22b. The reinforcing member 23 is a reinforcing beam installed in a band shape in the circumferential direction of the width portion of the wafer frame 10 as shown in a plan view showing an example of an appearance in FIG. In the present embodiment, when the size of the wafer frame 10 is increased, the thickness of the frame 10 is increased and the rigidity is increased. This is an effective treatment if
　なお、補強部材としては、金属、特に鉄、ステンレス、アルミ、チタン等が好適であり、ゼンマイ等のバネ材や、座金等を空間内に保持出来るものなら何でも使用しても良い。また、補強部材として樹脂を使用することもできる。この場合は、樹脂をリング状にしてもよいし、上蓋断面全体または一部に樹脂板を使用することもできる。補強部材の形状は特に限定はしない。 As the reinforcing member, metal, particularly iron, stainless steel, aluminum, titanium, or the like is suitable, and any member that can hold a spring material such as a spring or a washer in the space may be used. Moreover, resin can also be used as a reinforcing member. In this case, the resin may be formed in a ring shape, or a resin plate may be used for the whole or a part of the upper lid cross section. The shape of the reinforcing member is not particularly limited.
　第三の実施の形態
　次に本発明の第三の実施の形態に係るウェーハ用フレーム１０について説明する。 Third Embodiment Next, a wafer frame 10 according to a third embodiment of the present invention will be described.
　本発明の第三の実施の形態に係るウェーハ用フレーム１０を図１０に示す。図１０（ａ）はウェーハ用フレーム１０の上面側を示す平面図である。図１０（ｂ）はＢ－Ｂ断面図である。上蓋２１は天井２１ｂと側壁２１ａとが平板から一体成形されるが、本実施の形態では、上蓋天井部２１ｂに下蓋底部２２ｂに接する窪み２１ｄを任意の間隔で複数個設置した。窪み２１ｄの幅、長さは任意であるが深さは下蓋底部２２ｂに接するようにし、フレームの周長に非連続した配置とする。本窪みも上蓋と一体成形するのが好ましい。 FIG. 10 shows a wafer frame 10 according to a third embodiment of the present invention. FIG. 10A is a plan view showing the upper surface side of the wafer frame 10. FIG. 10B is a BB cross-sectional view. In the upper lid 21, the ceiling 21 b and the side wall 21 a are integrally formed from a flat plate. In this embodiment, a plurality of depressions 21 d in contact with the lower lid bottom portion 22 b are provided in the upper lid ceiling portion 21 b at arbitrary intervals. The width and length of the recess 21d are arbitrary, but the depth is in contact with the lower lid bottom portion 22b and is arranged discontinuously with the peripheral length of the frame. It is preferable that the hollow is integrally formed with the upper lid.
　断面形状は第二の実施例と同様に、上蓋２１のフレーム断面（Ｂ－Ｂ断面）は略コの字型となっている。下蓋２２も底部２２ｂと側壁２２ａとが上蓋２１と同様に平板から一体成形されており、下蓋２２のフレーム断面（Ｂ－Ｂ断面）も略コの字型となっている。 As for the cross-sectional shape, the frame cross section (BB cross section) of the upper lid 21 is substantially U-shaped as in the second embodiment. Similarly to the upper lid 21, the lower lid 22 has a bottom 22 b and a side wall 22 a integrally formed from a flat plate, and the frame cross section (BB cross section) of the lower lid 22 is also substantially U-shaped.
このようにすることによって、図９に示した補強部材２３に代えてウェーハ用フレーム１０の剛性を上げることができる。ウェーハ用フレーム１０の捩れ等を考慮すると窪み２１ｄは上蓋天井部２１ｂの全体に複数個を均等に、非連続配置（図１０では対角に配置）とするのが好ましい。窪み２１ｄは図１０（ｂ）では鋭角に描いたが壁面は傾斜を持たせても良いし、角部も鈍角としたり、丸みをもたせても良い。また幅、長さもウェーハ用フレーム１０の大きさ、必要な剛性や捩れ、反り特性を勘案して適宜決定すれば良い。 By doing in this way, it can replace with the reinforcement member 23 shown in FIG. 9, and can raise the rigidity of the flame | frame 10 for wafers. In consideration of the twist of the wafer frame 10 and the like, it is preferable that a plurality of the recesses 21d are arranged evenly and discontinuously (disposed diagonally in FIG. 10) over the entire upper lid ceiling portion 21b. Although the depression 21d is drawn at an acute angle in FIG. 10B, the wall surface may be inclined, the corner may be obtuse, or rounded. In addition, the width and length may be appropriately determined in consideration of the size of the wafer frame 10 and necessary rigidity, twist, and warp characteristics.
　またフレーム内部には空間３ｃが成形されているのでフレームの軽量化が図れる。さらに上蓋２１が下蓋２２の内側に嵌合するようにしたので、下蓋２２の底部２２ｂには上蓋２１の側壁２１ａの端部が現れないので底部２２ｂは平滑な面となり、図２０、２１に示すようにダイシングフィルム３１をウェーハ用フレーム１０の裏面側２２ｂに貼付してもフィルムを傷つけることがない。 Also, since the space 3c is formed inside the frame, the weight of the frame can be reduced. Further, since the upper lid 21 is fitted inside the lower lid 22, the end portion of the side wall 21a of the upper lid 21 does not appear on the bottom portion 22b of the lower lid 22, so that the bottom portion 22b becomes a smooth surface. As shown in FIG. 3, the film is not damaged even if the dicing film 31 is affixed to the back side 22b of the wafer frame 10.
　図１１は、図１０と同様に下蓋２２に非連続の窪み２２ｄを複数個設けた例であり、基本的構造は図１０と同じである。 FIG. 11 is an example in which a plurality of non-continuous depressions 22d are provided in the lower lid 22 as in FIG. 10, and the basic structure is the same as FIG.
　図１２は上蓋、下蓋共に窪み２１ｄ、２２ｄを有し、各窪み２１ｄ、２２ｄ同士はお互いに接触しないように複数個配置されている。本実施の形態では、上蓋、下蓋の各々に設置する窪み２１ｄ、２２ｄの数は少なくてもウェーハ用フレーム１０全体としては数を倍増できる。本ケースはウェーハ用フレーム１０の幅が狭く、窪みのプレス成形時に歪みが発生し易い場合には上、下蓋当たりの窪みの数を減らせるので有効である。 In FIG. 12, both the upper and lower lids have depressions 21d and 22d, and a plurality of depressions 21d and 22d are arranged so as not to contact each other. In the present embodiment, the number of the recesses 21d and 22d installed in each of the upper lid and the lower lid can be doubled as a whole for the wafer frame 10 even if the number is small. This case is effective in that the width of the wafer frame 10 is narrow and distortion is likely to occur during press forming of the recess, so that the number of recesses per upper and lower lid can be reduced.
　図１３は、上蓋、下蓋に設置した窪み２１ｄ、２２ｄのウェーハ用フレーム１０の周長さ方向位置を同じにして、窪みの底部がお互いに接するようにしたものである。本実施の形態は、窪み２１ｄ、２２ｄの深さを深くプレス成形できない場合に有効である。窪み２１ｄ、２２ｄ同士が接しているので剛性の向上、捩れ防止に効果的である。 FIG. 13 shows the recesses 21d and 22d installed in the upper and lower lids at the same position in the circumferential direction of the wafer frame 10 so that the bottoms of the recesses are in contact with each other. This embodiment is effective when the depressions 21d and 22d cannot be deeply pressed. Since the recesses 21d and 22d are in contact with each other, it is effective in improving rigidity and preventing twisting.
　図１４に示す実施の形態は、上蓋２１または下蓋２２の片方にウェーハ用フレーム１０の周長さ方向に連続した窪み２１ｄを配置した例である。窪みの幅は任意であり、狭幅にして幅方向に２条以上設けてもよい。窪みの底部は上蓋天井部または下蓋底部に接するのを基本とするが、捩れ等が問題無い場合は接しないで浮いた状態でもよい。 The embodiment shown in FIG. 14 is an example in which a recess 21 d continuous in the circumferential length direction of the wafer frame 10 is arranged on one side of the upper lid 21 or the lower lid 22. The width of the dent is arbitrary, and it may be narrow and two or more strips may be provided in the width direction. The bottom of the depression is basically in contact with the top lid ceiling or bottom lid bottom, but may be in a floating state without contact if there is no problem with twisting or the like.
　図１５に示す実施の形態は、上蓋２１および下蓋２２の両方にウェーハ用フレーム１０の周長さ方向に連続した窪み２１ｄ、２２ｄを配置した例である。窪みの底部同士は互いに接している。このように構成することで剛性がより向上し、捩れ防止にも有効である。本ケースもフレームの幅が許せば２条以上設置しても良い。 The embodiment shown in FIG. 15 is an example in which depressions 21 d and 22 d continuous in the circumferential length direction of the wafer frame 10 are arranged on both the upper lid 21 and the lower lid 22. The bottoms of the recesses are in contact with each other. With such a configuration, the rigidity is further improved and it is effective for preventing twisting. Two or more cases may be installed in this case if the width of the frame allows.
　図１６は、ウェーハ用フレーム１０の剛性をさらに向上するために図６のケースと同様に図７～１５に図示したウェーハ用フレーム１０の内部の空間３ｃに中空金属体４を充填した例である。図１６（ａ）は、本発明のウェーハ用フレーム１０の部分破断平面図であり、図１６（ｂ）は図１６（ａ）のＢ－Ｂ断面図である。中空金属体４を使用することによって重量の増加を抑制しつつ剛性の向上を達成できるので好適である。 FIG. 16 shows an example in which the hollow metal body 4 is filled in the space 3c inside the wafer frame 10 shown in FIGS. 7 to 15 in the same manner as the case of FIG. 6 in order to further improve the rigidity of the wafer frame 10. . 16 (a) is a partially broken plan view of the wafer frame 10 of the present invention, and FIG. 16 (b) is a cross-sectional view taken along the line BB of FIG. 16 (a). Use of the hollow metal body 4 is preferable because an increase in rigidity can be achieved while suppressing an increase in weight.
　充填する中空金属体４の数量は、ウェーハ用フレーム１０内部の空間の寸法や中空金属体４の大きさ等に応じて適宜設定することができる。そのため中空金属体４の材質、形状については、第一の実施の形態の図６の説明で述べたことと基本的に変わるところはない。 The number of hollow metal bodies 4 to be filled can be appropriately set according to the size of the space inside the wafer frame 10 and the size of the hollow metal bodies 4. Therefore, the material and shape of the hollow metal body 4 are basically the same as those described in the description of FIG. 6 of the first embodiment.
　なお、本実施例では、中空金属体について述べたが、ウェーハ用フレーム１０の内部の空間３ｃの充填材として樹脂材料を用いることができる。樹脂材料としては、アクリル系樹脂、エポキシ系樹脂、シリコン系樹脂、ポリカーボネード樹脂、ナイロン樹脂、ポリエステル樹脂、ポリイミド樹脂、ＰＢＴ樹脂（ポリブチレンテレフタレート樹脂）、ＰＰＳ樹脂（ポリフェニレンサルファイド樹脂）およびＡＢＳ樹脂等が充填材として好適である。更には、上記した樹脂材料をガラス繊維で強化した樹脂材料（以下、ＧＦＲＰと呼ぶ）とすることができる。その場合は、アウトガスの発生が無く、しかも線膨張係数が低いポリカーボネード樹脂をマトリックスとし、ガラス繊維を体積分率で１０～２０％含有することが好適である。なお、ガラス繊維は断面が丸型形状や扁平形状の単独または複合添加がより好適である。 In addition, although the hollow metal body was described in the present Example, a resin material can be used as a filler of the space 3c inside the wafer frame 10. Resin materials include acrylic resin, epoxy resin, silicon resin, polycarbonate resin, nylon resin, polyester resin, polyimide resin, PBT resin (polybutylene terephthalate resin), PPS resin (polyphenylene sulfide resin), and ABS resin. Suitable as a filler. Furthermore, the above-described resin material can be a resin material reinforced with glass fiber (hereinafter referred to as GFRP). In that case, it is preferable that a polycarbonate resin having no outgas and having a low linear expansion coefficient is used as a matrix, and glass fiber is contained in an amount of 10 to 20% by volume fraction. The glass fiber is more preferably used alone or in combination with a round or flat cross section.
　ウェーハ用フレームの製造方法
　プレス加工による上蓋、下蓋一体成形する場合（図７または図１０）に示す上蓋２１と下蓋２２）は、金属平板（例えばステンレス薄鋼板）をプレス打抜き加工により上蓋原板または下板原板を作成する。次いで、打抜かれた上蓋原板または下板原板を型絞りプレスにて側壁２１ａ、２２ａを成形していく。さらにフレームの全体形状を整えるためのプレス成形工程を経るのが好ましい。また、図１０に示す窪み２１ｄは、型絞りプレス工程で側壁成形後に窪み部を絞りプレスするか、側壁成形と同時に絞りプレスにて窪み部を成形する。 Method for Manufacturing Wafer Frame When the upper and lower lids are integrally formed by pressing (the upper lid 21 and the lower lid 22 shown in FIG. 7 or 10), the upper lid original plate is formed by press punching a metal flat plate (for example, a stainless steel sheet). Or create the lower plate. Next, the side walls 21a and 22a are formed on the punched upper lid original plate or lower plate original plate using a die drawing press. Furthermore, it is preferable to go through a press molding process for adjusting the overall shape of the frame. In addition, the depression 21d shown in FIG. 10 is formed by drawing the depression after the side wall is formed in the die drawing press process, or forming the depression by the drawing press simultaneously with the side wall formation.
　第四の実施の形態
　以上、ウェーハ用フレームを金属平板から製造する場合について述べたが、本実施の形態では、薄肉鋼管を使ってウェーハ用フレームを成形する工程について述べる。 Fourth Embodiment As described above, the case where the wafer frame is manufactured from a metal flat plate has been described. In the present embodiment, a process of forming the wafer frame using a thin steel pipe will be described.
　薄肉鋼管からウェーハ用フレームを具体的に成形する工程を図１７により説明する。 A specific process for forming a wafer frame from a thin steel pipe will be described with reference to FIG.
図１７（ａ）工程では薄肉鋼管を管軸方向に曲げて略円形の円筒体を作成する。（ｂ）工程では円筒体の両端面を溶接にて接合してリング状とする。（ｃ）工程では、ウェーハ用フレームの位置決め用ノッチをプレスにて成形する。（ｄ）工程では、円筒体をプレス成形して箱型フレーム形状とする。なお、剛性を上げるために薄肉鋼管に中空金属体および／または樹脂材料を充填することもでき、その場合は、（ａ）工程の円筒体成形前に薄肉鋼管に中空金属体や樹脂材料を充填しておくのが良い。 In the step of FIG. 17 (a), a thin steel pipe is bent in the pipe axis direction to create a substantially circular cylindrical body. In the step (b), both end surfaces of the cylindrical body are joined by welding to form a ring shape. In the step (c), a notch for positioning the wafer frame is formed by a press. In the step (d), the cylindrical body is press-molded into a box frame shape. In order to increase the rigidity, it is possible to fill a thin steel pipe with a hollow metal body and / or a resin material. In this case, the thin steel pipe is filled with a hollow metal body or a resin material before forming the cylindrical body in step (a). It is good to keep.
　評価試験について
　重量比測定
　ウェーハ用フレーム１０の重量を測定し、従来材ウェーハ用フレーム１０の質量を１００とした場合の比を質量比と表した。
評価結果は、質量比５０未満を◎、質量比５０以上７０未満を○、質量比７０以上を×と表記した。 About Evaluation Test Weight Ratio Measurement The weight of the wafer frame 10 was measured, and the ratio when the mass of the conventional wafer frame 10 was 100 was expressed as a mass ratio.
In the evaluation results, a mass ratio of less than 50 is indicated by ◎, a mass ratio of 50 or more and less than 70 is indicated by ○, and a mass ratio of 70 or more is indicated by ×.
　荷重変形試験
　ウェーハ用フレーム１０の一端に特定荷重を一定時間加えた後に荷重を除荷してフレームに生じた反り量を評価する試験である。試験方法を図２３に図示する。
図２３（ａ）はウェーハ用フレーム１０の固定方法、荷重方法を説明する模式図である。図２３（ｂ）はウェーハ用フレーム１０の固定位置を説明する平面図である。 Load deformation test In this test, a specific load is applied to one end of the wafer frame 10 for a certain period of time, and then the load is removed to evaluate the amount of warpage generated in the frame. The test method is illustrated in FIG.
FIG. 23A is a schematic diagram for explaining a fixing method and a loading method of the wafer frame 10. FIG. 23B is a plan view for explaining a fixing position of the wafer frame 10.
　ウェーハ用フレーム１０の一端から全幅の３／４の位置または１／４の位置を治具により固定し、固定部と相対する自由端部に３／４の位置を固定する場合は３０Ｎ、１／４の位置を固定する場合は１０Ｎの力をそれぞれ６０秒間加えた後に力を解放し、ウェーハ用フレーム１０を定盤上に置いて変形反り量を高さゲージにて測定した。 In the case where the position of 3/4 or 1/4 of the full width from one end of the wafer frame 10 is fixed by a jig, and the position of 3/4 is fixed to the free end opposite to the fixed portion, 30N, 1 / When the position 4 was fixed, a force of 10 N was applied for 60 seconds, and then the force was released. The wafer frame 10 was placed on a surface plate, and the amount of deformation warpage was measured with a height gauge.
試験結果は、変形反り量０．３ｍｍ未満を◎、変形反り量０．３ｍｍ以上０．５ｍｍ未満を○、変形反り量０．５ｍｍ以上を×と表記した。 In the test results, a deformation warp amount of less than 0.3 mm was indicated as ◎, a deformation warp amount of 0.3 mm or more and less than 0.5 mm was indicated as ◯, and a deformation warp amount of 0.5 mm or more was indicated as ×.
　平坦度試験
　ウェーハ用フレーム１０を定盤上に置き、高さゲージによりフレーム上の最高点と最低点を測定し、この差を平坦度とした。 Flatness test The wafer frame 10 was placed on a surface plate, the highest point and the lowest point on the frame were measured with a height gauge, and this difference was defined as the flatness.
試験結果は、平坦度０．３ｍｍ未満を◎、平坦度０．３ｍｍ以上０．４ｍｍ未満を○、平坦度０．４ｍｍ以上を×と表記した。 In the test results, the flatness of less than 0.3 mm was indicated by ◎, the flatness of 0.3 mm or more and less than 0.4 mm by ◯, and the flatness of 0.4 mm or more by ×.
　以下具体的実施例について説明する。
試験Ｎｏ．１～７は請求項１～３に対応する実施例であり、図１に示す形状の上板１、下板２を０．２０ｍｍ厚のステンレス鋼板から作成し、型枠３は図２に示す形状（表１コア材：型枠Ａ）または、図３に示す形状（表１コア材：型枠Ｂ）を１．０ｍｍ厚のステンレス鋼板から作成し、上板１、下板２と型枠３を組み合わせてフレーム寸法外径４００ｍｍ、内径３５０ｍｍ、厚さ１．５ｍｍのウェーハ用フレーム（全厚１．５ｍｍ）を作成した。上板１と型枠３の接合、下板２と型枠３の接合はアウトガスが発生しない耐熱仕様の接着剤、ロウ付け及びレーザ溶接により接合した。 Specific examples will be described below.
Test No. 1 to 7 are embodiments corresponding to claims 1 to 3, and the upper plate 1 and the lower plate 2 having the shape shown in FIG. 1 are made of a stainless steel plate having a thickness of 0.20 mm, and the mold 3 is shown in FIG. The shape (Table 1 core material: formwork A) or the shape shown in FIG. 3 (Table 1 core material: formwork B) is made from a 1.0 mm thick stainless steel plate, and the upper plate 1, lower plate 2 and formwork 3 was combined to produce a wafer frame (total thickness 1.5 mm) having an outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 1.5 mm. The upper plate 1 and the mold 3 were joined, and the lower plate 2 and the mold 3 were joined by heat-resistant adhesive that does not generate outgas, brazing, and laser welding.
　試験Ｎｏ．８～２１は請求項４～６に対応する実施例であり、上蓋、下蓋の素材は０．２０ｍｍ厚のステンレス鋼板を使用して、プレス絞り加工により天井部２１ｂと側壁２１ａを、底部２２ｂと側壁２２ａを一体成形した。側壁の高さは、上蓋は１．３ｍｍ高さに、下蓋は１．５ｍｍ高さとして、フレーム寸法外径４００ｍｍ、内径３５０ｍｍ、厚さ１．５ｍｍのウェーハ用フレーム（全厚１．５ｍｍ）を作成した。なお、試験Ｎｏ．１３～１６の図９（ｃ）に図示する補強部材２３（表１のコア材：型枠Ｃ）は、板厚１．０ｍｍの鋼板から中心径φ３７０ｍｍで幅３ｍｍのリングを打抜いたもので、フレームの内部に接着剤またはロウ付けにより接合した。 Test No. Nos. 8 to 21 are embodiments corresponding to claims 4 to 6, and the top cover and the bottom cover are made of 0.20 mm thick stainless steel plate, and the ceiling portion 21b and the side wall 21a are formed by press drawing and the bottom portion 22b. And the side wall 22a were integrally formed. The height of the side wall is 1.3 mm for the upper lid and 1.5 mm for the lower lid. The wafer frame has an outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 1.5 mm (total thickness of 1.5 mm). It was created. In addition, Test No. A reinforcing member 23 (core material: formwork C in Table 1) shown in FIGS. 13 to 16 in FIG. 9C is obtained by punching a ring having a center diameter of 370 mm and a width of 3 mm from a steel plate having a thickness of 1.0 mm. The inside of the frame was joined by an adhesive or brazing.
　また、試験Ｎｏ．１７～２１の図８に図示するカッタを収容する溝を有する梁２２ｃは、プレス絞り加工前にプレス加工により下蓋のフレームに設けた。 Also, test no. The beam 22c having a groove for accommodating the cutter illustrated in FIGS. 17 to 21 in FIG. 8 was provided on the frame of the lower lid by press work before press drawing.
　試験Ｎｏ．２２～３３は請求項７～１５に対応する実施例であり、上蓋、下蓋の素材は０．２０ｍｍ厚のステンレス鋼板を使用して、プレス絞り加工により上蓋側壁２１ａ、上蓋天井２１ｂと上蓋窪み２１ｄを、下蓋側壁２２ａ、下蓋底部２２ｂと下蓋窪み２２ｄを一体成形した。側壁の高さは、上蓋は１．３ｍｍ高さに、下蓋は１．５ｍｍ高さとして、フレーム寸法外径４００ｍｍ、内径３５０ｍｍ、厚さ１．５ｍｍのウェーハ用フレーム（全厚１．５ｍｍ）を作成した。上蓋と下蓋、中空鉄球は、接着剤により接合した。 Test No. 22 to 33 are embodiments corresponding to claims 7 to 15, and the upper lid and lower lid are made of stainless steel plate having a thickness of 0.20 mm, and the upper lid side wall 21a, the upper lid ceiling 21b and the upper lid depression are formed by press drawing. 21d was integrally formed with the lower lid side wall 22a, the lower lid bottom portion 22b, and the lower lid recess 22d. The height of the side wall is 1.3 mm for the upper lid and 1.5 mm for the lower lid. The wafer frame has an outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 1.5 mm (total thickness of 1.5 mm). It was created. The upper and lower lids and the hollow iron ball were joined with an adhesive.
　試験Ｎｏ．３４～３５は請求項１６～１７に対応する実施例であり、薄肉鋼管４１を管軸方向に略円形に成形して、管端面同士をレーザ溶接して円筒体を成形し、円筒体を扁平プレス成形して１．５ｍｍ高さのウェーハ用フレーム（全厚１．５ｍｍ）を作成した。 Test No. 34 to 35 are embodiments corresponding to claims 16 to 17, in which the thin steel tube 41 is formed in a substantially circular shape in the tube axis direction, the end surfaces of the tubes are laser welded to form a cylindrical body, and the cylindrical body is flattened. A wafer frame (total thickness: 1.5 mm) having a height of 1.5 mm was formed by press molding.
試験Ｎｏ．３６は従来例でありフレーム素材は１．５ｍｍ厚のステンレス鋼板を使用してフレーム寸法外径４００ｍｍ、内径３５０ｍｍ、厚さ１．５ｍｍのウェーハ用フレームを作成した。 Test No. 36 is a conventional example, and a frame material for a wafer having a frame size outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 1.5 mm was prepared using a stainless steel plate having a thickness of 1.5 mm.
　以上、各試験材の構造と重量測定結果、平坦度試験結果および荷重変形試験結果をまとめて表１および表２に示す。 The structures and weight measurement results, flatness test results, and load deformation test results of each test material are summarized in Tables 1 and 2 above.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　上述したが、あらためて述べると、表１および表２に示す「コア材」（上板、下板ないし上蓋、下蓋の間に積層、固着または充填される材料）欄のうち、型枠Ａは図２に図示する型枠３を、型枠Ｂは図３に図示する型枠３を、型枠Ｃは図９（ｃ）に図示するリング状補強部材２３をそれぞれ意味する。 As described above, again, in the “core material” (material laminated, fixed or filled between the upper plate, lower plate or upper lid, and lower lid) column shown in Table 1 and Table 2, the mold A is The mold 3 shown in FIG. 2, the mold B means the mold 3 shown in FIG. 3, and the mold C means the ring-shaped reinforcing member 23 shown in FIG. 9C.
　作成したウェーハ用フレームの基本構造は表１の「フレーム構造の図番号対応」欄に記載されているが、試験Ｎｏ．１～７は上、下板に型枠を積層した構造であり、このうち図４に図示する構造は試験Ｎｏ．１、２、７で、図５に図示する構造は試験Ｎｏ．３～６で試験した。なお試験Ｎｏ．４と６では、図５に図示する構造にさらに中空鉄球４を充填した構造と、同じく試験Ｎｏ．２では図４に図示する構造にさらに中空鉄球４が充填された構造となっている（図６）。 The basic structure of the created wafer frame is listed in the “Frame structure corresponding to figure number” column in Table 1. Nos. 1 to 7 have a structure in which molds are laminated on the upper and lower plates, and the structure shown in FIG. 1, 2 and 7, the structure shown in FIG. Tested at 3-6. Test No. In Nos. 4 and 6, the test No. 4 is the same as the structure shown in FIG. 2, the structure shown in FIG. 4 is further filled with hollow iron balls 4 (FIG. 6).
　上蓋、下蓋と側壁部を一体成形した実施例は試験Ｎｏ．８～２１である。このうち、試験Ｎｏ．８～１２は梁を有しない図７に図示する構造であり、Ｎｏ．１１、１２はさらに中空鉄球を充填した構造となっている（図１６）。また、試験Ｎｏ．１３～１６は図９に図示する構造であり、図７に図示する構造にウェーハ用フレーム１０の補強部材２３を設けた構造となっている。試験Ｎｏ．１７～２１は図８に図示する構造であり、下蓋のフレームには粘着フィルム３１を切断するカッタを収容する溝を有する梁２２ｃが設けられている。なお試験Ｎｏ．１８と２０では、図８に図示する構造にさらに中空鉄球４を充填した構造となっている。 An example in which the upper lid, the lower lid and the side wall portion are integrally molded is shown in Test No. 8-21. Among these, test No. Nos. 8 to 12 have the structure shown in FIG. 11 and 12 are further filled with hollow iron balls (FIG. 16). In addition, Test No. Reference numerals 13 to 16 denote the structure shown in FIG. 9, and the structure shown in FIG. 7 is provided with the reinforcing member 23 of the wafer frame 10. Test No. Reference numerals 17 to 21 denote the structure shown in FIG. 8, and a beam 22c having a groove for receiving a cutter for cutting the adhesive film 31 is provided on the frame of the lower lid. Test No. In 18 and 20, the structure shown in FIG. 8 is further filled with a hollow iron ball 4.
上蓋、下蓋、側壁部および窪みを一体成形した実施例は試験Ｎｏ．２２～３３である。試験Ｎｏ．２２～２３は図１０に示す構造であり、上蓋２１に下蓋２２の底部２２ｂに接する窪み２１ｄがフレームの周長さ方向に設けられている。Ｎｏ．２４～２５は図１１に示す構造であり、下蓋２２に上蓋の天井２１ｂに接する窪み２２ｄがフレームの周長さ方向に設けられている。Ｎｏ．２６～２７は図１２に示す構造であり、上蓋２１および下蓋２２に、窪み２１ｄおよび２２ｄがフレームの周長さ方向に、相互に異なる箇所に上蓋２１の天井２１ｂ又は下蓋２２の底部２２ｂに接するように設けられている。Ｎｏ．２８～２９は図１３に示す構造であり、上蓋２１および下蓋２２に窪み２１ｄおよび２２ｄがフレームの周長さ方向の同一箇所に窪み同士が接触するように設けられている。Ｎｏ．３０～３１は図１４に示す構造であり、上蓋２１のフレームの周長さ方向に連続した窪み２１ｄが１条設けられている。Ｎｏ．３２～３３は図１５に示す構造であり、上蓋２１および下蓋２２にそれぞれフレームの周長さ方向に連続した窪み２１ｄおよび２２ｄが相互に接触するように各１条設けられている。 An example in which the upper lid, the lower lid, the side wall, and the recess were integrally formed was shown in Test No. 22-33. Test No. Reference numerals 22 to 23 have the structure shown in FIG. 10, and the upper lid 21 is provided with a recess 21d in contact with the bottom 22b of the lower lid 22 in the circumferential length direction of the frame. No. Reference numerals 24 to 25 denote the structure shown in FIG. 11, in which a recess 22d in contact with the ceiling 21b of the upper lid is provided in the lower lid 22 in the circumferential length direction of the frame. No. 26 to 27 have the structure shown in FIG. 12, and the upper lid 21 and the lower lid 22 have recesses 21d and 22d in the circumferential length direction of the frame, and the ceiling 21b of the upper lid 21 or the bottom 22b of the lower lid 22 at different locations. It is provided so that it may touch. No. In the structure shown in FIG. 13, the upper lid 21 and the lower lid 22 are provided with depressions 21d and 22d so that the depressions are in contact with each other at the same position in the circumferential direction of the frame. No. Reference numerals 30 to 31 denote the structure shown in FIG. 14, in which one recess 21 d is provided in the circumferential direction of the frame of the upper lid 21. No. Reference numerals 32 to 33 each have a structure shown in FIG. 15, and each of the upper lid 21 and the lower lid 22 is provided with one strip so that the recesses 21d and 22d continuous in the circumferential length direction of the frame come into contact with each other.
Ｎｏ．３４～３５は図１７に示す構造であり、薄肉鋼管４１を管軸方向に略円形に成形して、管端面同士をレーザ溶接４２して円筒体を成形し、更に、その円筒体を扁平プレス成形したものである。 No. Reference numerals 34 to 35 denote structures shown in FIG. 17, in which a thin steel pipe 41 is formed in a substantially circular shape in the direction of the pipe axis, the end surfaces of the pipes are laser welded 42 to form a cylindrical body, and the cylindrical body is further flattened. Molded.
試験Ｎｏ．１～３５は本願発明の構造を有しているので、従来例のウェーハ用フレームの質量を１００とした場合に質量比で３０～６２の値を示すウェーハ用フレームが得られた。また、このように軽量化したにもかかわらず、平坦度試験、荷重変形試験の値は従来例のウェーハ用フレームと何ら遜色のない値が得られた。 Test No. Since 1 to 35 have the structure of the present invention, a wafer frame having a mass ratio of 30 to 62 when the mass of the conventional wafer frame is 100 was obtained. In addition, despite the weight reduction, flatness test and load deformation test values were inferior to those of the conventional wafer frame.
　図２４に表１および表２に示す試験結果を反り量評価と軽量化率（＝１００－質量比）との関係で図式化したものを示す。側壁部一体成形、側壁部嵌入溝一体成形および側壁部窪み一体成形のコア材を有するフレーム構造にすると、従来例のウェーハ用フレームと反り量の変化は少ないが、軽量化率が４８％～６２％に達することが分かる。 FIG. 24 shows the test results shown in Tables 1 and 2 schematically represented by the relationship between the warpage amount evaluation and the weight reduction rate (= 100-mass ratio). When the frame structure having the core material of the side wall part integral molding, the side wall insertion groove integral molding and the side wall recess depression integral molding is small in the amount of warpage with the conventional wafer frame, the weight reduction rate is 48% to 62%. % Is reached.
　本発明は軽量で耐熱性に優れたフレームが得られるので、フレーム構造を有する部材の軽量化に適用することができる。 Since the present invention provides a lightweight and excellent heat resistant frame, it can be applied to weight reduction of members having a frame structure.
１　　上板、　　　１ａ　天井部、　　　２　　下板、　　　２ａ　底部
　３　　型枠、　　　３ａ　側壁、　　　３ｂ　梁、　　　３ｃ　空間
　４　　中空金属体、　　　９　　収納容器、　　  １０　フレーム
　２１　上蓋、　　２１ａ上蓋側壁、　　２１ｂ上蓋天井、　　２１ｄ上蓋窪み
　２２　下板、　　２２ａ下蓋側壁、　２２ｂ下蓋底部、　
　２２ｃカッタを収容する溝を有する梁、　２２ｄ下蓋窪み、　２３　補強部材、　　２６　位置決め用ノッチ、　３０　ダイヤモンドブレード、　　
３１　ダイシングフィルム、　４１　鋼管、　４２　溶接部、　　
４３　ろう付け部、　　Ｄ　　ダイ、　　Ｗ　　半導体フェーハ
 

  DESCRIPTION OF SYMBOLS 1 Upper plate, 1a Ceiling part, 2 Lower plate, 2a Bottom part 3 Formwork, 3a Side wall, 3b Beam, 3c Space 4 Hollow metal body, 9 Storage container, 10 Frame 21 Upper lid, 21a Upper lid side wall, 21b Upper lid ceiling, 21d Upper lid Dent 22 lower plate, 22a lower lid side wall, 22b lower lid bottom,
A beam having a groove for accommodating a 22c cutter, 22d lower lid recess, 23 reinforcing member, 26 positioning notch, 30 diamond blade,
31 dicing film, 41 steel pipe, 42 welded part,
43 Brazing section, D die, W semiconductor fae

Claims (17)

  1. 　　金属材料からなる、天井部、底部と側壁と、
    前記天井部、前記底部と前記側壁とで形成された空間と、
    を有するウェーハ用フレーム。     A ceiling part, a bottom part and a side wall made of a metal material,
    A space formed by the ceiling, the bottom and the side wall;
    Wafer frame having
  2. 　　前記天井部が平坦な上板からなり、
    　　前記底部が平坦な下板からなり、
    　　前記側壁が型枠からなり、
    前記空間が、前記上板と前記下板との間に、前記型枠を積層することによって設けられている、
    請求項１に記載のウェーハ用フレーム。     The ceiling part is composed of a flat upper plate,
    The bottom is made of a flat lower plate,
    The side wall comprises a formwork;
    The space is provided by laminating the formwork between the upper plate and the lower plate.
    The wafer frame according to claim 1.
  3. 　　さらに、前記型枠に設けられた梁を有する請求項２に記載のウェーハ用フレーム。 The wafer frame according to claim 2, further comprising a beam provided on the mold.
  4. 　　前記天井部と前記側壁とが断面形状がコの字形状に一体成形された上蓋を形成し、
    前記底部と前記側壁とが断面形状がコの字形状に一体成形された下蓋を形成し、
    前記空間が、前記上蓋と前記下蓋を嵌合することによって形成される、
    請求項１に記載のウェーハ用フレーム。     The ceiling part and the side wall form an upper lid in which a cross-sectional shape is integrally formed in a U shape,
    The bottom part and the side wall form a lower lid in which a cross-sectional shape is integrally formed in a U shape,
    The space is formed by fitting the upper lid and the lower lid,
    The wafer frame according to claim 1.
  5. 　　さらに、前記下蓋を一体成形して前記下蓋の底部に設けられた、粘着フィルム切断用カッタを収容する溝を持つ梁を有する請求項４に記載のウェーハ用フレーム。 5. The wafer frame according to claim 4, further comprising a beam having a groove for housing the adhesive film cutting cutter, which is integrally formed with the lower lid and provided at the bottom of the lower lid.
  6. 　　さらに、前記上蓋と、前記下蓋との間に固着された補強部材を有する請求項４に記載のウェーハ用フレーム。 The wafer frame according to claim 4, further comprising a reinforcing member fixed between the upper lid and the lower lid.
  7. 　　さらに、前記上蓋の天井部に周方向に任意の間隔で１個以上設けられた、下蓋の底部に接する窪み、または、前記下蓋の底部に周方向に任意の間隔で１個以上設けられた、上蓋の天井部に接する窪み、を有する請求項４に記載のウェーハ用フレーム。 Furthermore, one or more depressions in contact with the bottom of the lower lid provided at an arbitrary interval in the circumferential direction on the ceiling of the upper lid or one or more provided at an arbitrary interval in the circumferential direction on the bottom of the lower lid. The wafer frame according to claim 4, further comprising a recess in contact with a ceiling portion of the upper lid.
  8. 　　さらに、前記上蓋の天井部に周方向に任意の間隔で１個以上設けられた、下蓋の底部に接する窪み、および、前記下蓋の底部に周方向に任意の間隔で１個以上設けられた、上蓋の天井部に接する窪み、を有し、
    前記下蓋の底部に接する窪みと上蓋の天井部に接する窪みが接触しないように形成されている、
    請求項４に記載のウェーハ用フレーム。     Further, one or more depressions in contact with the bottom of the lower lid provided at an arbitrary interval in the circumferential direction on the ceiling of the upper lid, and one or more depressions provided at an arbitrary interval in the circumferential direction on the bottom of the lower lid. And a recess in contact with the ceiling of the upper lid,
    It is formed so that the dent in contact with the bottom of the lower lid and the dent in contact with the ceiling of the upper lid do not contact,
    The wafer frame according to claim 4.
  9. 　　さらに、前記上蓋の天井部に周方向に任意の間隔で１個以上設けられた、下蓋の底部に接する窪み、および、前記下蓋の底部に周方向に任意の間隔で１個以上設けられた、上蓋の天井部に接する窪み、を有し、
    前記下蓋の底部に接する窪みと上蓋の天井部に接する窪みが接触するように形成されている、
    請求項４に記載のウェーハ用フレーム。     Further, one or more depressions in contact with the bottom of the lower lid provided at an arbitrary interval in the circumferential direction on the ceiling of the upper lid, and one or more depressions provided at an arbitrary interval in the circumferential direction on the bottom of the lower lid. And a recess in contact with the ceiling of the upper lid,
    The dent in contact with the bottom of the lower lid and the dent in contact with the ceiling of the upper lid are formed so as to contact each other.
    The wafer frame according to claim 4.
  10. 　　更に、前記上蓋の天井部に全周に１条以上設けられた、下蓋の底部に接する連続した窪み、または、前記下蓋の底部に全周に１条以上設けた上蓋の天井部に接する連続した窪み、を有する請求項４に記載のウェーハ用フレーム。
          Furthermore, one or more ridges are provided on the ceiling of the upper lid, and the continuous recess is in contact with the bottom of the lower lid, or the ceiling of the upper lid is provided on the bottom of the lower lid on the entire circumference. The wafer frame according to claim 4, having a continuous depression.
  11. 　　更に、前記上蓋の天井部に全周に１条以上設けられた、下蓋の底部に接する連続した窪み、および、前記下蓋の底部に全周に１条以上設けた上蓋の天井部に接する連続した窪み、を有し、
    前下蓋の底部に接する連続した窪みと上蓋の天井部に接する連続した窪みの底部同士が接するように形成された、
    請求項４に記載のウェーハ用フレーム。     Furthermore, one or more strips are provided on the entire top of the ceiling of the upper lid, and a continuous recess in contact with the bottom of the lower lid, and a ceiling of the upper lid provided on the bottom of the lower lid on the entire circumference. Having a continuous depression,
    It was formed so that the bottom of the continuous dent that touches the bottom of the front lower lid and the bottom of the continuous dent that touches the ceiling of the upper lid touch each other.
    The wafer frame according to claim 4.
  12. 　　さらに、前記空間に充填された中空金属体と樹脂材料とからなるグループから選択された少なくとも一つを有する請求項１乃至請求項１１のいずれかに記載のウェーハ用フレーム。 The wafer frame according to any one of claims 1 to 11, further comprising at least one selected from the group consisting of a hollow metal body and a resin material filled in the space.
  13. 　　前記中空金属体が、中空鉄球を押圧して変形させた中空金属体である請求項１２に記載のウェーハ用フレーム。 The wafer frame according to claim 12, wherein the hollow metal body is a hollow metal body formed by pressing and deforming a hollow iron ball.
  14. 　　上蓋用部材と下蓋用部材を金属平板からプレス打抜きするプレス打抜き加工工程と、
    前記上蓋用部材と下蓋用部材から側壁を成形するプレス絞り加工工程と、
    を有する請求項４に記載のウェーハ用フレームの製造方法。     A press punching process for press punching a member for an upper lid and a member for a lower lid from a metal flat plate;
    A press drawing process for forming a side wall from the upper lid member and the lower lid member;
    The manufacturing method of the flame | frame for wafers of Claim 4 which has these.
  15. 　　さらに、プレス絞り加工工程に続いて、フレームの全体形状を成形するプレス成形工程を有する請求項１４に記載のウェーハ用フレームの製造方法。 15. The method for manufacturing a wafer frame according to claim 14, further comprising a press forming step of forming the entire shape of the frame following the press drawing step.
  16. 　　薄肉鋼管を管軸方向に略円形に成形して、管端面同士を溶接して円筒体を成形する工程と、
    前記円筒体にウェーハ用フレームの位置決め用ノッチを成形する工程と、
    前記円筒体を扁平プレス成形する工程と、
    を有するウェーハ用フレームの製造方法。     Forming a thin steel pipe into a substantially circular shape in the pipe axis direction, welding the pipe end faces together, and forming a cylindrical body;
    Forming a notch for positioning a wafer frame in the cylindrical body;
    A step of flat pressing the cylindrical body;
    A method for manufacturing a frame for a wafer comprising:
  17. 　　さらに、前記円筒体を成形する工程の前に、前記薄肉鋼管に中空金属体および／または樹脂材料を充填する工程を有する請求項１６に記載のウェーハ用フレームの製造方法。
     
     

          Furthermore, the manufacturing method of the flame | frame for wafers of Claim 16 which has the process of filling a hollow metal body and / or a resin material in the said thin steel pipe before the process of shape | molding the said cylindrical body.



PCT/JP2009/002895 2008-06-26 2009-06-24 Wafer frame WO2009157193A1 (en)

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JP5225236B2 (en) * 2009-09-01 2013-07-03 株式会社大川金型設計事務所 Wafer holder
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