WO2009154335A1 - Printed circuit board electrically connected to the ground of electronic device - Google Patents

Printed circuit board electrically connected to the ground of electronic device Download PDF

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Publication number
WO2009154335A1
WO2009154335A1 PCT/KR2008/006904 KR2008006904W WO2009154335A1 WO 2009154335 A1 WO2009154335 A1 WO 2009154335A1 KR 2008006904 W KR2008006904 W KR 2008006904W WO 2009154335 A1 WO2009154335 A1 WO 2009154335A1
Authority
WO
WIPO (PCT)
Prior art keywords
ground
layer
pcb
ground layer
electronic device
Prior art date
Application number
PCT/KR2008/006904
Other languages
French (fr)
Inventor
Kyoung Il Kang
Yong Goo Lee
Original Assignee
Gigalane Co.Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigalane Co.Ltd filed Critical Gigalane Co.Ltd
Publication of WO2009154335A1 publication Critical patent/WO2009154335A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the present invention relates to a printed circuit board (PCB), and more particularly, to a PCB electrically connected to a ground of an electronic device.
  • PCB printed circuit board
  • PCB printed circuit boards
  • the present invention provides a printed circuit board (PCB) electrically connected to a ground of an electronic device.
  • PCB printed circuit board
  • the present invention also provides a PCB whose cover layer is partially removed in such a way that a part of a ground layer is exposed.
  • a printed circuit board coupled with an electronic device, the PCB including: a first ground layer extended in one direction; a dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; and a cover layer covering the first ground layer, wherein a part of the cover layer is removed, a part of the first ground layer is exposed via the removed part, and the exposed part of the first ground layer is in electrical contact with a ground of the electronic device.
  • PCB printed circuit board
  • the PCB may further include: a bonding sheet disposed on the signal transmission line; a second dielectric layer disposed on the boding sheet; and a second ground layer disposed on the second dielectric layer.
  • the PCB may further include a conductive material disposed between the exposed part of the first ground layer and the ground of the electronic device.
  • a PCB coupled with an electronic device, the PCB including: a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; and a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer, wherein the first ground layer is in electric contact with a ground of the electronic device.
  • a PCB coupled with an electronic device, the PCB including: a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; and a cover layer covering the first ground layer, wherein a part of the cover layer is removed, a part of the first ground layer is exposed via the removed part, and the exposed of the first ground layer is in electrical contact with a ground of a part installed in the electronic device.
  • a PCB including: a board unit extended in a first direction; and one or more grounding units projected from lateral surfaces of a longitudinal side of the board unit, wherein the board unit and the one or more grounding units include: a first ground layer; a first dielectric layer laminated one the first ground layer; and a signal transmission line laminated on the first dielectric layer, in which the first ground layer of the one or more grounding units is electrically connected to a ground of an electronic device.
  • a printed circuit board (PCB) according to an embodiment of the present invention is electrically connected to a ground of an electronic device, thereby allowing a stable ground state thereof.
  • a part of a ground layer is exposed by removing a part of a cover layer and the exposed part of the ground layer is allowed to be in electrical contact with the ground of the electronic device, thereby allowing a stable ground state of the PCB.
  • FIG. 1 is a view illustrating a printed circuit board (PCB) according to a first embodiment of the present invention
  • FIG. 2 is a view illustrating a PCB according to a second embodiment of the present invention
  • FIG. 3 is a view illustrating a PCB according to a third embodiment of the present invention
  • FIGS. 4 and 5 are views illustrating the PCB of FIG. 1 , which is electrically connected to a ground of an electronic device;
  • FIGS. 6 and 7 are views illustrating the PCB of FIG. 1, which is electrically connected to a ground of a part installed in an electronic device;
  • FIG. 8 is a view illustrating a PCB according to still another embodiment of the present invention, which is electrically connected to an electronic device;
  • FIG. 9 is a side view illustrating the PCB of FIG. 8.
  • FIG. 10 is a view illustrating a PCB according to yet another embodiment of the present invention.
  • PCB printed circuit board
  • PCB PCB or a flexible PCB.
  • FIG. 1 is a view illustrating a PCB 100 according to a first embodiment of the present invention.
  • the PCB 100 includes a cover layer 110, a first ground layer 120, a first dielectric layer 130, and a signal transmission line 140.
  • the cover layer 110, the first ground layer 120, the first dielectric layer 130, and the signal transmission layer 140 are sequentially laminated and extended in the same direction.
  • the cover layer 110 covers one side of the first ground layer 120. A part of the cover layer 110 is removed, which is referred to as a cover layer removal area 115. Via the cover layer removal area 115, a part of the first ground layer 120 is exposed. The exposed part of the first ground layer 120 may be in electrical contact with a ground of an electronic device. Accordingly, the first ground layer 120 performs a role of a ground of the PCB 100. It will be described later that the exposed part of the first ground layer 120 is in electrical contact with the ground of the electronic device.
  • the first ground layer 120 is formed of a metal material such as copper and connected to the ground.
  • the first dielectric layer 130 is formed of a dielectric material such as polyimide.
  • the signal transmission line 140 is formed of a metal material such as copper.
  • FIG. 2 is a view illustrating a PCB 200 according to a second embodiment of the present invention.
  • the PCB 200 includes a cover layer 210, a first ground layer 220, a first dielectric layer 230, a signal transmission line 240, a bonding sheet 250, a second dielectric layer 270, and a second ground layer 280.
  • the cover layer 210 covers one side of the first ground layer 220. A part of the cover layer 210 is removed, thereby forming a cover layer removal area 215. Via the cover layer removal area 215, a part of the first ground layer 220 is exposed. The exposed part of the first ground layer 220 may be in electrical contact with a ground of an electronic device. Accordingly, the first ground layer 220 performs a role of a ground of the PCB 200. It will be described later that the exposed part of the first ground layer 220 is in electrical contact with the ground of the electronic device.
  • the PCB 200 further includes the bonding sheet 250, the second dielectric layer 270, and the second ground layer 280.
  • the second ground layer 280 is formed of a metal material such as copper and connected to the ground.
  • the second dielectric layer 270 is formed of a dielectric material such as polyimide.
  • the bonding sheet 250 bonds the second dielectric layer 270 and the second ground layer 280 to the signal transmission line 240.
  • FIG. 3 is a view illustrating a PCB 300 according to a third embodiment of the present invention.
  • the PCB 300 includes a cover layer 310, a first ground layer 320, a first dielectric layer 330, a signal transmission line 340, a bonding sheet 350, a second dielectric layer 370, and a second ground layer 380.
  • the cover layer 310 covers one side of the first ground layer 320.
  • a par of the cover layer 310 is removed, thereby forming a cover layer removal area 315.
  • Via the cover layer removal area 315 a part of the first ground layer 320 is exposed.
  • the PCB 300 further includes a via hole 390.
  • the via hole 390 penetrates the first dielectric layer 330 and the second dielectric layer 370 and electrically connects the first ground layer 320 to the second ground layer 380. Since other elements correspond to elements shown in FIG. 2, a detailed description thereof will be omitted.
  • the part of the first ground layer 320 which is exposed via the cover layer removal area 315, may be in electrical contact with a ground of an electronic device. Accordingly, the first ground layer 320 may perform a role of a ground of the PCB 300. In this case, since the second ground layer 380 is electrically connected to the first ground layer 320 via the via hole 390, the second ground layer 380 also performs a role of a ground. Instead of the exposed part of the first ground layer 320, the second ground layer 380 may be in electrical contact with the ground of the electronic device. In this case, via the via hole 390, both of the first ground layer 320 and the second ground layer 380 may perform a role of the ground.
  • both of the exposed part of the first ground layer 320 and the second ground layer 380 may be in contact with the ground of the electronic device.
  • the PCBs 100, 200, and 300 include the cover layers 110, 210, and 310, respectively.
  • a PCB according to another embodiment of the present invention may not include a cover layer.
  • the PCB according to another embodiment of the present invention includes the elements of the PCB 100 of FIG. 1 , except for the cover layer 110, and may allow the first ground layer 120 to be in electrical contact with a ground of an electronic device.
  • a PCB according to another embodiment of the present invention includes the elements of the PCB 200, except for the cover layer 210, and may allow the first ground layer 220 and/or the second ground layer 280 to be in electrical contact with a ground of an electronic device.
  • a PCB according to another embodiment of the present invention includes the elements of the PCB 300 of FIG. 3, except for the cover layer 310, and may allow the first ground layer 320 and/or the second ground layer 380 to be in electrical contact with a ground of an electronic device.
  • FIG. 4 and 5 are views illustrating the PCB 100 electrically connected to a ground 420 of an electronic device 400.
  • a part of the cover layer 110 is removed, thereby exposing a part of the first ground layer 120 of the PCB 100.
  • the PCB 100 is mounted on the electronic device 400 in such a way that the exposed part of the first ground layer 120 turns downward.
  • the exposed part of the first ground layer 120 is in direct contact with the ground 420 of the electronic device 400.
  • the exposed part of the first ground layer 120 is in electrical contact with the ground 420 of the electronic device 400, direct contact therebetween is not required.
  • a conductive material (not shown) may be disposed between the exposed part of the first ground layer 120 and the ground 420 of the electronic device 400.
  • the conductive material electrically connects the exposed part of the first ground layer 120 to the electronic device 400, thereby more definitely connecting the first ground layer 120 to a ground 420.
  • the first ground layer 120 may be perfectly grounded.
  • the conductive material there may be a conductive silicone piece or an elastic body.
  • FIGS. 6 and 7 are views illustrating the PCB 100 electrically connected to a ground 570 of a part 550 installed in an electronic device 500.
  • the exposed part of the first ground layer 120 is in contact with the ground 420 of the electronic device 400.
  • an exposed part of the first ground layer 120 is in contact with the ground 570 of the part 550 installed in the electronic device 500.
  • the ground 570 is formed on the part 550 installed in the electronic device 500.
  • the PCB 100 is mounted on the electronic device 500.
  • the PCB 100 is mounted on the electronic device 500 in such a way that the exposed part of the first ground layer 120 turns upward.
  • the part 550 is mounted on the PCB 100 in such a way that the ground 570 turns downward.
  • the exposed part of the first ground layer 120 is in direct contact with the ground 570 of the part 550.
  • the exposed part of the first ground layer 120 is in electrical contact with the ground 570 of the part 550, direct contact therebetween is not required.
  • a conductive material (not shown) may be disposed between the exposed part of the first ground layer 120 and the ground 570 of the part 550.
  • the conductive material electrically connects the exposed part of the first ground layer 120 to the ground 570 of the part 550, thereby more definitely connecting the first ground layer 120 to a ground 570.
  • the first ground layer 120 may be perfectly grounded.
  • the conductive material there may be a conductive silicone piece or an elastic body. In addition to a structure using the conductive material, it is possible to those skilled in the art to embody a structure of electrically connecting the exposed part of the first ground layer 120 to the ground 570 of the electronic device 500.
  • the electronic devices 400 and 500 shown in FIGS. 4 to 7 may be mobile phones.
  • the part 550 shown in FIGS. 6 and 7 may be a battery installed in a mobile phone.
  • the PCB 100 with the first ground layer 120 including the exposed part may be connected to various electronic devices in addition to a mobile phone.
  • FIGS. 4 to 7, the PCB 100 of FIG. 1 is connected to one of the ground 420 of the electronic device 400 and the ground 570 of the part 550.
  • the PCB 200 of FIG. 2 may be electrically connected to one of the ground 420 of the electronic device 400 and the ground 570 of the part 550.
  • the PCB 200 shown in FIG. 2 may be mounted on the electronic device 400 in such a way that an exposed part of the first ground layer 220 turns downward.
  • the exposed part of the first ground layer 220 may be in direct contact with the ground 420 of the electronic device 400 or be in electrical contact therewith via a conductive material (not shown).
  • the PCB 200 shown in FIG. 2 may be mounted on the electronic device 500 in such a way that the exposed part of the first ground layer 220 turns upward.
  • the part 550 may be mounted on the PCB 200 in such a way that the ground 570 turns downward.
  • the exposed part of the first ground layer 220 may be in direct contact with the ground 570 of the part 550 or be in electrical contact therewith via a conductive material (not shown).
  • the PCB 300 of FIG. 3 may be in electrical contact with one of the ground 420 of the electronic device 400 and the ground 570 of the electronic device 500.
  • an exposed part of the first ground layer 320 and/or the second ground layer 380 may be in direct contact with one of the ground 420 of the electronic device 400 and the ground 570 of the electronic device 500 or be in electrical contact therewith via a conductive material (not shown).
  • the PCB according to another embodiment of the present invention which does not include a cover layer, may be in electrical contact with one of the ground 420 of the electronic device 400 and the ground 570 of the electronic device 500.
  • FIG. 8 is a view illustrating a PCB 600 according to still another embodiment of the present invention, which is in electrical contact with an electronic device 700.
  • the PCB 600 includes a board unit 605 and one or more grounding units 662 and 664.
  • the number of the grounding units 662 and 664 may be one or more. However, in FIG. 8, the number of the grounding units 662 and 664 is two.
  • the grounding units 662 and 664 may be electrically connected to a ground 720 of an electronic device 700.
  • the grounding units 662 and 664 may be in direct contact with the ground 720 of the electronic device 700 or may be connected thereto via a conductive material (not shown).
  • the board unit 605 is extended toward a first direction.
  • the grounding units 662 and 664 are connected to both lateral faces of a longitudinal side of the board unit 605, respectively.
  • the grounding units 662 and 664 are projected from the lateral faces of the longitudinal side of the board unit 605.
  • the number of grounding units is one
  • one grounding unit is connected to one lateral face of the board unit 605.
  • the board unit 605 may have a rectangular shape.
  • the grounding units 662 and 664 may be connected to lateral faces of both longitudinal side of the board unit 605 having a rectangular shape, respectively.
  • the board unit 605 has a structure similar to that of the PCB 200 shown in FIG. 2. However, a part of the cover layer 210 is removed in the PCB 200 shown in FIG. 2, but a cover layer (not shown) is not removed or not included in the board unit 605 shown in FIG. 8.
  • the board unit 605 will be described later referring to FIG. 9.
  • the grounding units 662 and 664 include via holes 692 and 694, respectively.
  • the via holes 692 and 694 penetrate the grounding units 662 and 664 and electrically connect a top side and a bottom side of the grounding units 662 and 664, respectively.
  • the grounding units 662 and 664 and the via holes 692 and 694 will be described later referring to FIG. 9.
  • FIG. 9 is a side view illustrating the PCB 600 of FIG. 8.
  • the board unit 605 includes a cover layer 610, a first ground layer 620, a first dielectric layer 630, a signal transmission line 640, a bonding sheet 650, a second dielectric layer 670, and a second ground layer 680.
  • the grounding units 662 and 664 have a shape formed by extending the layers 620, 630, 650, 670, and 680 of the board unit 605, excluding the cover layer 610.
  • the grounding unit 662 may include layers 622, 632, 652, 672, and 682 sequentially laminated and extended in the same direction
  • the grounding unit 664 may include layers 624, 634, 654, 674, and 684 sequentially laminated and extended in the same direction.
  • the via holes 692 and 694 penetrate the grounding units 662 and 664 and electrically connect first ground layers 622 and 624 to second ground layers 682 and 684 of the grounding units 662 and 664. Accordingly, when connecting a ground to one of the first ground layers 622 and 624 and the second ground layers 682 and 684, the other thereof is connected to the ground.
  • the via holes 692 and 694 are not formed on the board unit 605 performing a role of signal transmission, there is no influence on signal transmission of the PCB 600. That is, using the via holes 692 and 694, without influence on the signal transmission, all of the first ground layers 622 and 624 and the second ground layers 682 and 684 may be simply grounded.
  • the PCB 600 may not include the via holes 692 and 694.
  • the first ground layers 622 and 624 and the second ground layers 682 and 684 may be connected to the ground but not limited thereto.
  • a part of the cover layer 610 may not be removed. However, as including the grounding units 662 and 664, the cover layer 610 partially removed may be included in the board unit 605. Though the board unit 605 includes the cover layer 610, the board unit 605 may not include a cover layer.
  • the PCB 600 shown in FIG. 9 has a strip line structure.
  • a PCB may have a micro strip line structure. That is, a board unit and a grounding unit of the PCB may include a first ground layer, a first dielectric layer, and a signal transmission line. The first ground layer of the grounding unit may be electrically connected to a ground of an electronic device.
  • the PCB having a micro strip line structure may further include a cover layer covering a first ground layer.
  • the cover layer may include a removed area or not include a removed area.
  • FIG. 10 is a view illustrating a PCB 800 according to yet another embodiment of the present invention.
  • the PCB 800 includes a cover layer 810, a first ground layer 820, a first dielectric layer 830, a signal transmission line 840, one or more connection patterns 842 and 844, and one or more via holes 892 and 894.
  • the cover layer 810, the first ground layer 820, the first dielectric layer 830, the signal transmission line 840, and the one or more connection patterns 842 and 844 are sequentially laminated and extended in the same direction.
  • the cover layer 810 covers one side of the first ground layer 820. A part of the cover layer 810 is removed.
  • the PCB 800 shown in FIG. 10 further includes the one or more connection patterns 842 and 844 and the one or more via holes 892 and 894.
  • connection patterns 842 and 844 are separated with a predetermined interval, extended in a lateral direction of the signal transmission line 840, and formed on the same height of the signal transmission line 840.
  • the one or more connection patterns 842 and 844 may have the same material of the signal transmission line 840.
  • the one or more via holes 892 and 894 penetrate the first dielectric layer 830 and electrically connect the one or more connection patterns 842 and 844 to the first ground layer 820. Though the two connection patterns 842 and 844 are shown in FIG. 10, the number of connection patterns may be one or three or more. According to the number of connection patterns, the number of via holes may be changed.
  • the present invention may be applied to the field of manufacturing printed circuit boards.

Abstract

There is provided a printed circuit board (PCB) coupled with an electronic device. The PCB includes: a first ground layer extended in one direction; a dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; and a cover layer covering the first ground layer. A part of the cover layer is removed and a part of the first ground layer is exposed via the removed part. The exposed part of the first ground layer is in electrical contact with a ground of the electronic device.

Description

[DESCRIPTION] [INVENTION TITLE]
PRINTED CIRCUIT BOARD ELECTRICALLY CONNECTED TO THE GROUND
OF ELECTRONIC DEVICE
[TECHNICAL FIELD]
The present invention relates to a printed circuit board (PCB), and more particularly, to a PCB electrically connected to a ground of an electronic device.
[BACKGROUND ART]
To form a ground, in a general coaxial cable, a covering of the coaxial cable is taken off to surround a metal body and the metal body is electrically connected to a ground of a mobile phone. On the other hand, internal circuits of wireless communication devices are generally embodied on printed circuit boards (PCBs). Such PCB technology has been notably developed. Currently, there are generally used not only hard PCBs but also flexible PCBs capable of freely moving.
[DETAILED DESCRIPTION OF THE INVENTION]
[TECHNICAL PROBLEM]
The present invention provides a printed circuit board (PCB) electrically connected to a ground of an electronic device. The present invention also provides a PCB whose cover layer is partially removed in such a way that a part of a ground layer is exposed.
[TECHNICAL SOLUTION] According to an aspect of the present invention, there is provided a printed circuit board (PCB) coupled with an electronic device, the PCB including: a first ground layer extended in one direction; a dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; and a cover layer covering the first ground layer, wherein a part of the cover layer is removed, a part of the first ground layer is exposed via the removed part, and the exposed part of the first ground layer is in electrical contact with a ground of the electronic device. The PCB may further include: a bonding sheet disposed on the signal transmission line; a second dielectric layer disposed on the boding sheet; and a second ground layer disposed on the second dielectric layer. The PCB may further include a conductive material disposed between the exposed part of the first ground layer and the ground of the electronic device.
According to another aspect of the present invention, there is provided a PCB coupled with an electronic device, the PCB including: a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; and a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer, wherein the first ground layer is in electric contact with a ground of the electronic device. According to still another aspect of the present invention, there is provided a PCB coupled with an electronic device, the PCB including: a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; and a cover layer covering the first ground layer, wherein a part of the cover layer is removed, a part of the first ground layer is exposed via the removed part, and the exposed of the first ground layer is in electrical contact with a ground of a part installed in the electronic device. According to yet another embodiment of the present invention, there is provided a PCB including: a board unit extended in a first direction; and one or more grounding units projected from lateral surfaces of a longitudinal side of the board unit, wherein the board unit and the one or more grounding units include: a first ground layer; a first dielectric layer laminated one the first ground layer; and a signal transmission line laminated on the first dielectric layer, in which the first ground layer of the one or more grounding units is electrically connected to a ground of an electronic device.
[ADVANTAGEOUS EFFECTS]
A printed circuit board (PCB) according to an embodiment of the present invention is electrically connected to a ground of an electronic device, thereby allowing a stable ground state thereof.
Also, a part of a ground layer is exposed by removing a part of a cover layer and the exposed part of the ground layer is allowed to be in electrical contact with the ground of the electronic device, thereby allowing a stable ground state of the PCB.
[BRIEF DESCRIPTION OF THE DRAWINGS]
FIG. 1 is a view illustrating a printed circuit board (PCB) according to a first embodiment of the present invention;
FIG. 2 is a view illustrating a PCB according to a second embodiment of the present invention; FIG. 3 is a view illustrating a PCB according to a third embodiment of the present invention;
FIGS. 4 and 5 are views illustrating the PCB of FIG. 1 , which is electrically connected to a ground of an electronic device;
FIGS. 6 and 7 are views illustrating the PCB of FIG. 1, which is electrically connected to a ground of a part installed in an electronic device;
FIG. 8 is a view illustrating a PCB according to still another embodiment of the present invention, which is electrically connected to an electronic device;
FIG. 9 is a side view illustrating the PCB of FIG. 8; and
FIG. 10 is a view illustrating a PCB according to yet another embodiment of the present invention.
[BEST MODE FOR CARRYING OUT THE INVENTION]
To fully understand advantages of operations of the present invention and the objects obtained by embodiments of the present invention, it is required to refer to attached drawings illustrating preferable embodiments of the present invention and contents shown in the drawings. Hereinafter, the preferable embodiments of the present invention will be described in detail with reference to the attached drawings. The same reference numerals shown in each drawing indicate the same elements. A printed circuit board (PCB) disclosed in the description may be a general
PCB or a flexible PCB.
FIG. 1 is a view illustrating a PCB 100 according to a first embodiment of the present invention. Referring to FIG. 1 , the PCB 100 includes a cover layer 110, a first ground layer 120, a first dielectric layer 130, and a signal transmission line 140. The cover layer 110, the first ground layer 120, the first dielectric layer 130, and the signal transmission layer 140 are sequentially laminated and extended in the same direction.
The cover layer 110 covers one side of the first ground layer 120. A part of the cover layer 110 is removed, which is referred to as a cover layer removal area 115. Via the cover layer removal area 115, a part of the first ground layer 120 is exposed. The exposed part of the first ground layer 120 may be in electrical contact with a ground of an electronic device. Accordingly, the first ground layer 120 performs a role of a ground of the PCB 100. It will be described later that the exposed part of the first ground layer 120 is in electrical contact with the ground of the electronic device.
The first ground layer 120 is formed of a metal material such as copper and connected to the ground. The first dielectric layer 130 is formed of a dielectric material such as polyimide. The signal transmission line 140 is formed of a metal material such as copper. FIG. 2 is a view illustrating a PCB 200 according to a second embodiment of the present invention.
Referring to FIG. 2, the PCB 200 includes a cover layer 210, a first ground layer 220, a first dielectric layer 230, a signal transmission line 240, a bonding sheet 250, a second dielectric layer 270, and a second ground layer 280. The cover layer 210 covers one side of the first ground layer 220. A part of the cover layer 210 is removed, thereby forming a cover layer removal area 215. Via the cover layer removal area 215, a part of the first ground layer 220 is exposed. The exposed part of the first ground layer 220 may be in electrical contact with a ground of an electronic device. Accordingly, the first ground layer 220 performs a role of a ground of the PCB 200. It will be described later that the exposed part of the first ground layer 220 is in electrical contact with the ground of the electronic device.
On the other hand, different from the PCB 100 shown in FIG. 1 , the PCB 200 further includes the bonding sheet 250, the second dielectric layer 270, and the second ground layer 280. The second ground layer 280 is formed of a metal material such as copper and connected to the ground. The second dielectric layer 270 is formed of a dielectric material such as polyimide. The bonding sheet 250 bonds the second dielectric layer 270 and the second ground layer 280 to the signal transmission line 240.
FIG. 3 is a view illustrating a PCB 300 according to a third embodiment of the present invention.
Referring to FIG. 3, the PCB 300 includes a cover layer 310, a first ground layer 320, a first dielectric layer 330, a signal transmission line 340, a bonding sheet 350, a second dielectric layer 370, and a second ground layer 380. The cover layer 310 covers one side of the first ground layer 320. A par of the cover layer 310 is removed, thereby forming a cover layer removal area 315. Via the cover layer removal area 315, a part of the first ground layer 320 is exposed. The PCB 300 further includes a via hole 390. The via hole 390 penetrates the first dielectric layer 330 and the second dielectric layer 370 and electrically connects the first ground layer 320 to the second ground layer 380. Since other elements correspond to elements shown in FIG. 2, a detailed description thereof will be omitted.
The part of the first ground layer 320, which is exposed via the cover layer removal area 315, may be in electrical contact with a ground of an electronic device. Accordingly, the first ground layer 320 may perform a role of a ground of the PCB 300. In this case, since the second ground layer 380 is electrically connected to the first ground layer 320 via the via hole 390, the second ground layer 380 also performs a role of a ground. Instead of the exposed part of the first ground layer 320, the second ground layer 380 may be in electrical contact with the ground of the electronic device. In this case, via the via hole 390, both of the first ground layer 320 and the second ground layer 380 may perform a role of the ground. Both of the exposed part of the first ground layer 320 and the second ground layer 380 may be in contact with the ground of the electronic device. In FIGS. 1 and 3, the PCBs 100, 200, and 300 include the cover layers 110, 210, and 310, respectively. However, a PCB according to another embodiment of the present invention may not include a cover layer.
The PCB according to another embodiment of the present invention includes the elements of the PCB 100 of FIG. 1 , except for the cover layer 110, and may allow the first ground layer 120 to be in electrical contact with a ground of an electronic device. Also, a PCB according to another embodiment of the present invention includes the elements of the PCB 200, except for the cover layer 210, and may allow the first ground layer 220 and/or the second ground layer 280 to be in electrical contact with a ground of an electronic device. Also, a PCB according to another embodiment of the present invention includes the elements of the PCB 300 of FIG. 3, except for the cover layer 310, and may allow the first ground layer 320 and/or the second ground layer 380 to be in electrical contact with a ground of an electronic device. FIGS. 4 and 5 are views illustrating the PCB 100 electrically connected to a ground 420 of an electronic device 400. Referring to FIG. 4, a part of the cover layer 110 is removed, thereby exposing a part of the first ground layer 120 of the PCB 100. Referring to FIG. 5, the PCB 100 is mounted on the electronic device 400 in such a way that the exposed part of the first ground layer 120 turns downward. The exposed part of the first ground layer 120 is in direct contact with the ground 420 of the electronic device 400.
On the other hand, as the exposed part of the first ground layer 120 is in electrical contact with the ground 420 of the electronic device 400, direct contact therebetween is not required. For example, between the exposed part of the first ground layer 120 and the ground 420 of the electronic device 400, a conductive material (not shown) may be disposed. The conductive material electrically connects the exposed part of the first ground layer 120 to the electronic device 400, thereby more definitely connecting the first ground layer 120 to a ground 420. Accordingly, the first ground layer 120 may be perfectly grounded. As the conductive material, there may be a conductive silicone piece or an elastic body. In addition to a structure using the conductive material, it is possible to those skilled in the art to embody a structure of electrically connecting the exposed part of the first ground layer 120 to the ground 420 of the electronic device 400. Therefore, a detailed description on various examples will be omitted. FIGS. 6 and 7 are views illustrating the PCB 100 electrically connected to a ground 570 of a part 550 installed in an electronic device 500. In FIGS. 4 and 5, the exposed part of the first ground layer 120 is in contact with the ground 420 of the electronic device 400. On the other hand, in FIGS. 6 and 7, an exposed part of the first ground layer 120 is in contact with the ground 570 of the part 550 installed in the electronic device 500. Referring to FIG. 6, a part of the cover layer 110 is removed, thereby forming the exposed part of the first ground layer 120. Also, the ground 570 is formed on the part 550 installed in the electronic device 500. Referring to FIG. 7, the PCB 100 is mounted on the electronic device 500. The PCB 100 is mounted on the electronic device 500 in such a way that the exposed part of the first ground layer 120 turns upward. The part 550 is mounted on the PCB 100 in such a way that the ground 570 turns downward. The exposed part of the first ground layer 120 is in direct contact with the ground 570 of the part 550.
On the other hand, as the exposed part of the first ground layer 120 is in electrical contact with the ground 570 of the part 550, direct contact therebetween is not required. For example, between the exposed part of the first ground layer 120 and the ground 570 of the part 550, a conductive material (not shown) may be disposed. The conductive material electrically connects the exposed part of the first ground layer 120 to the ground 570 of the part 550, thereby more definitely connecting the first ground layer 120 to a ground 570. Accordingly, the first ground layer 120 may be perfectly grounded. As the conductive material, there may be a conductive silicone piece or an elastic body. In addition to a structure using the conductive material, it is possible to those skilled in the art to embody a structure of electrically connecting the exposed part of the first ground layer 120 to the ground 570 of the electronic device 500.
The electronic devices 400 and 500 shown in FIGS. 4 to 7 may be mobile phones. The part 550 shown in FIGS. 6 and 7 may be a battery installed in a mobile phone. However, it may be known to those skilled in the art that a mobile phone and a battery thereof are just examples. That is, the PCB 100 with the first ground layer 120 including the exposed part may be connected to various electronic devices in addition to a mobile phone. FIGS. 4 to 7, the PCB 100 of FIG. 1 is connected to one of the ground 420 of the electronic device 400 and the ground 570 of the part 550. However, the PCB 200 of FIG. 2 may be electrically connected to one of the ground 420 of the electronic device 400 and the ground 570 of the part 550.
For example, the PCB 200 shown in FIG. 2 may be mounted on the electronic device 400 in such a way that an exposed part of the first ground layer 220 turns downward. The exposed part of the first ground layer 220 may be in direct contact with the ground 420 of the electronic device 400 or be in electrical contact therewith via a conductive material (not shown). The PCB 200 shown in FIG. 2 may be mounted on the electronic device 500 in such a way that the exposed part of the first ground layer 220 turns upward. The part 550 may be mounted on the PCB 200 in such a way that the ground 570 turns downward. The exposed part of the first ground layer 220 may be in direct contact with the ground 570 of the part 550 or be in electrical contact therewith via a conductive material (not shown). Also, the PCB 300 of FIG. 3 may be in electrical contact with one of the ground 420 of the electronic device 400 and the ground 570 of the electronic device 500. For this, an exposed part of the first ground layer 320 and/or the second ground layer 380 may be in direct contact with one of the ground 420 of the electronic device 400 and the ground 570 of the electronic device 500 or be in electrical contact therewith via a conductive material (not shown). Also, the PCB according to another embodiment of the present invention, which does not include a cover layer, may be in electrical contact with one of the ground 420 of the electronic device 400 and the ground 570 of the electronic device 500. FIG. 8 is a view illustrating a PCB 600 according to still another embodiment of the present invention, which is in electrical contact with an electronic device 700. Referring to FIG. 8, the PCB 600 includes a board unit 605 and one or more grounding units 662 and 664. The number of the grounding units 662 and 664 may be one or more. However, in FIG. 8, the number of the grounding units 662 and 664 is two. The grounding units 662 and 664 may be electrically connected to a ground 720 of an electronic device 700. The grounding units 662 and 664 may be in direct contact with the ground 720 of the electronic device 700 or may be connected thereto via a conductive material (not shown). The board unit 605 is extended toward a first direction. The grounding units 662 and 664 are connected to both lateral faces of a longitudinal side of the board unit 605, respectively. That is, the grounding units 662 and 664 are projected from the lateral faces of the longitudinal side of the board unit 605. On the other hand, when the number of grounding units is one, one grounding unit is connected to one lateral face of the board unit 605. The board unit 605 may have a rectangular shape. The grounding units 662 and 664 may be connected to lateral faces of both longitudinal side of the board unit 605 having a rectangular shape, respectively.
The board unit 605 has a structure similar to that of the PCB 200 shown in FIG. 2. However, a part of the cover layer 210 is removed in the PCB 200 shown in FIG. 2, but a cover layer (not shown) is not removed or not included in the board unit 605 shown in FIG. 8. The board unit 605 will be described later referring to FIG. 9. The grounding units 662 and 664 include via holes 692 and 694, respectively. The via holes 692 and 694 penetrate the grounding units 662 and 664 and electrically connect a top side and a bottom side of the grounding units 662 and 664, respectively. The grounding units 662 and 664 and the via holes 692 and 694 will be described later referring to FIG. 9.
FIG. 9 is a side view illustrating the PCB 600 of FIG. 8. Referring to FIG. 8, the board unit 605 includes a cover layer 610, a first ground layer 620, a first dielectric layer 630, a signal transmission line 640, a bonding sheet 650, a second dielectric layer 670, and a second ground layer 680. The grounding units 662 and 664 have a shape formed by extending the layers 620, 630, 650, 670, and 680 of the board unit 605, excluding the cover layer 610. That is, the grounding unit 662 may include layers 622, 632, 652, 672, and 682 sequentially laminated and extended in the same direction, and the grounding unit 664 may include layers 624, 634, 654, 674, and 684 sequentially laminated and extended in the same direction. The via holes 692 and 694 penetrate the grounding units 662 and 664 and electrically connect first ground layers 622 and 624 to second ground layers 682 and 684 of the grounding units 662 and 664. Accordingly, when connecting a ground to one of the first ground layers 622 and 624 and the second ground layers 682 and 684, the other thereof is connected to the ground. Also, since the via holes 692 and 694 are not formed on the board unit 605 performing a role of signal transmission, there is no influence on signal transmission of the PCB 600. That is, using the via holes 692 and 694, without influence on the signal transmission, all of the first ground layers 622 and 624 and the second ground layers 682 and 684 may be simply grounded.
On the other hand, the PCB 600 may not include the via holes 692 and 694. In this case, if necessary, the first ground layers 622 and 624 and the second ground layers 682 and 684 may be connected to the ground but not limited thereto. A part of the cover layer 610 may not be removed. However, as including the grounding units 662 and 664, the cover layer 610 partially removed may be included in the board unit 605. Though the board unit 605 includes the cover layer 610, the board unit 605 may not include a cover layer.
On the other hand, the PCB 600 shown in FIG. 9 has a strip line structure. With respect thereto, a PCB may have a micro strip line structure. That is, a board unit and a grounding unit of the PCB may include a first ground layer, a first dielectric layer, and a signal transmission line. The first ground layer of the grounding unit may be electrically connected to a ground of an electronic device.
Also, the PCB having a micro strip line structure may further include a cover layer covering a first ground layer. The cover layer may include a removed area or not include a removed area.
FIG. 10 is a view illustrating a PCB 800 according to yet another embodiment of the present invention. Referring to FIG. 10, the PCB 800 includes a cover layer 810, a first ground layer 820, a first dielectric layer 830, a signal transmission line 840, one or more connection patterns 842 and 844, and one or more via holes 892 and 894. The cover layer 810, the first ground layer 820, the first dielectric layer 830, the signal transmission line 840, and the one or more connection patterns 842 and 844 are sequentially laminated and extended in the same direction. The cover layer 810 covers one side of the first ground layer 820. A part of the cover layer 810 is removed. On the other hand, comparing with the PCB 100 shown in FIG. 1 , the PCB 800 shown in FIG. 10 further includes the one or more connection patterns 842 and 844 and the one or more via holes 892 and 894.
The one or more connection patterns 842 and 844 are separated with a predetermined interval, extended in a lateral direction of the signal transmission line 840, and formed on the same height of the signal transmission line 840. The one or more connection patterns 842 and 844 may have the same material of the signal transmission line 840. The one or more via holes 892 and 894 penetrate the first dielectric layer 830 and electrically connect the one or more connection patterns 842 and 844 to the first ground layer 820. Though the two connection patterns 842 and 844 are shown in FIG. 10, the number of connection patterns may be one or three or more. According to the number of connection patterns, the number of via holes may be changed.
As described above, exemplary embodiments have been shown and described. Though specific terms are used herein, they are just used for describing the present invention but do not limit the meanings and the scope of the present invention disclosed in the claims. Therefore, it would be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the invention. Accordingly, the technical scope of the present invention is defined by the claims and their equivalents. [INDUSTRIAL APPLICABILITY]
The present invention may be applied to the field of manufacturing printed circuit boards.

Claims

[CLAIMS]
1. A printed circuit board (PCB) coupled with an electronic device, the PCB comprising: a first ground layer extended in one direction; a dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; and a cover layer covering the first ground layer, wherein a part of the cover layer is removed and a part of the first ground layer is exposed via the removed part.
2. The PCB of claim 1 , further comprising: a bonding sheet disposed on the signal transmission line; a second dielectric layer disposed on the boding sheet; and a second ground layer disposed on the second dielectric layer.
3. The PCB according to anyone of claims 1 and 2, wherein the exposed part of the first ground layer is in electrical contact with a ground of the electronic device.
4. The PCB of claim 2, further comprising a via hole penetrating the first dielectric layer and the second dielectric layer and electrically connecting the first ground layer to the second ground layer.
5. The PCB of claim 4, wherein one of the exposed part of the first ground layer and the second ground layer is in electrical contact with a ground of the electronic device, or the exposed part of the first ground layer and the second ground layer are in electrical contact with the ground of the electronic device.
6. The PCB according to anyone of claims 3 and 5, further comprising a conductive material disposed between the exposed part of the first ground layer and the ground of the electronic device.
7. The PCB according to anyone of claims 3 and 5, wherein the exposed part of the first ground layer is in direct contact with the ground of the electronic device.
8. The PCB of claim 1 , further comprising: one or more connection patterns separated with a predetermined interval in a lateral direction of the signal transmission line, extended in the same direction and formed on the same height of the signal transmission line; and a via hole penetrating the first dielectric layer and electrically connecting the connection patterns to the first ground layer, wherein the exposed part of the first ground layer is in electrical contact with a ground of the electronic device.
9. A PCB coupled with an electronic device, the PCB comprising: a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; and a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer, wherein the first ground layer is in electric contact with a ground of the electronic device.
10. The PCB of claim 9, further comprising: a bonding sheet disposed on the signal transmission line; a second dielectric layer disposed on the bonding sheet; and a second ground layer disposed on the second dielectric layer.
11. The PCB of claim 10, further comprising a via hole penetrating the first dielectric layer and the second dielectric layer and electrically connecting the first ground layer to the second ground layer.
12. The PCB of claim 11 , wherein one of the first ground layer is in electrical contact with the ground of the electronic device; or the first ground layer and the second ground are in electrical contact with the ground of the electronic device.
13. A PCB coupled with an electronic device, the PCB comprising: a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; and a cover layer covering the first ground layer, wherein a part of the cover layer is removed and a part of the first ground layer is exposed via the removed part, and the exposed of the first ground layer is in electrical contact with a ground of a part installed in the electronic device.
14. The PCB of claim 13, further comprising: a bonding sheet disposed on the signal transmission line; a second dielectric layer disposed on the bonding sheet; and a second ground layer disposed on the second dielectric layer.
15. The PCB according to anyone of claims 13 and 14, wherein the part comprises a battery.
16. The PCB of claim 15, wherein the electronic device is a mobile phone, and the part comprises a battery of the mobile phone.
17. The PCB according to anyone of claims 13 and 14, further comprising a conductive material disposed between the exposed part of the first ground layer and the ground of the electronic device.
18. A PCB comprising: a board unit extended in a first direction; and one or more grounding units projected from lateral surfaces of a longitudinal side of the board unit, wherein the board unit and the one or more grounding units comprise: a first ground layer; a first dielectric layer laminated one the first ground layer; and a signal transmission line laminated on the first dielectric layer, in which the first ground layer of the one or more grounding units is electrically connected to a ground of an electronic device.
19. The PCB of claim 18, wherein the boarding unit and the one or more grounding units further comprise: a bonding sheet disposed on the signal transmission line; a second dielectric layer disposed on the bonding sheet; and a second ground layer disposed on the second dielectric layer.
20. The PCB according to anyone of claims 18 and 19, wherein the board unit further comprises a cover layer covering the first ground layer.
21. The PCB of claim 19, wherein the grounding unit further comprises a via hole penetrating the first dielectric layer, the bonding sheet, and the second dielectric layer of the grounding unit and electrically connecting the first ground layer of the grounding unit to the second ground layer thereof.
22. The PCB according to anyone of claims 19 to 21 , wherein one of the first ground layer and the second ground layer of the one or more grounding units is electrically connected to the ground of the electronic device, or the first ground layer and the second ground layer of the one or more grounding units are electrically connected to the ground layer of the electronic device.
23. The PCB of claim 22, further comprising a conductive material disposed between the grounding unit and the ground of the electronic device.
24. The PCB according to anyone of claims 1 , 9, 13, and 18, which is a flexible PCB.
PCT/KR2008/006904 2008-06-16 2008-11-21 Printed circuit board electrically connected to the ground of electronic device WO2009154335A1 (en)

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