WO2009152908A3 - Puce électroluminescente et dispositif électroluminescent doté d'une telle puce - Google Patents

Puce électroluminescente et dispositif électroluminescent doté d'une telle puce Download PDF

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Publication number
WO2009152908A3
WO2009152908A3 PCT/EP2009/003506 EP2009003506W WO2009152908A3 WO 2009152908 A3 WO2009152908 A3 WO 2009152908A3 EP 2009003506 W EP2009003506 W EP 2009003506W WO 2009152908 A3 WO2009152908 A3 WO 2009152908A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
semiconductor structure
emitting chip
emitting
bond area
Prior art date
Application number
PCT/EP2009/003506
Other languages
German (de)
English (en)
Other versions
WO2009152908A2 (fr
Inventor
Frederic Tonhofer
Original Assignee
Setrinx Sarl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Setrinx Sarl filed Critical Setrinx Sarl
Priority to EP09765488A priority Critical patent/EP2283525A2/fr
Publication of WO2009152908A2 publication Critical patent/WO2009152908A2/fr
Publication of WO2009152908A3 publication Critical patent/WO2009152908A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/003—Lens or lenticular sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4298—Coupling light guides with opto-electronic elements coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/385—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une puce électroluminescente comprenant au moins une structure semi-conductrice (12), qui émet de la lumière lorsqu'une tension est appliquée à ses bornes et comporte au moins une zone de connexion (28, 24c), ainsi qu'un substrat de support (32) supportant la structure semi-conductrice (12). Le substrat de support (32) comporte, sur au moins une zone de surface (34, 36) faisant saillie de la structure semi-conductrice (12), une couche de contact (38, 40) reliée de manière électriquement conductrice à la zone de connexion (28, 24c) de la structure semi-conductrice (12). L'invention concerne également un dispositif électroluminescent (56; 62; 64; 72; 86; 90; 92; 132) comportant au moins une structure semi-conductrice (12), qui émet de la lumière lorsqu'une tension est appliquée à ses bornes et comporte au moins une zone de connexion (28, 24c), ainsi qu'au moins un dispositif de raccordement (58, 60; 68, 70; 82) pouvant être relié à une source de tension et relié de manière électriquement conductrice à la zone de connexion (28, 24c) de la structure semi-conductrice (12). Au moins une puce électroluminescente (10, 10') selon une des revendications 1 à 10 est prévue, le dispositif de raccordement (58, 60; 68, 70; 82) étant relié de manière électriquement conductrice à la couche de contact (38, 40) de la puce électroluminescente (10, 10').
PCT/EP2009/003506 2008-05-27 2009-05-16 Puce électroluminescente et dispositif électroluminescent doté d'une telle puce WO2009152908A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09765488A EP2283525A2 (fr) 2008-05-27 2009-05-16 Puce électroluminescente et dispositif électroluminescent doté d'une telle puce

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008025318.9 2008-05-27
DE102008025318A DE102008025318A1 (de) 2008-05-27 2008-05-27 Leuchtchip und Leuchtvorrichtung mit einem solchen

Publications (2)

Publication Number Publication Date
WO2009152908A2 WO2009152908A2 (fr) 2009-12-23
WO2009152908A3 true WO2009152908A3 (fr) 2010-09-23

Family

ID=41268598

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/003506 WO2009152908A2 (fr) 2008-05-27 2009-05-16 Puce électroluminescente et dispositif électroluminescent doté d'une telle puce

Country Status (4)

Country Link
EP (1) EP2283525A2 (fr)
DE (1) DE102008025318A1 (fr)
TW (1) TW201013980A (fr)
WO (1) WO2009152908A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100999733B1 (ko) * 2010-02-18 2010-12-08 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
US8338317B2 (en) 2011-04-06 2012-12-25 Infineon Technologies Ag Method for processing a semiconductor wafer or die, and particle deposition device
TWI523269B (zh) 2012-03-30 2016-02-21 晶元光電股份有限公司 發光元件
CN103378254B (zh) * 2012-04-27 2017-07-21 晶元光电股份有限公司 发光元件
TWI626395B (zh) 2013-06-11 2018-06-11 晶元光電股份有限公司 發光裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4936808A (en) * 1988-12-12 1990-06-26 Samsung Electronics Co., Ltd. Method of making an LED array head
DE19757850A1 (de) * 1996-12-27 1998-07-02 Sharp Kk Lichtemittierendes Anzeigeelement, Verfahren zum Verbinden desselben mit einem elektrischen Verdrahtungssubstrat und Herstellungsverfahren hierfür
DE10017336A1 (de) * 2000-04-07 2001-10-18 Vishay Semiconductor Gmbh verfahren zur Herstellung von strahlungsemittierenden Halbleiter-Wafern
WO2006034671A2 (fr) * 2004-09-30 2006-04-06 Osram Opto Semiconductors Gmbh Composant optoélectronique pourvu d'un contact sans fil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
DE102006049081B4 (de) * 2006-10-13 2012-06-14 Noctron Soparfi S.A. Halbleiter-Leuchtmittel und Leuchtpaneel mit solchen
US7626210B2 (en) * 2006-06-09 2009-12-01 Philips Lumileds Lighting Company, Llc Low profile side emitting LED

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4936808A (en) * 1988-12-12 1990-06-26 Samsung Electronics Co., Ltd. Method of making an LED array head
DE19757850A1 (de) * 1996-12-27 1998-07-02 Sharp Kk Lichtemittierendes Anzeigeelement, Verfahren zum Verbinden desselben mit einem elektrischen Verdrahtungssubstrat und Herstellungsverfahren hierfür
DE10017336A1 (de) * 2000-04-07 2001-10-18 Vishay Semiconductor Gmbh verfahren zur Herstellung von strahlungsemittierenden Halbleiter-Wafern
WO2006034671A2 (fr) * 2004-09-30 2006-04-06 Osram Opto Semiconductors Gmbh Composant optoélectronique pourvu d'un contact sans fil

Also Published As

Publication number Publication date
WO2009152908A2 (fr) 2009-12-23
EP2283525A2 (fr) 2011-02-16
TW201013980A (en) 2010-04-01
DE102008025318A1 (de) 2009-12-10

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