WO2009152818A1

WO2009152818A1 - Light module comprising a transponder that can be read in a contactless manner

Info

Publication number: WO2009152818A1
Application number: PCT/DE2009/000854
Authority: WO
Inventors: Kurt-Jürgen Lang; Markus Hofmann; Hagen Luckner; Rainer Huber; Wilhelm Weiss
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2008-06-18
Filing date: 2009-06-17
Publication date: 2009-12-23
Also published as: DE102008028654A1

Abstract

The invention relates to a light module comprising at least one radiation-emitting semiconductor chip (1). The light module contains a transponder (12) that can be read in a contactless manner and has a memory chip (13) and an antenna (14). The invention also relates to a light comprising a light module of this type.

Description

description

Light module with a contactless readable transponder

This patent application claims the priority of German Patent Application 102008028654.0, the disclosure of which is hereby incorporated by reference.

The present application relates to a light module with a non-contact readable transponder.

Light modules are usually classified according to different parameters. Often it is necessary, for example when replacing a defective light module, to know these parameters. For this purpose, the light module may have a memory module, a processor semiconductor module or a resistor selected or set according to the classification, which contains corresponding information. The problem here is that after installation of the light module in a luminaire, this information is often difficult or impossible to read.

It is an object of the present application to provide a light module and a luminaire, which allow a particularly simple identification of the light module.

The object is achieved by a light module and a lamp according to the independent claims. Advantageous embodiments and further developments are specified in the dependent claims. The disclosure of the

Claims are hereby expressly incorporated in the description. A light module with at least one radiation-emitting semiconductor chip, such as a light-emitting diode chip and / or laser diode chip, is specified. The light module contains a contactlessly readable transponder with a memory chip and an antenna.

The transponder is intended to receive and answer incoming radio signals, the answer being particularly automatic. It can be an active or, preferably, a passive transponder. The passive transponder obtains the energy required to answer the incoming signal from the incoming signal itself, for example by means of inductive and / or capacitive coupling. In particular, the passive transponder is independent of an operating current of the

Light module. The operating state of the radiation-emitting semiconductor chip is in particular independent of the transponder.

By way of example, the transponder is a radio-frequency identification transponder (RFID transponder, Radio Frequency Identification Transponder). The transponder is vorzugwseise intended for operation with a carrier frequency of about 1 MHz, in particular of 13.65 MHz. In a further development, the transponder is for operation with a

Ultra high frequency of more than 1 GHz, in particular 2.4 GHz provided. With an ultra-high frequency transponder, a particularly small construction size of the transponder can be achieved. Such a transponder is particularly well suited for a light module with a radiation-emitting semiconductor chip. To read the transponder, a reader is expediently provided, which emits a radio signal with the carrier frequency. The reader is also preferable to this suitable for receiving and decoding the response of the transponder.

In a preferred embodiment, the memory chip of the transponder contains information which uniquely identifies the light module. For example, a serial number of the light module is encoded in the memory chip.

Alternatively or additionally, the transponder may contain at least one technical parameter and in particular a measured value of a technical characteristic of the at least one radiation-emitting semiconductor chip and / or at least one technical parameter of the light module. For example, at least one of the following technical characteristics is stored in the memory chip: forward voltage, light intensity, luminous flux, wavelength, Parbort. These variables may relate to the semiconductor chip or the light module, or the respective characteristics of both the semiconductor chip and the light module are stored.

Alternatively or additionally, the memory chip may contain information about the assignment of the light module in a group with a specific range of a technical characteristic (so-called "bin"), for example the assignment to a color and / or brightness group.

By means of the transponder, a readout of the information contained on the memory chip is advantageously without a clear view of the light module and without producing a line-connected electrical contact to the

Light module possible. The reading out of the information can advantageously without the removal of the light module from a lamp or the lamp with the light module from a Bracket done. The reading out of the information is also possible with advantage both in the switched-on state of the light module and on the current and voltage-free light module.

If the memory chip merely contains information which uniquely identifies the light module, the technical characteristics of the light module, such as the production date, the brightness rating or the technical characteristics already mentioned above, are expediently stored in a database. The database is preferably connected to or contained in the reading device which is provided for reading out the information stored in the transponder.

If the technical parameters are stored in the memory chip of the transponder itself, such a database can be dispensed with. In this case, the transponder sends the technical parameters to the reader when reading out.

In a further development of the memory chip is writable, especially rewritable. Preferably, the memory chip is freely programmable. In a training he has a storage capacity of 10 kB or more.

In this way, a production method of the light module is possible, in which technical characteristics of the light module or of the semiconductor chip-for example at least one of the abovementioned characteristics such as the color location, the light intensity and / or the forward voltage-are measured and these measured values are subsequently stored on the memory chip become. In particular, in the case of a writable memory chip, it is also conceivable for the memory chip to contain further information, for example the date and / or the time of installation of the light module in a luminaire and / or information about a performed test or maintenance of the light module.

In a further embodiment, the light module has a carrier substrate. The semiconductor chip or a semiconductor component contained in the semiconductor chip is fastened to the carrier substrate. The carrier substrate is a development in a circuit board.

Preferably, the antenna overlaps laterally completely with the carrier substrate. In other words, in a plan view of the carrier substrate, the antenna does not protrude laterally beyond it.

For example, the transponder is attached to the carrier substrate. Alternatively, the light module can also contain a plug connection element, such as a plug or a socket, which is provided for electrical contacting of the light module. In particular, the plug connection element is provided for supplying the operating current to the radiation-emitting semiconductor chip. In a light module with a plug connection element, the transponder is fastened, for example, to the plug connection element. For example, it is attached to a housing of the connector element. In particular, the transponder is glued to the carrier substrate or to the connector element.

In another embodiment, the antenna of the transponder is contained in or on the carrier substrate. The antenna can, for example, as a conductor of the Carrier substrate be executed. In this case, the memory chip is fastened in particular to the carrier substrate, whereby an electrically conductive connection to the antenna contained in the carrier substrate is preferably produced by means of the attachment.

By means of the transponder, a particularly simple control of the location and / or the transport path of the light module can take place. In addition, the storage is simplified in this way. Thus, for example, an automatic sorting of the light modules or an automatic reorders when falling below a minimum inventory of light modules are conceivable.

In addition, a luminaire is specified, which contains a light module according to one of the embodiments described above. For example, the lamp is a motor vehicle light. The motor vehicle light, for example, a daytime running light (DRL, daytime running light), a flashing light, a brake light - especially a so-called "third brake light", which is in particular centrally located at the top of the rear window of a motor vehicle (CHMSL, central high mounted stop light) -, a tail lamp or a combination rear light (RCL, rear combination lamp) act.

Advantageously, the technical characteristics of the light module can be controlled in a simple manner when assembling the lights or at a later time. Thus, a simple error detection - for example, a swapping of light modules of different characteristics - allows with advantage. - -

In a method for producing the luminaire, the information stored on the memory chip of the transponder can be read out. Based on the read-out information, for example, a drive circuit for the light module is adapted to the technical parameters read from the memory chip or from the technical parameter determined on the basis of the information contained in the memory chip on the basis of a database. For example, a drive voltage is adapted to at least one of the technical characteristics. In this way, a particularly accurate tuning of the drive circuit is achieved on the technical characteristics of the individual light module.

Further advantages and advantageous embodiments will become apparent from the embodiments illustrated below in connection with the figures.

Show it:

Figure 1, a schematic perspective view of a

Light module according to a first embodiment, and

Figure 2, a schematic perspective view of a light module according to a second

Embodiment.

In the exemplary embodiments and figures, identical, identical or identically acting elements are provided with the same reference numerals. The figures and the

Magnitudes of the elements shown in the figures with each other are not to be considered to scale. Rather, individual elements can do better Representability and / or exaggerated for better understanding.

FIG. 1 shows a schematic perspective view of a light module according to a first exemplary embodiment.

In this embodiment, three radiation-emitting semiconductor chips 1, which in the present case are light-emitting diode chips which emit in the visible spectral range, are mounted in a frame 2 on a heat sink 3. The heat sink 3 is in turn located on a carrier substrate, in the present case a printed circuit board 4. The carrier substrate 4 is presently a metal core board.

The heat sink 3 has a good thermally conductive material, such as copper and / or a ceramic or consists of at least one of these materials. It serves to dissipate heat generated during operation of the LED chips 1, from these.

The frame 2 with the LED chips 1 is in the emission of the LED chips 1 in a further development, a separately manufactured lens (not shown in Figure 1) downstream, for example, has a wavelength conversion substance.

The use of the frame 2 in the present device is optional. It is suitable for being filled with an envelope (not shown), which serves to protect the LED chips 1, and also reduces the refractive index jump between LED chips 1 and their surroundings. Furthermore, a wavelength conversion substance may be contained in the cladding. Furthermore you can the inner flanks of the frame 2 may be formed as reflectors, which serve the beam shaping. The frame 2 may comprise a plastic material, aluminum and / or a ceramic or consist of at least one of these materials.

For the back electrical contacting of the LED chips 1 3 electrically conductive contact areas 5 are provided on the heat sink (not shown in Figure 1 for clarity), which are electrically connected by bonding wires, each with a corresponding electrical connection region 6 on the circuit board 4 side of the heat sink 3 , On the front side, the light-emitting diode chips 1 are likewise electrically conductively connected to a bonding wire with a corresponding electrical connection region 6.

The electrical connection areas 6 are connected by conductor tracks 7 to further electrical connection areas 8, which produce an electrical connection to pins of a plug connection element 9. The pins of the

Plug connection element 9 are arranged in a housing and not visible in FIG. The connector element 9 is adapted to be contacted with a plug or a coupling to the outside.

For mounting the light module 4 holes 10 are still provided for pass-pins on the circuit board. In addition, the circuit board 4 varistors 11 to protect the component against electrostatic discharges (ESD protection).

On the circuit board 4, a transponder 12 is glued, which includes a memory chip 13 and an antenna 14. On the memory chip are a serial number and an assignment of the Light module stored to a brightness group. The transponder 12 is an RFID transponder.

The transponder 12 completely overlaps in plan view with the printed circuit board 4. The maximum lateral dimension of the

Transponders 12 is smaller than a side length, in this case the shorter side length, the rectangular printed circuit board 4th

In a variant, not shown, the antenna 14 of the transponder is integrated into the carrier substrate 4.

For example, it is formed by a conductor track of the printed circuit board 4.

Figure 2 shows a schematic perspective view of a second embodiment of a light module.

In contrast to the first embodiment, the transponder 12 is glued to a housing of the connector element 9 in the second embodiment.

In the present exemplary embodiment, it additionally contains measured values for the light stream and for the color locus or the dominant wavelength of the semiconductor chips 1.

The invention is not limited by the description based on the embodiments of these. Rather, the invention encompasses every new feature as well as every combination of features, which in particular includes any combination of features in the patent claims, even if this feature or combination itself is not explicitly described in the claims

Claims or embodiments is given.

Claims

claims

1. Light module with at least one radiation-emitting

Semiconductor chip (1), characterized in that the light module contains a non-contact readable transponder (12) with a memory chip (13) and an antenna (14).

2. Light module according to claim 1, wherein the memory chip (13) contains information that uniquely identifies the light module.

3. Light module according to one of claims 1 or 2, wherein the memory chip (13) information about the

Assignment of the light module to a group with a predetermined range of a technical characteristic contains.

4. Light module according to one of claims 1 to 3, wherein in the memory chip (13) at least one measured value of a technical characteristic of the at least one radiation-emitting semiconductor chip (1) and / or the light module is stored.

5. Light module according to one of claims 3 or 4, wherein at least one of the following technical characteristics in the memory chip (13) is stored: forward voltage, light intensity, luminous flux, wavelength, color location.

6. Light module according to one of the preceding claims, wherein the memory chip (13) is writable.

7. Light module according to one of the preceding claims, which has a carrier substrate (4) on which the

Semiconductor chip (1) or a semiconductor chip (1) containing semiconductor device is attached. -

8. Light module according to claim 7, wherein the antenna (14) laterally completely overlaps with the carrier substrate (4).

9. Light module according to one of claims 7 or 8, wherein the transponder (12) is fixed to the carrier substrate (4).

10. Light module according to one of claims 7 or 8, which has a plug connection element (9) for electrically contacting the light module, which is fastened to the carrier substrate (4), wherein the transponder (12) is fastened to the plug connection element (9).

11. Light module according to claim 9 or 10, wherein the

Transponder (12) is glued to the carrier substrate (4) or the connector element (9).

12. Light module according to one of claims 7 or 8, wherein the antenna (14) of the transponder (12) in the carrier substrate (4) and the memory chip (13) is fixed to the carrier substrate (4).

13. Light with a light module according to one of the preceding claims.

14. Luminaire according to claim 13, which is a motor vehicle light.

15. A motor vehicle lamp according to claim 14, which is a daytime running light, a flashing light, a stop lamp, a tail light, or a combination rear light.