WO2009148881A2 - Electron detection systems and methods - Google Patents

Electron detection systems and methods Download PDF

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Publication number
WO2009148881A2
WO2009148881A2 PCT/US2009/045145 US2009045145W WO2009148881A2 WO 2009148881 A2 WO2009148881 A2 WO 2009148881A2 US 2009045145 W US2009045145 W US 2009045145W WO 2009148881 A2 WO2009148881 A2 WO 2009148881A2
Authority
WO
WIPO (PCT)
Prior art keywords
particles
sample
magnetic field
source
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/045145
Other languages
English (en)
French (fr)
Other versions
WO2009148881A3 (en
Inventor
Raymond Hill
John A. Notte Iv
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT Inc
Original Assignee
Carl Zeiss SMT Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2008/065470 external-priority patent/WO2009014811A2/en
Application filed by Carl Zeiss SMT Inc filed Critical Carl Zeiss SMT Inc
Priority to EP09759042A priority Critical patent/EP2288905A2/en
Priority to JP2011512528A priority patent/JP5753080B2/ja
Priority to US12/994,316 priority patent/US20110127428A1/en
Publication of WO2009148881A2 publication Critical patent/WO2009148881A2/en
Publication of WO2009148881A3 publication Critical patent/WO2009148881A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2255Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident ion beams, e.g. proton beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/244Detectors; Associated components or circuits therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06Sources
    • H01J2237/08Ion sources
    • H01J2237/0802Field ionization sources
    • H01J2237/0807Gas field ion sources [GFIS]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244Detection characterized by the detecting means
    • H01J2237/2448Secondary particle detectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244Detection characterized by the detecting means
    • H01J2237/2449Detector devices with moving charges in electric or magnetic fields

Definitions

  • This disclosure relates to systems and methods to detect electrons from one or more samples.
  • BACKGROUND Semiconductor fabrication typically involves the preparation of an article (a semiconductor article) that includes multiple layers of materials sequentially deposited and processed to form an integrated electronic circuit, an integrated circuit element, and/or a different microelectronic device.
  • Such articles typically contain various features (e.g., circuit lines formed of electrically conductive material, wells filled with electrically non-conductive material, regions formed of electrically semiconductive material) that are precisely positioned with respect to each other (e.g., generally on the scale of within a few nanometers).
  • the location, size (length, width, depth), composition (chemical composition) and related properties (conductivity, crystalline orientation, magnetic properties) of a given feature can have an important impact on the performance of the article.
  • the term semiconductor article refers to an integrated electronic circuit, an integrated circuit element, a microelectronic device or an article formed during the process of fabricating an integrated electronic circuit, an integrated circuit element, a microelectronic device.
  • a semiconductor article can be a portion of a flat panel display or a photovoltaic cell.
  • particles such as secondary electrons, to leave the article.
  • the secondary electrons are detected, providing information about the article that is used to obtain an image of the sample.
  • the disclosure relates to improved methods and systems to detect electrons.
  • the systems and methods involve interacting a charged particle beam with a sample to cause electrons (e.g., secondary electrons) to leave the sample.
  • the systems and methods can enhance the efficiency with which electrons are detected.
  • the enhanced electron efficiency can provide numerous benefits. As an example, with the increased electron detection efficiency, it can take less time to develop an image of a sample having a desired resolution. If multiple samples are being sampled (in series or in parallel), the reduced time to obtain the image having the desired resolution can result in a higher throughput process.
  • the systems and methods disclosed herein can be advantageously used, whereas it may not be possible to successfully use systems and methods that can provide only lower resolution to obtain the desired images.
  • Manipulating the trajectory of the electrons with a magnetic field can enhance the ability to detect the electrons of interest.
  • the disclosure generally features a method that includes interacting a plurality of first particles with a sample to cause a plurality of second particles to the leave the sample, and exposing the plurality of second particles to a magnetic field to modify the trajectory of the plurality of second particles.
  • the method also includes, after exposing the plurality of second particles to the magnetic field, detecting the plurality of second particles.
  • the disclosure generally features a system that includes a housing, a first source in the housing, a magnetic field source in the housing and a detector in the housing.
  • the first source is configured to emit a plurality of first particles to a sample so that, during use when the plurality of first particles interacts with the sample, a plurality of second particles leaves the sample.
  • the magnetic field source is configured so that, during use when the plurality of second particles leaves the sample and the magnetic field source is on, the magnetic field source provides a magnetic field that modifies a trajectory of the plurality of second particles.
  • the detector is configured so that, during use after the plurality of second particles interacts with the magnetic field, the detector detects at least some of the plurality of second particles.
  • the disclosure generally features a method that includes interacting a plurality of first particles with a sample to cause a plurality of second particles to leave the sample, and exposing the plurality of second particles to a magnetic field to modify the trajectory of the plurality of second particles.
  • the trajectory of the first particles is substantially unaltered by the magnetic field.
  • the disclosure generally features a method that includes interacting a magnetic field with a plurality of secondary electrons leaving a sample.
  • the trajectory of particles that caused the secondary electrons to leave the sample is substantially unaltered by the magnetic field.
  • the disclosure generally features a method that includes interacting a plurality of first particles with a sample to cause a plurality of second particles to the leave the sample, and exposing the plurality of second particles to a magnetic field to modify the trajectory of the plurality of second particles.
  • the efficiency of the first particles to cause the second particles to leave the sample is substantially unaltered by the magnetic field.
  • the disclosure generally features a method that includes interacting a magnetic field with a plurality of secondary electrons leaving a sample.
  • the efficiency of particles that caused the secondary electrons to leave the sample is substantially unaltered by the magnetic field.
  • Fig. 1 is a schematic representation of a He ion microscope.
  • Fig. 2 is a schematic representation of a He ion microscope.
  • Fig. 3 A depicts a trajectory of an electron in a He ion microscope.
  • Fig. 3B depicts a trajectory of an electron in a He ion microscope.
  • Fig. 4 is a cross-sectional view of a semiconductor article. Like reference symbols in the various drawings indicate like elements.
  • Fig. 1 is a schematic representation of a He ion microscope 100 including a housing 102, a He ion source 110, a semiconductor article 120 and a detector 130 (e.g., an Everhart-Thornley detector).
  • source 110 generates a beam of ions that interacts with a surface 122 (and optionally a subsurface region) of article 120 to cause particles, including electrons, such as secondary electrons (electrons emitted from a sample that have an energy of less than 50 eV), to leave article 120.
  • the electrons are detected with detector 130 to provide information about article 120 which is used to prepare an image of article 120.
  • detector 130 creates an electrostatic positive extraction field to enhance the ability of the electrons to reach the detector.
  • the field is at most 0.5 V/mm (e.g., from 0.1 V/mm to 0.5 V/mm).
  • ion source 110 typically includes an ion column, the most distal components of which are desirably close to article 120 to enhance the flux of He ions that impinge on article 120, thereby enhancing image resolution and/or throughput.
  • Detector 130 is therefore located off-axis relative to an axis 140 between the He ions generated by source 110 and article 120. This can make it challenging to have detector 130 create an electrostatic extraction field that effectively enhances the detection of electrons from article 120 without negatively impacting the ability of the He ions to impinge on article 120. In other words, in certain cases, by the time the electrostatic potential created by detector 130 is high enough to significantly enhance electron detection, the field may be so high that it impacts the flux and/or Attorney Docket: 21384-039WO1/P16226
  • Fig. 2 is a schematic representation of a He ion microscope 200 including a housing 202, source 110, article 120, detector 130 and a magnetic field source 210.
  • source 210 can be any magnetic field source.
  • source 210 is a permanent magnet.
  • source 210 is a wire (e.g., a coiled wire) configured so that, as electrical current passes therethrough, the wire creates a magnetic field.
  • source 210 can be a pair of Tesla coils positioned above and below the plane of microscope 200 shown in Fig. 2.
  • source 210 is a relatively small coil located beneath article 120.
  • system 200 can be appreciated when it is realized that the impact of a magnetic field on the trajectory of a positively charged ion can be negligible relative to the impact of the magnetic field on the trajectory of an electron. As an example, it is believed that, under certain conditions, a He ion will be deflected approximately 85 times less than an electron of the same energy in a given magnetic field. With the understanding that the He ions created by source 110 typically have a much greater energy than the electrons to be detected, it is seen that the advantageous effect of the magnetic field is further amplified.
  • the magnetic field deflects the trajectory of a He ion by an amount that is at least 25 times less (e.g., at least 50 times less, at least 75 times less, at least 100 times less) than the amount by which the magnetic field deflects the trajectory of an electron that is detected.
  • the trajectory of electrons leaving article 120 can be manipulated so that more of the electrons reach detector 130, while at the same time the magnetic field has little or no impact on the interaction of the He ions with article 120.
  • the magnitude and/or orientation of the magnetic field can be based on the distance between the distal end of the ion column of source 110 and article 120, the distance between article 120 and detector 130, the angle between detector 130 and a location at article 120 where the electrons leave the sample, the energy of the electrons that are detected, the morphology of the location of article 120 where the electrons leave article 120, and/or the voltage applied to detector 130. It is Attorney Docket: 21384-039WO1/P16226
  • the magnetic field is perpendicular to surface 122 of article 120. In certain embodiments, the magnetic field is parallel to surface 122 of article 120. Optionally, the magnetic field can be oriented to have an overall vector that is between perpendicular and parallel to surface 122 of article 120.
  • the magnetic field created by source 210 is at least 0.005 Tesla (e.g., at least 0.01 Tesla, at least 0.025 Tesla), and/or at most 0.05 Tesla (e.g., at most 0.04 Tesla, at most 0.03 Tesla). In some embodiments, the magnetic field created by source 210 is from 0.005 Tesla to 0.05 Tesla.
  • Figs. 3 A and 3B are schematic representations that demonstrate the enhanced ability to detect an electron using a magnetic field.
  • a trajectory 310 of an electron is such that an end 112 of an ion column 114 of source 110 blocks the electron from reaching detector 130.
  • the magnetic field created by source 210 has an orientation (parallel to surface 122 and into the plane of the figure) and magnitude such that the electron follows a trajectory 310' (which is also impacted by the positive electrostatic field created by detector 130, particularly as electron 320 gets closer to detector 130) and is detected by detector 130.
  • Figs. 3 A without magnetic field source 210, a trajectory 310 of an electron is such that an end 112 of an ion column 114 of source 110 blocks the electron from reaching detector 130.
  • the magnetic field created by source 210 has an orientation (parallel to surface 122 and into the plane of the figure) and magnitude such that the electron follows a trajectory 310' (which is also impacted by the positive electrostatic field created by detector 130, particularly as electron 320
  • end 112 of ion column 114 is a distance X from a surface 122 of article 120 onto which the He ions impinge, hi some embodiments, the distance X is at most 10 millimeters (e.g., at most nine millimeters, at most eight millimeters, at most seven millimeters, at most six millimeters, at most five millimeters, at most four millimeters). In certain embodiments, X is four millimeters to 10 millimeters. As shown in Figs. 3 A and 3B, detector 130 is a distance Y from the location on surface 122 from electrons that leave article 120. hi general, the distance Y can be selected as desired.
  • the distance Y may be relatively small (e.g., less than 10 millimeters). As another example, such as when using energy and/or trajectory filtering, the distance Y may be relatively large. In some embodiments, the distance Y is at least five millimeters (e.g., at least 10 millimeters, at least 20 millimeters, at least 30 millimeters, at least fifty millimeters), and/or at most 200 Attorney Docket: 21384-039WO1/P16226
  • Y is five millimeters to 200 millimeters (e.g., from five millimeters to 100 millimeters, from five millimeters to 50 millimeters).
  • the ratio of distance Y to distance X is at least 2:1 (e.g., at least 3 : 1 , at least 4: 1 , at least 5:1). In certain embodiments, the ratio of distance Y to distance X is from 2:1 to 10:1 (e.g., from 2: 1 to 5:1).
  • Fig. 4 is a cross-sectional view of a semiconductor article 400 having a cross- section 410 cut therein.
  • Cross-section 410 has sidewalls 412 and 414 and a bottom 416.
  • Such cross-sections are commonly cut into samples when it is desirable to image one or more features that are disposed within the interior of article 400 prior to making the cross-section cut into the sample.
  • the region of interest may be at or near a portion of article 400 (e.g., sidewall 412, sidewall 414, bottom 416) that is exposed by the cross-section.
  • the use of the magnetic field source allows an image to be taken of sidewalls 412 and 414 and/or bottom 416 in less time than would otherwise be available. In some instances, absent the magnetic field source, it may not be possible to take an image of sidewalls 412 and 414 and/or bottom 416 that would be of sufficient resolution.
  • an ion source is a He ion source
  • other types of gas field ion sources can be used. Examples include Ne ion sources, Ar ion source, Kr ion sources and Xe ion sources.
  • a liquid metal ion source can be used.
  • An example of a liquid metal ion source is a Ga ion source (e.g., a Ga focused ion beam column).
  • any charged particle source may be used.
  • an electron source such as a scanning electron microscope may be used, hi such embodiments, it is to be appreciated that, while the charge to mass ratio of the electrons impinging on the sample is the same as the charge to mass ratio of the detected electrons, the electrons created in the electron source will generally have a substantially higher energy than the detected electrons. Accordingly, the electrons created in the electron source may be deflected by the magnetic field by a smaller amount than the detected electrons.
  • samples are in the form of semiconductor articles
  • other types of samples can be used. Examples include biological samples (e.g., tissue, nucleic acids, proteins, carbohydrates, lipids and cell membranes), pharmaceutical samples (e.g., a small molecule drug), frozen water (e.g., ice), read/write heads used in magnetic storage devices, and metal and alloy samples. Exemplary samples are disclosed in, for example, US 2007-0158558.
  • the disclosure relates to the detection of any type of electron that leaves a sample.
  • the detected electrons can include Auger electrons.
  • the detected electrons have an energy in excess of 50 eV.
  • an an an an electrons can include Auger electrons.
  • Everhart-Thornley detector is used, more generally, any type of appropriate electron Attorney Docket: 21384-039WO1/P16226
  • electron detector can be used.
  • electron detectors include microchannel plate detectors, channeltron detectors and solid state detectors.
  • a detector may be positioned on the opposite side of the sample from the charged particle source, hi such embodiments, it may be of interest to detect electrons that are generated by He ions that are transmitted by (e.g., transmitted through) the sample. Such electrons are typically generated on the backside surface of the sample.
  • a system may include one or more detectors located on the same side of the sample as the charged particle source, as well as one or more detectors located on the opposite side of the sample relative to the charged particle source.
  • the electrons that are detected pass through at least a portion of (e.g., through the final lens of) the column used to focus the charged particle beam onto the sample.
  • the ion column In the case of a gas field ion microscope, this is commonly referred to as the ion column.
  • detection configurations are often referred to as through lens detectors.
  • the combination of the electric field used in the column with the magnetic field created by the magnetic field source can be used to control the trajectory of the electrons of interest to enhance their detection.
  • multiple magnetic fields can be used.
  • a first magnetic field can be used to control the trajectory of the electrons such that they are generally directed into the ion column, and a second magnetic field can be used to direct the electrons toward the detector when the electrons are in the column.
  • an electrostatic field e.g., created by an element, such as a lens, in the ion column
  • a second magnetic field source can be used alone or in conjunction with a second magnetic field source, to direct electrons in the column to the detector.
  • electrons having only a particular energy or range of energies may be of Attorney Docket: 21384-039WO1/P16226
  • an electric field may be combined with the magnetic field to achieve this goal.
  • one or more prism detectors in which an electric and/or magnetic field is used to deflect incident electrons, and where the amount of deflection depends on the energy of the electrons, can be used to spatially separate electrons with different energies so that only electrons with the appropriate energy(ies) are detected by detector 130.
  • one or more apertures e.g., located adjacent surface 122 may be used to select detected electrons based on trajectory.
  • the magnetic field source can be located on the opposite side of the sample relative to the charged particle source.
  • a system may include one or more magnetic field source located on the same side of the sample as the charged particle source, as well as one or more magnetic field source located on the opposite side of the sample relative to the charged particle source.
  • one or more electrostatic field sources may be used in combination with one or more magnetic field sources.

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
PCT/US2009/045145 2008-06-02 2009-05-26 Electron detection systems and methods Ceased WO2009148881A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP09759042A EP2288905A2 (en) 2008-06-02 2009-05-26 Electron detection systems and methods
JP2011512528A JP5753080B2 (ja) 2008-06-02 2009-05-26 電子検出システム及び方法
US12/994,316 US20110127428A1 (en) 2008-06-02 2009-05-26 Electron detection systems and methods

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
USPCT/US2008/065470 2008-06-02
PCT/US2008/065470 WO2009014811A2 (en) 2007-06-08 2008-06-02 Ice layers in charged particle systems and methods
US7425608P 2008-06-20 2008-06-20
US61/074,256 2008-06-20

Publications (2)

Publication Number Publication Date
WO2009148881A2 true WO2009148881A2 (en) 2009-12-10
WO2009148881A3 WO2009148881A3 (en) 2010-03-25

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PCT/US2009/045145 Ceased WO2009148881A2 (en) 2008-06-02 2009-05-26 Electron detection systems and methods

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US (1) US20110127428A1 (enExample)
EP (1) EP2288905A2 (enExample)
JP (1) JP5753080B2 (enExample)
WO (1) WO2009148881A2 (enExample)

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US9767986B2 (en) * 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
TWI573077B (zh) * 2015-03-27 2017-03-01 凌通科技股份有限公司 電子印刷品的自動頁面檢測方法以及使用其之電子印刷品

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JPS58110956U (ja) * 1982-01-22 1983-07-28 株式会社日立製作所 荷電粒子照射装置
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JPH0616400B2 (ja) * 1986-11-28 1994-03-02 日本電信電話株式会社 荷電ビ−ム観察装置
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WO2007117397A2 (en) * 2006-03-31 2007-10-18 Fei Company Improved detector for charged particle beam instrument
US7804068B2 (en) * 2006-11-15 2010-09-28 Alis Corporation Determining dopant information

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Publication number Publication date
JP5753080B2 (ja) 2015-07-22
JP2011525237A (ja) 2011-09-15
WO2009148881A3 (en) 2010-03-25
US20110127428A1 (en) 2011-06-02
EP2288905A2 (en) 2011-03-02

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