WO2009146987A1 - Structure de contact, composant électronique muni d’une structure de contact et procédé de fabrication - Google Patents

Structure de contact, composant électronique muni d’une structure de contact et procédé de fabrication Download PDF

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Publication number
WO2009146987A1
WO2009146987A1 PCT/EP2009/055186 EP2009055186W WO2009146987A1 WO 2009146987 A1 WO2009146987 A1 WO 2009146987A1 EP 2009055186 W EP2009055186 W EP 2009055186W WO 2009146987 A1 WO2009146987 A1 WO 2009146987A1
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WO
WIPO (PCT)
Prior art keywords
layer
electrically conductive
inner electrode
contact structure
electrically
Prior art date
Application number
PCT/EP2009/055186
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German (de)
English (en)
Inventor
Carsten Schuh
Original Assignee
Continental Automotive Gmbh
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Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2009146987A1 publication Critical patent/WO2009146987A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials

Definitions

  • the invention relates to a contact structure, an electronic component with a contact structure and a method for producing a contact structure and an electronic component.
  • Electronic components with a ceramic body and at least one metallic inner electrode, such as piezo actuators, are known, for example, from DE 10 2006 003 070 B3.
  • These electronic components typically have large-area metallic external contacts, which are arranged at least partially on the ceramic body of the component and are in electrical connection with the internal electrodes.
  • Piezoelectrically active components are susceptible to cracking due to the mechanical deformation of the piezoelectrically active ceramic, since this mechanical deformation can lead to additional stress on the external contacts.
  • the object of the invention is therefore to provide a contact structure for an electronic component with a ceramic body and at least one inner electrode, which is more reliable. Furthermore, it is an object of the invention to provide an To provide nischer component with a contact structure that is more reliable.
  • a contact structure of an electronic component with a ceramic body and at least one inner electrode is provided.
  • the inner electrode is disposed in the ceramic body and extends to a first surface of the device where it forms a portion of the first surface of the device.
  • the first surface of the component has an electrically insulating layer with at least one through opening, which exposes at least a part of the inner electrode.
  • the contact structure has a first electrically conductive layer of electrically conductive nanoscale grains and a second electrically conductive contact layer.
  • the first electrically conductive layer is arranged in the through opening of the electrically insulating layer and is electrically connected to the inner electrode arranged in the through opening.
  • the second electrically conductive contact layer is arranged on the first electrically conductive layer and electrically connected to the inner electrode.
  • the contact structure according to the invention thus has two layers.
  • the lower first electrically conductive layer is in direct contact with the inner electrode and is formed from nanoscale grains.
  • nanoscale is used herein to refer to grains having an average diameter of 1 nm to 100 nm, preferably from 1 nm to 200 nm.
  • This lower electrically conductive layer forms an improved electrical connection with the inner electrode, because the diameter of the nanoscale grains is substantially smaller than the thickness or exposed surface of the inner electrode that forms a portion of the first surface of the device.
  • the thickness of the inner electrode is about a few micrometers, for example 2 to 3 micrometers ( ⁇ m). Consequently, an electrical connection between a plurality of nanoscale grains of the first electrically conductive layer and the inner electrode is generated over the thickness of the inner electrode layer. With increasingly smaller grains, the contact area between the first electrically conductive layer and the inner electrode is increased. This increased contact area between the contact structure and the inner electrode leads to a reliable electrical connection even under mechanical stress of the contact structure.
  • the second electrically conductive contact layer can also have nanoscale grains, but also larger grains, i. do not have nanoscale grains.
  • the second electrically conductive contact layer may be made of a known material as well as a known method. By inserting some additional steps for applying the first layer of nanoscale grains, the contact structure according to the invention can be integrated into a known production method. The manufacturing costs can be kept low.
  • the second electrically conductive contact layer may be formed from a conductive adhesive or may be an electrodeposited metal or an alloy.
  • the nanoscale grains of the first electrically conductive layer can be made of a metal or an alloy. hen, which has a good electrical conductivity.
  • the electrically conductive nanoscale grains include one or more of Ag, Au, Cu, Ni, Cr, Pt, Pd, Ti, and W.
  • the first electrically conductive layer is formed in one embodiment of wet-chemically applied nanoscale particles.
  • This structure has the advantage that preformed nanoscale particles can be used, which are commercially available.
  • the particles may be applied as a suspension in a vaporizable solution or as a mixture with a binder.
  • the applied mixture may be thermally treated to remove the solution or binder and then form a layer of nanoscale sintered grains.
  • This sintered layer may be macroscopically electrically conductive.
  • the first electrically conductive layer can also advantageously be a bonding agent in order to further increase the reliability of the contact structure.
  • Grains as well as the material of the inner electrode can be selected so that they chemically react or alloy together to produce a mechanically reliable and electrically conductive connection.
  • the boundary between the first electrically conductive layer and the inner electrode has phases comprising the material of the inner electrode and the material of the nanoscale grains.
  • the first surface of the electronic component has an electrically insulating layer with at least one through opening which exposes at least part of the inner electrode in order to ensure electrical contact between the first and the second electrically conductive layer and the inner electrode.
  • electrode which is arranged in the ceramic body, to ensure.
  • a plurality of strip-shaped openings are provided in the electrically insulating layer, which each expose a strip-shaped surface of an inner electrode.
  • the strip-shaped openings can expose the entire length of the inner electrode.
  • a larger opening has the advantage that the contact area between the inner electrode and the contact structure increases and the electrical resistance of the contact between the inner electrode and the contact structure is reduced. At the same time, the reliability of the connection can be improved because the mechanical strength of the connection is increased.
  • the first electrically conductive layer is disposed entirely within the through opening or openings.
  • the thickness of the first electrically conductive layer is smaller than the thickness of the electrically insulating layer.
  • the first electrically conductive layer is provided in this embodiment as a limited area or a plurality of separate limited areas, which are electrically insulated from one another in their position over regions of the electrically insulating layer. The regions of the first electrically conductive layer are electrically connected to one another only via the second electrically conductive contact layer.
  • the first electrically conductive layer is further arranged on the electrically insulating layer.
  • the first electrically conductive layer is disposed not only within the through holes but also adjacent to the through holes.
  • the first electrically conductive layer may have several exposed ones Internal electrode of the surface electrically connect to each other when it extends over a plurality of exposed internal electrodes.
  • the first electrically conductive layer of nanoscale grains can thus be a closed layer on the surface of the component.
  • a protective layer is further arranged on the second electrically conductive contact layer.
  • the protective layer can increase the service life of the component during operation, since the contamination of the contact structure is prevented by the operating conditions.
  • the device when using the device as a piezoelectric actuator, the device can come into physical contact with the substance to be switched, for example diesel or gasoline in an injection valve. This material can be corrosive, so that the material of the protective layer is selected accordingly.
  • the protective layer can completely encase the component at the side surfaces, wherein contact surfaces of the collecting contacts are kept free, so that an external contact to the components can be produced.
  • the protective layer is electrically insulating and / or has plastic.
  • the first surface of the component has an electrically insulating layer, which in one exemplary embodiment is a further layer which is arranged on the ceramic component.
  • This arrangement can be used when the inner electrode extends completely over the layers of the ceramic body, such as in a fully active multilayer piezoelectric actuator.
  • the electrically insulating layer is formed from the ceramic body of the device. The ceramic body thus has openings in its surface, which exposes at least a portion of the inner electrode. This arrangement can be used when the inner electrode does not extend completely over the ceramic layer.
  • the invention also provides an electronic component with a contact structure according to one of the preceding embodiments.
  • the electronic component has a ceramic body and at least one inner electrode which is arranged in the ceramic body, extends up to a first surface of the component and forms a region of the first surface of the component.
  • the first surface of the electronic component has an electrically insulating layer with at least one through opening, which exposes at least a part of the inner electrode.
  • the contact structure according to the invention has a first lower electrically conductive layer of electrically conductive nanoscale grains and a second upper electrically conductive contact layer.
  • the first electrically conductive layer is arranged in the through opening of the electrically insulating layer and is electrically connected to the inner electrode arranged in the through opening.
  • the second upper electrically conductive contact layer is disposed on the first lower electrically conductive layer and electrically connected to the inner electrode.
  • the electronic device is a multilayer piezoelectric actuator having a plurality of piezoelectrically active layers and a plurality of electrically conductive inner electrode layers.
  • the electrically conductive Inner electrode layers each provide an electrically conductive inner electrode.
  • the piezoelectrically active layers and the electrically conductive inner electrode layers are alternately stacked on each other in a stacking direction.
  • the first surface of the electronic component extends approximately perpendicular to the surface of the piezoelectrically active layers and the electrically conductive inner electrode layers and parallel to the stacking direction.
  • every second inner electrode layer of the first surface is arranged in one of a plurality of through openings of the electrically insulating layer.
  • the further inner electrode layers are covered by the electrically insulating layer on the first surface.
  • the second electrically conductive contact layer electrically connects each other of the plurality of inner electrode layers of the first surface.
  • the second electrically conductive contact layer provides a collecting contact that electrically connects each second one of the plurality of inner electrode layers exposed on the first surface in parallel.
  • the electronic component has a second surface, which is arranged opposite the first surface.
  • This second surface has a contact structure according to one of the preceding embodiments.
  • the second surface may also include a plurality of alternating piezoelectric see layers and electrically conductive inner electrode layers and having an electrically insulating layer with openings.
  • a through opening of the electrically insulating layer on the second surface exposes every second inner electrode layer of the second surface that is not electrically connected to the second electrically conductive contact layer on the first surface.
  • Adjacent internal electrode layers of the stack are electrically connected to different contact layers. The two contact layers are electrically isolated from each other, so that a voltage between adjacent inner electrode layers of the multilayer piezoactuator can be applied to the contact layers.
  • the invention also provides a method for contacting a ceramic component.
  • a device with a ceramic body and at least one inner electrode is provided.
  • the inner electrode is disposed in the ceramic body, extends to a first surface of the device and forms a portion of the first surface of the device.
  • the first surface has an electrically insulating layer with at least one through opening, which exposes at least a part of the inner electrode.
  • a first layer of electrically conductive nanoparticles is applied in the through opening.
  • a second electrically conductive layer is applied to the first layer, wherein the inner electrode is electrically connected to the second layer via the first layer.
  • the device has a plurality of piezoelectrically active layers and a plurality of electrically conductive inner electrode layers.
  • the piezoelectrically active layers and the electrically conductive inner electrode layers are alternately stacked on each other in a stacking direction.
  • the electrically insulating layer is structured such that a through opening exposes every second inner electrode layer on the first upper side.
  • the first electrically conductive layer is applied in the openings of the electrically insulating layer.
  • the second electrically conductive layer is deposited on the first electrically conductive layer in the through holes, so that a plurality of internal electrodes, which are respectively exposed in one of the through openings, are electrically connected to one another and to the second contact layer.
  • an electrically insulating layer with openings on the second surface is structured such that a through opening opens out every second inner electrode layer the second surface is not electrically connected to the second electrically conductive contact layer on the first surface.
  • Each contact layer provides an electrical connection to a group of internal electrodes, the two groups of internal electrodes being electrically isolated from each other.
  • the interior Electrode of each group is electrically connected in parallel at least over its second contact layer.
  • the internal electrodes forming part of the first surface are electrically connected to each other via the second contact layer disposed on the first surface.
  • the internal electrodes, which form part of the second surface are electrically connected to one another via the second contact layer, which is arranged on the second surface.
  • a first layer of electrically conductive nanoparticles may be deposited in the apertures of the second surface.
  • An upper second electrically conductive contact layer is deposited on the lower first electrically conductive layer of nanoscale grains on the second surface.
  • the nanoparticles from which the first layer is formed can be applied in a mixture with a solvent or in a mixture with one or more organic binders. Thereafter, the device may be thermally treated to remove the solvents or binders and to increase the electrical conductivity of the first layer.
  • An electrical and mechanical connection between the first layer and the inner electrode can be effected by a thermal treatment.
  • An electrically conductive layer with nanoscale grains is formed from the applied nanoparticles.
  • An electrical connection between the first layer and the inner electrode exposed in the through-opening can by a chemical reaction or alloying of the first layer with the inner electrode.
  • the first layer can simultaneously exert an adhesion-promoting effect.
  • the nanoparticles or the solvents or binders with nanoparticles can be applied by a screen printing method, spraying or dipping.
  • the electrically insulating layer can be used as a mask. This method can be used when the first layer is completely disposed within the apertures.
  • the second electrically conductive layer may be applied by spraying or dipping or screen printing.
  • the electrically insulating layer is applied by spraying or dipping or by a screen printing method or by lamination of a film. If the electrically insulating layer is applied in the form of a closed layer, after the application of the electrically insulating layer, the electrically insulating layer can be patterned with laser ablation or a photolithographic method.
  • FIG. 1 shows a schematic view of a multilayer piezoactuator with a contact structure according to the invention
  • Figure 2 shows a schematic detailed view of a contact structure according to a first embodiment of the invention
  • Figure 3 shows a schematic detailed view of a contact structure according to a second embodiment of the invention.
  • FIG. 1 shows a multilayer piezoactuator 1 which has a multiplicity of internal electrode layers 2 and a multiplicity of piezoelectrically active layers 3.
  • the multilayer piezoelectric actuator is used in this embodiment for use as an actuating element in injection valves of a motor vehicle engine.
  • the inner electrode layers 2 and the piezoelectrically active layers 3 are alternately stacked on each other in a stacking direction 4 and form a multilayer body 7 of the multilayer piezoelectric actuator 1.
  • the inner electrode layers 2 each consist of an electrically conductive material, in particular a metal or an alloy such as Ag-Pd.
  • the piezoelectrically active layers 3 are made of a material exhibiting the piezoelectric effect, i. When an electric field is applied, the material deforms mechanically. This mechanical deformation creates usable strain and / or force on the end surfaces so that the stack can be used as an actuator.
  • the piezoelectrically active layers 3 consist of a ceramic, in particular PZT (lead zirconate titanate).
  • the inner electrode layers 2 extend over the entire surface of the adjacent piezoelectrically active layers 3.
  • This arrangement of the multilayer piezoelectric actuator 1 is referred to as a fully active piezoelectric actuator stack.
  • the internal electrodes 2 extend to the peripheral 5 pages of the stack and form there a part of the surface 6 of the body 7 of the piezoelectric actuator. 1
  • the piezoelectric actuator 1 further has a contact structure 8, with which an electrical contact to the respective internal electrodes 2 can be produced.
  • a voltage is applied between the adjacent internal electrodes 2 of the stack, so that the piezoelectrically active layers 3 arranged between the internal electrodes 2 react mechanically.
  • Each second inner electrode 2 is electrically connected to a common collecting contact 11, so that two groups of inner electrodes 9, 10 are provided, which are electrically insulated from each other. Adjacent internal electrodes 2, 2 'of the stack belong to different groups 9, 10.
  • a first collecting contact 11 is arranged on a first edge side 12 of the body 7 and a second collecting contact 13 on the opposite edge side 14 of the body 7, the first collecting contact 11 with the first group 9 of inner electrodes 2 and the second collecting contact 13 with the second group 10 of internal electrodes 2 'is electrically connected.
  • an electrically insulating layer 15 is provided on at least the two edge sides 12, 14 of the body 7 with the collecting contacts 11, 13 arranged.
  • the electrically insulating layer 15 has through openings 16 which expose the surface 17 of the inner electrode layers 2, which forms part of the first surface 6 of the body 7.
  • the openings 16 in the electrically insulating layer 15 define the first group 9 of internal electrodes 2 on the first edge side 12 and the second group pe 10 of internal electrodes 2 'on the second edge side 14 free.
  • the second group 10 of inner electrodes 2 ' is covered by the electrically insulating layer 15 and consequently electrically insulated by the electrically insulating layer 15 from the collecting contact 11 arranged thereon.
  • the first group 9 of internal electrodes 2 is covered by the electrically insulating layer 15 and consequently electrically insulated by the electrically insulating layer 15 from the collecting contact 13 arranged thereon.
  • FIG. 2 shows the contact structure 8 of the first collecting contact 11.
  • the contact structure 8 of the second collective contact 13 is the same.
  • FIG. 2 a part of the first edge side 12 of the multilayer piezoelectric actuator 1 with four of the piezoelectrically active layers 3 and three mecanicelektrodenla- gene 2 is shown.
  • the electrically insulating layer 15 is arranged on the surface 6 of the body 7 of the multilayer piezoelectric actuator 1 and exposes every second internal electrode 2.
  • the interposed inner electrode 2 'of the second group 10 is covered by the electrically insulating layer 15 and electrically insulated with this electrically insulating layer 15 of the first collecting contact 11 arranged thereon.
  • the contact structure 8 consists of two layers 18, 19.
  • a first lower electrically conductive layer 18 has nanoscale grains, not shown, and is in the openings.
  • gene 16 of the electrically insulating layer 15 is arranged.
  • the first electrically conductive layer 18 is in direct contact and in electrical connection with the exposed inner electrode 2, which is disposed within the through opening 16.
  • the first layer 18 is completely disposed within the respective openings 16.
  • the thickness of the first layer 18 is smaller than the thickness of the electrically insulating layer 15.
  • the first layer 18 consists of a multiplicity of regions 20, which are separated from one another by the electrically insulating layer 15.
  • the nanoscale grains of the first electrically conductive layer 18 consist of an electrically conductive metal or an electrically conductive alloy, such as silver or gold and their alloys.
  • the second electrically conductive layer 19 of the contact structure 8 extends over the entire edge side 12 of the multilayer piezoactuator 1 and into the through openings 16 of the electrically insulating layer 15.
  • the second layer 19 is directly on the surface 21 of the electrically insulating layer 15 and on the first electrically conductive layer 18 is arranged.
  • the second electrically conductive layer 19 provides the collecting contact 11, since it electrically connects the inner electrodes 2 of the first group 9 to each other.
  • the second layer 19 is made of a conductive adhesive. In a further embodiment, the second layer is applied by a galvanic process.
  • the nanoscale grains of the first layer lead to a higher contact area between the contact structure 8 and the inner electrode 2.
  • This higher contact surface provides a lower contact resistance and an improved mechanical Resilience of the connection between the contact structure 8 and the internal electrodes 2 before.
  • the inner electrode layers 2 have a thickness of typically 2 to 3 .mu.m and the nanoscale grains of the first
  • Layer 18 has an average diameter of 2 to 100 nm. Consequently, several nanoscale grains are in direct contact with the exposed surface 17 of the inner electrode 2.
  • the contact area between the first layer 18 and the inner electrode 2 is higher than the contact area achieved by using a layer with larger diameter particles, such as conductive adhesive Grains or particles with a larger diameter of 1 to 10 microns, can be provided.
  • the first electrically conductive layer 18 is disposed between the inner electrodes 2 and the second electrically conductive collecting layer 19 and serves at least in part as a bonding agent to improve the mechanical strength of the connection between the collecting contact 19 and the body 7 of the piezoelectric actuator 1 to improve.
  • the adhesion-promoting effect can be further increased if, at least at the boundary between the inner electrode 2 and the first layer 18, phases are formed which are the products of a reaction or alloying of the material of the first layer 18 and the material of the inner electrodes 2.
  • the material of the first layer 18 and the material of the inner electrode 2 may be selected and the manufacturing process adjusted so that a suitable reaction takes place.
  • the material of the first layer 18 may react with the material of the second layer 19, so that an improved Secured mechanical connection between these layers 18, 19 of the contact structure 8 is formed.
  • FIG. 3 shows a detailed view of a contact structure 8 'of a piezoelectric actuator 1' according to a second exemplary embodiment.
  • the contact structure 8 ' has a lower first electrically conductive layer 18' of nanoscale grains, not shown, and an upper second electrically conductive layer 19, as in the first exemplary embodiment, which is shown in FIG.
  • the contact structure 8 'of the second embodiment differs from the contact structure 8 of the first embodiment by the arrangement of the first lower electrically conductive layer 18'.
  • the first layer 18 ' is in the form of a closed layer that extends completely and approximately conformally across the electrically insulating layer 15.
  • the first layer 18 ' extends over the inner walls 22 and the bottom 23 of the openings 16, wherein an inner electrode 2 forms at least part of the bottom 23 of each second opening 16.
  • the second upper electrically conductive layer 19 is only in direct contact with the first electrically conductive layer 18 'and not in direct contact with the electrically insulating layer 15.
  • both the first layer connects 18' and the second layer 19, the exposed inner electrodes 2 of the first edge side 12 are electrically connected to one another.
  • the multilayer piezoelectric actuator 1 can be produced by the following method. First, a stacked component of alternately arranged inner electrode layers 2 and piecemeal zoelektrischdonen layers 3 produced. Thereafter, the surfaces 6 of the component can be further processed, for example by grinding, to form a surface 6 of the ceramic piezoelectrically active layers 3 and the inner electrode layers 2.
  • An electrically insulating layer 15 is applied at least on the edge sides 12, 14 of the body 7, at which the collecting contacts 11, 13 are applied later. This electrically insulating layer 15 can be used as a closed
  • Layer or a structured layer can be applied.
  • all surfaces 6 of the body 7 are coated with the electrically insulating layer 15.
  • the electrically insulating layer 15 is patterned after application in order to expose the internal electrodes 2.
  • every second inner electrode 2 is exposed on a first edge side 12, and on the opposite edge side 14 every second inner electrode 2 'is uncovered, which is not exposed on the first edge side 12.
  • the first layer 18 is applied in the through openings 16 in the electrically insulating layer 15.
  • the first layer 18 may be applied as a suspension of nanoparticles in a solvent.
  • the solvent is removed, for example, by aund a first layer 18 of nanoscale grains formed from the nanoparticles.
  • the nanoparticles are applied in the through openings 16, for example by a screen printing method, so that the first electrically conductive layer 18 is completely inside the through openings 16 is arranged.
  • the patterned electrically insulating layer 15 may be used as a mask.
  • the nanoparticles are applied as a closed layer 18', for example by dipping, which extends over the electrically insulating layer 15 and through openings 16.
  • the applied closed layer 18 'on the two opposite edge sides 12, 14 of the body 7 is structured so that two portions of the first electrically conductive layer 18', which are electrically separated from each other, on the two opposite edge sides 12, 14 is formed. This can be done by the selective application of the first layer 18 'only on these two edge sides 12, 14 or by the application of a closed layer 18' on all edge sides 5 of the body 7, which is subsequently patterned.
  • a second layer 19 of conductive adhesive is applied after the application and formation of the first layer 18, 18' of the contact structure 8, 8 '.
  • the second layer 19 is applied at least on the edge sides 12, 14 on which the collecting contacts 11, 13 are to be arranged.
  • the second layer 19 extends between the exposed internal electrodes 2, 2 'of one of the two groups 9, 10 and electrically connects the internal electrodes 2, 2' of these groups 9, 10 to one another.
  • the applied closed second layer 19 can be patterned on the two opposite edge sides 12, 14 of the body 7, so that two areas and consequently two collecting contacts 11, 13, which are electrically separated from each other, are formed. This can be done by the selective application of the second layer 19 or by the application of a closed layer 19, which is subsequently structured.
  • the second layer 19 After the application of the second layer 19, it can be treated, for example by thermal treatment, to produce an electrically conductive layer and / or to increase the electrical conductivity of this second layer 19. Subsequently, an outer protective layer, not shown, can be applied to the multilayer piezoelectric actuator.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)

Abstract

L’invention concerne une structure de contact (8; 8') d’un composant électronique (1), comprenant un corps céramique (7) et au moins une électrode intérieure (2). Une première surface (6) du composant (1) présente une couche électriquement isolante (15) munie d’au moins une ouverture débouchante (16), laquelle expose au moins une partie de l’électrode intérieure (2). La structure de contact (8; 8') présente une première couche électroconductrice (18; 18') constituée de grains nanoscopiques électroconducteurs qui est disposée dans l'ouverture débouchante (16) et à laquelle est électriquement reliée l'électrode intérieure (2). De plus, la structure de contact présente une deuxième couche de contact électroconductrice (19) qui est disposée sur la première couche de contact électroconductrice (18).
PCT/EP2009/055186 2008-06-06 2009-04-29 Structure de contact, composant électronique muni d’une structure de contact et procédé de fabrication WO2009146987A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008027115A DE102008027115A1 (de) 2008-06-06 2008-06-06 Kontaktstruktur, elektronisches Bauelement mit einer Kontaktstruktur und Verfahren zu deren Herstellung
DE102008027115.2 2008-06-06

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WO2009146987A1 true WO2009146987A1 (fr) 2009-12-10

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