WO2009124846A1 - Boîtier pour circuit électronique, pourvu d'un système de canal de refroidissement - Google Patents

Boîtier pour circuit électronique, pourvu d'un système de canal de refroidissement Download PDF

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Publication number
WO2009124846A1
WO2009124846A1 PCT/EP2009/053610 EP2009053610W WO2009124846A1 WO 2009124846 A1 WO2009124846 A1 WO 2009124846A1 EP 2009053610 W EP2009053610 W EP 2009053610W WO 2009124846 A1 WO2009124846 A1 WO 2009124846A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
cooling channel
channel system
coolant
housing parts
Prior art date
Application number
PCT/EP2009/053610
Other languages
German (de)
English (en)
Inventor
Erich Ilic
Dietmar Saur
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2009124846A1 publication Critical patent/WO2009124846A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a housing for an electronic circuit, in particular for an electronic control unit circuit of a control unit of an electric vehicle or an internal combustion engine, in particular for a hybrid drive of a motor vehicle, with at least two housing parts, between which coolant is passed in a cooling duct system.
  • actuators and motors in vehicles are electrically operated.
  • Previously known couplings to an internal combustion engine are replaced by independent electromotive units, in particular find in hybrid or electric vehicles electric motors for driving the motor vehicle use.
  • Such applications require control devices, which consist of several functional units, such as converters for converting direct current, as provided by on-board batteries, in alternating currents or DC-DC converters, alternators, control units for supplying ancillaries with air conditioning compressor, power steering and the like.
  • These functional units in turn, in turn consist of various electronic components, in particular of power semiconductors, which in principle produce power loss in the form of waste heat and to this extent must be cooled.
  • the active cooling has proven, for example by forced ventilation or a liquid cooling medium.
  • the functional units or power components to be cooled are often distributed to a plurality of cooling points within a control unit and can not be concentrated due to the given circuit topology.
  • a cooling system for electronics housing is known in which pipes through which coolant flows through the electronics housing, In particular, there are arranged meandering and take on several levels, as required for example by multi-stage board arrangement or due to different component dimensions, absorb waste heat and transport away.
  • the object of the invention is to provide a simple, functional and production-optimized housing design, which allows optimized with regard to heat emission cooling medium guide and a space-optimized design.
  • a housing for an electronic circuit in particular for an electronic control unit circuit of a control unit of an electric vehicle or an internal combustion engine, in particular for a hybrid drive of a motor vehicle, proposed, with at least two housing parts, between which coolant is passed in a cooling duct system.
  • the housing parts have recesses which form the cooling channel system and which are sealed by abutment of the respective other housing part and that at least one recess portion of the recess of a housing part facing a recess portion of the recess of the other housing part communicating. Consequently, unlike the prior art, the coolant is not directed into pipes that are routed within the housing.
  • the housing parts have recesses, in the manner of channels which are open on one side, namely in the direction in which the respective other housing part is arranged.
  • the respective other housing part covers the channels thus formed and seals them off.
  • the recesses can be introduced directly in the manufacture of the housing, so that the subsequent introduction of casings or similar complicated structures, in particular after introduction of the electronic circuit, is not required.
  • the production of the cooling channel systems is extraordinary in this way simplified and cheaper.
  • the cooling channels can be performed in such a way that they are guided in the immediate vicinity of the electronic circuit to be cooled, for example such that the electronic circuit to be cooled is arranged opposite to the same wall of the housing part on which the recesses are formed. In this way, a very simple and effective heat transfer from the electronic circuit into the region of the recesses is made possible, in which the coolant is guided.
  • Two such trained housing parts are placed in opposition and joined together, each non-recessed portions of a housing part the
  • surface-enlarging structures are arranged in the depressions. Such surface-enlarging structures allow a better heat transfer from the housing part to the coolant guided in the recesses, in particular thus a larger heat flow through the enlarged surface.
  • the structures are integrally formed on the housing parts housing structures.
  • the structures are particularly preferably incorporated by way of production of the housing parts, for example by means of an injection process or an injection-molding process.
  • the structures are cooling ribs, that is, have a rib-like dimension extending in particular in the direction of flow, for introducing heat into the coolant flowing past.
  • the contact of the two housing parts is formed together as a plant level.
  • the system of the two housing parts can be particularly simple and effective represent each other.
  • the two housing parts are therefore formed flat-planar in their system, the recesses are recessed from the plane into the housing inside. If the two housing parts are placed against one another, a closure of the respective opposite recesses of the respective other housing part takes place in the abutment plane.
  • the cooling channel system is therefore designed in this way as a closed cooling channel system.
  • At least one seal for sealing the cooling channel system is preferably located in the region of the abutment plane.
  • Such a seal can be carried out particularly advantageously as a continuous flat seal, in particular when embodied in a contact plane; Of course, however, all other seals are possible, which allow effective sealing of the wells to form the cooling channel system.
  • the electronic circuit has power semiconductors. These are particularly advantageous in the manner described to cool.
  • the cooling channel system to an inlet and a drain for the coolant, wherein inlet and outlet are spaced from the plant level.
  • the inlet and outlet are therefore not in the contact plane, but spaced therefrom, for example, that in the region of a housing passage of inlet and outlet recesses are sunk into the housing and at least in the area of the crossing (the outflow or inlet of inlet and outlet) have a universally enclosed by the housing cross-section. In this way it is very easy to form connection points, for example for connection to hoses or nozzles.
  • the inlet is arranged on one of the housing parts and the outlet on the other of the housing parts. The coolant thus flows through the one and the other housing part, wherein the inlet and the outlet are made on different housing parts, for example on the same side of the housing or on different sides, depending on the requirements of the respective installation situation.
  • inlet and outlet are formed on one of the housing parts;
  • the coolant is consequently passed from one housing part via the recessed portions, via which the depressions in the housing parts communicate with one another, from one housing part into the other and back again, so that the discharge takes place on the same housing part as before the inlet.
  • a certain central supply and discharge of coolant can be formed, whereby the tubing or piping of the cooling circuit is simplified and cheapened.
  • Figure 1 shows a cross section through a two housing parts exhibiting
  • Figure 2 is a schematisieret representation of the formed in the housing parts cooling duct system.
  • FIG. 1 shows a housing 1 for an electronic circuit 2 arranged in the housing 1, wherein the housing 1 consists of two housing parts 3, which lie flat against one another in a contact plane 4.
  • the housing parts 3 each have the contact surface 4 facing recesses 5, which are each introduced into 6 housing recesses 5.
  • the depressions 5 are bounded on all sides by the housing walls 6 with the exception of their side facing the abutment plane 4, so they are only open to the abutment plane 4.
  • surface enlarging structures 7 are formed, namely integrally formed with the housing parts 3 cooling fins 8.
  • the recesses 5 are in the form of
  • housing parts 3 introduced that the recesses 5 of each one housing part 3 are covered by the other housing part 3 when assembling the housing parts 3 in the abutment plane 4, with the exception of recessed portions 9, which are not covered and are communicating opposite, so that in the wells 5 of a housing part 3 guided coolant 20 can pass into the recesses 5 of the other housing part 3.
  • the depressions 5 are communicatively connected to an inlet 10 and a flow, not shown here, for the coolant 20.
  • a seal 11 as a continuous gasket 12, which has in the region of the recessed portions 9 openings 13 through which the coolant 20 can pass from the wells of a housing part 3 in the recesses 5 of the other housing part 3.
  • the recesses 5 form a cooling channel system 14, through which the coolant 20 is passed through the housing 1 such that it flows around the cooling fins 8 in an optimal manner; on the cooling fins 8 opposite sides of the respective housing 6 power semiconductors 15 are arranged, which are to be cooled.
  • the heat leakage takes place by the cooling fins 8 associated housing 6 of the respective housing part 3, so that an unhindered heat transfer into the coolant 20 takes place.
  • Suitable coolants 20 are gaseous as well as liquid media.
  • FIG. 2 shows an example and schematically an embodiment of the cooling channel system 14 with inlet 10 and a drain 16, wherein the housing parts 3 are omitted to illustrate the structure of the cooling channel system 14.
  • the course of the coolant 20 is shown within the Recesses 5 of the housing parts 3, not shown here.
  • a level crossing 17 marks the area of the recessed portions 9 shown in FIG. 1, in which the coolant 20 passes from one housing part 3 to the other housing part 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un boîtier pour un circuit électronique, en particulier un circuit électronique d'un bloc de commande d'un véhicule électrique ou d'un moteur à combustion interne, notamment pour une motorisation hybride d'un véhicule automobile, ledit boîtier comportant au moins deux parties entre lesquelles un fluide de refroidissement est conduit dans un système de canal de refroidissement. Selon l'invention, les parties de boîtier (3) comportent des évidements (5), qui forment le système de canal de refroidissement (14) et sont rendus étanches par installation de l'autre partie de boîtier (3), et au moins une partie (9) de l'évidement (5) d'une partie de boîtier (3) est opposée à une partie (9) de l'évidement (5) de l'autre partie de boîtier (3) de manière communicante.
PCT/EP2009/053610 2008-04-07 2009-03-26 Boîtier pour circuit électronique, pourvu d'un système de canal de refroidissement WO2009124846A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200810001028 DE102008001028A1 (de) 2008-04-07 2008-04-07 Gehäuse für eine elektronische Schaltung mit Kühlkanalsystem
DE102008001028.6 2008-04-07

Publications (1)

Publication Number Publication Date
WO2009124846A1 true WO2009124846A1 (fr) 2009-10-15

Family

ID=40810211

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/053610 WO2009124846A1 (fr) 2008-04-07 2009-03-26 Boîtier pour circuit électronique, pourvu d'un système de canal de refroidissement

Country Status (2)

Country Link
DE (1) DE102008001028A1 (fr)
WO (1) WO2009124846A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687439A (zh) * 2012-09-06 2014-03-26 西门子公司 具有液体冷却装置的功率电子系统
CN105324014A (zh) * 2015-09-18 2016-02-10 江苏帕维电动科技有限公司 电动车控制器及电动车
EP3163991A1 (fr) * 2015-10-29 2017-05-03 Delta Electronics (Shanghai) Co., Ltd. Dispositif de conversion de puissance

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009016531U1 (de) * 2009-12-04 2011-04-14 Liebherr-Elektronik Gmbh Leistungselektronische Baugruppe und Wechselrichteranordnung
CN102159051B (zh) * 2010-02-12 2013-05-01 台达电子工业股份有限公司 模块化散热装置
DE102011075614A1 (de) * 2011-05-10 2012-11-15 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches System mit Flüssigkeitskühleinrichtung
EP2557907B1 (fr) * 2011-08-11 2013-12-18 Siemens Aktiengesellschaft Agencement de refroidissement d'un module de convertisseur de courant
CN105451521B (zh) * 2015-12-22 2017-08-29 福建省汽车工业集团云度新能源汽车股份有限公司 一种带散热结构的电机控制器
DE102019123262A1 (de) * 2019-08-30 2021-03-04 Bayerische Motoren Werke Aktiengesellschaft Kraftfahrzeug-Leistungssteuergerät
AT525115A1 (de) * 2021-06-10 2022-12-15 Avl List Gmbh Elektronikvorrichtung für eine Leistungselektronik einer elektrischen Antriebsvorrichtung eines Fahrzeugs
DE102022211844A1 (de) 2022-11-09 2024-05-16 Zf Friedrichshafen Ag Inverteranordnung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396692B1 (en) * 2000-07-27 2002-05-28 Motorola, Inc. Electronic control unit with integrated cooling module
FR2826831A1 (fr) * 2001-06-29 2003-01-03 Peugeot Citroen Automobiles Sa Dsipositif de refroidissement d'au moins un module electronique de puissance, par exemple pour un vehicule automobile
EP1548916A1 (fr) * 2002-09-13 2005-06-29 Aisin Aw Co., Ltd. Dispositif d'entrainement
US20060207780A1 (en) * 2005-03-17 2006-09-21 Toyota Jidosha Kabushiki Kaisha Electronic component housing structural body

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005036299B4 (de) 2005-08-02 2008-01-24 Siemens Ag Kühlanordnung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396692B1 (en) * 2000-07-27 2002-05-28 Motorola, Inc. Electronic control unit with integrated cooling module
FR2826831A1 (fr) * 2001-06-29 2003-01-03 Peugeot Citroen Automobiles Sa Dsipositif de refroidissement d'au moins un module electronique de puissance, par exemple pour un vehicule automobile
EP1548916A1 (fr) * 2002-09-13 2005-06-29 Aisin Aw Co., Ltd. Dispositif d'entrainement
US20060207780A1 (en) * 2005-03-17 2006-09-21 Toyota Jidosha Kabushiki Kaisha Electronic component housing structural body

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687439A (zh) * 2012-09-06 2014-03-26 西门子公司 具有液体冷却装置的功率电子系统
CN103687439B (zh) * 2012-09-06 2017-01-04 西门子公司 具有液体冷却装置的功率电子系统
CN105324014A (zh) * 2015-09-18 2016-02-10 江苏帕维电动科技有限公司 电动车控制器及电动车
EP3163991A1 (fr) * 2015-10-29 2017-05-03 Delta Electronics (Shanghai) Co., Ltd. Dispositif de conversion de puissance
US9820414B2 (en) 2015-10-29 2017-11-14 Delta Electronics (Shanghai) Co., Ltd. Power conversion device with cooling system

Also Published As

Publication number Publication date
DE102008001028A1 (de) 2009-10-08

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