WO2009124846A1 - Housing for an electronic circuit with cooling channel system - Google Patents
Housing for an electronic circuit with cooling channel system Download PDFInfo
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- WO2009124846A1 WO2009124846A1 PCT/EP2009/053610 EP2009053610W WO2009124846A1 WO 2009124846 A1 WO2009124846 A1 WO 2009124846A1 EP 2009053610 W EP2009053610 W EP 2009053610W WO 2009124846 A1 WO2009124846 A1 WO 2009124846A1
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- WO
- WIPO (PCT)
- Prior art keywords
- housing
- cooling channel
- channel system
- coolant
- housing parts
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a housing for an electronic circuit, in particular for an electronic control unit circuit of a control unit of an electric vehicle or an internal combustion engine, in particular for a hybrid drive of a motor vehicle, with at least two housing parts, between which coolant is passed in a cooling duct system.
- actuators and motors in vehicles are electrically operated.
- Previously known couplings to an internal combustion engine are replaced by independent electromotive units, in particular find in hybrid or electric vehicles electric motors for driving the motor vehicle use.
- Such applications require control devices, which consist of several functional units, such as converters for converting direct current, as provided by on-board batteries, in alternating currents or DC-DC converters, alternators, control units for supplying ancillaries with air conditioning compressor, power steering and the like.
- These functional units in turn, in turn consist of various electronic components, in particular of power semiconductors, which in principle produce power loss in the form of waste heat and to this extent must be cooled.
- the active cooling has proven, for example by forced ventilation or a liquid cooling medium.
- the functional units or power components to be cooled are often distributed to a plurality of cooling points within a control unit and can not be concentrated due to the given circuit topology.
- a cooling system for electronics housing is known in which pipes through which coolant flows through the electronics housing, In particular, there are arranged meandering and take on several levels, as required for example by multi-stage board arrangement or due to different component dimensions, absorb waste heat and transport away.
- the object of the invention is to provide a simple, functional and production-optimized housing design, which allows optimized with regard to heat emission cooling medium guide and a space-optimized design.
- a housing for an electronic circuit in particular for an electronic control unit circuit of a control unit of an electric vehicle or an internal combustion engine, in particular for a hybrid drive of a motor vehicle, proposed, with at least two housing parts, between which coolant is passed in a cooling duct system.
- the housing parts have recesses which form the cooling channel system and which are sealed by abutment of the respective other housing part and that at least one recess portion of the recess of a housing part facing a recess portion of the recess of the other housing part communicating. Consequently, unlike the prior art, the coolant is not directed into pipes that are routed within the housing.
- the housing parts have recesses, in the manner of channels which are open on one side, namely in the direction in which the respective other housing part is arranged.
- the respective other housing part covers the channels thus formed and seals them off.
- the recesses can be introduced directly in the manufacture of the housing, so that the subsequent introduction of casings or similar complicated structures, in particular after introduction of the electronic circuit, is not required.
- the production of the cooling channel systems is extraordinary in this way simplified and cheaper.
- the cooling channels can be performed in such a way that they are guided in the immediate vicinity of the electronic circuit to be cooled, for example such that the electronic circuit to be cooled is arranged opposite to the same wall of the housing part on which the recesses are formed. In this way, a very simple and effective heat transfer from the electronic circuit into the region of the recesses is made possible, in which the coolant is guided.
- Two such trained housing parts are placed in opposition and joined together, each non-recessed portions of a housing part the
- surface-enlarging structures are arranged in the depressions. Such surface-enlarging structures allow a better heat transfer from the housing part to the coolant guided in the recesses, in particular thus a larger heat flow through the enlarged surface.
- the structures are integrally formed on the housing parts housing structures.
- the structures are particularly preferably incorporated by way of production of the housing parts, for example by means of an injection process or an injection-molding process.
- the structures are cooling ribs, that is, have a rib-like dimension extending in particular in the direction of flow, for introducing heat into the coolant flowing past.
- the contact of the two housing parts is formed together as a plant level.
- the system of the two housing parts can be particularly simple and effective represent each other.
- the two housing parts are therefore formed flat-planar in their system, the recesses are recessed from the plane into the housing inside. If the two housing parts are placed against one another, a closure of the respective opposite recesses of the respective other housing part takes place in the abutment plane.
- the cooling channel system is therefore designed in this way as a closed cooling channel system.
- At least one seal for sealing the cooling channel system is preferably located in the region of the abutment plane.
- Such a seal can be carried out particularly advantageously as a continuous flat seal, in particular when embodied in a contact plane; Of course, however, all other seals are possible, which allow effective sealing of the wells to form the cooling channel system.
- the electronic circuit has power semiconductors. These are particularly advantageous in the manner described to cool.
- the cooling channel system to an inlet and a drain for the coolant, wherein inlet and outlet are spaced from the plant level.
- the inlet and outlet are therefore not in the contact plane, but spaced therefrom, for example, that in the region of a housing passage of inlet and outlet recesses are sunk into the housing and at least in the area of the crossing (the outflow or inlet of inlet and outlet) have a universally enclosed by the housing cross-section. In this way it is very easy to form connection points, for example for connection to hoses or nozzles.
- the inlet is arranged on one of the housing parts and the outlet on the other of the housing parts. The coolant thus flows through the one and the other housing part, wherein the inlet and the outlet are made on different housing parts, for example on the same side of the housing or on different sides, depending on the requirements of the respective installation situation.
- inlet and outlet are formed on one of the housing parts;
- the coolant is consequently passed from one housing part via the recessed portions, via which the depressions in the housing parts communicate with one another, from one housing part into the other and back again, so that the discharge takes place on the same housing part as before the inlet.
- a certain central supply and discharge of coolant can be formed, whereby the tubing or piping of the cooling circuit is simplified and cheapened.
- Figure 1 shows a cross section through a two housing parts exhibiting
- Figure 2 is a schematisieret representation of the formed in the housing parts cooling duct system.
- FIG. 1 shows a housing 1 for an electronic circuit 2 arranged in the housing 1, wherein the housing 1 consists of two housing parts 3, which lie flat against one another in a contact plane 4.
- the housing parts 3 each have the contact surface 4 facing recesses 5, which are each introduced into 6 housing recesses 5.
- the depressions 5 are bounded on all sides by the housing walls 6 with the exception of their side facing the abutment plane 4, so they are only open to the abutment plane 4.
- surface enlarging structures 7 are formed, namely integrally formed with the housing parts 3 cooling fins 8.
- the recesses 5 are in the form of
- housing parts 3 introduced that the recesses 5 of each one housing part 3 are covered by the other housing part 3 when assembling the housing parts 3 in the abutment plane 4, with the exception of recessed portions 9, which are not covered and are communicating opposite, so that in the wells 5 of a housing part 3 guided coolant 20 can pass into the recesses 5 of the other housing part 3.
- the depressions 5 are communicatively connected to an inlet 10 and a flow, not shown here, for the coolant 20.
- a seal 11 as a continuous gasket 12, which has in the region of the recessed portions 9 openings 13 through which the coolant 20 can pass from the wells of a housing part 3 in the recesses 5 of the other housing part 3.
- the recesses 5 form a cooling channel system 14, through which the coolant 20 is passed through the housing 1 such that it flows around the cooling fins 8 in an optimal manner; on the cooling fins 8 opposite sides of the respective housing 6 power semiconductors 15 are arranged, which are to be cooled.
- the heat leakage takes place by the cooling fins 8 associated housing 6 of the respective housing part 3, so that an unhindered heat transfer into the coolant 20 takes place.
- Suitable coolants 20 are gaseous as well as liquid media.
- FIG. 2 shows an example and schematically an embodiment of the cooling channel system 14 with inlet 10 and a drain 16, wherein the housing parts 3 are omitted to illustrate the structure of the cooling channel system 14.
- the course of the coolant 20 is shown within the Recesses 5 of the housing parts 3, not shown here.
- a level crossing 17 marks the area of the recessed portions 9 shown in FIG. 1, in which the coolant 20 passes from one housing part 3 to the other housing part 3.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a housing for an electronic circuit, in particular for an electronic control unit circuit of a control unit of an electric vehicle or an internal combustion engine, in particular for a hybrid drive of a motor vehicle, comprising at least two housing sections with coolant being passed therebetween in a cooling channel system. It is provided that the housing sections (3) comprise recesses (5) that form the cooling channel system (14) and that are sealed off by abutting the other respective housing section (3) and that at least one recess section (9) of the recess (5) of a housing section (3) is disposed opposite to a recess section (9) of the recess (5) of the other housing section (3) in communicating fashion.
Description
Beschreibung description
Titel Gehäuse für eine elektronische Schaltung mit KühlkanalsystemTitle Housing for an electronic circuit with cooling duct system
Die Erfindung betrifft ein Gehäuse für eine elektronische Schaltung, insbesondere für eine elektronische Steuergeräteschaltung eines Steuergerätes eines Elektrofahrzeugs oder einer Brenn kraftmasch ine, insbesondere für einen Hybridantriebs eines Kraftfahrzeugs, mit mindestens zwei Gehäuseteilen, zwischen denen in einem Kühlkanalsystem Kühlmittel hindurchgeleitet wird.The invention relates to a housing for an electronic circuit, in particular for an electronic control unit circuit of a control unit of an electric vehicle or an internal combustion engine, in particular for a hybrid drive of a motor vehicle, with at least two housing parts, between which coolant is passed in a cooling duct system.
Stand der TechnikState of the art
In immer größeren Umfang werden Aktoren und Motoren in Fahrzeugen, insbesondere Kraftfahrzeugen, elektrisch betrieben. Bislang bekannte Ankoppelungen an eine Brennkraftmaschine werden durch selbstständige elektromotorische Einheiten ersetzt, insbesondere finden in Hybrid- oder auch Elektrofahrzeugen Elektromotoren zum Antrieb des Kraftfahrzeugs Verwendung. Derartige Anwendungen benötigen Steuergeräte, wobei diese aus mehreren Funktionseinheiten bestehen, beispielsweise Konvertern zur Wandlung von Gleichstrom, wie er von Bordbatterien bereitgestellt wird, in Wechselströme oder Gleichspannungswandlern, Lichtmaschinen-Substituten, Steuer- und Kontrolleinheiten zur Versorgung von Nebenaggregaten mit Klimakompressor, Servolenkung und Ähnliches. Diese Funktionseinheiten wiederum bestehen ihrerseits aus verschiedenen elektronischen Bauteilen, insbesondere aus Leistungshalbleitern, die prinzipbedingt Verlustleistung in Form von Abwärme produzieren und insoweit gekühlt werden müssen. Als vorteilhaft gegenüber der bekannten passiven Kühlung hat sich die aktive Kühlung beispielsweise durch Zwangsbelüftung oder ein flüssiges Kühlmedium erwiesen. Die zu kühlenden Funktionseinheiten beziehungsweise Leistungsbauteile sind jedoch häufig auf mehrere Kühlstellen innerhalb eines Steuergeräts verteilt und können aufgrund der gegebenen Schaltungstopologie nicht konzentriert werden. Aus der DE 10 2005 036 299 A1 ist daher ein Kühlsystem für Elektronikgehäuse bekannt, bei dem von Kühlmittel durchflossene Rohre das Elektronikgehäuse durchziehen,
insbesondere dort mäanderförmig angeordnet sind und auf mehreren Ebenen, wie sie beispielsweise durch mehrstufige Platinenanordnung oder bedingt durch unterschiedliche Bauteildimensionen erforderlich sind, Abwärme aufnehmen und abtransportieren. Daran ist nachteilig, dass durch die Verrohrung des Kühlsystems innerhalb des Elektronikgehäuses ein relativ großer Bauraum beansprucht wird und überdies das das Kühlmittel führende Rohr nur unvollkommen an die Kühlstellen, nämlich die zu kühlenden Halbleiter, angekoppelt werden kann; der Verlustwärmeaustrag ist demzufolge nicht optimal.To an ever greater extent actuators and motors in vehicles, especially motor vehicles, are electrically operated. Previously known couplings to an internal combustion engine are replaced by independent electromotive units, in particular find in hybrid or electric vehicles electric motors for driving the motor vehicle use. Such applications require control devices, which consist of several functional units, such as converters for converting direct current, as provided by on-board batteries, in alternating currents or DC-DC converters, alternators, control units for supplying ancillaries with air conditioning compressor, power steering and the like. These functional units, in turn, in turn consist of various electronic components, in particular of power semiconductors, which in principle produce power loss in the form of waste heat and to this extent must be cooled. As an advantage over the known passive cooling, the active cooling has proven, for example by forced ventilation or a liquid cooling medium. However, the functional units or power components to be cooled are often distributed to a plurality of cooling points within a control unit and can not be concentrated due to the given circuit topology. From DE 10 2005 036 299 A1, therefore, a cooling system for electronics housing is known in which pipes through which coolant flows through the electronics housing, In particular, there are arranged meandering and take on several levels, as required for example by multi-stage board arrangement or due to different component dimensions, absorb waste heat and transport away. This has the disadvantage that a relatively large space is claimed by the piping of the cooling system within the electronics housing and, moreover, the refrigerant pipe leading incomplete to the cooling points, namely the semiconductor to be cooled, can be coupled; the loss heat release is therefore not optimal.
Aufgabe der Erfindung ist es, eine einfache, funktions- und herstellungsoptimierte Gehäusebauweise bereitzustellen, die eine in Hinblick auf Wärmeaustrag optimierte Kühlmediumsführung sowie eine bauraumoptimierte Gestaltung ermöglicht.The object of the invention is to provide a simple, functional and production-optimized housing design, which allows optimized with regard to heat emission cooling medium guide and a space-optimized design.
Offenbarung der ErfindungDisclosure of the invention
Hierzu wird ein Gehäuse für eine elektronische Schaltung, insbesondere für eine elektronische Steuergeräteschaltung eines Steuergeräts eines Elektrofahrzeugs oder einer Brennkraftmaschine, insbesondere für einen Hybridantrieb eines Kraftfahrzeugs, vorgeschlagen, mit mindestens zwei Gehäuseteilen, zwischen denen in einem Kühlkanalsystem Kühlmittel hindurchgeleitet wird. Hierbei ist vorgesehen, dass die Gehäuseteile Vertiefungen aufweisen, die das Kühlkanalsystem bilden und die durch Anlage des jeweils anderen Gehäuseteils abgedichtet sind und dass mindestens ein Vertiefungsabschnitt der Vertiefung eines Gehäuseteils einem Vertiefungsabschnitt der Vertiefung des anderen Gehäuseteils kommunizierend gegenüberliegt. Anders als im Stand der Technik wird demzufolge das Kühlmittel nicht in Rohren geleitet, die innerhalb des Gehäuses verlegt sind. Vielmehr weisen die Gehäuseteile Vertiefungen auf, in der Art von Kanälen, die einseitig offen sind, nämlich in die Richtung, in der das jeweils andere Gehäuseteil angeordnet wird. Das jeweils andere Gehäuseteil deckelt die so ausgebildeten Kanäle und dichtet sie ab. Die Vertiefungen können bei der Herstellung des Gehäuses direkt eingebracht werden, so dass das spätere Einbringen von Verrohrungen oder ähnlichen komplizierten Strukturen, insbesondere nach Einbringen der elektronischen Schaltung, nicht erforderlich ist. Die Herstellung der Kühlkanalsysteme wird auf diese Art außerordentlich
vereinfacht und preisgünstiger gestaltet. Hierbei können die Kühlkanäle dergestalt geführt werden, dass sie in unmittelbare Nachbarschaft der zu kühlenden elektronischen Schaltung geführt sind, beispielsweise dergestalt, dass die zu kühlende elektronische Schaltung an derselben Wandung des Gehäuseteils, an der die Vertiefungen ausgebildet sind, gegenüberliegend angeordnet ist. Auf diese Weise wird ein sehr einfacher und wirkungsvoller Wärmeü bertritt von der elektronischen Schaltung in den Bereich der Vertiefungen ermöglicht, in denen das Kühlmittel geführt ist. Zwei solcher Art ausgebildete Gehäuseteile werden in Gegenüberlage gebracht und aneinander gefügt, wobei jeweils nicht vertiefte Abschnitte des einen Gehäuseteils dieFor this purpose, a housing for an electronic circuit, in particular for an electronic control unit circuit of a control unit of an electric vehicle or an internal combustion engine, in particular for a hybrid drive of a motor vehicle, proposed, with at least two housing parts, between which coolant is passed in a cooling duct system. In this case, it is provided that the housing parts have recesses which form the cooling channel system and which are sealed by abutment of the respective other housing part and that at least one recess portion of the recess of a housing part facing a recess portion of the recess of the other housing part communicating. Consequently, unlike the prior art, the coolant is not directed into pipes that are routed within the housing. Rather, the housing parts have recesses, in the manner of channels which are open on one side, namely in the direction in which the respective other housing part is arranged. The respective other housing part covers the channels thus formed and seals them off. The recesses can be introduced directly in the manufacture of the housing, so that the subsequent introduction of casings or similar complicated structures, in particular after introduction of the electronic circuit, is not required. The production of the cooling channel systems is extraordinary in this way simplified and cheaper. Here, the cooling channels can be performed in such a way that they are guided in the immediate vicinity of the electronic circuit to be cooled, for example such that the electronic circuit to be cooled is arranged opposite to the same wall of the housing part on which the recesses are formed. In this way, a very simple and effective heat transfer from the electronic circuit into the region of the recesses is made possible, in which the coolant is guided. Two such trained housing parts are placed in opposition and joined together, each non-recessed portions of a housing part the
Vertiefungen des anderen Gehäuseteils abdecken und abdichten. Gleichzeitig ist vorgesehen, dass jeweils mindestens ein Vertiefungsabschnitt der Vertiefung des einen Gehäuseteils einem Vertiefungsabschnitt der Vertiefung des anderen Gehäuseteils dergestalt gegenüberliegt, dass die Vertiefungen miteinander kommunizieren, also ein Kühlmittelübertritt von der Vertiefung des einen Gehäuseteils in die Vertiefung des anderen Gehäuseteils ermöglicht wird. Auf diese Weise lassen sich kühlmittelleitende Strukturen über verschiedene Gehäuseteile hinweg ausbilden, wobei jeweils in dem einen und auch dem anderen Gehäuseteil mittels desselben Kühlmittels eine Wärmeabfuhr ermöglicht wird.Cover and seal the recesses of the other housing part. At the same time it is provided that in each case at least one recess portion of the recess of a housing part is opposite a recess portion of the recess of the other housing part such that the recesses communicate with each other, so a coolant transfer is made possible by the recess of a housing part in the recess of the other housing part. In this way, coolant-conducting structures can be formed over different housing parts, heat removal being possible in each case in the one and the other housing part by means of the same coolant.
Bevorzugt sind in den Vertiefungen oberflächenvergrößernde Strukturen angeordnet. Solche oberflächenvergrößernde Strukturen erlauben einen besseren Wärmeübertritt von dem Gehäuseteil auf das in den Vertiefungen geführte Kühlmittel, insbesondere also einen größeren Wärmestrom durch die vergrößerte Oberfläche.Preferably, surface-enlarging structures are arranged in the depressions. Such surface-enlarging structures allow a better heat transfer from the housing part to the coolant guided in the recesses, in particular thus a larger heat flow through the enlarged surface.
Bevorzugt sind die Strukturen einstückig an den Gehäuseteilen ausgebildete Gehäusestrukturen. Die Strukturen werden besonders bevorzugt im Wege der Herstellung der Gehäuseteile, beispielsweise im Wege eines Spritzvorganges oder eines Spritzdruckvorganges, miteingebracht.Preferably, the structures are integrally formed on the housing parts housing structures. The structures are particularly preferably incorporated by way of production of the housing parts, for example by means of an injection process or an injection-molding process.
Bevorzugt ist vorgesehen, dass die Strukturen Kühlrippen sind, also eine insbesondere in Strömungsrichtung verlaufende, rippenartige Dimension haben zum Eintrag von Wärme in das vorbeiströmende Kühlmittel.
In einer Ausführungsform ist vorgesehen, dass die Anlage der beiden Gehäuseteile aneinander als Anlageebene ausgebildet ist. In dieser Ausführungsform lässt sich die Anlage der beiden Gehäuseteile aneinander besonders einfach und wirksam darstellen. Die beiden Gehäuseteile sind demzufolge in ihrer Anlage jeweils flächig-eben ausgebildet, wobei die Vertiefungen von der Ebene in das Gehäuse hinein vertieft sind. Werden die beiden Gehäuseteile aneinander gelegt, findet in der Anlageebene ein Verschluss der jeweils gegenüberliegenden Vertiefungen des jeweils anderen Gehäuseteils statt. Das Kühlkanalsystem ist demzufolge auf diese Weise als geschlossenes Kühlkanalsystem ausgebildet.It is preferably provided that the structures are cooling ribs, that is, have a rib-like dimension extending in particular in the direction of flow, for introducing heat into the coolant flowing past. In one embodiment it is provided that the contact of the two housing parts is formed together as a plant level. In this embodiment, the system of the two housing parts can be particularly simple and effective represent each other. The two housing parts are therefore formed flat-planar in their system, the recesses are recessed from the plane into the housing inside. If the two housing parts are placed against one another, a closure of the respective opposite recesses of the respective other housing part takes place in the abutment plane. The cooling channel system is therefore designed in this way as a closed cooling channel system.
Bevorzugt befindet sich im Bereich der Anlageebene mindestens eine Dichtung zur Abdichtung des Kühlkanalsystems. Eine solche Dichtung kann, insbesondere bei Ausführung in einer Anlageebene, besonders vorteilhaft als eine durchgehende Flachdichtung ausgeführt werden; selbstverständlich sind aber auch alle anderen Dichtungen möglich, die eine wirksame Andichtung der Vertiefungen zur Ausbildung des Kühlkanalsystems ermöglichen.At least one seal for sealing the cooling channel system is preferably located in the region of the abutment plane. Such a seal can be carried out particularly advantageously as a continuous flat seal, in particular when embodied in a contact plane; Of course, however, all other seals are possible, which allow effective sealing of the wells to form the cooling channel system.
Weiter ist vorgesehen, dass die elektronische Schaltung Leistungshalbleiter aufweist. Diese sind in der beschriebenen Art und Weise besonders vorteilhaft zu kühlen.It is further provided that the electronic circuit has power semiconductors. These are particularly advantageous in the manner described to cool.
In einer bevorzugten Ausführungsform weist das Kühlkanalsystem einen Zulauf und einen Ablauf für das Kühlmittel auf, wobei Zulauf und Ablauf beabstandet zur Anlageebene liegen. Zulauf und Ablauf erfolgen demzufolge nicht in der Anlageebene, sondern beabstandet hierzu, beispielsweise dadurch, dass im Bereich eines Gehäusedurchtritts von Zulauf und Ablauf die Vertiefungen in das Gehäuse versenkt sind und zumindest im Bereich des Übertritts (des Aus- beziehungsweise Eintritts von Zulauf und Ablauf) einen allseitig vom Gehäuse umschlossenen Querschnitt aufweisen. Auf diese Weise lassen sich sehr einfach Anschlussstellen, beispielsweise zur Verbindung mit Schläuchen oder Stutzen, ausbilden.
In einer Ausführungsform ist der Zulauf an einem der Gehäuseteile und der Ablauf an den anderen der Gehäuseteile angeordnet. Das Kühlmittel durchströmt folglich das eine und das andere Gehäuseteil, wobei der Zulauf und der Ablauf an unterschiedlichen Gehäuseteilen erfolgen, beispielsweise auf derselben Seite des Gehäuses oder an verschiedenen Seiten, je nach den Anforderungen der jeweiligen Einbausituation.In a preferred embodiment, the cooling channel system to an inlet and a drain for the coolant, wherein inlet and outlet are spaced from the plant level. The inlet and outlet are therefore not in the contact plane, but spaced therefrom, for example, that in the region of a housing passage of inlet and outlet recesses are sunk into the housing and at least in the area of the crossing (the outflow or inlet of inlet and outlet) have a universally enclosed by the housing cross-section. In this way it is very easy to form connection points, for example for connection to hoses or nozzles. In one embodiment, the inlet is arranged on one of the housing parts and the outlet on the other of the housing parts. The coolant thus flows through the one and the other housing part, wherein the inlet and the outlet are made on different housing parts, for example on the same side of the housing or on different sides, depending on the requirements of the respective installation situation.
In einer anderen Ausführungsform sind Zulauf und Ablauf an einem der Gehäuseteile ausgebildet; das Kühlmittel wird folglich von dem einen Gehäuseteil über die Vertiefungsabschnitte, über die die Vertiefungen in den Gehäuseteilen miteinander kommunizieren, von einem Gehäuseteil in das andere und wieder zurück geleitet, so dass der Ablauf an dem selben Gehäuseteil erfolgt wie zuvor der Zulauf. Auf diese Weise lässt sich eine gewissermaßen zentrale Zu- und Abführung von Kühlmittel ausbilden, wodurch die Verschlauchung oder Verrohrung des Kühlkreislaufes vereinfacht und verbilligt wird.In another embodiment, inlet and outlet are formed on one of the housing parts; The coolant is consequently passed from one housing part via the recessed portions, via which the depressions in the housing parts communicate with one another, from one housing part into the other and back again, so that the discharge takes place on the same housing part as before the inlet. In this way, a certain central supply and discharge of coolant can be formed, whereby the tubing or piping of the cooling circuit is simplified and cheapened.
Weitere vorteilhafte Ausführungsformen ergeben sich aus den Unteransprüchen und aus Kombinationen derselben.Further advantageous embodiments will become apparent from the dependent claims and combinations thereof.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Die Erfindung wird nachfolgend anhand eines Ausführungsbeispiels näher beschrieben, ohne aber hierauf beschränkt zu sein.The invention will be described in more detail below with reference to an embodiment, but without being limited thereto.
Es zeigenShow it
Figur 1 einen Querschnitt durch ein zwei Gehäuseteile aufweisendesFigure 1 shows a cross section through a two housing parts exhibiting
Gehäuse undHousing and
Figur 2 eine schematisieret Darstellung des in den Gehäuseteilen ausgebildeten Kühlkanalsystems.Figure 2 is a schematisieret representation of the formed in the housing parts cooling duct system.
Ausführungsform(en) der Erfindung
Figur 1 zeigt ein Gehäuse 1 für eine in dem Gehäuse 1 angeordnete elektronische Schaltung 2, wobei das Gehäuse 1 aus zwei Gehäuseteilen 3 besteht, die in einer Anlageebene 4 flächig-eben aneinander liegen. Die Gehäuseteile 3 weisen jeweils der Anlageebene 4 zugewandte Vertiefungen 5 auf, die jeweils in Gehäusewandungen 6 eingebrachte Vertiefungen 5 sind. Die Vertiefungen 5 werden von den Gehäusewandungen 6 allseitig mit Ausnahme ihrer der Anlageebene 4 zugewandten Seite hin begrenzt, sie sind also nur zur Anlageebene 4 hin offen. In den Vertiefungen 5 sind oberflächenvergrößernde Strukturen 7 ausgebildet, nämlich einstückig mit den Gehäuseteilen 3 ausgebildete Kühlrippen 8. Die Vertiefungen 5 sind dergestalt in denEmbodiment (s) of the invention FIG. 1 shows a housing 1 for an electronic circuit 2 arranged in the housing 1, wherein the housing 1 consists of two housing parts 3, which lie flat against one another in a contact plane 4. The housing parts 3 each have the contact surface 4 facing recesses 5, which are each introduced into 6 housing recesses 5. The depressions 5 are bounded on all sides by the housing walls 6 with the exception of their side facing the abutment plane 4, so they are only open to the abutment plane 4. In the recesses 5 surface enlarging structures 7 are formed, namely integrally formed with the housing parts 3 cooling fins 8. The recesses 5 are in the form of
Gehäuseteilen 3 eingebracht, dass beim Zusammenfügen der Gehäuseteile 3 in der Anlageebene 4 die Vertiefungen 5 des jeweils einen Gehäuseteils 3 von dem anderen Gehäuseteil 3 überdeckt werden, mit Ausnahme von Vertiefungsabschnitten 9, die nicht abgedeckt werden und sich kommunizierend gegenüberliegen, so dass in den Vertiefungen 5 des einen Gehäuseteils 3 geführtes Kühlmittel 20 in die Vertiefungen 5 des jeweils anderen Gehäuseteils 3 übertreten kann. Die Vertiefungen 5 sind mit einem Zulauf 10 und einem hier nicht dargestellten Ablauf für das Kühlmittel 20 kommunizierend verbunden. In der Anlageebene 4 liegt eine Dichtung 11 als durchgehende Flachdichtung 12 ein, die im Bereich der Vertiefungsabschnitte 9 Durchbrüche 13 aufweist, durch die das Kühlmittel 20 von den Vertiefungen des einen Gehäuseteils 3 in die Vertiefungen 5 des anderen Gehäuseteils 3 übertreten kann. Die Vertiefungen 5 bilden ein Kühlkanalsystem 14 aus, durch das das Kühlmittel 20 durch das Gehäuse 1 dergestalt geleitet wird, dass es die Kühlrippen 8 in optimaler Weise umströmt; auf den den Kühlrippen 8 gegenüberliegenden Seiten der jeweiligen Gehäusewandung 6 sind Leistungshalbleiter 15 angeordnet, die zu kühlen sind. Der Wärmeaustrag findet durch die den Kühlrippen 8 zugeordnete Gehäusewandung 6 des jeweiligen Gehäuseteils 3 statt, so dass ein ungehinderter Wärmeübertritt in das Kühlmittel 20 erfolgt. Als Kühlmittel 20 kommen gasförmige wie auch flüssige Medien in Betracht.Housing parts 3 introduced that the recesses 5 of each one housing part 3 are covered by the other housing part 3 when assembling the housing parts 3 in the abutment plane 4, with the exception of recessed portions 9, which are not covered and are communicating opposite, so that in the wells 5 of a housing part 3 guided coolant 20 can pass into the recesses 5 of the other housing part 3. The depressions 5 are communicatively connected to an inlet 10 and a flow, not shown here, for the coolant 20. In the contact plane 4 is a seal 11 as a continuous gasket 12, which has in the region of the recessed portions 9 openings 13 through which the coolant 20 can pass from the wells of a housing part 3 in the recesses 5 of the other housing part 3. The recesses 5 form a cooling channel system 14, through which the coolant 20 is passed through the housing 1 such that it flows around the cooling fins 8 in an optimal manner; on the cooling fins 8 opposite sides of the respective housing 6 power semiconductors 15 are arranged, which are to be cooled. The heat leakage takes place by the cooling fins 8 associated housing 6 of the respective housing part 3, so that an unhindered heat transfer into the coolant 20 takes place. Suitable coolants 20 are gaseous as well as liquid media.
Figur 2 zeigt beispielhaft und schematisch eine Ausführungsform des Kühlkanalsystems 14 mit Zulauf 10 und einem Ablauf 16, wobei die Gehäuseteile 3 weggelassen sind, um die Struktur des Kühlkanalsystems 14 zu verdeutlichen. Dargestellt ist folglich der Verlauf des Kühlmittels 20 innerhalb der
Vertiefungen 5 der hier nicht dargestellten Gehäuseteile 3. Ein Ebenenübertritt 17 kennzeichnet den Bereich der in Figur 1 dargestellten Vertiefungsabschnitte 9, in denen das Kühlmittel 20 von einem Gehäuseteil 3 zum anderen Gehäuseteil 3 übertritt. Demzufolge ist hier in einer unteren Ebene 18 der Kühlmittelverlauf in dem einen Gehäuseteil 3 dargestellt, während in der oberen Ebene 19 der Kühlmittelverlauf in dem anderen Gehäuseteil 3 dargestellt ist, wobei sich untere Ebene 18 und obere Ebene 19 in den Ebenenübertritten 17 trennen beziehungsweise wieder vereinigen. Der hier dargestellte Kühlmittelverlauf ist gewissermaßen das reine Strömungsbild des im Kühlkanalsystem 14 sich ergebenden Kühlmittelverlaufs. Eine in dieser Weise erfolgende Verrohrung ist gerade nicht erforderlich, da das Kühlkanalsystem 14 von den in den Gehäuseteilen 3 ausgebildeten Vertiefungen 5 gebildet wird (vergleiche Figur 1 ). Auf diese Weise ist eine sehr kostengünstige und einfache Hinführung von Kühlmittel 20 hin zu den Orten innerhalb des Gehäuses 1 möglich, wo Wärmeaustrag erfolgen soll. Insbesondere ist so eine großflächige Wärmeübertrittsfläche realisierbar, die vergleichsweise wenig Bauraum beansprucht und eine sehr kompakte und einfach herzustellende und zu montierende Gehäusegeometrie zulässt.
Figure 2 shows an example and schematically an embodiment of the cooling channel system 14 with inlet 10 and a drain 16, wherein the housing parts 3 are omitted to illustrate the structure of the cooling channel system 14. Thus, the course of the coolant 20 is shown within the Recesses 5 of the housing parts 3, not shown here. A level crossing 17 marks the area of the recessed portions 9 shown in FIG. 1, in which the coolant 20 passes from one housing part 3 to the other housing part 3. Accordingly, here in a lower level 18 of the coolant flow in the one housing part 3 is shown, while in the upper level 19 of the coolant flow in the other housing part 3 is shown, with the lower level 18 and upper level 19 in the plane cross 17 separate or reunite , The coolant flow shown here is to a certain extent the pure flow pattern of the coolant flow path resulting in the cooling channel system 14. A piping that takes place in this way is not required because the cooling channel system 14 is formed by the recesses 5 formed in the housing parts 3 (see FIG. 1). In this way, a very cost-effective and simple introduction of coolant 20 to the locations within the housing 1 is possible, where heat removal should take place. In particular, such a large-scale heat transfer surface can be realized, which requires comparatively little space and allows a very compact and easy to manufacture and to be mounted housing geometry.
Claims
1. Gehäuse für eine elektronische Schaltung, insbesondere für eine elektronische Steuergeräteschaltung eines Steuergeräts eines Elektrofahrzeuges oder einer Brennkraftmaschine, insbesondere für ein1. Housing for an electronic circuit, in particular for an electronic control unit circuit of a control unit of an electric vehicle or an internal combustion engine, in particular for a
Hybridantrieb eines Kraftfahrzeugs, mit mindestens zwei Gehäuseteilen, zwischen denen in einem Kühlkanalsystem Kühlmittel hindurchgeleitet wird, dadurch gekennzeichnet, dass die Gehäuseteile (3) Vertiefungen (5) aufweisen, die das Kühlkanalsystem (14) bilden und die durch Anlage des jeweils anderen Gehäuseteils (3) abgedichtet sind und dass mindestens ein Vertiefungsabschnitt (9) der Vertiefung (5) eines Gehäuseteils (3) einen Vertiefungsabschnitt (9) der Vertiefung (5) des anderen Gehäuseteils (3) kommunizierend gegenüberliegt.Hybrid drive of a motor vehicle, with at least two housing parts, between which coolant is passed in a cooling channel system, characterized in that the housing parts (3) recesses (5) which form the cooling channel system (14) and by conditioning the respective other housing part (3 ) and that at least one recessed portion (9) of the recess (5) of a housing part (3) communicating with a recess portion (9) of the recess (5) of the other housing part (3).
2. Gehäuse nach Anspruch 1 , dadurch gekennzeichnet, dass in den2. Housing according to claim 1, characterized in that in the
Vertiefungen (5) oberflächenvergrößernde Strukturen (7) angeordnet sind.Wells (5) surface enlarging structures (7) are arranged.
3. Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Strukturen (7) insbesondere einstückig an den Gehäuseteilen (3) ausgebildete Gehäusestrukturen sind.3. Housing according to one of the preceding claims, characterized in that the structures (7) are in particular integrally formed on the housing parts (3) housing structures.
4. Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Strukturen (7) Kühlrippen (8) sind.4. Housing according to one of the preceding claims, characterized in that the structures (7) are cooling fins (8).
5. Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Anlage der beiden Gehäuseteile (3) aneinander als Anlageebene (4) ausgebildet ist.5. Housing according to one of the preceding claims, characterized in that the abutment of the two housing parts (3) to each other as a bearing plane (4) is formed.
6. Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass sich im Bereich der Anlageebene (4) mindestens eine Dichtung (11 ) zur Abdichtung des Kühlkanalsystems (14) befindet.6. Housing according to one of the preceding claims, characterized in that in the region of the abutment plane (4) at least one seal (11) for sealing the cooling channel system (14).
7. Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die elektronische Schaltung Leistungshalbleiter (15) aufweist. 7. Housing according to one of the preceding claims, characterized in that the electronic circuit comprises power semiconductors (15).
8. Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Kühlkanalsystem (14) einen Zulauf (10) und einen Ablauf (16) für das Kühlmittel (20) aufweist, wobei Zulauf (10) und Ablauf (16) beabstandet zur Anlageebene (4) liegen.8. Housing according to one of the preceding claims, characterized in that the cooling channel system (14) has an inlet (10) and a drain (16) for the coolant (20), wherein inlet (10) and outlet (16) spaced from the plant level (4) lie.
9. Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Zulauf (10) an einem der Gehäuseteile (3) und der Ablauf (16) an dem anderen der Gehäuseteile (3) angeordnet ist.9. Housing according to one of the preceding claims, characterized in that the inlet (10) on one of the housing parts (3) and the outlet (16) on the other of the housing parts (3) is arranged.
10. Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass Zulauf (10) und Ablauf (16) an einem der Gehäuseteile (3) ausgebildet ist. 10. Housing according to one of the preceding claims, characterized in that inlet (10) and outlet (16) on one of the housing parts (3) is formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008001028.6 | 2008-04-07 | ||
| DE200810001028 DE102008001028A1 (en) | 2008-04-07 | 2008-04-07 | Housing for an electronic circuit with cooling channel system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009124846A1 true WO2009124846A1 (en) | 2009-10-15 |
Family
ID=40810211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2009/053610 WO2009124846A1 (en) | 2008-04-07 | 2009-03-26 | Housing for an electronic circuit with cooling channel system |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102008001028A1 (en) |
| WO (1) | WO2009124846A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687439A (en) * | 2012-09-06 | 2014-03-26 | 西门子公司 | Power electronics system with liquid cooling system |
| CN105324014A (en) * | 2015-09-18 | 2016-02-10 | 江苏帕维电动科技有限公司 | Electric vehicle controller and electric vehicle |
| EP3163991A1 (en) * | 2015-10-29 | 2017-05-03 | Delta Electronics (Shanghai) Co., Ltd. | Power conversion device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202009016531U1 (en) * | 2009-12-04 | 2011-04-14 | Liebherr-Elektronik Gmbh | Power electronic assembly and inverter assembly |
| CN102159051B (en) * | 2010-02-12 | 2013-05-01 | 台达电子工业股份有限公司 | Modular heat-radiating device |
| DE102011075614A1 (en) * | 2011-05-10 | 2012-11-15 | Semikron Elektronik Gmbh & Co. Kg | Power electronic system with liquid cooling device |
| EP2557907B1 (en) * | 2011-08-11 | 2013-12-18 | Siemens Aktiengesellschaft | Cooling assembly for cooling a frequency converter module |
| CN105451521B (en) * | 2015-12-22 | 2017-08-29 | 福建省汽车工业集团云度新能源汽车股份有限公司 | A kind of electric machine controller with radiator structure |
| DE102019123262A1 (en) * | 2019-08-30 | 2021-03-04 | Bayerische Motoren Werke Aktiengesellschaft | Motor vehicle power control device |
| AT525115A1 (en) * | 2021-06-10 | 2022-12-15 | Avl List Gmbh | Electronic device for power electronics of an electric drive device of a vehicle |
| DE102022211844A1 (en) | 2022-11-09 | 2024-05-16 | Zf Friedrichshafen Ag | Inverter arrangement |
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| US6396692B1 (en) * | 2000-07-27 | 2002-05-28 | Motorola, Inc. | Electronic control unit with integrated cooling module |
| FR2826831A1 (en) * | 2001-06-29 | 2003-01-03 | Peugeot Citroen Automobiles Sa | Car electronics power module cooling mechanism having enclosure with side walls/sole plate base around electronics module providing cooling enclosure with input/output fluid ports. |
| EP1548916A1 (en) * | 2002-09-13 | 2005-06-29 | Aisin Aw Co., Ltd. | Drive device |
| US20060207780A1 (en) * | 2005-03-17 | 2006-09-21 | Toyota Jidosha Kabushiki Kaisha | Electronic component housing structural body |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005036299B4 (en) | 2005-08-02 | 2008-01-24 | Siemens Ag | cooling arrangement |
-
2008
- 2008-04-07 DE DE200810001028 patent/DE102008001028A1/en not_active Withdrawn
-
2009
- 2009-03-26 WO PCT/EP2009/053610 patent/WO2009124846A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6396692B1 (en) * | 2000-07-27 | 2002-05-28 | Motorola, Inc. | Electronic control unit with integrated cooling module |
| FR2826831A1 (en) * | 2001-06-29 | 2003-01-03 | Peugeot Citroen Automobiles Sa | Car electronics power module cooling mechanism having enclosure with side walls/sole plate base around electronics module providing cooling enclosure with input/output fluid ports. |
| EP1548916A1 (en) * | 2002-09-13 | 2005-06-29 | Aisin Aw Co., Ltd. | Drive device |
| US20060207780A1 (en) * | 2005-03-17 | 2006-09-21 | Toyota Jidosha Kabushiki Kaisha | Electronic component housing structural body |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687439A (en) * | 2012-09-06 | 2014-03-26 | 西门子公司 | Power electronics system with liquid cooling system |
| CN103687439B (en) * | 2012-09-06 | 2017-01-04 | 西门子公司 | There is the power electronic system of Control device of liquid cooling |
| CN105324014A (en) * | 2015-09-18 | 2016-02-10 | 江苏帕维电动科技有限公司 | Electric vehicle controller and electric vehicle |
| EP3163991A1 (en) * | 2015-10-29 | 2017-05-03 | Delta Electronics (Shanghai) Co., Ltd. | Power conversion device |
| US9820414B2 (en) | 2015-10-29 | 2017-11-14 | Delta Electronics (Shanghai) Co., Ltd. | Power conversion device with cooling system |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008001028A1 (en) | 2009-10-08 |
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