WO2009115083A2 - Rf component and the method thereof for surface finishing - Google Patents

Rf component and the method thereof for surface finishing Download PDF

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Publication number
WO2009115083A2
WO2009115083A2 PCT/DE2009/000367 DE2009000367W WO2009115083A2 WO 2009115083 A2 WO2009115083 A2 WO 2009115083A2 DE 2009000367 W DE2009000367 W DE 2009000367W WO 2009115083 A2 WO2009115083 A2 WO 2009115083A2
Authority
WO
WIPO (PCT)
Prior art keywords
component
roughened
components
anodized
electron emission
Prior art date
Application number
PCT/DE2009/000367
Other languages
German (de)
French (fr)
Other versions
WO2009115083A3 (en
Inventor
Ulrich Wochner
Dieter Wolk
Original Assignee
Tesat-Spacecom Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesat-Spacecom Gmbh & Co. Kg filed Critical Tesat-Spacecom Gmbh & Co. Kg
Priority to DE112009001179T priority Critical patent/DE112009001179A5/en
Publication of WO2009115083A2 publication Critical patent/WO2009115083A2/en
Publication of WO2009115083A3 publication Critical patent/WO2009115083A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
    • H01J23/12—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J25/00—Transit-time tubes, e.g. klystrons, travelling-wave tubes, magnetrons

Definitions

  • the invention relates to RF (Radio Frequency) components with reduced multipactor effect and method for reducing the multipactor effect.
  • the multipactor effect is a phenomenon that occurs in RF devices in a vacuum, in that secondary electrons are excited and emitted by RF fields. This phenomenon can increase exponentially and lead to damage to the RF component up to the destruction of the same.
  • the component according to the invention with the characterizing features of claim 1 and the method according to the invention with the characterizing features of claim 6 have the advantage that the roughened surface reduces the secondary electron emission and thus the multipactor effect is reduced.
  • the Oberfumblee consists of silver.
  • the surface is anodized.
  • the roughened surface is vapor-deposited with a metal, in particular gold, in order to reduce the oxidation.
  • Fig. L a section through a first component with a
  • a first component 1 of an aluminum alloy is shown in section, the surface of which consists of silver 2, which is roughened with an aqueous etching solution.
  • a second component 3 of an aluminum alloy is shown in section, the surface 4 by anodization roughened and vaporized with a gold layer 5 to reduce the oxidation.
  • the roughening of the surface causes the multipactor effect to be reduced.

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention relates to a RF component having a reduced multipactor effect, and to a method for reducing the multipactor effect in RF components.

Description

Tesat-Spacecom GmbH & Co. KG; 71522 Backnang Tesat-Spacecom GmbH & Co. KG; 71522 Backnang
RF-Bauteil und deren Verfahren zur OberflächenbearbeitungRF component and its method for surface treatment
Beschreibungdescription
Die Erfindung betrifft RF(Radio-Frequenz) -Bauteile mit reduziertem Multipaktor-Effekt und Verfahren um den Multipaktor-Effekt zu reduzieren.The invention relates to RF (Radio Frequency) components with reduced multipactor effect and method for reducing the multipactor effect.
Der Multipaktor-Effekt ist ein Phänomen, dass bei RF-Bauteilen im Vakuum auftritt, indem Sekundärelektronen durch RF-Felder angeregt werden und emittieren. Dieses Phänomen kann expotentiell ansteigen und zu Schäden am RF-Bauteil führen bis hin zur Zerstörung desselben.The multipactor effect is a phenomenon that occurs in RF devices in a vacuum, in that secondary electrons are excited and emitted by RF fields. This phenomenon can increase exponentially and lead to damage to the RF component up to the destruction of the same.
Das erfindungsgemäße Bauteil mit den kennzeichnenden Merkmalen nach Anspruch 1 und das erfindungsgemäße Verfahren mit den kennzeichnenden Merkmalen nach Anspruch 6 haben den Vorteil, dass durch die aufgeraute Oberfläche die Sekundärelektronenemission reduziert und damit der Multipaktor- Effekt verringert wird.The component according to the invention with the characterizing features of claim 1 and the method according to the invention with the characterizing features of claim 6 have the advantage that the roughened surface reduces the secondary electron emission and thus the multipactor effect is reduced.
Nach einer vorteilhaften Ausgestaltung der Erfindung besteht die Oberfäche aus Silber. Nach einer weiteren vorteilhaften Ausgestaltung der Erfindung wird die Oberfläche eloxiert.According to an advantageous embodiment of the invention, the Oberfäche consists of silver. According to a further advantageous embodiment of the invention, the surface is anodized.
Nach einer zusätzlichen Ausgestaltung der Erfindung wird die aufgeraute Oberfläche mit einem Metall, insbesondere Gold, bedampft um die Oxidation zu verringern.According to an additional embodiment of the invention, the roughened surface is vapor-deposited with a metal, in particular gold, in order to reduce the oxidation.
Weitere Vorteile und vorteilhafte Ausgestaltungen der Erfindung sind der nachfolgenden Beispielbeschreibung, den Zeichnungen und den Ansprüchen entnehmbar.Further advantages and advantageous embodiments of the invention are the following example description, the drawings and claims removed.
Zeichnungendrawings
Ausführungsbeispiele der Erfindung sind in den Zeichnungen dargestellt und im Folgenden näher beschrieben. Es zeigen:Embodiments of the invention are illustrated in the drawings and described in more detail below. Show it:
Fig. l: einen Schnitt durch ein erstes Bauteil mit einerFig. L: a section through a first component with a
Silberoberfläche undSilver surface and
Fig.2: einen Schnitt durch ein zweites Bauteil mit einer2 shows a section through a second component with a
Goldschicht.Gold layer.
Beschreibung der AusführungsbeispieleDescription of the embodiments
In Fig. 1 ist ein erstes Bauteil 1 aus einer Alumiumlegierung im Schnitt dargestellt, dessen Oberfläche aus Silber 2 besteht, die mit einer wässrigen Ätzlösung aufgeraut wird.In Fig. 1, a first component 1 of an aluminum alloy is shown in section, the surface of which consists of silver 2, which is roughened with an aqueous etching solution.
In Fig. 2 ist ein zweites Bauteil 3 aus einer Alumiumlegierung im Schnitt dargestellt, dessen Oberfläche 4 durch Eloxierung aufgeraut wird und mit einer Goldschicht 5 bedampft wird, um die Oxidation zu veringern.In Fig. 2, a second component 3 of an aluminum alloy is shown in section, the surface 4 by anodization roughened and vaporized with a gold layer 5 to reduce the oxidation.
Die Aufrauung der Oberfläche bewirkt, dass der Multipaktor-Effekt reduziert wird.The roughening of the surface causes the multipactor effect to be reduced.
Alle in der Beschreibung, in den nachfolgenden Ansprüchen und in den Zeichnungen dargestellten Merkmale können sowohl einzeln als auch in beliebiger Kombination erfindungswesentlich sein. All features described in the description, in the following claims and in the drawings may be essential to the invention both individually and in any desired combination.

Claims

Tesat-Spacecom GmbH & Co. KG; 71522 BacknangRF-Bauteil und deren Verfahren zur OberflächenbearbeitungAnsprüche Tesat-Spacecom GmbH & Co. KG; 71522 BacknangRF component and its surface treatment methodsApprovals
1. Bauteil, insbesondere RF-Bauteil (1,3) zum Einsatz im Weltall, mit einer Oberfläche (2,4), dadurch gekennzeichnet, dass die Oberfläche (2,4) aufgeraut ist um die Sekundärelektronenemission zu reduzieren.1. component, in particular RF component (1.3) for use in space, with a surface (2,4), characterized in that the surface (2,4) is roughened to reduce the secondary electron emission.
2. Bauteil nach Anspruch 1, dadurch gekennzeichnet, dass das Bauteil (1,3) mindestens ein Teil umfasst, das aus einer Aluminiumlegierung besteht.2. Component according to claim 1, characterized in that the component (1,3) comprises at least one part which consists of an aluminum alloy.
3. Bauteil nach Anspruch 2, dadurch gekennzeichnet, dass das mindestens eine Teil eine aufgeraute Silberoberfläche (2) besitzt.3. Component according to claim 2, characterized in that the at least one part has a roughened silver surface (2).
4. Bauteil nach Anspruch 2, dadurch gekennzeichnet, dass mindestens eine Oberfläche (4) des mindestens einen Teils eloxiert ist.4. Component according to claim 2, characterized in that at least one surface (4) of the at least one part is anodized.
5. Bauteil nach Anspruch 4, dadurch gekennzeichnet, dass die mindestens eine eloxierte Oberfläche (4) mit einer leitenden Schicht (5), insbesondere eine Goldschicht, besitzt.5. Component according to claim 4, characterized in that the at least one anodized surface (4) with a conductive layer (5), in particular a gold layer possesses.
6. Verfahren zur Reduzierung der Sekundärelektronenemission bei Bauteilen (1,3), insbesondere bei RF-Bauteilen für das Weltall, dadurch gekennzeichnet, dass mindestens eine Oberfläche (2,4) mindestens eines Teils des Bauteils aufgeraut wird.6. A method for reducing the secondary electron emission in components (1,3), in particular in RF components for the universe, characterized in that at least one surface (2,4) of at least a portion of the component is roughened.
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, dass die mindestens eine Oberfläche (2) durch Ätzen aufgeraut wird.7. The method according to claim 6, characterized in that the at least one surface (2) is roughened by etching.
8. Verfahren nach Anspruch 7, dadurch gekennzeichnet, dass zum Aufrauen eine Ätzlösung, insbesondere HF+HNO3, in Wasser verwendet wird.8. The method according to claim 7, characterized in that for roughening an etching solution, in particular HF + HNO3, is used in water.
9. Verfahren nach einem der Ansprüche 6 bis 8, dadurch gekennzeichnet, dass die mindestens eine aufgeraute Oberfläche (2,4) mit Metall (5), insbesondere Gold, bedampft wird. 9. The method according to any one of claims 6 to 8, characterized in that the at least one roughened surface (2,4) with metal (5), in particular gold, is vapor-deposited.
PCT/DE2009/000367 2008-03-20 2009-03-20 Rf component and the method thereof for surface finishing WO2009115083A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112009001179T DE112009001179A5 (en) 2008-03-20 2009-03-20 RF component and its method for surface treatment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008015330 2008-03-20
DE102008015330.3 2008-03-20

Publications (2)

Publication Number Publication Date
WO2009115083A2 true WO2009115083A2 (en) 2009-09-24
WO2009115083A3 WO2009115083A3 (en) 2009-11-26

Family

ID=40991971

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/000367 WO2009115083A2 (en) 2008-03-20 2009-03-20 Rf component and the method thereof for surface finishing

Country Status (2)

Country Link
DE (1) DE112009001179A5 (en)
WO (1) WO2009115083A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016042192A1 (en) 2014-09-16 2016-03-24 Consejo Superior De Investigaciones Científicas (Csic) Anti-multipactor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB195964A (en) * 1922-04-08 1924-04-03 British Thomson Houston Co Ltd Improvements in and relating to electron discharge apparatus
JPS5595264A (en) * 1979-01-16 1980-07-19 Hamamatsu Tv Kk Photoelectron multiplier
EP0113907A1 (en) * 1982-12-21 1984-07-25 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Layer preventing disturbances created by secondary-electron emission, and manufacture of such a layer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB195964A (en) * 1922-04-08 1924-04-03 British Thomson Houston Co Ltd Improvements in and relating to electron discharge apparatus
JPS5595264A (en) * 1979-01-16 1980-07-19 Hamamatsu Tv Kk Photoelectron multiplier
EP0113907A1 (en) * 1982-12-21 1984-07-25 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Layer preventing disturbances created by secondary-electron emission, and manufacture of such a layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016042192A1 (en) 2014-09-16 2016-03-24 Consejo Superior De Investigaciones Científicas (Csic) Anti-multipactor device
US10724141B2 (en) 2014-09-16 2020-07-28 Consejo Superior De Investigaciones Cientificas (Csic) Anti-multipactor device

Also Published As

Publication number Publication date
DE112009001179A5 (en) 2011-02-17
WO2009115083A3 (en) 2009-11-26

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