WO2009101884A1 - Robinet-vanne - Google Patents

Robinet-vanne Download PDF

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Publication number
WO2009101884A1
WO2009101884A1 PCT/JP2009/051876 JP2009051876W WO2009101884A1 WO 2009101884 A1 WO2009101884 A1 WO 2009101884A1 JP 2009051876 W JP2009051876 W JP 2009051876W WO 2009101884 A1 WO2009101884 A1 WO 2009101884A1
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WO
WIPO (PCT)
Prior art keywords
heating element
valve plate
gate valve
valve
temperature
Prior art date
Application number
PCT/JP2009/051876
Other languages
English (en)
Japanese (ja)
Inventor
Mitsuaki Komino
Tatsuo Tokuhiro
Original Assignee
Eagle Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eagle Industry Co., Ltd. filed Critical Eagle Industry Co., Ltd.
Publication of WO2009101884A1 publication Critical patent/WO2009101884A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/0254—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor being operated by particular means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/025—Actuating devices; Operating means; Releasing devices electric; magnetic actuated by thermo-electric means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Definitions

  • the present invention relates to a gate valve suitable for being installed in a vacuum chamber of, for example, a semiconductor manufacturing apparatus or an FPD (Flat Panel Display) manufacturing apparatus, and in particular, can maintain a desired high-temperature state appropriately and has high reliability.
  • the gate valve is easy to maintain.
  • a wafer is placed in a processing chamber, and the wafer is exposed to a reaction gas or plasma in a high-temperature atmosphere, so that a desired film forming process or etching process is performed on the wafer.
  • a load lock chamber that adjusts the pressure for loading / unloading the wafer into / from the processing chamber
  • a transfer chamber equipped with a robot that transfers the wafer etc.
  • pipes for evacuating the interior of the chamber and supplying and exhausting a processing gas are disposed in each chamber and room.
  • a so-called gate valve is usually disposed in a partition portion of each space such as a processing chamber or an opening portion of a pipe connected to a space such as the processing chamber.
  • the processing gas and reaction by-product flowing through the chamber and piping of such a semiconductor device sublimate and change both phases of gas and solid depending on the relationship between pressure and temperature (sublimation curve), but from gas to solid.
  • sublimation changes, the by-product precipitates as a solid and adheres to the wall surface below the sublimation temperature such as in the chamber or exhaust pipe.
  • a large amount of deposits is not preferable because the piping may be blocked by by-products or may affect the process in the chamber.
  • the by-product is peeled off and adversely affects the wafer as particle contamination, which causes a decrease in yield.
  • the temperature of the chamber and piping is set to a relatively uniform high temperature state. It is necessary to maintain and manage this accurately. Similarly, it is necessary to maintain the gate valve disposed at the boundary of each chamber, piping, etc. at a high temperature.
  • a sheath is provided between flat metal members such as stainless steel and aluminum alloy as illustrated in FIG.
  • a method of directly embedding the heating element of the mold is used.
  • a counterbore is formed on the inner facing surface of a metal member such as stainless steel by casting or machining to secure an installation space for the heating element, and after placing the heating element there, a lid member is attached.
  • a method of incorporating a heating device into each component of a semiconductor manufacturing apparatus such as a gate valve is used.
  • the sheath type heating element is directly embedded in a metal block or the like, temperature uniformity cannot be ensured appropriately in the metal block or metal plate, Even if it tries to improve, there is a problem that adjustment cannot be made because the heating element is directly embedded. Moreover, even if an attempt is made to form a desired temperature distribution on such a metal block or metal plate to be heated, the formation of such a temperature distribution is substantially due to the fact that the heating element is a linear heating element and installation conditions. There is a problem that it is impossible and strict temperature control of the object to be heated is not possible. There is also a problem that the installation of the heating element is troublesome and causes an increase in cost.
  • the present invention has been made in view of such problems, and its purpose is to change the temperature distribution and the temperature rise condition according to the heating location, or to set an arbitrary temperature gradient. At the same time, it is possible to achieve uniform heat generation with high accuracy, reduce the risk of having to stop the equipment and lines in the event of failure, and make repair work easier and repair costs It is to provide a gate valve that can be made inexpensive.
  • a gate valve of the present invention includes a valve body that forms a desired opening, a valve plate that has a sealing surface that seals and closes the opening formed by the valve body, and the valve body. And an actuator for driving the valve plate so as to open and close the formed opening by the valve plate, wherein the valve plate accommodates a heating element in an accommodating member and receives a terminal of the heating element. It has a plurality of derived heating element modules, a substrate on which the plurality of heating element modules are installed, and a wiring part that supplies power to the plurality of heating element modules via the terminals.
  • the base material of the valve plate is constituted by two plate-like members joined by screws or the like so that a concave portion (sealed space) is formed on the opposing surface, and the concave portion (sealed space) has the above-mentioned
  • a plurality of heating element modules are installed and accommodated.
  • At least one surface of the outer surface of the plate-like member is formed as a seal surface that seals the opening in close contact with the opening of the valve body.
  • the gate valve having such a configuration, since the valve plate is directly heated by the plurality of heating element modules, the valve plate itself can be appropriately heated. As a result, the gate valve, the passage through the gate valve opening and the vicinity thereof can be appropriately heated and maintained at a desired high temperature state, and precipitation of reaction by-products in the vicinity of the gate valve can be appropriately prevented. As a result, the treatment process can be carried out stably and appropriately. In addition, the number of times the reaction by-product is cleaned can be reduced, which can contribute to an improvement in the operating rate of the apparatus.
  • the gate valve of the present invention is provided with a plurality of heating element modules on the valve plate, desired temperature conditions can be set for the valve plate and the gate valve by controlling them independently. For example, it is possible to perform heating locally, change the temperature raising condition depending on the location, or set a temperature gradient. Moreover, this can be realized with high accuracy for making the heat generation uniform.
  • the heating element module is only necessary to replace the failed heating element module, so that the repair work is easy and the repair cost can be reduced. Further, even if the entire apparatus is large, the heating element module is subdivided into small parts, so that repair work and installation work are also facilitated in this respect. As a result, the cost of the gate valve or the entire apparatus can be reduced overall.
  • the plurality of heating element modules of the valve plate are grouped into one or a plurality of predetermined groups, and the plurality of heating elements are arranged in the wiring portion.
  • the module is characterized in that wiring is formed so as to supply power for each of the groups.
  • the gate valve having such a configuration, electric power can be supplied to each of the plurality of heating element modules arranged on the valve plate for each one or a plurality of predetermined groups.
  • the valve can be set to a desired temperature condition with high accuracy. For example, it is possible to heat a specific region, change the temperature raising condition according to the region, or set a temperature gradient.
  • the gate valve of the present invention supplies power to each of the groups via the wiring portion to the plurality of heating element modules so that the valve plate has a desired temperature distribution.
  • a control unit for controlling heat generation of the plurality of heating element modules is also preferably, the gate valve of the present invention.
  • desired power is appropriately supplied to one or a plurality of predetermined groups of the plurality of heating element modules arranged on the valve plate, as described above. It is possible to provide a valve plate having a control unit that can set the valve plate and the gate valve to desired temperature conditions with high accuracy.
  • the gate valve of the present invention further includes a sensor for detecting a temperature at an arbitrary position of the valve plate.
  • the gate valve having such a configuration, heat generation can be controlled after a desired location is detected by the sensor. Therefore, the gate valve, the passage passing through the opening of the gate valve, and the vicinity thereof can be more appropriately provided. They can be heated and properly maintained at the desired high temperature.
  • the gate valve of the present invention is characterized in that it further includes a wireless transmission unit that wirelessly transmits an output signal from the sensor to the outside.
  • the gate valve having such a configuration, it is not necessary to lead out an output lead wire from the sensor to the outside, so that the wiring of the connection portion with the outside of the gate valve or the configuration of its peripheral portion can be simplified. .
  • This is particularly effective when a large number of sensors are arranged on the valve plate or when there are a large number of wires for the heating element module.
  • FIG. 1 is a diagram showing a schematic configuration of a gate valve according to an embodiment of the present invention, and shows a state in which the gate valve is opened.
  • FIG. 2 is a view showing a state where the gate valve shown in FIG. 1 is closed.
  • FIG. 3 is a view showing the configuration of the valve plate of the gate valve shown in FIG. 4A is an overall perspective view showing the configuration of the heating element module of the valve plate shown in FIG. 4B is a diagram showing the configuration of the heating element module of the valve plate shown in FIG. 2, and is a cross-sectional view taken along the line AA in FIG. 4A.
  • 4C is a diagram showing the configuration of the heating element module of the valve plate shown in FIG. 2, and is a cross-sectional view taken along the line BB of FIG.
  • FIG. 5 is a view showing another configuration of the gate valve according to the present invention.
  • FIG. 6 is a diagram showing a general configuration of the heating device according to the present invention.
  • FIG. 7 is a diagram illustrating an example of a conventional heating device used in a semiconductor manufacturing apparatus.
  • the gate valve is used in a semiconductor manufacturing apparatus such as a CVD apparatus, an etching apparatus, or a plasma processing apparatus, between chambers as processing chambers, between a chamber and a load lock chamber, or a load lock chamber.
  • a semiconductor manufacturing apparatus such as a CVD apparatus, an etching apparatus, or a plasma processing apparatus
  • chambers as processing chambers
  • load lock chamber between a chamber and a load lock chamber
  • load lock chamber Suitable for partitioning each space in the wafer transfer path between the chamber and the transfer chamber, or opening and closing an opening such as a supply / exhaust pipe connected to the chamber, load lock chamber or transfer chamber Therefore, the present invention will be described with reference to a suitable gate valve installed for the purpose.
  • FIGS. 1 and 2 are diagrams schematically showing the overall configuration of the gate valve 1
  • FIG. 1 is a diagram showing a state in which the gate valve 1 is opened
  • FIG. 2 is a diagram in which the gate valve 1 is closed.
  • the gate valve 1 includes a valve body 10, a valve plate 20, and an actuator 50.
  • the valve body 10 has a through-hole 12 penetrating the front and back so as to form a passage 11 (virtually indicated by a two-dot chain line in FIGS. 1 and 2) serving as a wafer conveyance path or a gas flow path.
  • a passage 11 (virtually indicated by a two-dot chain line in FIGS. 1 and 2) serving as a wafer conveyance path or a gas flow path.
  • it is a box-shaped member having an internal space 13 in which the valve plate 20 is movably accommodated.
  • the valve plate 20 is supported by a support rod 21 and is driven by an actuator 50 through the support rod 21 to open and close the through hole 12 of the valve body 10.
  • the valve plate 20 moves between the valve opening position shown in FIG. 1 and the valve closing position shown in FIG. 2 in the internal space 13 of the valve body 10.
  • Sealing surfaces 22 are formed on both the front and back surfaces of the valve plate 20 or one of the surfaces, and after the valve plate 20 is moved to the valve closing position, the sealing surface 22 is pressed against the through hole 12 of the valve body 10.
  • the through hole 12 of the valve body 10 that constitutes the wafer conveyance path or the flow path of gas or the like is hermetically closed.
  • valve plate 20 When the valve plate 20 has the sealing surface 22 formed only on one surface, the valve plate 20 is moved from the open position to the closed position in a direction perpendicular to the passage 11, and then further the passage 11. Is driven in the direction parallel to the horizontal direction (horizontal direction) and pressed toward the through hole 12 of the valve body 10. As a result, the sealing surface 22 of the valve plate 20 is pressed against the peripheral edge of the through hole 12 of the valve body 10.
  • valve plate 20 When the valve plate 20 has sealing surfaces 22 formed on both front and back surfaces, for example, the back surfaces of the sealing surfaces 22 on the front and back surfaces are connected to each other by bellows, etc. 11 is made movable in the outward or inward direction parallel to the direction 11, and is moved in the outward or inward direction by an air cylinder or the like, whereby the front and back sealing surfaces 22 are respectively connected to the through holes 12 of the valve body 10. Pressed against or separated from. Although these mechanisms are not shown in FIGS. 1 and 2, the valve plate 20 opens and closes the through hole 12 of the valve body 10 with such a configuration, for example.
  • a heating device is embedded in the valve plate 20. This will be described in detail later.
  • Actuator 50 drives valve plate 20 through support rod 21 as described above.
  • valve plate 20 in which the heating device is embedded will be described with reference to FIGS. 3, 4A, 4B, and 4C.
  • the valve plate 20 described here does not include the special mechanism as described above for pressing the sealing surface 22 against the through-hole 12, as shown in FIG. 3. It is assumed that the member has a shape fixed to the shape.
  • the valve plate 20 includes a support rod 21, first and second outer wall members 23 and 24, a plurality of heating element modules 30, and a temperature sensor 40.
  • the support rod 21 is interposed between the body of the valve plate 20 and the actuator 50, supports the valve plate 20 inside the valve body 10, and moves the valve plate 20. To communicate. Further, the support rod 21 has a hollow region inside, and the wiring 38 of the heating element module 30 and the lead wire 41 of the temperature sensor 40 described later are led out of the valve plate 20 through this region.
  • the first and second outer wall members 23 and 24 are both flat plate-like members, and form the main body of the valve plate 20 by being assembled to face each other.
  • One or both outer surfaces of the first and second outer wall members 23 and 24 are formed on the seal surface 22 that seals and closes the through hole 12 of the valve body 10 as described above.
  • the opposing surfaces of the first and second outer wall members 23 and 24 have a space for accommodating the heating element module 30 and the temperature sensor 40 in the state where the first and second outer wall members 23 and 24 are joined.
  • One or both of them are machined into a concave shape so as to be formed.
  • the 1st and 2nd outer wall members 23 and 24 are joined in the peripheral part by welding or screwing.
  • At least one of the first and second outer wall members 23 and 24 is used as a base material on which the heating element module 30 is installed. That is, a plurality of heating element modules 30 to be described later are fixedly installed on the inner surfaces (opposing surfaces) of the first and second outer wall members 23 and 24 that are base materials.
  • the support rod 21 and the first and second outer wall members 23 and 24 are made of, for example, aluminum alloy steel or stainless steel. In particular, in terms of corrosion resistance, it is preferable to form with stainless steel or the like. Further, the first and second outer wall members 23 and 24 as the base material on which the heating element module 30 is fixedly installed may use a material having high thermal conductivity such as steel or aluminum alloy.
  • the heating element module 30 is a member in which the heating element 33 is accommodated in the accommodating member (31, 32) and the terminal is led out.
  • the heating element module 30 is relatively small in size and combined with a plurality of heating elements having desired conditions. It is a member that can be freely configured.
  • FIGS. 4A to 4C are diagrams showing the configuration of the heating element module 30, wherein FIG. 4A is a perspective view of the entire heating element module 30, and FIG. 4B is a cross-sectional view taken along line AA in FIG. 4A. 4C is a cross-sectional view taken along the line BB of FIG. 4A.
  • the heating element module 30 includes first and second housing members 31, 32, a heating element 33, and heating element terminals 34, 35.
  • the first and second housing members 31 and 32 are flat members that house the heating element 33 and form the heating element module 30 main body. As shown in FIG. 4B, the first and second housing members 31 and 32 house the heating element 33 in the substantially central portion of the facing surface, and are integrated by welding at the peripheral portion (welded portion 36). Yes. As a result, the heating element 33 is sealed and accommodated between the first and second accommodation members 31 and 32.
  • the first and second housing members 31 and 32 are made of, for example, aluminum alloy steel or copper alloy steel. In particular, in terms of high thermal conductivity, it is preferable to form with a copper alloy or the like.
  • the heating element 33 may be any heating element.
  • a sheet heating element such as a mica heater, a ceramic heater, or a silicon rubber heater, or an outer periphery of a resistance heating wire such as nickel, chromium, or stainless steel is coated with glass or the like. It is preferable to use a material covered with a material.
  • the heating element terminals 34 and 35 pass through the welded portion 36 and supply the first and second accommodation members 31 in order to supply power to the heating elements 33 accommodated in the first and second accommodation members 31 and 32.
  • 32 is a terminal led to the outside.
  • the valve plate 20 has a plurality of heating element modules 30 having such a configuration. It is preferable that the configuration and the electrical or exothermic characteristics of each heating element module 30 are the same, but there may be different types depending on the application and installation location.
  • the valve plate 20 of this embodiment has five heating element modules 30 having such a configuration as shown in the figure.
  • the plurality of heating element modules 30 housed in the valve plate 20 have their heating element terminals 34 and 35 connected to the wiring of the valve plate 20 (not shown) so that electric power can be supplied from the outside.
  • the electrical connection form of the plurality of heating element modules 30, that is, the connection method of the terminals 34 and 35 is arbitrary. For example, all may be connected in series or in parallel. Alternatively, a configuration may be employed in which all the individual wirings (wirings from the individual terminals) for all the heating element modules 30 are led out to the outside without being connected to each other. With such a configuration, the heat generation in the plurality of heating element modules 30 can be individually and independently controlled.
  • the plurality of heating element modules 30 may be divided into an arbitrary number of groups, and the power supply terminals for each group may be led out to the outside. That is, the heat generation from the heating element module 30 may be controlled independently between the groups in units of groups.
  • the temperature sensor 40 is a means for measuring the temperature of a desired portion of the valve plate 20 and is, for example, a thermocouple or a platinum resistance thermometer.
  • the valve plate 20 has two temperature sensors 40, but any number of temperature sensors 40 may be installed at any location.
  • Output wires (lead wires) 41 from the respective temperature sensors 40 are led out to the outside through the inner hollow portion of the support rod 21 and inputted to an external temperature control device (not shown).
  • the temperature of the heating element module 30 is changed so that the valve plate 20 has a desired temperature or temperature distribution, in other words, each heating element module 30. To control the power supplied to the.
  • a plurality of heating element modules 30 are arranged inside the valve plate 20 to heat the valve plate 20, so that the valve plate 20 itself is appropriately heated. Can do.
  • the gate valve 1 and the passage 11 passing through the through hole 12 of the gate valve 1 and the vicinity thereof can be appropriately heated and maintained at a desired high temperature state, and reaction by-products are deposited and deposited in the vicinity of the gate valve. Therefore, the semiconductor manufacturing process can be carried out stably and appropriately.
  • the number of times the reaction by-product is cleaned can be reduced, which can contribute to an improvement in the operating rate of the apparatus.
  • the valve plate 20 since the valve plate 20 includes a plurality of heating element modules 30, the temperature of the entire gate valve decreases even if any heating element module fails. This makes it possible to avoid problems such as making a mistake and to reduce the risk that the apparatus must be stopped urgently. That is, the reliability of the gate valve 1 or the entire semiconductor manufacturing apparatus can be substantially improved by distributing the probability of failure.
  • the heating element module even if a failure occurs in the heating element module, it is only necessary to replace the failed heating element module 30, so that the repair work is easy and the repair cost can be reduced. Further, even if the entire apparatus is large, the heating element module is subdivided into small parts, so that repair work and installation work are also facilitated in this respect. As a result, the cost of the gate valve or the entire apparatus can be reduced overall.
  • the heating element module wiring 38 does not have such a configuration, but the plurality of heating element modules 30 of the valve plate 20 are controlled independently or for each predetermined group.
  • desired temperature conditions can be set for the valve plate 20 and the gate valve 1.
  • this can be realized with high accuracy for making the heat generation uniform.
  • the gate valve 1 of this embodiment measures the temperature of the predetermined location inside the valve plate 20 with the temperature sensor 40, the valve plate 20 can be heated more appropriately, The periphery can be appropriately maintained at a desired high temperature state.
  • the output signal of the temperature sensor 40 embedded in the valve plate 20 is led out of the valve plate 20 via the lead wire 41 and input to a temperature control device (not shown).
  • the sensor output signal may be transmitted wirelessly.
  • FIG. 5 is a diagram showing an embodiment of the valve plate 60 configured to transmit the heat generation state of the heating element module 30 to the control device using a wireless transmitter.
  • the valve plate 60 includes a data collection / transmission unit (wireless transmission unit) 61 in the support rod 21, and output lead wires 41 from the temperature sensors 40 are connected to the data collection / transmission unit. 61 is connected.
  • the data collection / transmission unit 61 generates a signal indicating the output from each temperature sensor 40 and transmits the signal to the temperature control device 70 wirelessly.
  • the temperature control device 70 includes a receiving unit 71 that receives a signal from the data collection / transmission unit 61 of the valve plate 60 and, based on this signal, the valve plate 60 selects a desired value.
  • the temperature of the heating element module 30, in other words, the power supplied to each heating element module 30 is controlled so that the temperature or temperature distribution is obtained.
  • the data collection / transmission unit 61 temporarily stores, for example, an input unit that receives a sensor output, an A / D conversion unit that performs A / D conversion on the input signal, and an obtained signal. And a transmission unit that wirelessly transmits a signal.
  • a configuration may be appropriately realized by software, for example, by a circuit having a microcomputer or the like.
  • the data collection / transmission unit 61 is installed in the support rod 21, but may be installed inside the outer wall members 23, 24, that is, inside the main body portion of the valve plate 60.
  • valve plate 60 In the valve plate 60, the configuration and functions of the heating element module 30, the outer wall members 23 and 24, the support rod 21, the temperature sensor 40, the temperature sensor lead wire 41, the heating element module wiring 38, and the like have been described above. The form is the same.
  • valve plate 60 having such a configuration, there is no need to lead the lead wire 41 from the temperature sensor 40 to the outside via the support rod 21, so that the wiring inside the support rod 21 or the actuator side end or the
  • the configuration of the peripheral part can be simplified. This is particularly effective when a large number of temperature sensors 40 are disposed on the valve plate or when the number of heating element modules 30 that are controlled independently is large (when the number of heating element module wires 38 is large).
  • FIG. 6 is a diagram showing a configuration of the heating device 2.
  • the heating device 2 includes first and second outer wall members 64 and 65, a plurality of heating element modules 30, wirings 68, and terminals 69.
  • the first and second outer wall members 64 and 65 are flat members, respectively, and are assembled to face each other to form the main body of the heating device 2. One or both opposing surfaces of the first and second outer wall members 64 and 65 are processed into a concave shape so that a space for accommodating the heating element module 30 and the like is formed inside when the first and second outer wall members 64 and 65 are joined. It is joined at the periphery by welding or screwing.
  • the configuration of the heating element module 30 is the same as that of the heating element module 30 of the valve plate 20 of the gate valve 1 described above.
  • One of the first and second outer wall members 64 and 65 is used as a base material on which the heating element module 30 is installed, and an arbitrary number of heating element modules 30 are fixedly installed in an arbitrary arrangement as shown in the figure.
  • the Each heating element module 30 is grouped and wired in a desired form by wiring 68. Finally, it is led out through one or more sets of terminals 69 so that power can be supplied from the outside.
  • the heating device 2 may also be provided with a temperature sensor at an arbitrary location so that the heat generation in the heating element module 30 is feedback-controlled.
  • heating is performed by a plurality of heating element modules, and power is supplied to each of the plurality of heating element modules for each one or a plurality of predetermined groups. Therefore, it is possible to heat the surrounding heating target under a desired temperature condition. For example, heating can be performed under conditions such as heating a specific region, changing a temperature raising condition depending on the region, or setting a temperature gradient.
  • the heating element module 30 is directly fixed and installed on the outer wall member of the valve plate 20 or the outer wall member of the heating device, but is mounted on a member such as a substrate or a flexible substrate. It may be configured to be accommodated and installed in the valve plate 20 or the heating device 2 later.
  • the wiring form for the plurality of heating element modules 30 may be performed by lead wires, or by a wiring pattern formed on the outer wall member or a wiring pattern formed on a mounting member such as the above-described substrate. Also good.
  • the present invention can be applied to a semiconductor manufacturing apparatus such as a CVD apparatus, an etching apparatus, or a plasma processing apparatus, an FPD manufacturing apparatus, and any other apparatus that requires heating, heat insulation, maintenance of temperature conditions, and the like.
  • a semiconductor manufacturing apparatus such as a CVD apparatus, an etching apparatus, or a plasma processing apparatus, an FPD manufacturing apparatus, and any other apparatus that requires heating, heat insulation, maintenance of temperature conditions, and the like.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Valves (AREA)
  • Sliding Valves (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

L'invention porte sur un robinet-vanne qui peut régler une distribution de température et une condition d'élévation de température de façon arbitraire ; peut générer de la chaleur homogène extrêmement précise ; peut réduire les risques en cas de défaillance ; et peut être aisément réparé. Le robinet-vanne comporte une plaque de vanne (20) équipée d'une pluralité de modules exothermiques (30) pour chauffer la plaque de vanne (20). Les modules exothermiques (30) sont des éléments qui scellent de façon étanche des éléments chauffants individuellement dans des éléments de boîtier. La régulation de température peut être réalisée au niveau de l'unité des modules exothermiques (30). Si le robinet-vanne tombe en panne, un seul module exothermique (30) peut être remplacé. De plus, cette défaillance a peu d'effet sur le tout, ce qui diminue le risque.
PCT/JP2009/051876 2008-02-13 2009-02-04 Robinet-vanne WO2009101884A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-031558 2008-02-13
JP2008031558A JP2011102595A (ja) 2008-02-13 2008-02-13 ゲートバルブ

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WO2009101884A1 true WO2009101884A1 (fr) 2009-08-20

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JP7313169B2 (ja) * 2019-03-19 2023-07-24 株式会社キッツエスシーティー 真空ベローズホットバルブ
CN112576770B (zh) * 2020-11-25 2022-08-23 威亿信(北京)工程技术有限公司 地埋式闸板阀

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