JP2011102595A - ゲートバルブ - Google Patents

ゲートバルブ Download PDF

Info

Publication number
JP2011102595A
JP2011102595A JP2008031558A JP2008031558A JP2011102595A JP 2011102595 A JP2011102595 A JP 2011102595A JP 2008031558 A JP2008031558 A JP 2008031558A JP 2008031558 A JP2008031558 A JP 2008031558A JP 2011102595 A JP2011102595 A JP 2011102595A
Authority
JP
Japan
Prior art keywords
heating element
valve plate
gate valve
valve
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008031558A
Other languages
English (en)
Japanese (ja)
Inventor
Mitsuaki Komino
光明 小美野
Tatsuro Tokuhiro
達郎 徳弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eagle Industry Co Ltd
Original Assignee
Eagle Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eagle Industry Co Ltd filed Critical Eagle Industry Co Ltd
Priority to JP2008031558A priority Critical patent/JP2011102595A/ja
Priority to TW98103456A priority patent/TW200949113A/zh
Priority to PCT/JP2009/051876 priority patent/WO2009101884A1/fr
Publication of JP2011102595A publication Critical patent/JP2011102595A/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/0254—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor being operated by particular means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/025—Actuating devices; Operating means; Releasing devices electric; magnetic actuated by thermo-electric means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Valves (AREA)
  • Sliding Valves (AREA)
  • Drying Of Semiconductors (AREA)
JP2008031558A 2008-02-13 2008-02-13 ゲートバルブ Pending JP2011102595A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008031558A JP2011102595A (ja) 2008-02-13 2008-02-13 ゲートバルブ
TW98103456A TW200949113A (en) 2008-02-13 2009-02-04 Gate valve
PCT/JP2009/051876 WO2009101884A1 (fr) 2008-02-13 2009-02-04 Robinet-vanne

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008031558A JP2011102595A (ja) 2008-02-13 2008-02-13 ゲートバルブ

Publications (1)

Publication Number Publication Date
JP2011102595A true JP2011102595A (ja) 2011-05-26

Family

ID=40956914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008031558A Pending JP2011102595A (ja) 2008-02-13 2008-02-13 ゲートバルブ

Country Status (3)

Country Link
JP (1) JP2011102595A (fr)
TW (1) TW200949113A (fr)
WO (1) WO2009101884A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020525719A (ja) * 2017-06-30 2020-08-27 バット ホールディング アーゲー 温度センサを備えた真空弁
JP2020153422A (ja) * 2019-03-19 2020-09-24 株式会社キッツエスシーティー 真空ベローズホットバルブ

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11031252B2 (en) 2016-11-30 2021-06-08 Taiwan Semiconductor Manufacturing Compant, Ltd. Heat shield for chamber door and devices manufactured using same
CN112576770B (zh) * 2020-11-25 2022-08-23 威亿信(北京)工程技术有限公司 地埋式闸板阀

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08278811A (ja) * 1995-04-05 1996-10-22 Toshiba Corp 監視システム
JP3366542B2 (ja) * 1996-12-25 2003-01-14 株式会社キッツエスシーティー ゲートバルブ
JP3012836B1 (ja) * 1998-09-21 2000-02-28 入江工研株式会社 ゲートバルブの加熱装置
JP2001004505A (ja) * 1999-06-22 2001-01-12 Sumitomo Metal Ind Ltd ゲートバルブ，それを備える試料処理装置及び試料処理方法
JP4082401B2 (ja) * 2004-10-01 2008-04-30 Ｓｍｃ株式会社 真空流量調整弁
JP2007309920A (ja) * 2006-04-18 2007-11-29 Yokogawa Electric Corp 穀物用温度計

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020525719A (ja) * 2017-06-30 2020-08-27 バット ホールディング アーゲー 温度センサを備えた真空弁
JP7309621B2 (ja) 2017-06-30 2023-07-18 バット ホールディング アーゲー 温度センサを備えた真空弁
JP2020153422A (ja) * 2019-03-19 2020-09-24 株式会社キッツエスシーティー 真空ベローズホットバルブ
CN111720621A (zh) * 2019-03-19 2020-09-29 株式会社开滋Sct 真空波纹管热阀
JP7313169B2 (ja) 2019-03-19 2023-07-24 株式会社キッツエスシーティー 真空ベローズホットバルブ
TWI833897B (zh) * 2019-03-19 2024-03-01 日商開滋Ｓｃｔ股份有限公司 真空波紋管熱閥
CN111720621B (zh) * 2019-03-19 2024-03-26 株式会社开滋Sct 真空波纹管热阀

Also Published As

Publication number Publication date
WO2009101884A1 (fr) 2009-08-20
TW200949113A (en) 2009-12-01

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