WO2009078415A1 - X-ray examining apparatus and method - Google Patents

X-ray examining apparatus and method Download PDF

Info

Publication number
WO2009078415A1
WO2009078415A1 PCT/JP2008/072886 JP2008072886W WO2009078415A1 WO 2009078415 A1 WO2009078415 A1 WO 2009078415A1 JP 2008072886 W JP2008072886 W JP 2008072886W WO 2009078415 A1 WO2009078415 A1 WO 2009078415A1
Authority
WO
WIPO (PCT)
Prior art keywords
ray
imaging surface
work
examining apparatus
ray source
Prior art date
Application number
PCT/JP2008/072886
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuhito Koizumi
Tatsuro Wakamatsu
Original Assignee
Uni-Hite System Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uni-Hite System Corporation filed Critical Uni-Hite System Corporation
Priority to JP2009546271A priority Critical patent/JPWO2009078415A1/en
Publication of WO2009078415A1 publication Critical patent/WO2009078415A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/044—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis

Abstract

An X-ray examining apparatus enabling quick and simple examination and moreover instantaneous close examination if necessary. The X-ray examining apparatus comprises an X-ray source having a cone-shaped irradiation region, a holding mechanism for holding a work to be examined and an X-ray camera having a flat imaging surface. The X-ray examining apparatus further comprises a mechanism in which the reference surface of the work and the imaging surface arranged parallel to each other, the optical axis of the X-rays radiated from the X-ray source is tilted with respect to the reference surface of the work, the x-rays obliquely fall on the imaging surface, either the work or the X-ray source and the X-ray camera are rotated around the center axis of the apparatus on a circle while the arrangement relation among the X-ray source, the holding mechanism, and the X-ray camera is kept. The X-ray examining apparatus still further comprises an imaging surface rotating mechanism for rotating the imaging surface around the center normal (the center axis of the imaging surface) or freely setting the imaging surface according to a desired capturing angle at which the projection data is acquired. The imaging surface rotating mechanism is operable while constantly keeping the imaging surfacein a predetermined orientation with respect to the center axis.
PCT/JP2008/072886 2007-12-17 2008-12-16 X-ray examining apparatus and method WO2009078415A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009546271A JPWO2009078415A1 (en) 2007-12-17 2008-12-16 X-ray inspection apparatus and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007324831 2007-12-17
JP2007-324831 2007-12-17

Publications (1)

Publication Number Publication Date
WO2009078415A1 true WO2009078415A1 (en) 2009-06-25

Family

ID=40795530

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072886 WO2009078415A1 (en) 2007-12-17 2008-12-16 X-ray examining apparatus and method

Country Status (2)

Country Link
JP (1) JPWO2009078415A1 (en)
WO (1) WO2009078415A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2206465A1 (en) * 2009-01-08 2010-07-14 Omron Co., Ltd. Examination method, examination apparatus and examination program
WO2011089658A1 (en) * 2010-01-19 2011-07-28 株式会社サキコーポレーション Method for correcting inspecting apparatus using correcting jig, and inspecting apparatus having correcting jig mounted thereon
CN102706909A (en) * 2012-06-17 2012-10-03 无锡市优耐特石化装备有限公司 Circumferential detection device for circular seam of thin-walled container
WO2013021413A1 (en) * 2011-08-05 2013-02-14 株式会社島津製作所 Radiography device
WO2013039032A1 (en) * 2011-09-14 2013-03-21 オムロン株式会社 X-ray examination device, x-ray examination device control method, program for controlling x-ray examination device, and storage medium for storing program
WO2013105194A1 (en) * 2012-01-12 2013-07-18 ヤマハ発動機株式会社 Complex inspection device for printed-circuit board
CN104024836A (en) * 2011-12-22 2014-09-03 Sec株式会社 Automatic X-ray inspection apparatus for SMT inline process
JP2014190702A (en) * 2013-03-26 2014-10-06 Nec Corp Inspection device, inspection method, and inspection program
KR101467478B1 (en) * 2013-09-13 2014-12-01 (주)시스트 Apparatus and method for scanning circuit elements using x-ray
KR20160006054A (en) * 2014-07-08 2016-01-18 (주)자비스 Method for Inspecting Compact Parts Formed on Substrate in Defect Inspection
JP2016533481A (en) * 2013-10-21 2016-10-27 エクスロン インターナショナル ゲゼルシャフト ミット ベシュレンクテル ハフツングＹｘｌｏｎ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｇｍｂｈ X-ray inspection system and method for rotating a test object using such an X-ray inspection system
GB2558605A (en) * 2017-01-09 2018-07-18 Caresoft Global Holdings Ltd Method
WO2019077950A1 (en) * 2017-10-17 2019-04-25 日本装置開発株式会社 X-ray inspection device
JP2020128890A (en) * 2019-02-07 2020-08-27 リョーエイ株式会社 Tilted x-ray inspection method, tilted x-ray inspection apparatus and its accuracy evaluation method

Citations (12)

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JPH05503652A (en) * 1990-08-30 1993-06-17 フォア　ピーアイ　システムズ　コーポレイション Multi-orbital tomography system
JPH05157708A (en) * 1991-12-10 1993-06-25 Toshiba Corp Lamino graph
JPH08327563A (en) * 1995-06-02 1996-12-13 Toshiba Corp Laminograph
JPH10104174A (en) * 1996-09-13 1998-04-24 Hewlett Packard Co <Hp> Electric connection inspection apparatus
JP2000329710A (en) * 1999-05-17 2000-11-30 Shimadzu Corp Radiation tomographic apparatus and object inspection apparatus using it
JP2002139315A (en) * 2000-09-07 2002-05-17 Daimlerchrysler Ag Method for nondestructive wall thickness inspecting of structure part
JP2002296204A (en) * 2001-03-30 2002-10-09 Matsushita Electric Ind Co Ltd X-ray inspection device and method
JP2003344316A (en) * 2002-05-27 2003-12-03 National Institute Of Advanced Industrial & Technology Reconstitution method of inclined three-dimensional x- ray ct image
JP2004515762A (en) * 2000-12-06 2004-05-27 テラダイン・インコーポレーテッド Eccentric fault synthesis
JP2004212200A (en) * 2002-12-27 2004-07-29 Akira Teraoka X-ray inspection system, and method of using x-ray inspection system
JP2004333310A (en) * 2003-05-08 2004-11-25 Hitachi Kokusai Electric Inc X-ray ct scanner
JP2005121633A (en) * 2003-08-27 2005-05-12 Matsushita Electric Ind Co Ltd X-ray inspection system and x-ray inspection method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05503652A (en) * 1990-08-30 1993-06-17 フォア　ピーアイ　システムズ　コーポレイション Multi-orbital tomography system
JPH05157708A (en) * 1991-12-10 1993-06-25 Toshiba Corp Lamino graph
JPH08327563A (en) * 1995-06-02 1996-12-13 Toshiba Corp Laminograph
JPH10104174A (en) * 1996-09-13 1998-04-24 Hewlett Packard Co <Hp> Electric connection inspection apparatus
JP2000329710A (en) * 1999-05-17 2000-11-30 Shimadzu Corp Radiation tomographic apparatus and object inspection apparatus using it
JP2002139315A (en) * 2000-09-07 2002-05-17 Daimlerchrysler Ag Method for nondestructive wall thickness inspecting of structure part
JP2004515762A (en) * 2000-12-06 2004-05-27 テラダイン・インコーポレーテッド Eccentric fault synthesis
JP2002296204A (en) * 2001-03-30 2002-10-09 Matsushita Electric Ind Co Ltd X-ray inspection device and method
JP2003344316A (en) * 2002-05-27 2003-12-03 National Institute Of Advanced Industrial & Technology Reconstitution method of inclined three-dimensional x- ray ct image
JP2004212200A (en) * 2002-12-27 2004-07-29 Akira Teraoka X-ray inspection system, and method of using x-ray inspection system
JP2004333310A (en) * 2003-05-08 2004-11-25 Hitachi Kokusai Electric Inc X-ray ct scanner
JP2005121633A (en) * 2003-08-27 2005-05-12 Matsushita Electric Ind Co Ltd X-ray inspection system and x-ray inspection method

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8509512B2 (en) 2009-01-08 2013-08-13 Omron Corporation Examination method, examination apparatus and examination program
EP2206465A1 (en) * 2009-01-08 2010-07-14 Omron Co., Ltd. Examination method, examination apparatus and examination program
WO2011089658A1 (en) * 2010-01-19 2011-07-28 株式会社サキコーポレーション Method for correcting inspecting apparatus using correcting jig, and inspecting apparatus having correcting jig mounted thereon
JPWO2013021413A1 (en) * 2011-08-05 2015-03-05 株式会社島津製作所 Radiography equipment
WO2013021413A1 (en) * 2011-08-05 2013-02-14 株式会社島津製作所 Radiography device
CN103733053A (en) * 2011-08-05 2014-04-16 株式会社岛津制作所 Radiography device
WO2013039032A1 (en) * 2011-09-14 2013-03-21 オムロン株式会社 X-ray examination device, x-ray examination device control method, program for controlling x-ray examination device, and storage medium for storing program
US20150003578A1 (en) * 2011-12-22 2015-01-01 Sec Co., Ltd. Automatic x-ray inspection apparatus for smt inline process
CN104024836A (en) * 2011-12-22 2014-09-03 Sec株式会社 Automatic X-ray inspection apparatus for SMT inline process
EP2796862A4 (en) * 2011-12-22 2015-08-12 Sec Co Ltd Automatic x-ray inspection apparatus for smt inline process
US10330611B2 (en) * 2011-12-22 2019-06-25 Sec Co., Ltd. Automatic X-ray inspection apparatus for SMT inline process
JP2013142678A (en) * 2012-01-12 2013-07-22 Yamaha Motor Co Ltd Composite inspection apparatus for print circuit board
CN104081193A (en) * 2012-01-12 2014-10-01 雅马哈发动机株式会社 Complex inspection device for printed-circuit board
WO2013105194A1 (en) * 2012-01-12 2013-07-18 ヤマハ発動機株式会社 Complex inspection device for printed-circuit board
US9329139B2 (en) 2012-01-12 2016-05-03 Yamaha Hatsudoki Kabushiki Kaisha Complex inspection device for printed-substrate
KR101621255B1 (en) * 2012-01-12 2016-05-16 야마하하쓰도키 가부시키가이샤 Complex inspection device for printed-circuit board
CN102706909A (en) * 2012-06-17 2012-10-03 无锡市优耐特石化装备有限公司 Circumferential detection device for circular seam of thin-walled container
JP2014190702A (en) * 2013-03-26 2014-10-06 Nec Corp Inspection device, inspection method, and inspection program
KR101467478B1 (en) * 2013-09-13 2014-12-01 (주)시스트 Apparatus and method for scanning circuit elements using x-ray
US10209204B2 (en) 2013-10-21 2019-02-19 Yxlon International Gmbh X-ray inspection system and method for rotating a test object by means of such an X-ray inspection system
JP2016533481A (en) * 2013-10-21 2016-10-27 エクスロン インターナショナル ゲゼルシャフト ミット ベシュレンクテル ハフツングＹｘｌｏｎ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｇｍｂｈ X-ray inspection system and method for rotating a test object using such an X-ray inspection system
KR101654825B1 (en) * 2014-07-08 2016-09-22 (주)자비스 Method for Inspecting Compact Parts Formed on Substrate in Defect Inspection
KR20160006054A (en) * 2014-07-08 2016-01-18 (주)자비스 Method for Inspecting Compact Parts Formed on Substrate in Defect Inspection
GB2558605A (en) * 2017-01-09 2018-07-18 Caresoft Global Holdings Ltd Method
GB2558605B (en) * 2017-01-09 2021-11-10 Caresoft Global Holdings Ltd Methodology to extract 3D CAD from CT Scan Output
US11475627B2 (en) 2017-01-09 2022-10-18 Caresoft Global Holdings Limited Method of obtaining 3D model data of a plurality of components of an object
WO2019077950A1 (en) * 2017-10-17 2019-04-25 日本装置開発株式会社 X-ray inspection device
JP2019074415A (en) * 2017-10-17 2019-05-16 日本装置開発株式会社 X-ray inspection device
JP2020128890A (en) * 2019-02-07 2020-08-27 リョーエイ株式会社 Tilted x-ray inspection method, tilted x-ray inspection apparatus and its accuracy evaluation method
JP7224598B2 (en) 2019-02-07 2023-02-20 リョーエイ株式会社 Inclined X-ray Inspection Method, Inclined X-ray Inspection Apparatus and Accuracy Evaluation Method Therefor

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Publication number Publication date
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