WO2009075060A1 - Substrate processing method - Google Patents

Substrate processing method Download PDF

Info

Publication number
WO2009075060A1
WO2009075060A1 PCT/JP2008/003316 JP2008003316W WO2009075060A1 WO 2009075060 A1 WO2009075060 A1 WO 2009075060A1 JP 2008003316 W JP2008003316 W JP 2008003316W WO 2009075060 A1 WO2009075060 A1 WO 2009075060A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing method
substrate processing
substrate
rotor
processed
Prior art date
Application number
PCT/JP2008/003316
Other languages
French (fr)
Japanese (ja)
Inventor
Minoru Matsuzawa
Kazuhiro Yoshikawa
Original Assignee
Realize Advanced Technology Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Realize Advanced Technology Limited filed Critical Realize Advanced Technology Limited
Publication of WO2009075060A1 publication Critical patent/WO2009075060A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Abstract

Provided is a substrate processing method wherein efficiencies of drainage and exhaust by centrifugal force and a rotor are improved. The substrate processing method is provided with a sample stage (2) for placing a substrate (1) to be processed, a spin rotor (3) arranged in the sample stage (2), and a supply nozzle (4) for supplying a liquid from the center portion of the spin rotor (3). The liquid supplied from the supply nozzle (4) is discharged by rotation of the spin rotor (3) in the outer circumference direction of the substrate (1) to be processed.
PCT/JP2008/003316 2007-12-13 2008-11-14 Substrate processing method WO2009075060A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007321957A JP2009147061A (en) 2007-12-13 2007-12-13 Substrate processing method
JP2007-321957 2007-12-13

Publications (1)

Publication Number Publication Date
WO2009075060A1 true WO2009075060A1 (en) 2009-06-18

Family

ID=40755310

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003316 WO2009075060A1 (en) 2007-12-13 2008-11-14 Substrate processing method

Country Status (2)

Country Link
JP (1) JP2009147061A (en)
WO (1) WO2009075060A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018144446A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
WO2018145070A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Removal of process effluents
WO2018145001A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
CN115054326A (en) * 2022-07-26 2022-09-16 上海鸿脉医疗科技有限公司 Rotary grinding system, rotary grinding assembly and rotary grinding head thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09257367A (en) * 1996-03-19 1997-10-03 Ebara Corp Base plate drying device
JP2001135610A (en) * 1999-05-25 2001-05-18 Ebara Corp Substrate processing device and its operating method
JP2005259874A (en) * 2004-03-10 2005-09-22 Tokyo Electron Ltd Substrate treatment device and substrate treatment method
WO2006051585A1 (en) * 2004-11-10 2006-05-18 Mimasu Semiconductor Industry Co., Ltd. Single-wafer processor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09257367A (en) * 1996-03-19 1997-10-03 Ebara Corp Base plate drying device
JP2001135610A (en) * 1999-05-25 2001-05-18 Ebara Corp Substrate processing device and its operating method
JP2005259874A (en) * 2004-03-10 2005-09-22 Tokyo Electron Ltd Substrate treatment device and substrate treatment method
WO2006051585A1 (en) * 2004-11-10 2006-05-18 Mimasu Semiconductor Industry Co., Ltd. Single-wafer processor

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10892172B2 (en) 2017-02-06 2021-01-12 Planar Semiconductor, Inc. Removal of process effluents
WO2018145001A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
KR102226086B1 (en) 2017-02-06 2021-03-09 플레이너 세미컨덕터, 인크. Removal of process emissions
US10985039B2 (en) 2017-02-06 2021-04-20 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
CN110603629A (en) * 2017-02-06 2019-12-20 平面半导体公司 Sub-nanometer optical-based substrate cleaning mechanism
KR20200011408A (en) * 2017-02-06 2020-02-03 플레이너 세미컨덕터, 인크. Sub-nanometer level substrate cleaning mechanism
KR20200011407A (en) * 2017-02-06 2020-02-03 플레이너 세미컨덕터, 인크. Removal of process emissions
KR102126645B1 (en) 2017-02-06 2020-06-24 플레이너 세미컨덕터, 인크. Sub-nanometer level substrate cleaning mechanism
US11830726B2 (en) 2017-02-06 2023-11-28 Planar Semiconductor Corporation Pte. Ltd. Subnanometer-level light-based substrate cleaning mechanism
WO2018145070A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Removal of process effluents
CN110603628A (en) * 2017-02-06 2019-12-20 平面半导体公司 Removal of treated wastewater
US11069521B2 (en) 2017-02-06 2021-07-20 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
TWI770115B (en) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 Removal of process effluents
TWI770114B (en) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 Sub-nanometer-level substrate cleaning mechanism
WO2018144446A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
CN110603628B (en) * 2017-02-06 2023-11-07 平面半导体公司 Removal of treated sewage
CN115054326B (en) * 2022-07-26 2022-11-15 上海鸿脉医疗科技有限公司 Rotary grinding system, rotary grinding assembly and rotary grinding head thereof
CN115054326A (en) * 2022-07-26 2022-09-16 上海鸿脉医疗科技有限公司 Rotary grinding system, rotary grinding assembly and rotary grinding head thereof

Also Published As

Publication number Publication date
JP2009147061A (en) 2009-07-02

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