WO2009069527A1 - 沸騰冷却装置 - Google Patents

沸騰冷却装置 Download PDF

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Publication number
WO2009069527A1
WO2009069527A1 PCT/JP2008/071106 JP2008071106W WO2009069527A1 WO 2009069527 A1 WO2009069527 A1 WO 2009069527A1 JP 2008071106 W JP2008071106 W JP 2008071106W WO 2009069527 A1 WO2009069527 A1 WO 2009069527A1
Authority
WO
WIPO (PCT)
Prior art keywords
section
refrigerant
condensing
cooling unit
heat
Prior art date
Application number
PCT/JP2008/071106
Other languages
English (en)
French (fr)
Inventor
Satoshi Hariu
Original Assignee
Kabushiki Kaisha Toyota Jidoshokki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toyota Jidoshokki filed Critical Kabushiki Kaisha Toyota Jidoshokki
Priority to US12/744,936 priority Critical patent/US20100300657A1/en
Priority to EP08853985A priority patent/EP2216812A1/en
Priority to CN200880117873.3A priority patent/CN101874300A/zh
Publication of WO2009069527A1 publication Critical patent/WO2009069527A1/ja

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20881—Liquid coolant with phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

良好な冷媒循環を維持できる沸騰冷却装置を提供する。 本発明の沸騰冷却装置１は、発熱体Ｚが取り付けられ内部に冷媒を有する受熱部２１と、受熱部２１に連通し、発熱体Ｚの熱によって沸騰した冷媒を凝縮させる凝縮部２２と、受熱部２１および凝縮部２２に連通し、凝縮部２２で凝縮された冷媒が流入するとともに受熱部２１へ冷媒を供給する冷媒環流部２３と、を備える沸騰冷却装置であって、凝縮部２２の内底面２２ｂは、重力により冷媒を冷媒環流部２３へ誘導する誘導部を備えることを特徴とする。
PCT/JP2008/071106 2007-11-28 2008-11-20 沸騰冷却装置 WO2009069527A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/744,936 US20100300657A1 (en) 2007-11-28 2008-11-20 Ebullient cooling device
EP08853985A EP2216812A1 (en) 2007-11-28 2008-11-20 Ebullient cooling unit
CN200880117873.3A CN101874300A (zh) 2007-11-28 2008-11-20 沸腾冷却装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007307796A JP2009135142A (ja) 2007-11-28 2007-11-28 沸騰冷却装置
JP2007-307796 2007-11-28

Publications (1)

Publication Number Publication Date
WO2009069527A1 true WO2009069527A1 (ja) 2009-06-04

Family

ID=40678429

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071106 WO2009069527A1 (ja) 2007-11-28 2008-11-20 沸騰冷却装置

Country Status (6)

Country Link
US (1) US20100300657A1 (ja)
EP (1) EP2216812A1 (ja)
JP (1) JP2009135142A (ja)
KR (1) KR101080027B1 (ja)
CN (1) CN101874300A (ja)
WO (1) WO2009069527A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4730624B2 (ja) * 2008-11-17 2011-07-20 株式会社豊田自動織機 沸騰冷却装置
JP5252230B2 (ja) * 2009-11-11 2013-07-31 株式会社豊田自動織機 自然循環式沸騰冷却装置
JP2011108685A (ja) * 2009-11-12 2011-06-02 Toyota Industries Corp 自然循環式沸騰冷却装置
CN112243333B (zh) * 2019-07-17 2022-02-25 华为技术有限公司 一种齿片、散热器和通信设备
JP7421176B2 (ja) * 2020-01-07 2024-01-24 大成建設株式会社 液浸冷却システム
CN111863740A (zh) * 2020-04-10 2020-10-30 上海交通大学 用于浸没式液冷系统的自诱导射流无源沸腾散热强化方法及装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52135441A (en) * 1976-05-07 1977-11-12 Mitsubishi Electric Corp Seething cooler
JPS57147258A (en) * 1981-03-06 1982-09-11 Hitachi Ltd Cooler for electric component part
JPH1174432A (ja) * 1997-08-28 1999-03-16 Calsonic Corp 電子部品用沸騰冷却装置
JP2003042672A (ja) * 2001-07-31 2003-02-13 Denso Corp 沸騰冷却装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118561A (en) * 1979-03-05 1980-09-11 Hitachi Ltd Constant pressure type boiling cooler
JPS61234059A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体素子の沸謄冷却装置
JPH0724293B2 (ja) * 1987-09-30 1995-03-15 株式会社日立製作所 沸騰冷却装置
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
JP2000049266A (ja) 1998-05-25 2000-02-18 Denso Corp 沸騰冷却装置
US6695039B1 (en) * 2003-02-25 2004-02-24 Delphi Technologies, Inc. Orientation insensitive thermosiphon assembly for cooling electronic components
NO326076B1 (no) * 2006-07-07 2008-09-15 Shell Int Research Undersjoisk kjoleaggregat
US20100012299A1 (en) * 2007-01-24 2010-01-21 Nec Corporation Heat exchanger unit
KR100868517B1 (ko) 2007-05-29 2008-11-12 한국과학기술연구원 냉각 유닛, 발열체 냉각 장치 및 그를 구비하는 전자 장치
JP4730624B2 (ja) * 2008-11-17 2011-07-20 株式会社豊田自動織機 沸騰冷却装置
JP2010196912A (ja) * 2009-02-23 2010-09-09 Toyota Industries Corp 沸騰冷却装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52135441A (en) * 1976-05-07 1977-11-12 Mitsubishi Electric Corp Seething cooler
JPS57147258A (en) * 1981-03-06 1982-09-11 Hitachi Ltd Cooler for electric component part
JPH1174432A (ja) * 1997-08-28 1999-03-16 Calsonic Corp 電子部品用沸騰冷却装置
JP2003042672A (ja) * 2001-07-31 2003-02-13 Denso Corp 沸騰冷却装置

Also Published As

Publication number Publication date
JP2009135142A (ja) 2009-06-18
EP2216812A1 (en) 2010-08-11
US20100300657A1 (en) 2010-12-02
KR20100070378A (ko) 2010-06-25
CN101874300A (zh) 2010-10-27
KR101080027B1 (ko) 2011-11-04

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