WO2009069268A1 - 個片化された電子部品の搬送装置及び搬送方法 - Google Patents

個片化された電子部品の搬送装置及び搬送方法 Download PDF

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Publication number
WO2009069268A1
WO2009069268A1 PCT/JP2008/003400 JP2008003400W WO2009069268A1 WO 2009069268 A1 WO2009069268 A1 WO 2009069268A1 JP 2008003400 W JP2008003400 W JP 2008003400W WO 2009069268 A1 WO2009069268 A1 WO 2009069268A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
fixing member
storing section
electronic component
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/003400
Other languages
English (en)
French (fr)
Inventor
Yasuhiro Iwata
Shuzo Yamaji
Shinya Nakajima
Junko Kashimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to CN2008801181079A priority Critical patent/CN101878525B/zh
Priority to KR20107010585A priority patent/KR101511402B1/ko
Publication of WO2009069268A1 publication Critical patent/WO2009069268A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

　個片化された電子部品（Ｐ）の搬送装置のテーブル（ＴＡ）に、第１の収容部（Ｓ１）と、第２の収容部（Ｓ２）とを、隣接して設け、複数の電子部品（Ｐ）を下面に一括して吸着する固定部材（ＨＡ）と、固定部材（ＨＡ）に固定された複数の電子部品（Ｐ）の吸着を選択的に解除して、複数の電子部品（Ｐ）を固定されない状態にする固定解除機構とを備え、固定解除機構が、固定部材（ＨＡ）が第１の収容部（Ｓ１）の上に位置すると、固定部材（ＨＡ）に吸着された複数の電子部品（Ｐ）のうち市松模様の一の色に相当する位置のものの吸着を解除し、固定部材（ＨＡ）が第２の収容部（Ｓ２）の上に移動すると、固定部材（ＨＡ）に吸着された他の複数の電子部品（Ｐ）の吸着を解除することにより、第１の収容部（Ｓ１）及び第２の収容部（Ｓ２）に全ての電子部品（Ｐ）を一定のピッチで千鳥状に配置する。また、テーブル（ＴＡ）に千鳥状に収容された複数の電子部品（Ｐ）のうちＸ方向に沿う１ライン分の電子部品（Ｐ）を、一括して吸着して搬送する搬送機構が設けられている。
PCT/JP2008/003400 2007-11-30 2008-11-20 個片化された電子部品の搬送装置及び搬送方法 Ceased WO2009069268A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801181079A CN101878525B (zh) 2007-11-30 2008-11-20 单片化电子元件的搬送装置及搬送方法
KR20107010585A KR101511402B1 (ko) 2007-11-30 2008-11-20 개편화된 전자부품의 반송장치 및 반송방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007309905A JP5108481B2 (ja) 2007-11-30 2007-11-30 個片化された電子部品の搬送装置及び搬送方法
JP2007-309905 2007-11-30

Publications (1)

Publication Number Publication Date
WO2009069268A1 true WO2009069268A1 (ja) 2009-06-04

Family

ID=40678180

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003400 Ceased WO2009069268A1 (ja) 2007-11-30 2008-11-20 個片化された電子部品の搬送装置及び搬送方法

Country Status (6)

Country Link
JP (1) JP5108481B2 (ja)
KR (1) KR101511402B1 (ja)
CN (1) CN101878525B (ja)
MY (1) MY159009A (ja)
TW (1) TWI436443B (ja)
WO (1) WO2009069268A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101258162B1 (ko) * 2011-01-13 2013-04-25 (주)에이피텍 엘이디 칩의 이송장치 및 방법
NL2008290C2 (nl) * 2012-02-14 2013-08-19 Fico Bv Werkwijze en inrichting voor het uiteenplaatsen van in een matrixstructuur gerangschikte elektronische componenten.
KR102033204B1 (ko) * 2012-10-30 2019-10-16 가부시키가이샤 후지 노즐 관리기
JP6017382B2 (ja) * 2013-07-29 2016-11-02 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
CN105658387B (zh) * 2013-09-30 2019-01-15 株式会社村田制作所 吸引头及片材处理装置
US9205995B2 (en) * 2013-10-21 2015-12-08 International Business Machines Corporation Sorting, swapping, and organizing objects on transfer ball grids
JP6235391B2 (ja) * 2014-03-27 2017-11-22 Ｔｏｗａ株式会社 検査用治具、切断装置及び切断方法
CN104476568B (zh) * 2014-12-16 2015-11-18 贵州联合光电股份有限公司 用于取放电子元件的可调式气动装置
JP6382132B2 (ja) * 2015-03-04 2018-08-29 Ｔｏｗａ株式会社 切断装置、搬送方法、搬送プログラム、および搬送プログラムを格納した記録媒体
JP6382133B2 (ja) * 2015-03-04 2018-08-29 Ｔｏｗａ株式会社 切断装置、搬送方法、搬送プログラム、および搬送プログラムを格納した記録媒体
JP6555100B2 (ja) * 2015-11-20 2019-08-07 富士ゼロックス株式会社 基板装置の製造方法
JP6952515B2 (ja) * 2017-06-30 2021-10-20 Ｔｏｗａ株式会社 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法
KR102486822B1 (ko) 2018-03-29 2023-01-10 삼성전자주식회사 칩 이송 장치 및 이를 이용한 칩 이송 방법
KR101941541B1 (ko) * 2018-05-10 2019-04-12 주식회사 팀즈 마이크로 led소자의 정렬이송방법, 이에 따른 led디스플레이모듈의 제조방법, 및 이에 사용되는 정렬모듈
KR102091036B1 (ko) * 2019-06-18 2020-03-19 주식회사 효준베스트진테크 Tv스탠드용 러버 자동부착장치 및 방법
KR102173442B1 (ko) * 2019-06-18 2020-11-03 주식회사 효준베스트진테크 Tv스탠드용 러버 자동부착장치
JP7498674B2 (ja) * 2021-01-18 2024-06-12 Ｔｏｗａ株式会社 搬送機構、切断装置及び切断品の製造方法
TWI823679B (zh) * 2021-11-19 2023-11-21 日商芝浦機械電子裝置股份有限公司 供給裝置及成膜裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169423A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 部品移載装置
JPS64522U (ja) * 1987-06-18 1989-01-05
JP2004055860A (ja) * 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000002851U (ko) * 1998-07-11 2000-02-07 김영환 반도체 패키지 이송용 핸들러
KR100479528B1 (ko) * 2003-03-31 2005-03-31 한미반도체 주식회사 쏘잉장치의 격자형 제1적재테이블

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169423A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 部品移載装置
JPS64522U (ja) * 1987-06-18 1989-01-05
JP2004055860A (ja) * 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
MY159009A (en) 2016-11-30
JP2009135259A (ja) 2009-06-18
JP5108481B2 (ja) 2012-12-26
CN101878525A (zh) 2010-11-03
TWI436443B (zh) 2014-05-01
TW200938467A (en) 2009-09-16
KR101511402B1 (ko) 2015-04-10
CN101878525B (zh) 2012-07-25
KR20100089076A (ko) 2010-08-11

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