WO2009063825A1 - Wafer processing apparatus - Google Patents

Wafer processing apparatus Download PDF

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Publication number
WO2009063825A1
WO2009063825A1 PCT/JP2008/070404 JP2008070404W WO2009063825A1 WO 2009063825 A1 WO2009063825 A1 WO 2009063825A1 JP 2008070404 W JP2008070404 W JP 2008070404W WO 2009063825 A1 WO2009063825 A1 WO 2009063825A1
Authority
WO
WIPO (PCT)
Prior art keywords
section
wafer
processing apparatus
wafer processing
ultraviolet irradiation
Prior art date
Application number
PCT/JP2008/070404
Other languages
French (fr)
Japanese (ja)
Inventor
Tasuku Shimizu
Tetsuya Hirano
Original Assignee
Tokyo Seimitsu Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co., Ltd. filed Critical Tokyo Seimitsu Co., Ltd.
Publication of WO2009063825A1 publication Critical patent/WO2009063825A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A wafer processing apparatus (10) is provided with a storing section (14), a cooling section (16), an expanding section (18), a cleaning section (24), an ultraviolet irradiation section (26) and a wafer transfer section (28) at prescribed positions on a main body (12). The wafer transfer section (28) permits required processing to be performed at each section, while transferring a wafer (W) having a frame member in a prescribed order. Thus, the wafer processing apparatus (10) continuously and automatically performs expanding process, cleaning process and ultraviolet irradiation process to the wafer after dicing without damaging a chip.
PCT/JP2008/070404 2007-11-16 2008-11-10 Wafer processing apparatus WO2009063825A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007298226 2007-11-16
JP2007-298226 2007-11-16

Publications (1)

Publication Number Publication Date
WO2009063825A1 true WO2009063825A1 (en) 2009-05-22

Family

ID=40638674

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070404 WO2009063825A1 (en) 2007-11-16 2008-11-10 Wafer processing apparatus

Country Status (1)

Country Link
WO (1) WO2009063825A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019008809A1 (en) * 2017-07-03 2019-01-10 リンテック株式会社 Adhesive sheet for stealth dicing, and production method for semiconductor device
CN110753993A (en) * 2017-07-03 2020-02-04 琳得科株式会社 Adhesive sheet for stealth dicing and method for manufacturing semiconductor device
CN110809815A (en) * 2017-07-03 2020-02-18 琳得科株式会社 Adhesive sheet for stealth dicing and method for manufacturing semiconductor device
CN110832620A (en) * 2017-07-03 2020-02-21 琳得科株式会社 Adhesive sheet for stealth dicing and method for manufacturing semiconductor device
JP2022133465A (en) * 2018-01-11 2022-09-13 株式会社東京精密 Work division device and work division method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266182A (en) * 1996-03-29 1997-10-07 Nec Corp Dicing device and its method
JP2002299286A (en) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd Dicing device with uv irradiation device
JP2005136228A (en) * 2003-10-30 2005-05-26 Canon Inc Method for dicing semiconductor substrate
JP2006049591A (en) * 2004-08-05 2006-02-16 Disco Abrasive Syst Ltd Fracture method and fracture equipment of adhesive film stuck on wafer
JP2007201179A (en) * 2006-01-26 2007-08-09 Tokyo Seimitsu Co Ltd Device and method for mounting wafer
JP2007250598A (en) * 2006-03-14 2007-09-27 Renesas Technology Corp Process for manufacturing semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266182A (en) * 1996-03-29 1997-10-07 Nec Corp Dicing device and its method
JP2002299286A (en) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd Dicing device with uv irradiation device
JP2005136228A (en) * 2003-10-30 2005-05-26 Canon Inc Method for dicing semiconductor substrate
JP2006049591A (en) * 2004-08-05 2006-02-16 Disco Abrasive Syst Ltd Fracture method and fracture equipment of adhesive film stuck on wafer
JP2007201179A (en) * 2006-01-26 2007-08-09 Tokyo Seimitsu Co Ltd Device and method for mounting wafer
JP2007250598A (en) * 2006-03-14 2007-09-27 Renesas Technology Corp Process for manufacturing semiconductor device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110753992B (en) * 2017-07-03 2023-10-13 琳得科株式会社 Adhesive sheet for invisible dicing and method for manufacturing semiconductor device
TWI791485B (en) * 2017-07-03 2023-02-11 日商琳得科股份有限公司 Adhesive sheet for stealth dicing and method for manufacturing semiconductor device
CN110753993A (en) * 2017-07-03 2020-02-04 琳得科株式会社 Adhesive sheet for stealth dicing and method for manufacturing semiconductor device
CN110809815A (en) * 2017-07-03 2020-02-18 琳得科株式会社 Adhesive sheet for stealth dicing and method for manufacturing semiconductor device
CN110832620B (en) * 2017-07-03 2024-01-02 琳得科株式会社 Adhesive sheet for invisible dicing and method for manufacturing semiconductor device
KR20200026178A (en) * 2017-07-03 2020-03-10 린텍 가부시키가이샤 Manufacturing method of adhesive sheet for stealth dicing and semiconductor device
CN110753992A (en) * 2017-07-03 2020-02-04 琳得科株式会社 Adhesive sheet for stealth dicing and method for manufacturing semiconductor device
JPWO2019008809A1 (en) * 2017-07-03 2020-04-30 リンテック株式会社 Stealth dicing adhesive sheet and method for manufacturing semiconductor device
CN110832620A (en) * 2017-07-03 2020-02-21 琳得科株式会社 Adhesive sheet for stealth dicing and method for manufacturing semiconductor device
KR102478993B1 (en) * 2017-07-03 2022-12-19 린텍 가부시키가이샤 Method for manufacturing adhesive sheet for stealth dicing and semiconductor device
JP7062654B2 (en) 2017-07-03 2022-05-06 リンテック株式会社 Manufacturing method of adhesive sheet for stealth dicing and semiconductor device
CN110753993B (en) * 2017-07-03 2023-12-01 琳得科株式会社 Adhesive sheet for invisible dicing and method for manufacturing semiconductor device
WO2019008809A1 (en) * 2017-07-03 2019-01-10 リンテック株式会社 Adhesive sheet for stealth dicing, and production method for semiconductor device
CN110809815B (en) * 2017-07-03 2023-10-20 琳得科株式会社 Adhesive sheet for invisible dicing and method for manufacturing semiconductor device
JP7284439B2 (en) 2018-01-11 2023-05-31 株式会社東京精密 Work dividing device and work dividing method
JP2022133465A (en) * 2018-01-11 2022-09-13 株式会社東京精密 Work division device and work division method

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