WO2009063709A1 - 電子回路モジュール - Google Patents
電子回路モジュール Download PDFInfo
- Publication number
- WO2009063709A1 WO2009063709A1 PCT/JP2008/068382 JP2008068382W WO2009063709A1 WO 2009063709 A1 WO2009063709 A1 WO 2009063709A1 JP 2008068382 W JP2008068382 W JP 2008068382W WO 2009063709 A1 WO2009063709 A1 WO 2009063709A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring cable
- cable connecting
- electronic component
- region
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
- A61B1/00114—Electrical cables in or with an endoscope
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Surgery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Biomedical Technology (AREA)
- Animal Behavior & Ethology (AREA)
- Radiology & Medical Imaging (AREA)
- Optics & Photonics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Physics & Mathematics (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Biophysics (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007295803A JP2009123884A (ja) | 2007-11-14 | 2007-11-14 | 電子回路モジュール |
| JP2007-295803 | 2007-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009063709A1 true WO2009063709A1 (ja) | 2009-05-22 |
Family
ID=40638562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/068382 Ceased WO2009063709A1 (ja) | 2007-11-14 | 2008-10-09 | 電子回路モジュール |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2009123884A (enExample) |
| WO (1) | WO2009063709A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016189679A1 (ja) * | 2015-05-27 | 2016-12-01 | オリンパス株式会社 | 撮像装置および内視鏡 |
| JPWO2017199406A1 (ja) * | 2016-05-19 | 2019-04-11 | オリンパス株式会社 | ケーブル接続用基板、撮像装置、内視鏡および撮像装置の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH058969U (ja) * | 1991-07-12 | 1993-02-05 | 日本ケミコン株式会社 | 回路基板 |
| JPH0582918A (ja) * | 1991-09-20 | 1993-04-02 | Olympus Optical Co Ltd | フレキシブルプリント基板 |
| JPH11330639A (ja) * | 1998-05-11 | 1999-11-30 | Sony Corp | 実装基板 |
| JP2001094232A (ja) * | 1999-08-18 | 2001-04-06 | Fujitsu Ltd | フレキシブル回路構造体の製造方法及び材料品 |
-
2007
- 2007-11-14 JP JP2007295803A patent/JP2009123884A/ja active Pending
-
2008
- 2008-10-09 WO PCT/JP2008/068382 patent/WO2009063709A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH058969U (ja) * | 1991-07-12 | 1993-02-05 | 日本ケミコン株式会社 | 回路基板 |
| JPH0582918A (ja) * | 1991-09-20 | 1993-04-02 | Olympus Optical Co Ltd | フレキシブルプリント基板 |
| JPH11330639A (ja) * | 1998-05-11 | 1999-11-30 | Sony Corp | 実装基板 |
| JP2001094232A (ja) * | 1999-08-18 | 2001-04-06 | Fujitsu Ltd | フレキシブル回路構造体の製造方法及び材料品 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016189679A1 (ja) * | 2015-05-27 | 2016-12-01 | オリンパス株式会社 | 撮像装置および内視鏡 |
| JPWO2016189679A1 (ja) * | 2015-05-27 | 2018-03-15 | オリンパス株式会社 | 撮像装置および内視鏡 |
| US10750940B2 (en) | 2015-05-27 | 2020-08-25 | Olympus Corporation | Image pickup apparatus including solid-state image pickup device and electronic component mounted on folded flexible substrate and endoscope including the image pickup apparatus |
| JPWO2017199406A1 (ja) * | 2016-05-19 | 2019-04-11 | オリンパス株式会社 | ケーブル接続用基板、撮像装置、内視鏡および撮像装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009123884A (ja) | 2009-06-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| 122 | Ep: pct application non-entry in european phase |
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