JP2009123884A - 電子回路モジュール - Google Patents

電子回路モジュール Download PDF

Info

Publication number
JP2009123884A
JP2009123884A JP2007295803A JP2007295803A JP2009123884A JP 2009123884 A JP2009123884 A JP 2009123884A JP 2007295803 A JP2007295803 A JP 2007295803A JP 2007295803 A JP2007295803 A JP 2007295803A JP 2009123884 A JP2009123884 A JP 2009123884A
Authority
JP
Japan
Prior art keywords
cable connection
wiring cable
wiring
electronic component
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007295803A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009123884A5 (enExample
Inventor
Mikio Nakamura
幹夫 中村
Hiroshi Ito
寛 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2007295803A priority Critical patent/JP2009123884A/ja
Priority to PCT/JP2008/068382 priority patent/WO2009063709A1/ja
Publication of JP2009123884A publication Critical patent/JP2009123884A/ja
Publication of JP2009123884A5 publication Critical patent/JP2009123884A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00112Connection or coupling means
    • A61B1/00114Electrical cables in or with an endoscope
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/055Folded back on itself
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/056Folded around rigid support or component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10356Cables

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Surgery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Biomedical Technology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Optics & Photonics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Physics & Mathematics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Biophysics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2007295803A 2007-11-14 2007-11-14 電子回路モジュール Pending JP2009123884A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007295803A JP2009123884A (ja) 2007-11-14 2007-11-14 電子回路モジュール
PCT/JP2008/068382 WO2009063709A1 (ja) 2007-11-14 2008-10-09 電子回路モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007295803A JP2009123884A (ja) 2007-11-14 2007-11-14 電子回路モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012211449A Division JP5351323B2 (ja) 2012-09-25 2012-09-25 電子回路モジュール

Publications (2)

Publication Number Publication Date
JP2009123884A true JP2009123884A (ja) 2009-06-04
JP2009123884A5 JP2009123884A5 (enExample) 2010-12-24

Family

ID=40638562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007295803A Pending JP2009123884A (ja) 2007-11-14 2007-11-14 電子回路モジュール

Country Status (2)

Country Link
JP (1) JP2009123884A (enExample)
WO (1) WO2009063709A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10750940B2 (en) 2015-05-27 2020-08-25 Olympus Corporation Image pickup apparatus including solid-state image pickup device and electronic component mounted on folded flexible substrate and endoscope including the image pickup apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109195501B (zh) * 2016-05-19 2021-06-04 奥林巴斯株式会社 电缆连接用电路板、摄像装置、内窥镜和摄像装置的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058969U (ja) * 1991-07-12 1993-02-05 日本ケミコン株式会社 回路基板
JPH0582918A (ja) * 1991-09-20 1993-04-02 Olympus Optical Co Ltd フレキシブルプリント基板
JPH11330639A (ja) * 1998-05-11 1999-11-30 Sony Corp 実装基板
JP2001094232A (ja) * 1999-08-18 2001-04-06 Fujitsu Ltd フレキシブル回路構造体の製造方法及び材料品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058969U (ja) * 1991-07-12 1993-02-05 日本ケミコン株式会社 回路基板
JPH0582918A (ja) * 1991-09-20 1993-04-02 Olympus Optical Co Ltd フレキシブルプリント基板
JPH11330639A (ja) * 1998-05-11 1999-11-30 Sony Corp 実装基板
JP2001094232A (ja) * 1999-08-18 2001-04-06 Fujitsu Ltd フレキシブル回路構造体の製造方法及び材料品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10750940B2 (en) 2015-05-27 2020-08-25 Olympus Corporation Image pickup apparatus including solid-state image pickup device and electronic component mounted on folded flexible substrate and endoscope including the image pickup apparatus

Also Published As

Publication number Publication date
WO2009063709A1 (ja) 2009-05-22

Similar Documents

Publication Publication Date Title
JP5404981B1 (ja) 超音波内視鏡
JP6633067B2 (ja) 撮像装置および内視鏡
CN104995907A (zh) 用于视频内窥镜的组件
EP2208456A1 (en) Endoscopic device
EP1887622A3 (en) Capacitor built-in substrate and method of manufacturing the same and electronic component device
US20150163937A1 (en) Rigid flex circuit board
JP5583372B2 (ja) 集合ケーブル、電子回路モジュールおよび撮像装置
CN104684455A (zh) 摄像模块和内窥镜装置
EP2987448A1 (en) Image capturing device and electronic endoscope
JPWO2018078767A1 (ja) 内視鏡
JP2009123884A (ja) 電子回路モジュール
JP5351323B2 (ja) 電子回路モジュール
US9343863B2 (en) Method for manufacturing mount assembly
JP5711178B2 (ja) 撮像装置及びこの撮像装置を用いた内視鏡
JP5541968B2 (ja) 撮像装置
JP5041379B2 (ja) 積層型回路基板及びその製造方法
JP5154783B2 (ja) 撮像モジュールの製造方法
JP2011035170A (ja) 多層積層回路
US20180249049A1 (en) Endoscope
JP2019166170A (ja) 半導体モジュール
JP3158863U (ja) 小型撮像装置
JP2009188802A (ja) 撮像モジュール
JP2004311907A (ja) 実装基板
JP2006185627A (ja) 電子機器
JP5526250B2 (ja) 実装構造体の製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101104

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101104

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120522

A521 Written amendment

Effective date: 20120711

Free format text: JAPANESE INTERMEDIATE CODE: A523

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120731

A02 Decision of refusal

Effective date: 20121127

Free format text: JAPANESE INTERMEDIATE CODE: A02