WO2009057381A1 - Method for cutting a fragile material substrate - Google Patents

Method for cutting a fragile material substrate Download PDF

Info

Publication number
WO2009057381A1
WO2009057381A1 PCT/JP2008/065860 JP2008065860W WO2009057381A1 WO 2009057381 A1 WO2009057381 A1 WO 2009057381A1 JP 2008065860 W JP2008065860 W JP 2008065860W WO 2009057381 A1 WO2009057381 A1 WO 2009057381A1
Authority
WO
WIPO (PCT)
Prior art keywords
crack
substrate
cutting
along
bending moment
Prior art date
Application number
PCT/JP2008/065860
Other languages
French (fr)
Japanese (ja)
Inventor
Norifumi Arima
Koji Yamamoto
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Priority to JP2009538974A priority Critical patent/JP5216017B2/en
Priority to CN200880114171A priority patent/CN101842203A/en
Priority to KR1020107009795A priority patent/KR101190173B1/en
Publication of WO2009057381A1 publication Critical patent/WO2009057381A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

Provided is a method which can stably cut a substrate while reducing a bending moment (break pressure) required for the cutting. The method for cutting a fragile material substrate includes: a step for forming a crack along a planned cut line; and a break step for separating the substrate along the formed crack by applying a bending moment. The step for forming the crack forms a cyclic crack having the maximum depth limited by a clamping stress region inside the substrate while the crack depth is changed along the planned cut line by a cycle of the heating condition or/and the cooling condition by cyclically changing the heating condition and/or the cooling condition along the planned cut line. In the break step, a bending moment is applied from the rear surface side of the substrate to the cyclic crack.
PCT/JP2008/065860 2007-11-02 2008-09-03 Method for cutting a fragile material substrate WO2009057381A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009538974A JP5216017B2 (en) 2007-11-02 2008-09-03 Method for dividing brittle material substrate
CN200880114171A CN101842203A (en) 2007-11-02 2008-09-03 Method for cutting a fragile material substrate
KR1020107009795A KR101190173B1 (en) 2007-11-02 2008-09-03 Method for cutting a fragile material substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007285808 2007-11-02
JP2007-285808 2007-11-02

Publications (1)

Publication Number Publication Date
WO2009057381A1 true WO2009057381A1 (en) 2009-05-07

Family

ID=40590783

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065860 WO2009057381A1 (en) 2007-11-02 2008-09-03 Method for cutting a fragile material substrate

Country Status (5)

Country Link
JP (1) JP5216017B2 (en)
KR (1) KR101190173B1 (en)
CN (1) CN101842203A (en)
TW (1) TWI466749B (en)
WO (1) WO2009057381A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012121071A (en) * 2012-03-23 2012-06-28 Mitsuboshi Diamond Industrial Co Ltd Laser beam machining method, method for dividing workpiece, and laser beam machining apparatus
KR101200789B1 (en) * 2009-06-30 2012-11-13 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for dividing brittle material substrate
EP2261179A3 (en) * 2009-06-09 2013-09-18 Mitsuboshi Diamond Industrial Co., Ltd. Cooling nozzle, cooling method using the same, and brittle material substrate division method
KR101369211B1 (en) * 2010-08-27 2014-03-04 미쓰보시 다이야몬도 고교 가부시키가이샤 Laser cutting device
JP2014519982A (en) * 2011-04-06 2014-08-21 マウザー‐ヴェルケ オベルンドルフ マシーネンバウ ゲーエムベーハー Method, workpiece and laser apparatus for breaking and dividing a workpiece
JP2015062926A (en) * 2013-09-25 2015-04-09 三星ダイヤモンド工業株式会社 Processing method and processing device of brittle material substrate
JP2015062927A (en) * 2013-09-25 2015-04-09 三星ダイヤモンド工業株式会社 Processing method and processing device of brittle material substrate
WO2015063370A1 (en) * 2013-11-04 2015-05-07 Ledil Oy Light guide with grooves for dividing by bending
CN117123940A (en) * 2023-10-23 2023-11-28 雄县路成纸塑包装有限公司 Laser cutting device of antistatic plastic

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280238B (en) * 2011-05-19 2015-02-25 广东风华高新科技股份有限公司 Method for manufacturing chip components
CN103212785A (en) * 2012-01-20 2013-07-24 豪晶科技股份有限公司 Laser processing method and processed piece formed through same
KR101641939B1 (en) * 2014-07-14 2016-07-22 한국미쯔보시다이아몬드공업(주) Apparatus and method for breaking substrate
DE102015000451A1 (en) * 2015-01-15 2016-07-21 Siltectra Gmbh Uneven Wafer and Method of Making an Uneven Wafer
TWI609754B (en) * 2015-09-29 2018-01-01 三星鑽石工業股份有限公司 Fragmentation method of brittle substrate
KR101980606B1 (en) * 2017-08-29 2019-05-21 한국미쯔보시다이아몬드공업(주) Tilting type panel breaking device of brittle material substrate and tilting type panel breaking method using the same
CN112620965A (en) * 2019-10-08 2021-04-09 台湾丽驰科技股份有限公司 Dual laser processing machine and processing method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3027768B2 (en) * 1993-04-02 2000-04-04 フォノン テクノロジー リミテッド Method for cutting brittle nonmetallic material
JP2002316829A (en) * 2001-04-17 2002-10-31 Seiko Epson Corp Method for cutting glass substrate, method for manufacturing electro-optic device, electro-optic device, electronic apparatus and scribed groove former
JP2004155159A (en) * 2002-11-08 2004-06-03 Nippon Emikku:Kk Cutting-off equipment and cutting-off method
JP2004223796A (en) * 2003-01-21 2004-08-12 Kyoto Seisakusho Co Ltd Split processing method for fragile material
WO2006011608A1 (en) * 2004-07-30 2006-02-02 Mitsuboshi Diamond Industrial Co., Ltd. Vertical crack forming method and vertical crack forming device in substrate
JP2006248075A (en) * 2005-03-11 2006-09-21 Tohoku Pioneer Corp Method and apparatus for working substrate using laser beam

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179556A (en) * 2002-11-28 2004-06-24 Kyocera Corp Ceramic substrate, method for forming groove, and laser machining apparatus
JP4606325B2 (en) * 2003-01-29 2011-01-05 三星ダイヤモンド工業株式会社 Substrate cutting apparatus and substrate cutting method
JP2006131443A (en) * 2004-11-04 2006-05-25 Shibuya Kogyo Co Ltd Method and apparatus for cutting brittle material
JP4256840B2 (en) * 2004-12-24 2009-04-22 株式会社日本製鋼所 Laser cutting method and apparatus
JP5037138B2 (en) * 2005-01-05 2012-09-26 Ｔｈｋ株式会社 Work breaking method and device, scribing and breaking method, and scribing device with break function
KR100693934B1 (en) * 2006-03-24 2007-03-12 케이 이엔지(주) Glass cutting apparatus with bending member and method using thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3027768B2 (en) * 1993-04-02 2000-04-04 フォノン テクノロジー リミテッド Method for cutting brittle nonmetallic material
JP2002316829A (en) * 2001-04-17 2002-10-31 Seiko Epson Corp Method for cutting glass substrate, method for manufacturing electro-optic device, electro-optic device, electronic apparatus and scribed groove former
JP2004155159A (en) * 2002-11-08 2004-06-03 Nippon Emikku:Kk Cutting-off equipment and cutting-off method
JP2004223796A (en) * 2003-01-21 2004-08-12 Kyoto Seisakusho Co Ltd Split processing method for fragile material
WO2006011608A1 (en) * 2004-07-30 2006-02-02 Mitsuboshi Diamond Industrial Co., Ltd. Vertical crack forming method and vertical crack forming device in substrate
JP2006248075A (en) * 2005-03-11 2006-09-21 Tohoku Pioneer Corp Method and apparatus for working substrate using laser beam

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2261179A3 (en) * 2009-06-09 2013-09-18 Mitsuboshi Diamond Industrial Co., Ltd. Cooling nozzle, cooling method using the same, and brittle material substrate division method
KR101200789B1 (en) * 2009-06-30 2012-11-13 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for dividing brittle material substrate
KR101369211B1 (en) * 2010-08-27 2014-03-04 미쓰보시 다이야몬도 고교 가부시키가이샤 Laser cutting device
JP2014519982A (en) * 2011-04-06 2014-08-21 マウザー‐ヴェルケ オベルンドルフ マシーネンバウ ゲーエムベーハー Method, workpiece and laser apparatus for breaking and dividing a workpiece
JP2012121071A (en) * 2012-03-23 2012-06-28 Mitsuboshi Diamond Industrial Co Ltd Laser beam machining method, method for dividing workpiece, and laser beam machining apparatus
JP2015062926A (en) * 2013-09-25 2015-04-09 三星ダイヤモンド工業株式会社 Processing method and processing device of brittle material substrate
JP2015062927A (en) * 2013-09-25 2015-04-09 三星ダイヤモンド工業株式会社 Processing method and processing device of brittle material substrate
WO2015063370A1 (en) * 2013-11-04 2015-05-07 Ledil Oy Light guide with grooves for dividing by bending
CN117123940A (en) * 2023-10-23 2023-11-28 雄县路成纸塑包装有限公司 Laser cutting device of antistatic plastic
CN117123940B (en) * 2023-10-23 2023-12-22 雄县路成纸塑包装有限公司 Laser cutting device of antistatic plastic

Also Published As

Publication number Publication date
JPWO2009057381A1 (en) 2011-03-10
KR101190173B1 (en) 2012-10-12
TW200920534A (en) 2009-05-16
JP5216017B2 (en) 2013-06-19
CN101842203A (en) 2010-09-22
KR20100077005A (en) 2010-07-06
TWI466749B (en) 2015-01-01

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