WO2009051071A1 - Panneau flexible - Google Patents
Panneau flexible Download PDFInfo
- Publication number
- WO2009051071A1 WO2009051071A1 PCT/JP2008/068440 JP2008068440W WO2009051071A1 WO 2009051071 A1 WO2009051071 A1 WO 2009051071A1 JP 2008068440 W JP2008068440 W JP 2008068440W WO 2009051071 A1 WO2009051071 A1 WO 2009051071A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesiveness
- board
- flexible
- flexible material
- flexible board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Abstract
La présente invention concerne un panneau flexible qui possède une adhésivité nécessaire pour un procédé qui consiste à découper le panneau en pièces et permet à un procédé subséquent de décollage d'être facilement réalisé. Le panneau flexible est utilisé en étant décollé à partir d'un panneau de support. Le panneau flexible est pourvu d'une couche de matériau flexible (11) qui possède une première adhésivité, et une couche de matériau flexible (12) qui possède une seconde adhésivité inférieure à la première adhésivité de la couche de matériau flexible (11). Une surface mise en contact avec le panneau de support (20) se compose des couches de matériau flexible qui possèdent la première adhésivité et la seconde adhésivité. La couche de matériau flexible (11) qui possède la première adhésivité est positionnée dans le voisinage d'une surface de coupe pour entourer le voisinage de la surface de coupe.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007271087A JP2009099834A (ja) | 2007-10-18 | 2007-10-18 | 可撓性基板 |
JP2007-271087 | 2007-10-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009051071A1 true WO2009051071A1 (fr) | 2009-04-23 |
Family
ID=40567338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/068440 WO2009051071A1 (fr) | 2007-10-18 | 2008-10-10 | Panneau flexible |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2009099834A (fr) |
WO (1) | WO2009051071A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100203296A1 (en) * | 2009-02-10 | 2010-08-12 | Industrial Technology Research Institute | Transferring structure for flexible electronic device and method for fabricating flexible electronic device |
US20140356567A1 (en) * | 2013-06-03 | 2014-12-04 | Samsung Display Co., Ltd. | Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006032390A (ja) * | 2004-07-12 | 2006-02-02 | Seiko Epson Corp | ダイシングシートおよびその製造方法、半導体装置の製造方法 |
JP2007173811A (ja) * | 2005-12-22 | 2007-07-05 | Princo Corp | Ic整合基板とキャリアの結合構造、及びその製造方法と電子デバイスの製造方法 |
-
2007
- 2007-10-18 JP JP2007271087A patent/JP2009099834A/ja not_active Withdrawn
-
2008
- 2008-10-10 WO PCT/JP2008/068440 patent/WO2009051071A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006032390A (ja) * | 2004-07-12 | 2006-02-02 | Seiko Epson Corp | ダイシングシートおよびその製造方法、半導体装置の製造方法 |
JP2007173811A (ja) * | 2005-12-22 | 2007-07-05 | Princo Corp | Ic整合基板とキャリアの結合構造、及びその製造方法と電子デバイスの製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100203296A1 (en) * | 2009-02-10 | 2010-08-12 | Industrial Technology Research Institute | Transferring structure for flexible electronic device and method for fabricating flexible electronic device |
US8715802B2 (en) * | 2009-02-10 | 2014-05-06 | Industrial Technology Research Institute | Transferring structure for flexible electronic device and method for fabricating flexible electronic device |
US20140356567A1 (en) * | 2013-06-03 | 2014-12-04 | Samsung Display Co., Ltd. | Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same |
US9437820B2 (en) * | 2013-06-03 | 2016-09-06 | Samsung Display Co., Ltd. | Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2009099834A (ja) | 2009-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008053299A3 (fr) | Procédés et appareil permettant de peler une feuille souple à partir d'un substrat | |
TW200717634A (en) | Film separation method and film separation apparatus | |
WO2010027507A3 (fr) | Stratifiés de psa lavables | |
WO2011063089A3 (fr) | Adhésifs à surface modifiée | |
MY139597A (en) | Film peeling method and film peeling device | |
TW200616773A (en) | Cutting process of laminated material, cutting mechanism and cutting board of laminated material | |
TW200644106A (en) | Support board separating apparatus, and support board separating method using the same | |
JP2012028760A5 (ja) | 半導体装置の作製方法 | |
IN2014CN04740A (fr) | ||
MY147978A (en) | Wafer cutting method | |
WO2008063761A3 (fr) | Procédé de conditionnement d'un dispositif faisant appel à une couche diélectrique | |
TW200715924A (en) | Sticking device and sticking method for thin sheet film | |
WO2008093120A3 (fr) | Revêtements protecteurs | |
TW200604309A (en) | Heat-peelable adhesive sheet and processing method for an adherend using the heat-peelable adhesive sheet | |
MY143700A (en) | Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension | |
WO2005101465A3 (fr) | Procede et systeme pour la technique des reseaux tridimensionnels | |
WO2011063082A3 (fr) | Adhésifs à surface modifiée | |
GB2483607A (en) | A method of manufacturing a flexible, impact-resistant material | |
WO2009063793A1 (fr) | Ruban adhésif utilisable pour le traitement d'une plaquette semi-conductrice | |
ATE492474T1 (de) | MASCHINE ZUM UMWICKELN MIT EINER GEMEINSAMEN ETIKETT VON MINDESTENS ZWEI GRUPPIERTEN GEFÄßEN SOWIE VERFAHREN ZUM AUSRICHTEN VON ZWEI GRUPPIERTEN GEFÄßEN | |
GB201215891D0 (en) | Composite material comprising a layer of polymeric piezoelectic material matched with a textile substrate and method for making such a composite material | |
WO2008129815A1 (fr) | Pré-imprégné avec support, procédé de fabrication du pré-imprégné, planche de câblage imprimé multicouche et dispositif semiconducteur | |
TW200744930A (en) | Apparatus for adhering adhesive tape | |
TW201129470A (en) | Surface protective sheet | |
MX2013001610A (es) | Aplicador de dosis sencilla para material autoadhesivo en tazas de inodoro. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08840469 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08840469 Country of ref document: EP Kind code of ref document: A1 |