WO2009051071A1 - Flexible board - Google Patents

Flexible board Download PDF

Info

Publication number
WO2009051071A1
WO2009051071A1 PCT/JP2008/068440 JP2008068440W WO2009051071A1 WO 2009051071 A1 WO2009051071 A1 WO 2009051071A1 JP 2008068440 W JP2008068440 W JP 2008068440W WO 2009051071 A1 WO2009051071 A1 WO 2009051071A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesiveness
board
flexible
flexible material
flexible board
Prior art date
Application number
PCT/JP2008/068440
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Ito
Original Assignee
Olympus Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corporation filed Critical Olympus Corporation
Publication of WO2009051071A1 publication Critical patent/WO2009051071A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Abstract

Provided is a flexible board, which has adhesiveness required for a process of dicing the board into pieces and permits a subsequent peeling process to be easily performed. The flexible board is used by being peeled from a supporting board. The flexible board is provided with a flexible material layer (11) having first adhesiveness, and a flexible material layer (12) having second adhesiveness lower than the first adhesiveness of the flexible material layer (11). A surface brought into contact with the supporting board (20) is composed of the flexible material layers having the first adhesiveness and the second adhesiveness. The flexiblematerial layer (11) having the first adhesiveness is positioned at the vicinity of a cutting surface to surround the vicinity of the cutting surface.
PCT/JP2008/068440 2007-10-18 2008-10-10 Flexible board WO2009051071A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-271087 2007-10-18
JP2007271087A JP2009099834A (en) 2007-10-18 2007-10-18 Flexible substrate

Publications (1)

Publication Number Publication Date
WO2009051071A1 true WO2009051071A1 (en) 2009-04-23

Family

ID=40567338

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068440 WO2009051071A1 (en) 2007-10-18 2008-10-10 Flexible board

Country Status (2)

Country Link
JP (1) JP2009099834A (en)
WO (1) WO2009051071A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100203296A1 (en) * 2009-02-10 2010-08-12 Industrial Technology Research Institute Transferring structure for flexible electronic device and method for fabricating flexible electronic device
US20140356567A1 (en) * 2013-06-03 2014-12-04 Samsung Display Co., Ltd. Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032390A (en) * 2004-07-12 2006-02-02 Seiko Epson Corp Dicing sheet, its manufacturing method, and manufacturing method of semiconductor device
JP2007173811A (en) * 2005-12-22 2007-07-05 Princo Corp Coupling structure of ic aligning substrate and carrier, manufacturing method of the same, and manufacturing method of electronic device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032390A (en) * 2004-07-12 2006-02-02 Seiko Epson Corp Dicing sheet, its manufacturing method, and manufacturing method of semiconductor device
JP2007173811A (en) * 2005-12-22 2007-07-05 Princo Corp Coupling structure of ic aligning substrate and carrier, manufacturing method of the same, and manufacturing method of electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100203296A1 (en) * 2009-02-10 2010-08-12 Industrial Technology Research Institute Transferring structure for flexible electronic device and method for fabricating flexible electronic device
US8715802B2 (en) * 2009-02-10 2014-05-06 Industrial Technology Research Institute Transferring structure for flexible electronic device and method for fabricating flexible electronic device
US20140356567A1 (en) * 2013-06-03 2014-12-04 Samsung Display Co., Ltd. Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same
US9437820B2 (en) * 2013-06-03 2016-09-06 Samsung Display Co., Ltd. Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same

Also Published As

Publication number Publication date
JP2009099834A (en) 2009-05-07

Similar Documents

Publication Publication Date Title
WO2008053299A3 (en) Methods and apparatus for peeling a flexible sheet from a substrate
TW200717634A (en) Film separation method and film separation apparatus
WO2010027507A3 (en) Washable psa laminates
WO2009047900A1 (en) Plasma processing apparatus
MY165350A (en) Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
WO2011063089A3 (en) Surface-modified adhesives
TW200618158A (en) Film peeling method and film peeling device
TW200616773A (en) Cutting process of laminated material, cutting mechanism and cutting board of laminated material
TW200644106A (en) Support board separating apparatus, and support board separating method using the same
JP2012028760A5 (en) Method for manufacturing semiconductor device
IN2014CN04740A (en)
MY147978A (en) Wafer cutting method
WO2008063761A3 (en) Method of packaging a device using a dielectric layer
TW200715924A (en) Sticking device and sticking method for thin sheet film
WO2008093120A3 (en) Protective coatings
MY143700A (en) Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension
WO2005101465A3 (en) Method and system for lattice space engineering
WO2011063082A3 (en) Surface-modified adhesives
GB2483607A (en) A method of manufacturing a flexible, impact-resistant material
WO2009063793A1 (en) Adhesive tape for processing semiconductor wafer
GB201215891D0 (en) Composite material comprising a layer of polymeric piezoelectic material matched with a textile substrate and method for making such a composite material
WO2008129815A1 (en) Prepreg with carrier, method for manufacturing the prepreg, multilayered printed wiring board, and semiconductor device
TW200744930A (en) Apparatus for adhering adhesive tape
TW200714154A (en) Multilayered structure forming method
EP4105289A3 (en) Double-sided pressure-sensitive adhesive tape

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08840469

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08840469

Country of ref document: EP

Kind code of ref document: A1