WO2009044695A1 - Method and the like for mounting electronic component - Google Patents

Method and the like for mounting electronic component Download PDF

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Publication number
WO2009044695A1
WO2009044695A1 PCT/JP2008/067621 JP2008067621W WO2009044695A1 WO 2009044695 A1 WO2009044695 A1 WO 2009044695A1 JP 2008067621 W JP2008067621 W JP 2008067621W WO 2009044695 A1 WO2009044695 A1 WO 2009044695A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
conductive adhesive
particles
substrate
solder
Prior art date
Application number
PCT/JP2008/067621
Other languages
French (fr)
Japanese (ja)
Inventor
Tomohiro Nishiyama
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009536036A priority Critical patent/JP5560713B2/en
Publication of WO2009044695A1 publication Critical patent/WO2009044695A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

Provided is an electronic component mounting method by which generation of bridge between terminals, unbonded bumps and residual particles, which could be factors in reliability deterioration of the electronic component, are suppressed. Specifically, in the method, a first electronic component or a substrate (10), and a second electronic component or a substrate (20) are mounted by solder-bonding facing electrode terminals (11, 21) by agglutinating and integrating particles (31) contained in a conductive adhesive (30). At least on the surface of one of the electrode terminals (11, 21), a suction film (101) is formed to protrude from the electrode terminal. The suction film (101) has a melting point higher than that of the solder particles (31) in the conductive adhesive and lower than the hardening temperature of a resin component (32) of the conductive adhesive.
PCT/JP2008/067621 2007-10-05 2008-09-29 Method and the like for mounting electronic component WO2009044695A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009536036A JP5560713B2 (en) 2007-10-05 2008-09-29 Electronic component mounting method, etc.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-261596 2007-10-05
JP2007261596 2007-10-05

Publications (1)

Publication Number Publication Date
WO2009044695A1 true WO2009044695A1 (en) 2009-04-09

Family

ID=40526124

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067621 WO2009044695A1 (en) 2007-10-05 2008-09-29 Method and the like for mounting electronic component

Country Status (2)

Country Link
JP (1) JP5560713B2 (en)
WO (1) WO2009044695A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102456658A (en) * 2010-10-20 2012-05-16 三星电子株式会社 Semiconductor package and method of forming the same
WO2015154236A1 (en) * 2014-04-09 2015-10-15 GM Global Technology Operations LLC Systems and methods for reinforced adhesive bonding
JP2016178177A (en) * 2015-03-19 2016-10-06 新光電気工業株式会社 Wiring board, electronic component device, and method for manufacturing electronic component device
CN113130457A (en) * 2019-12-31 2021-07-16 Tcl集团股份有限公司 Light source plate, preparation method thereof and display

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004260131A (en) * 2003-02-05 2004-09-16 Japan Science & Technology Agency Connection method between terminals, and packaging method of semiconductor device
WO2006098196A1 (en) * 2005-03-17 2006-09-21 Matsushita Electric Industrial Co., Ltd. Package equipped with semiconductor chip and method for producing same
JP2008078238A (en) * 2006-09-19 2008-04-03 Nec Corp Structure and method for mounting electronic component
WO2008075537A1 (en) * 2006-12-18 2008-06-26 Panasonic Corporation Electrode structure and method for forming bump

Family Cites Families (6)

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