WO2009041247A1 - 信号伝送基板 - Google Patents
信号伝送基板 Download PDFInfo
- Publication number
- WO2009041247A1 WO2009041247A1 PCT/JP2008/066083 JP2008066083W WO2009041247A1 WO 2009041247 A1 WO2009041247 A1 WO 2009041247A1 JP 2008066083 W JP2008066083 W JP 2008066083W WO 2009041247 A1 WO2009041247 A1 WO 2009041247A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- parts
- signal wiring
- signal transmission
- transmission board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Dc Digital Transmission (AREA)
- Waveguides (AREA)
Abstract
第1の信号配線は、第1の層に配された部分と第2の層に配された部分とを含んでいる。第1の層に配された部分と第2の層に配された部分とが所定位置で接続されている。第2の信号配線は、第1の信号配線の第1の層に配された部分と合計の長さが等しい第1の層に配された部分と、第1の信号配線の第2の層に配された部分と合計の長さが等しい第2の層に配された部分とを含んでいる。第1の層に配された部分と第2の層に配された部分との接続位置が第1の信号配線と異なる。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007251156A JP4934856B2 (ja) | 2007-09-27 | 2007-09-27 | 信号伝送基板 |
JP2007-251156 | 2007-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009041247A1 true WO2009041247A1 (ja) | 2009-04-02 |
Family
ID=40511136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/066083 WO2009041247A1 (ja) | 2007-09-27 | 2008-09-05 | 信号伝送基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4934856B2 (ja) |
WO (1) | WO2009041247A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012199904A (ja) * | 2011-03-08 | 2012-10-18 | Japan Oclaro Inc | 差動伝送回路、光送受信モジュール、及び情報処理装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5473688B2 (ja) * | 2010-03-12 | 2014-04-16 | 三菱電機株式会社 | 伝送線路 |
JP2022184342A (ja) | 2021-06-01 | 2022-12-13 | 富士通株式会社 | 設計プログラム、設計方法、プリント配線板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08181669A (ja) * | 1994-12-27 | 1996-07-12 | Matsushita Electric Ind Co Ltd | クロック妨害抑制装置 |
JP2005268649A (ja) * | 2004-03-19 | 2005-09-29 | Sony Corp | 基板、光ピックアップ及び光ディスクドライブ |
JP2007142307A (ja) * | 2005-11-22 | 2007-06-07 | Hitachi Ltd | 高速差動信号用多層基板、通信装置およびデータ記憶装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07245575A (ja) * | 1994-03-04 | 1995-09-19 | Oki Electric Ind Co Ltd | 複数信号平行伝送路 |
JPH11251779A (ja) * | 1998-03-02 | 1999-09-17 | Toshiba Corp | 半導体装置 |
JP2001267701A (ja) * | 2000-03-21 | 2001-09-28 | Ricoh Co Ltd | プリント基板 |
JP2001339442A (ja) * | 2000-05-25 | 2001-12-07 | Mitsubishi Electric Corp | 信号伝送方式 |
JP2005072961A (ja) * | 2003-08-25 | 2005-03-17 | Kawasaki Microelectronics Kk | 信号伝送回路 |
JP2007195055A (ja) * | 2006-01-20 | 2007-08-02 | Sharp Corp | 信号伝送装置 |
JP2008227376A (ja) * | 2007-03-15 | 2008-09-25 | Toshiba Corp | 伝送基板及びコンピュータ |
-
2007
- 2007-09-27 JP JP2007251156A patent/JP4934856B2/ja active Active
-
2008
- 2008-09-05 WO PCT/JP2008/066083 patent/WO2009041247A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08181669A (ja) * | 1994-12-27 | 1996-07-12 | Matsushita Electric Ind Co Ltd | クロック妨害抑制装置 |
JP2005268649A (ja) * | 2004-03-19 | 2005-09-29 | Sony Corp | 基板、光ピックアップ及び光ディスクドライブ |
JP2007142307A (ja) * | 2005-11-22 | 2007-06-07 | Hitachi Ltd | 高速差動信号用多層基板、通信装置およびデータ記憶装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012199904A (ja) * | 2011-03-08 | 2012-10-18 | Japan Oclaro Inc | 差動伝送回路、光送受信モジュール、及び情報処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2009081378A (ja) | 2009-04-16 |
JP4934856B2 (ja) | 2012-05-23 |
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