WO2009041106A1 - Support de substance fluorescente, procédé de production de ce support, et diode luminescente utilisant le support - Google Patents

Support de substance fluorescente, procédé de production de ce support, et diode luminescente utilisant le support Download PDF

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Publication number
WO2009041106A1
WO2009041106A1 PCT/JP2008/058331 JP2008058331W WO2009041106A1 WO 2009041106 A1 WO2009041106 A1 WO 2009041106A1 JP 2008058331 W JP2008058331 W JP 2008058331W WO 2009041106 A1 WO2009041106 A1 WO 2009041106A1
Authority
WO
WIPO (PCT)
Prior art keywords
fluorescent substance
supported carrier
supported
producing
carrier
Prior art date
Application number
PCT/JP2008/058331
Other languages
English (en)
Japanese (ja)
Inventor
Akihito Raikubo
Toshio Shimada
Haruhiro Kato
Original Assignee
Okaya Electric Industries Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okaya Electric Industries Co., Ltd. filed Critical Okaya Electric Industries Co., Ltd.
Publication of WO2009041106A1 publication Critical patent/WO2009041106A1/fr

Links

Classifications

    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
    • D06M23/08—Processes in which the treating agent is applied in powder or granular form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)

Abstract

L'invention concerne un support de substance fluorescente à haute luminosité qui permet d'augmenter la quantité de substance fluorescente supportée sur un substrat. On décrit un support de substance fluorescente (10) qui comprend un substrat (14) en tissu non tissé comportant un certain nombre d'espaces (16) entre les fibres (12). Une substance fluorescente (18) est supportée sur la surface des fibres (12). Un liant transparent à la lumière (20) contenant ladite substance (18) ajoutée vient remplir tous les espaces (16) entre les fibres (12). Il existe en outre un support de substance fluorescente (30) qui comprend un substrat (32) constitué d'un élément poreux élastique du type éponge avec un certain nombre de pores (34), et un liant transparent à la lumière (20) qui contient une substance fluorescente (18) ajoutée et venant remplir tous les pores (34).
PCT/JP2008/058331 2007-09-28 2008-05-01 Support de substance fluorescente, procédé de production de ce support, et diode luminescente utilisant le support WO2009041106A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-255225 2007-09-28
JP2007255225A JP2009084402A (ja) 2007-09-28 2007-09-28 蛍光物質担持体及びその製造方法、上記蛍光物質担持体を用いた発光ダイオード

Publications (1)

Publication Number Publication Date
WO2009041106A1 true WO2009041106A1 (fr) 2009-04-02

Family

ID=40511008

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058331 WO2009041106A1 (fr) 2007-09-28 2008-05-01 Support de substance fluorescente, procédé de production de ce support, et diode luminescente utilisant le support

Country Status (2)

Country Link
JP (1) JP2009084402A (fr)
WO (1) WO2009041106A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010003791A (ja) * 2008-06-19 2010-01-07 Okaya Electric Ind Co Ltd 発光ダイオード及びその製造方法
DE102015102406A1 (de) * 2015-02-20 2016-08-25 Deutsche Institute Für Textil- Und Faserforschung Denkendorf Leuchtmittelanordnung und Verfahren zu deren Herstellung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102409965B1 (ko) * 2015-06-08 2022-06-16 삼성전자주식회사 발광소자 패키지, 파장 변환 필름 및 그 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347116A (ja) * 1989-03-20 1991-02-28 Advanced Polymer Syst Inc 放出量の制御された機能性物質を含浸した布帛
JPH05132865A (ja) * 1991-11-14 1993-05-28 Kao Corp 衣料用柔軟仕上げ剤
JP2004256961A (ja) * 2003-02-27 2004-09-16 Toray Ind Inc 強化繊維基材の製造方法および該基材を用いた複合材料の製造方法
JP2006286999A (ja) * 2005-04-01 2006-10-19 Okaya Electric Ind Co Ltd 発光ダイオード及びその製造方法
JP2006282685A (ja) * 2005-03-31 2006-10-19 Okaya Electric Ind Co Ltd 蛍光体担持体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347116A (ja) * 1989-03-20 1991-02-28 Advanced Polymer Syst Inc 放出量の制御された機能性物質を含浸した布帛
JPH05132865A (ja) * 1991-11-14 1993-05-28 Kao Corp 衣料用柔軟仕上げ剤
JP2004256961A (ja) * 2003-02-27 2004-09-16 Toray Ind Inc 強化繊維基材の製造方法および該基材を用いた複合材料の製造方法
JP2006282685A (ja) * 2005-03-31 2006-10-19 Okaya Electric Ind Co Ltd 蛍光体担持体
JP2006286999A (ja) * 2005-04-01 2006-10-19 Okaya Electric Ind Co Ltd 発光ダイオード及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010003791A (ja) * 2008-06-19 2010-01-07 Okaya Electric Ind Co Ltd 発光ダイオード及びその製造方法
DE102015102406A1 (de) * 2015-02-20 2016-08-25 Deutsche Institute Für Textil- Und Faserforschung Denkendorf Leuchtmittelanordnung und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
JP2009084402A (ja) 2009-04-23

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