WO2009038022A1 - Compound seal member - Google Patents

Compound seal member Download PDF

Info

Publication number
WO2009038022A1
WO2009038022A1 PCT/JP2008/066559 JP2008066559W WO2009038022A1 WO 2009038022 A1 WO2009038022 A1 WO 2009038022A1 JP 2008066559 W JP2008066559 W JP 2008066559W WO 2009038022 A1 WO2009038022 A1 WO 2009038022A1
Authority
WO
WIPO (PCT)
Prior art keywords
seal member
fitted
seal
corrosive
performances
Prior art date
Application number
PCT/JP2008/066559
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Muramatsu
Original Assignee
Nippon Valqua Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Valqua Industries, Ltd. filed Critical Nippon Valqua Industries, Ltd.
Priority to JP2009533123A priority Critical patent/JP5126995B2/en
Publication of WO2009038022A1 publication Critical patent/WO2009038022A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
    • F16J15/104—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by structure

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Gasket Seals (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Provided is a compound seal member, which has performances such as a vacuum seal performance, a plasma resistance and a corrosive-gas resistance altogether, which has no vacuum sealing performance degraded even after repeated uses, which has no metal particle formed when used, which can be applied to the so-called 'dove-tail groove' used generally in a semiconductor manufacturing apparatus, and which has the performances such as the plasma resistance or the corrosive-gas resistance degraded even if used in a place opened/closed repeatedly. A first seal member (6) is constituted of an annular seal body (6A), an annular bulge (6B) protruded radially inward from the inner circumference side of the seal body (6A), and a fitted portion (6C) protruded radially inward from the annular bulge (6B). Moreover, a second seal member (8) is equipped with a fitted recess (8A) having a shape generally complementary to the fitted portion (6C), and a bent portion (8B) extending from the fitted recess (8A) toward a stepped portion (6D).
PCT/JP2008/066559 2007-09-21 2008-09-12 Compound seal member WO2009038022A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009533123A JP5126995B2 (en) 2007-09-21 2008-09-12 Composite sealing material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-245236 2007-09-21
JP2007245236 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038022A1 true WO2009038022A1 (en) 2009-03-26

Family

ID=40467838

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066559 WO2009038022A1 (en) 2007-09-21 2008-09-12 Compound seal member

Country Status (3)

Country Link
JP (1) JP5126995B2 (en)
TW (1) TWI414700B (en)
WO (1) WO2009038022A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010113079A3 (en) * 2009-03-31 2011-04-21 Sacmi Cooperativa Meccanici Imola Societa' Cooperativa Apparatus for blow-moulding parisons
WO2011119916A1 (en) 2010-03-25 2011-09-29 Parker-Hannifin Corporation Substrate processing apparatus with composite seal
TWI594347B (en) * 2012-10-09 2017-08-01 Nippon Valqua Industries Ltd Composite seal body
CN113969980A (en) * 2020-07-23 2022-01-25 中国科学院微电子研究所 Vacuum device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401376B (en) * 2011-01-21 2013-07-11 Chime Ball Technology Co Ltd Piston airtight device
JP6809917B2 (en) * 2017-01-31 2021-01-06 株式会社バルカー Composite sealing material
KR20210011030A (en) * 2018-08-02 2021-01-29 주식회사 발카 Composite sealing material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001124213A (en) * 1999-09-27 2001-05-11 Green Tweed Of Delaware Inc Seal, and protective shield
JP2005330988A (en) * 2004-05-18 2005-12-02 Mitsubishi Cable Ind Ltd Seal material
JP2007120738A (en) * 2005-09-30 2007-05-17 Tokyo Electron Ltd Sealing part and substrate processing apparatus
JP2008202787A (en) * 2007-02-21 2008-09-04 Ti Group Automotive Systems Llc Combined seal

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833228A (en) * 1973-07-19 1974-09-03 Chenprene Inc Stackable sealing mechanism
WO2007094228A1 (en) * 2006-02-14 2007-08-23 Nippon Valqua Industries, Ltd. Composite seal

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001124213A (en) * 1999-09-27 2001-05-11 Green Tweed Of Delaware Inc Seal, and protective shield
JP2005330988A (en) * 2004-05-18 2005-12-02 Mitsubishi Cable Ind Ltd Seal material
JP2007120738A (en) * 2005-09-30 2007-05-17 Tokyo Electron Ltd Sealing part and substrate processing apparatus
JP2008202787A (en) * 2007-02-21 2008-09-04 Ti Group Automotive Systems Llc Combined seal

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010113079A3 (en) * 2009-03-31 2011-04-21 Sacmi Cooperativa Meccanici Imola Societa' Cooperativa Apparatus for blow-moulding parisons
WO2011119916A1 (en) 2010-03-25 2011-09-29 Parker-Hannifin Corporation Substrate processing apparatus with composite seal
US8623145B2 (en) 2010-03-25 2014-01-07 Parker-Hannifin Corporation Substrate processing apparatus with composite seal
TWI594347B (en) * 2012-10-09 2017-08-01 Nippon Valqua Industries Ltd Composite seal body
US9892945B2 (en) 2012-10-09 2018-02-13 Nippon Valqua Industries, Ltd. Composite seal
CN113969980A (en) * 2020-07-23 2022-01-25 中国科学院微电子研究所 Vacuum device

Also Published As

Publication number Publication date
TWI414700B (en) 2013-11-11
TW200914755A (en) 2009-04-01
JPWO2009038022A1 (en) 2011-01-06
JP5126995B2 (en) 2013-01-23

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