WO2009037739A1 - プリント回路板間設計処理装置、プリント回路板間設計処理プログラムおよびプリント回路板間設計処理方法 - Google Patents

プリント回路板間設計処理装置、プリント回路板間設計処理プログラムおよびプリント回路板間設計処理方法 Download PDF

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Publication number
WO2009037739A1
WO2009037739A1 PCT/JP2007/068087 JP2007068087W WO2009037739A1 WO 2009037739 A1 WO2009037739 A1 WO 2009037739A1 JP 2007068087 W JP2007068087 W JP 2007068087W WO 2009037739 A1 WO2009037739 A1 WO 2009037739A1
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WO
WIPO (PCT)
Prior art keywords
inter
printed
circuit
board design
design processing
Prior art date
Application number
PCT/JP2007/068087
Other languages
English (en)
French (fr)
Inventor
Yoshitaka Nishio
Eiichi Konno
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/068087 priority Critical patent/WO2009037739A1/ja
Publication of WO2009037739A1 publication Critical patent/WO2009037739A1/ja

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　プリント回路板間設計処理装置は、複数のプリント回路板のプリント回路板データを基板データ、および複数のプリント回路板間の接続関係を示す基板間接続条件ファイルを予め記憶している。そして、プリント回路板間設計処理装置は、基板データおよび基板間接続条件ファイルを読み込んで、複数のプリント回路板間を跨ぐ信号の接続経路をトレースしてトレース情報を抽出する。プリント回路板間設計処理装置は、抽出したトレース情報に基づいて信号の遅延時間および減衰量を算出し、トレース情報、信号の遅延時間および減衰量を対応付けて格納する。
PCT/JP2007/068087 2007-09-18 2007-09-18 プリント回路板間設計処理装置、プリント回路板間設計処理プログラムおよびプリント回路板間設計処理方法 WO2009037739A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/068087 WO2009037739A1 (ja) 2007-09-18 2007-09-18 プリント回路板間設計処理装置、プリント回路板間設計処理プログラムおよびプリント回路板間設計処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/068087 WO2009037739A1 (ja) 2007-09-18 2007-09-18 プリント回路板間設計処理装置、プリント回路板間設計処理プログラムおよびプリント回路板間設計処理方法

Publications (1)

Publication Number Publication Date
WO2009037739A1 true WO2009037739A1 (ja) 2009-03-26

Family

ID=40467572

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/068087 WO2009037739A1 (ja) 2007-09-18 2007-09-18 プリント回路板間設計処理装置、プリント回路板間設計処理プログラムおよびプリント回路板間設計処理方法

Country Status (1)

Country Link
WO (1) WO2009037739A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010238170A (ja) * 2009-03-31 2010-10-21 Nec Corp 配線検証システム、配線検証方法、及び配線検証プログラム
JP2014123332A (ja) * 2012-12-21 2014-07-03 Fujitsu Ltd 解析プログラム、解析方法及び解析装置
JP2015087902A (ja) * 2013-10-30 2015-05-07 株式会社リコー 回路基板試作前検証システム、回路基板試作前検証装置および回路基板試作前検証プログラム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000123060A (ja) * 1998-10-16 2000-04-28 Hitachi Ltd 回路情報と線路情報との表示方法
JP2001325315A (ja) * 2000-05-16 2001-11-22 Fujitsu Ltd マルチｐｃｂ間接続設計支援装置
JP2003337841A (ja) * 2002-05-20 2003-11-28 Fujitsu Ltd Ｂｗｂ伝送配線設計システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000123060A (ja) * 1998-10-16 2000-04-28 Hitachi Ltd 回路情報と線路情報との表示方法
JP2001325315A (ja) * 2000-05-16 2001-11-22 Fujitsu Ltd マルチｐｃｂ間接続設計支援装置
JP2003337841A (ja) * 2002-05-20 2003-11-28 Fujitsu Ltd Ｂｗｂ伝送配線設計システム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010238170A (ja) * 2009-03-31 2010-10-21 Nec Corp 配線検証システム、配線検証方法、及び配線検証プログラム
US8312411B2 (en) 2009-03-31 2012-11-13 Nec Corporation Wiring verification system, wiring verification method, and wiring verification program product
JP2014123332A (ja) * 2012-12-21 2014-07-03 Fujitsu Ltd 解析プログラム、解析方法及び解析装置
JP2015087902A (ja) * 2013-10-30 2015-05-07 株式会社リコー 回路基板試作前検証システム、回路基板試作前検証装置および回路基板試作前検証プログラム

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