WO2009025254A1 - 包装状態での半導体基板の表面品質を迅速に評価する方法 - Google Patents

包装状態での半導体基板の表面品質を迅速に評価する方法 Download PDF

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Publication number
WO2009025254A1
WO2009025254A1 PCT/JP2008/064695 JP2008064695W WO2009025254A1 WO 2009025254 A1 WO2009025254 A1 WO 2009025254A1 JP 2008064695 W JP2008064695 W JP 2008064695W WO 2009025254 A1 WO2009025254 A1 WO 2009025254A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor substrate
surface quality
packaged state
temperature
tam
Prior art date
Application number
PCT/JP2008/064695
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English (en)
French (fr)
Inventor
Ryo Miyahara
Shinobu Nakamoto
Makoto Takiyama
Original Assignee
Siltronic Japan Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Siltronic Japan Corporation filed Critical Siltronic Japan Corporation
Publication of WO2009025254A1 publication Critical patent/WO2009025254A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

　包装状態での半導体基板の表面品質を迅速に評価する方法を提供する。 　本発明の包装状態での半導体基板の表面品質を迅速に評価する方法は、半導体基板を室温Ｔａｍで包装材料にて包装し、 （１）温度Ｔａｍより昇温して高温度Ｔｈｉで時間ｔｈｉ維持し、 （２）降温して低温度Ｔｌｏｗで時間ｔｌｏｗ維持し、 （３）昇温して室温Ｔａｍで時間ｔａｍ時間維持した後、 半導体基板の表面品質の劣化を検査することを特徴とする。 　本発明の方法により、包装状態での半導体基板の表面品質の劣化の程度を迅速に評価すること、半導体基板の使用前保存期限を推定すること、包装材料の品質の劣化の評価すること、及び劣化因子の同定することが可能となる。
PCT/JP2008/064695 2007-08-20 2008-08-18 包装状態での半導体基板の表面品質を迅速に評価する方法 WO2009025254A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007213661A JP2009049177A (ja) 2007-08-20 2007-08-20 包装状態での半導体基板の表面品質を迅速に評価する方法
JP2007-213661 2007-08-20

Publications (1)

Publication Number Publication Date
WO2009025254A1 true WO2009025254A1 (ja) 2009-02-26

Family

ID=40378156

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064695 WO2009025254A1 (ja) 2007-08-20 2008-08-18 包装状態での半導体基板の表面品質を迅速に評価する方法

Country Status (2)

Country Link
JP (1) JP2009049177A (ja)
WO (1) WO2009025254A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111052419A (zh) * 2017-08-30 2020-04-21 创光科学株式会社 发光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259254A (ja) * 1992-03-10 1993-10-08 Hitachi Cable Ltd 半導体ウェーハ収容容器の検査方法
JP2001151274A (ja) * 1999-11-25 2001-06-05 Nippon Steel Corp 保管容器
JP2006120859A (ja) * 2004-10-21 2006-05-11 Komatsu Electronic Metals Co Ltd 半導体ウェーハ収納用ケースの評価方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259254A (ja) * 1992-03-10 1993-10-08 Hitachi Cable Ltd 半導体ウェーハ収容容器の検査方法
JP2001151274A (ja) * 1999-11-25 2001-06-05 Nippon Steel Corp 保管容器
JP2006120859A (ja) * 2004-10-21 2006-05-11 Komatsu Electronic Metals Co Ltd 半導体ウェーハ収納用ケースの評価方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111052419A (zh) * 2017-08-30 2020-04-21 创光科学株式会社 发光装置
CN111052419B (zh) * 2017-08-30 2023-06-30 日机装株式会社 发光装置

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Publication number Publication date
JP2009049177A (ja) 2009-03-05

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