WO2009020180A1 - Snメッキ導電材料及びその製造方法並びに通電部品 - Google Patents
Snメッキ導電材料及びその製造方法並びに通電部品 Download PDFInfo
- Publication number
- WO2009020180A1 WO2009020180A1 PCT/JP2008/064224 JP2008064224W WO2009020180A1 WO 2009020180 A1 WO2009020180 A1 WO 2009020180A1 JP 2008064224 W JP2008064224 W JP 2008064224W WO 2009020180 A1 WO2009020180 A1 WO 2009020180A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive material
- plated conductive
- manufacturing
- carrying component
- electricity carrying
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
このSnメッキ導電材料は、導電性の金属からなる基材2の上に、Sn又はSn合金からなるSnメッキ層5が形成されたSnメッキ導電材料1であって、基材2とSnメッキ層5との積層方向に沿った断面において、Snメッキ層5の表層部分にAg-Sn粒子が凝集したAg-Sn合金層6が形成されている。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007205571 | 2007-08-07 | ||
JP2007-205571 | 2007-08-07 | ||
JP2008-185061 | 2008-07-16 | ||
JP2008185061A JP2009057630A (ja) | 2007-08-07 | 2008-07-16 | Snメッキ導電材料及びその製造方法並びに通電部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009020180A1 true WO2009020180A1 (ja) | 2009-02-12 |
Family
ID=40341411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/064224 WO2009020180A1 (ja) | 2007-08-07 | 2008-08-07 | Snメッキ導電材料及びその製造方法並びに通電部品 |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009020180A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2868773A4 (en) * | 2012-06-27 | 2016-05-25 | Jx Nippon Mining & Metals Corp | ELECTRONIC COMPONENT METALLIC MATERIAL AND MANUFACTURING METHOD THEREOF, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING SAID METALLIC ELECTRONIC COMPONENT MATERIAL |
EP3089277A4 (en) * | 2013-12-27 | 2017-08-23 | Hitachi Automotive Systems, Ltd. | In-vehicle electronic module |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5236529A (en) * | 1975-09-18 | 1977-03-19 | Nippon Electric Co | Method of surface treatment |
JPH0855521A (ja) * | 1994-08-10 | 1996-02-27 | Mitsubishi Shindoh Co Ltd | 通電部材およびその製造方法 |
JP2003171790A (ja) * | 2001-01-19 | 2003-06-20 | Furukawa Electric Co Ltd:The | めっき材料とその製造方法、それを用いた電気・電子部品 |
JP2005353542A (ja) * | 2004-06-14 | 2005-12-22 | Furukawa Electric Co Ltd:The | 導電性被覆材料とその製造方法、この被覆材料を用いたコネクタ端子または接点 |
JP2007284762A (ja) * | 2006-04-18 | 2007-11-01 | Sumitomo Metal Mining Co Ltd | スズめっき皮膜の形成方法および半導体装置 |
JP2008240018A (ja) * | 2007-03-26 | 2008-10-09 | Sumitomo Metal Mining Co Ltd | すずメッキ皮膜およびウィスカー防止方法 |
-
2008
- 2008-08-07 WO PCT/JP2008/064224 patent/WO2009020180A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5236529A (en) * | 1975-09-18 | 1977-03-19 | Nippon Electric Co | Method of surface treatment |
JPH0855521A (ja) * | 1994-08-10 | 1996-02-27 | Mitsubishi Shindoh Co Ltd | 通電部材およびその製造方法 |
JP2003171790A (ja) * | 2001-01-19 | 2003-06-20 | Furukawa Electric Co Ltd:The | めっき材料とその製造方法、それを用いた電気・電子部品 |
JP2005353542A (ja) * | 2004-06-14 | 2005-12-22 | Furukawa Electric Co Ltd:The | 導電性被覆材料とその製造方法、この被覆材料を用いたコネクタ端子または接点 |
JP2007284762A (ja) * | 2006-04-18 | 2007-11-01 | Sumitomo Metal Mining Co Ltd | スズめっき皮膜の形成方法および半導体装置 |
JP2008240018A (ja) * | 2007-03-26 | 2008-10-09 | Sumitomo Metal Mining Co Ltd | すずメッキ皮膜およびウィスカー防止方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2868773A4 (en) * | 2012-06-27 | 2016-05-25 | Jx Nippon Mining & Metals Corp | ELECTRONIC COMPONENT METALLIC MATERIAL AND MANUFACTURING METHOD THEREOF, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING SAID METALLIC ELECTRONIC COMPONENT MATERIAL |
US10826203B2 (en) | 2012-06-27 | 2020-11-03 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
EP3089277A4 (en) * | 2013-12-27 | 2017-08-23 | Hitachi Automotive Systems, Ltd. | In-vehicle electronic module |
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