WO2009020165A1 - フィルム光導波路パッケージ、フィルム光導波路モジュールおよび電子機器 - Google Patents

フィルム光導波路パッケージ、フィルム光導波路モジュールおよび電子機器 Download PDF

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Publication number
WO2009020165A1
WO2009020165A1 PCT/JP2008/064162 JP2008064162W WO2009020165A1 WO 2009020165 A1 WO2009020165 A1 WO 2009020165A1 JP 2008064162 W JP2008064162 W JP 2008064162W WO 2009020165 A1 WO2009020165 A1 WO 2009020165A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical waveguide
section
mounting surface
film optical
package
Prior art date
Application number
PCT/JP2008/064162
Other languages
English (en)
French (fr)
Inventor
Hiroshi Sameshima
Naru Yasuda
Hayami Hosokawa
Original Assignee
Omron Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corporation filed Critical Omron Corporation
Priority to US12/671,345 priority Critical patent/US8313252B2/en
Priority to CN2008801009311A priority patent/CN101765794B/zh
Priority to EP08792269A priority patent/EP2177937A1/en
Priority to KR1020107001094A priority patent/KR101161940B1/ko
Publication of WO2009020165A1 publication Critical patent/WO2009020165A1/ja

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G02B6/4242—Mounting of the optical light guide to the lid of the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages

Abstract

　光信号を発信または受信する発光部（７）または受信する受光部（９）を支持する支持部（５ａ）と、支持部（５ａ）を覆う蓋部（５ｂ）とにより形成されるパッケージ（５）において、支持部（５ａ）または蓋部（５ｂ）は、発光部（７）または受光部（９）と光学的に結合して光信号を伝送する光導波路（４）における、光信号の入出射口を含む少なくとも一方の端部を支持する光導波路実装面（２２）を有し、支持部（５ａ）または蓋部（５ｂ）における光導波路実装面（２２）から、該光導波路実装面（２２）に対向する蓋部（５ｂ）または支持部（５ａ）までの、該光導波路実装面（２２）に対して垂直方向となるＺ軸方向の長さ（Ｄ）が、光導波路（４）の、光導波路実装面（２２）に支持される領域におけるＺ軸方向の長さ（ｄ）よりも長い。これにより、振動等による衝撃を受けても、コア部の変形や破損が生じにくい構造を有する光導波路用のパッケージを提供することができる。
PCT/JP2008/064162 2007-08-07 2008-08-06 フィルム光導波路パッケージ、フィルム光導波路モジュールおよび電子機器 WO2009020165A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/671,345 US8313252B2 (en) 2007-08-07 2008-08-06 Film light guide package, film light guide module, and electronic device
CN2008801009311A CN101765794B (zh) 2007-08-07 2008-08-06 薄膜光波导封装、薄膜光波导模块以及电子设备
EP08792269A EP2177937A1 (en) 2007-08-07 2008-08-06 Film optical waveguide package, film optical waveguide module and electronic device
KR1020107001094A KR101161940B1 (ko) 2007-08-07 2008-08-06 필름 광도파로 패키지, 필름 광도파로 모듈 및 전자 기기

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007205895A JP2009042400A (ja) 2007-08-07 2007-08-07 フィルム光導波路パッケージ、フィルム光導波路モジュールおよび電子機器
JP2007-205895 2007-08-07

Publications (1)

Publication Number Publication Date
WO2009020165A1 true WO2009020165A1 (ja) 2009-02-12

Family

ID=40341397

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064162 WO2009020165A1 (ja) 2007-08-07 2008-08-06 フィルム光導波路パッケージ、フィルム光導波路モジュールおよび電子機器

Country Status (6)

Country Link
US (1) US8313252B2 (ja)
EP (1) EP2177937A1 (ja)
JP (1) JP2009042400A (ja)
KR (1) KR101161940B1 (ja)
CN (1) CN101765794B (ja)
WO (1) WO2009020165A1 (ja)

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JP5625138B1 (ja) * 2013-07-05 2014-11-12 古河電気工業株式会社 光モジュール、光モジュールの実装方法、光モジュール搭載回路基板、光モジュール評価キットシステム、回路基板および通信システム

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JP5477576B2 (ja) * 2010-03-08 2014-04-23 凸版印刷株式会社 光基板の製造方法
CN103210331A (zh) * 2010-11-19 2013-07-17 Fci公司 光学耦合设备、光学通信系统及制造方法
JP2012194207A (ja) * 2011-03-14 2012-10-11 Sumitomo Bakelite Co Ltd コネクタおよびコネクタ付き電気基板
JP2013050651A (ja) * 2011-08-31 2013-03-14 Omron Corp 光導波路、光伝送モジュールおよび電子機器
CN102981223B (zh) * 2012-12-07 2014-10-01 武汉光迅科技股份有限公司 一种光波导芯片与pd阵列的耦合封装结构
US9243784B2 (en) 2012-12-20 2016-01-26 International Business Machines Corporation Semiconductor photonic package
US9400356B2 (en) 2013-03-14 2016-07-26 International Business Machines Corporation Fiber pigtail with integrated lid
TWI575269B (zh) * 2013-04-10 2017-03-21 鴻海精密工業股份有限公司 光通訊裝置
US9059154B2 (en) * 2013-07-01 2015-06-16 Avago Technologies General Ip (Singapore) Pte. Ltd. Leadframe pocket
DE102014221728A1 (de) * 2014-10-24 2016-04-28 Technische Universität Dresden Anordnung elektro-optischer Bauelemente zur optischen Daten- und/oder Energieübertragung in einem Gehäuse
TWI584583B (zh) * 2016-06-08 2017-05-21 樹德科技大學 一種可引入導光調頻的封裝構造
CN106209254A (zh) * 2016-07-08 2016-12-07 河南仕佳光子科技股份有限公司 多波长混合集成接收器
WO2018094700A1 (zh) * 2016-11-25 2018-05-31 华为技术有限公司 一种光器件封装装置、光模块及光器件封装的方法
FR3079282B1 (fr) * 2018-03-20 2020-10-09 Psa Automobiles Sa Agencement pour vehicule automobile comprenant un element de carrosserie et un dispositif d’eclairage et/ou de signalisation implante dans ledit element de carrosserie
CA3107271A1 (en) * 2020-01-31 2021-07-31 Thorlabs, Inc. Low artifact, high speed, balanced optical detector array
JP7468280B2 (ja) * 2020-09-30 2024-04-16 住友大阪セメント株式会社 光導波路素子及びそれを用いた光変調デバイス並びに光送信装置
JP2022135003A (ja) * 2021-03-04 2022-09-15 住友電気工業株式会社 光コネクタケーブル
CN114895410B (zh) * 2022-05-27 2023-08-29 武汉光迅科技股份有限公司 一种基于倒置plc芯片的高速光发射组件及其制造方法

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Publication number Priority date Publication date Assignee Title
JP5625138B1 (ja) * 2013-07-05 2014-11-12 古河電気工業株式会社 光モジュール、光モジュールの実装方法、光モジュール搭載回路基板、光モジュール評価キットシステム、回路基板および通信システム
WO2015001681A1 (ja) * 2013-07-05 2015-01-08 古河電気工業株式会社 光モジュール、光モジュールの実装方法、光モジュール搭載回路基板、光モジュール評価キットシステム、回路基板および通信システム
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Also Published As

Publication number Publication date
KR101161940B1 (ko) 2012-07-04
US8313252B2 (en) 2012-11-20
CN101765794B (zh) 2011-12-21
JP2009042400A (ja) 2009-02-26
CN101765794A (zh) 2010-06-30
US20100202732A1 (en) 2010-08-12
EP2177937A1 (en) 2010-04-21
KR20100024992A (ko) 2010-03-08

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