WO2009019903A1 - Chip fuse and its manufacturing method - Google Patents

Chip fuse and its manufacturing method Download PDF

Info

Publication number
WO2009019903A1
WO2009019903A1 PCT/JP2008/053547 JP2008053547W WO2009019903A1 WO 2009019903 A1 WO2009019903 A1 WO 2009019903A1 JP 2008053547 W JP2008053547 W JP 2008053547W WO 2009019903 A1 WO2009019903 A1 WO 2009019903A1
Authority
WO
WIPO (PCT)
Prior art keywords
fuse
heat storage
storage layer
electrode portions
element portion
Prior art date
Application number
PCT/JP2008/053547
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuya Yamagishi
Hideki Seino
Hitoshi Sato
Original Assignee
Kamaya Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kamaya Electric Co., Ltd. filed Critical Kamaya Electric Co., Ltd.
Priority to CN2008800004039A priority Critical patent/CN101542670B/en
Publication of WO2009019903A1 publication Critical patent/WO2009019903A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H01H85/0056—Heat conducting or heat absorbing means associated with the fusible member, e.g. for providing time delay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/10—Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H01H2085/0414—Surface mounted fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits

Abstract

A chip fuse which is suppressed in temperature rise in steady operation in a high rated current region, has time lag type fusion characteristics, and has a high yield, and its manufacturing method, are provided. In the chip fuse, a heat storage layer (12) is formed on an insulation substrate (11), and a fuse film (13) is formed on the heat storage layer (12) so as not to be in contact with the insulation substrate (11). The fuse film (13) consists of front electrode portions (13a) disposed on both sides and a fuse element portion (13b) formed between the front electrode portions (13a). A protection layer (15) made of a material having a thermal conductivity higher than that of the heat storage layer (12) is formed between the front electrode portions (13a), covering the fuse element portion (13b). By forming the heat storage layer (12) in such a size not as to cover the whole area (11a) wherein the fuse element portion (13b) is to be formed, the protection layer (15) is partially brought into contact with the insulation substrate.
PCT/JP2008/053547 2007-08-08 2008-02-28 Chip fuse and its manufacturing method WO2009019903A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800004039A CN101542670B (en) 2007-08-08 2008-02-28 Chip fuse and its manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-206314 2007-08-08
JP2007206314A JP4510858B2 (en) 2007-08-08 2007-08-08 Chip fuse and manufacturing method thereof

Publications (1)

Publication Number Publication Date
WO2009019903A1 true WO2009019903A1 (en) 2009-02-12

Family

ID=40341142

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053547 WO2009019903A1 (en) 2007-08-08 2008-02-28 Chip fuse and its manufacturing method

Country Status (4)

Country Link
JP (1) JP4510858B2 (en)
KR (1) KR101037300B1 (en)
CN (1) CN101542670B (en)
WO (1) WO2009019903A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2573790A1 (en) * 2011-09-26 2013-03-27 Siemens Aktiengesellschaft Fuse element
EP2864996A2 (en) * 2012-08-24 2015-04-29 Siemens Aktiengesellschaft Fuse element

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5306139B2 (en) * 2009-10-08 2013-10-02 北陸電気工業株式会社 Chip fuse
JP5979654B2 (en) 2012-09-28 2016-08-24 釜屋電機株式会社 Chip fuse and manufacturing method thereof
JP6739922B2 (en) * 2015-10-27 2020-08-12 デクセリアルズ株式会社 Fuse element
CN105655213A (en) * 2016-04-08 2016-06-08 长沙三瑞传感技术有限公司 Fuse protector for overcurrent protection and manufacturing method of fuse protector
JP7368144B2 (en) * 2019-08-27 2023-10-24 Koa株式会社 Chip type current fuse

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000260765A (en) * 1999-03-05 2000-09-22 Matsushita Electronics Industry Corp Pattern formation method of organic insulating film
JP2000331590A (en) * 1999-03-18 2000-11-30 Koa Corp Circuit protection element and its manufacture
JP2003165239A (en) * 2001-11-29 2003-06-10 Kyocera Corp Manufacturing method for thermal head
JP2004319168A (en) * 2003-04-14 2004-11-11 Kamaya Denki Kk Chip fuse and its manufacturing method
JP2006344477A (en) * 2005-06-08 2006-12-21 Mitsubishi Materials Corp Chip type fuse

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
JPH0963454A (en) * 1995-08-29 1997-03-07 Kyocera Corp Chip fuse
US7570148B2 (en) * 2002-01-10 2009-08-04 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
DE102004033251B3 (en) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Fuse for a chip
CN100555500C (en) * 2006-09-04 2009-10-28 广东风华高新科技股份有限公司 Thick film sheet type fuse and manufacture method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000260765A (en) * 1999-03-05 2000-09-22 Matsushita Electronics Industry Corp Pattern formation method of organic insulating film
JP2000331590A (en) * 1999-03-18 2000-11-30 Koa Corp Circuit protection element and its manufacture
JP2003165239A (en) * 2001-11-29 2003-06-10 Kyocera Corp Manufacturing method for thermal head
JP2004319168A (en) * 2003-04-14 2004-11-11 Kamaya Denki Kk Chip fuse and its manufacturing method
JP2006344477A (en) * 2005-06-08 2006-12-21 Mitsubishi Materials Corp Chip type fuse

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2573790A1 (en) * 2011-09-26 2013-03-27 Siemens Aktiengesellschaft Fuse element
EP2864996A2 (en) * 2012-08-24 2015-04-29 Siemens Aktiengesellschaft Fuse element
US9893513B2 (en) 2012-08-24 2018-02-13 Siemens Aktiengesellschaft Fuse element

Also Published As

Publication number Publication date
KR20090040249A (en) 2009-04-23
CN101542670A (en) 2009-09-23
JP4510858B2 (en) 2010-07-28
CN101542670B (en) 2012-06-20
KR101037300B1 (en) 2011-05-26
JP2009043513A (en) 2009-02-26

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