WO2009018741A1 - Type d'appareil de climatisation à semi-conducteurs thermoélectriques pour réfrigération et chauffage - Google Patents

Type d'appareil de climatisation à semi-conducteurs thermoélectriques pour réfrigération et chauffage Download PDF

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Publication number
WO2009018741A1
WO2009018741A1 PCT/CN2008/071686 CN2008071686W WO2009018741A1 WO 2009018741 A1 WO2009018741 A1 WO 2009018741A1 CN 2008071686 W CN2008071686 W CN 2008071686W WO 2009018741 A1 WO2009018741 A1 WO 2009018741A1
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Prior art keywords
thermoelectric semiconductor
air conditioner
water tank
heat exchange
exchange water
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PCT/CN2008/071686
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English (en)
French (fr)
Inventor
Zhiping Wang
Original Assignee
Zhiping Wang
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Publication of WO2009018741A1 publication Critical patent/WO2009018741A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible

Definitions

  • the utility model relates to an air temperature regulator, in particular to a thermoelectric semiconductor double-system air conditioner. Background technique
  • the utility model utilizes the principle of thermoelectric effect to achieve the function of cooling or heating, and provides a thermoelectric semiconductor double-system air conditioner, which replaces the traditional old-fashioned refrigeration using freon refrigerant.
  • Air conditioners electricity consumption is 1 / 3 to 1 / 4 of the energy consumption of traditional air conditioners, small size, light weight, it cancels the filter of the existing air conditioner, and eliminates various pathogens to solve Existing air conditioners pollute the air, waste energy, run noise, make it difficult to manufacture and waste materials, and emit a lot of water vapor for a long time, causing people suffering from arthritis, frozen shoulder, air-conditioning disease, causing skin dryness and other problems.
  • thermoelectric semiconductor refrigeration component for cooling adopts low voltage, is safe to use, has long service life, reliable performance and no noise. It is small in size, light in weight, simple in structure, low in investment, low in cost, energy-saving and high-efficiency, and it also provides people with a certain amount of moisture. It is an environmentally friendly hot and cold dual-standard air conditioner, which can be used as an air conditioner. The preferred product for upgrading.
  • thermoelectric semiconductor dual-system air conditioner comprising a casing, a DC stabilized power supply, a thermoelectric semiconductor refrigeration plate connected in parallel thereto, a cold pole surface of the thermoelectric semiconductor refrigeration plate and a heat exchange water tank Connection
  • the high pressure pump is connected to the water outlet in the middle of the heat exchange water tank
  • the high pressure pump is connected with the capillary tube
  • the capillary tube is connected with the evaporator inlet pipe
  • the outlet pipe of the evaporator is connected with the heat exchange water tank at the lower water inlet, and is installed at the rear of the evaporator.
  • thermoelectric semiconductor refrigerating plate may be connected to a heat exchange water tank.
  • the DC regulated power supply is an adjustable regulated power supply.
  • thermoelectric semiconductor refrigeration plates are 8-40.
  • the liquid in the semiconductor thermoelectric heat exchange water tank is an antifreeze for automobiles.
  • thermoelectric semiconductor refrigeration plate The heat exchange water tank and the thermoelectric semiconductor refrigeration plate are connected to the inner side of the contact plate surface with a metal heat conduction block having a U-shaped longitudinal section.
  • the metal heat conducting block is made of an aluminum alloy material, and has the same number as the thermoelectric semiconductor refrigeration plate.
  • the thermoelectric semiconductor refrigeration does not require air compressor and refrigerant refrigeration, and is connected to the thermoelectric semiconductor refrigeration plate by a DC stabilized power supply.
  • the temperature of the air outlet is 5-15 ° C, and the temperature of the air outlet is 30-90 ° C when heating.
  • the same cooling and cooling effect of the air conditioner It has the characteristics of pollution-free and energy-saving, and solves the problem that the existing air conditioner must be cooled by air-compressed Freon refrigerant, causing air and noise pollution, environmental damage and energy consumption, achieving constant indoor temperature, no noise and exhaust gas pollution. , greatly saving energy.
  • the temperature rise rate can be controlled by adjusting the voltage to operate at a normal voltage of 6V-12V.
  • the water temperature of the water tank can be controlled at 5-15 °C within a few minutes. Because the thermoelectric semiconductor dual-system air conditioner has a series of advantages such as anti-vibration, pressure resistance, no refrigerant leakage and use of direct current, the utility model can also be widely applied in special occasions such as ships, railway locomotives, passenger cars and underground engineering, so Has significant economic benefits and very good development prospects.
  • thermoelectric semiconductor dual-system air conditioner of the present invention is a schematic view showing the principle of a thermoelectric semiconductor dual-system air conditioner of the present invention
  • thermoelectric semiconductor dual-system air conditioner of the present invention is a schematic view showing the refrigeration of the structure of the thermoelectric semiconductor dual-system air conditioner of the present invention
  • thermoelectric semiconductor dual-system air conditioner of the present invention is a schematic structural view of a thermoelectric semiconductor dual-system air conditioner of the present invention.
  • thermoelectric semiconductor dual-system air conditioner of the present invention is a schematic view showing the structure heating of the thermoelectric semiconductor dual-system air conditioner of the present invention
  • thermoelectric semiconductor dual-system air conditioner is composed of a thermoelectric semiconductor refrigeration device, an indoor evaporative heat sink, and an outdoor temperature discharge device. It is cooled (or heated) by the thermoelectric semiconductor refrigeration device, and the indoor evaporative heat sink blows cold air (or hot air) into the room, and the hot air (or cold air) is discharged to the outdoor by the outdoor heat exhaust device to form a temperature adjustment process. Realize indoor temperature control.
  • thermoelectric semiconductor dual-system air conditioner of the present invention includes a casing 1, a DC stabilized power supply 2, and a thermoelectric semiconductor refrigerating plate 3 connected thereto in parallel, and a cold pole surface of the thermoelectric semiconductor refrigerating plate 3 Connected to the heat exchange water tank 4, the water outlet in the middle of the heat exchange water tank 4 is connected to the high pressure pump 5, the high pressure pump 5 is connected to the capillary tube 6, the capillary tube 6 is connected to the inlet pipe of the evaporator 7, and the outlet pipe of the evaporator 7 is connected with the heat exchange water tank 4 The lower water inlet is connected, and an exhaust fan 8 is arranged behind the evaporator 7; a heat dissipating device 9 is arranged on the hot electrode surface of the thermoelectric semiconductor refrigerating plate 3, and the fan 10 and the exhaust pipe 11 are installed; in the heat exchange water tank 4 and The heat conductive block 12 is connected to the inner side of the contact surface of the thermoelectric
  • the air conditioner When the air conditioner is energized in this state, the cold surface of the thermoelectric semiconductor refrigerating plate 3 is cooled, and the temperature is directly transmitted to the heat exchange water tank 4 through the surface of the heat exchange water tank 4 which is in close contact. Since the heat transfer block 12 is mounted in the heat exchange water tank 4 at a position corresponding to the thermoelectric semiconductor refrigerating plate 3, it rapidly transfers the generated low temperature to the liquid 13 in the heat exchange water tank 4. In order to improve the efficiency, the liquid 13 can be used as an antifreeze for automobiles.
  • the liquid 13 to be cooled is injected into the evaporator through the capillary tube 6 through the high pressure pump 5 connected to the central water outlet of the heat exchange water tank 4, and flows through the evaporator 7 and then flows back from the outlet pipe of the evaporator 7 to the heat exchange.
  • the water tank 4 realizes liquid circulation.
  • An exhaust fan 8 is installed at the rear of the evaporator 7 to blow cold air into the chamber to cool down.
  • a heat dissipating device 9 is disposed on the hot surface of the thermoelectric semiconductor refrigerating plate 3, and the hot air generated by the hot surface is passed through the exhaust pipe through the fan 10. 11 discharge outside. Complete the effect of indoor cooling and cooling.
  • thermoelectric semiconductor refrigerating plate 3 can be connected to the heat exchange water tank 4.
  • the heat electrode of the air conditioner thermoelectric semiconductor refrigerating plate 3 is heated, and the heat is directly transmitted to the heat exchange water tank 4 through the surface of the heat exchange water tank 4 which is in close contact with each other. Since the heat transfer block 12 is installed in the heat exchange water tank 4 at a position corresponding to the thermoelectric semiconductor refrigerating plate 3, it rapidly transfers the generated heat temperature to the liquid 13 in the heat exchange water tank 4.
  • the heated liquid 13 is injected into the evaporator through the capillary 6 through the high pressure pump 5 connected to the central water outlet of the heat exchange water tank 4, flows through the evaporator 7, and then flows back from the outlet pipe of the evaporator 7 to heat exchange.
  • the water tank 4 realizes liquid circulation.
  • An exhaust fan 8 is installed on the rear side of the evaporator 7 to blow cold air into the chamber for heating.
  • a heat sink 9 is provided on the cold surface of the thermoelectric semiconductor refrigerating plate 3, and the cold air generated by the cold surface is discharged to the outside through the exhaust pipe 11 by the blower 10. Complete the role of indoor temperature protection.
  • the utility model relates to a DC stabilized power supply for a thermoelectric semiconductor double-system air conditioner.
  • the adjustable voltage source is used to adjust the voltage, and the number of the thermoelectric semiconductor refrigeration plates 3 is 8-40 according to the indoor area.
  • the liquid 13 of the heat exchange water tank 4 can be controlled at 5-15 °C in a few minutes.
  • the heat exchange block 12 is connected to the surface of the thermoelectric semiconductor refrigerating plate 3, and the heat conducting block 12 is made of an aluminum alloy material, which is the same as the thermoelectric semiconductor refrigerating plate 3.
  • the metal heat conducting block 12 adopts a U-shaped longitudinal section to increase the heating area.
  • Thermoelectric semiconductor dual-system air conditioner working with low voltage, that is, power saving and safety, large section Energy is available, and the temperature rise can be controlled by adjusting the voltage. It is easy to operate and suitable for both young and old. Whether it is cooling in the summer or heating in the winter, no noise and exhaust pollution are generated, and the indoor temperature is constant. Because the utility model has the advantages of anti-vibration, pressure resistance, no refrigerant leakage and use of direct current, etc. , will be widely used in a variety of different occasions.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)

Description

一种热电半导体双制式空调器 技术领域
本实用新型涉及一种空气温度调节器， 具体涉及一种热电半导体双制式 空调器。 背景技术
目前， 传统的制冷技术空调器已在工业生产、 生物工程、 医疗卫生和人 民日常生活中广泛的得到使用， 它已成为现代社会必不可缺的一项重要技术 和必需品。而现有的制冷与空调技术中，空气压缩机制冷方法应用最为普遍。 通常使用以氟利昂等为制冷剂， 一旦泄漏对大气臭氧层有一定的破坏作用； 现有的各种的空调器以压缩机制冷为中心， 空气压缩机工作时产生的噪音污 染， 危害人们的身体健康和生活质量， 对人类的环境保护起到了破坏作用， 同时消耗大量的电能， 也极大的浪费能源。传统的制冷技术由于大量使用该 类制冷剂而面临新的抉择， 包括压缩机、 冷凝器、 蒸发器、 膨胀阀、 散热板 等辅助设备， 涉及零部件、 元器件多， 原材料消耗大， 技术要求高， 制造工 艺复杂， 检测手段严格， 这些都对空调器的制造业造成了一定困难。 为了彻 底解决现有制冷剂造成的环保问题， 在寻找替代介质的同时， 人们也急切的 可求一种新的制冷方法和全新的空调器面世。 发明内容
本实用新型是利用热电效应原理达到制冷或致热的功能， 提供了一种 热电半导体双制式空调器， 它取代传统老式的采用氟利昂制冷剂等制冷的 空调机， 用电量是传统空调制冷机的耗能的 1 / 3至 1 / 4， 体积小， 重量 轻， 它取消了现有空调器的过滤网， 同时取消了各种病菌滋生因素， 解决 了现有空调器污染空气， 浪费能源， 运行噪声大， 制造难及耗材浪费和长 时间散发大量水气使人患关节炎、 肩周炎、 空调病、 致人皮肤感觉干噪等 问题， 本实用新型采用热电半导体制冷元件制冷， 采用低电压， 使用安全、 寿命长、 性能可靠、 无噪声。 它体积小、 重量轻、 构造简单、 投资少、 成 本低， 既节能且效能高， 还会给人们补充一定的水气， 是一种有利环保的 冷热双制式空调器， 可做为空调器升级换代的首选产品。
本实用新型所采用的技术方案是： 一种热电半导体双制式空调器， 包 括机壳， 直流稳压电源， 与之并联连接的热电半导体制冷板， 热电半导体 制冷板的冷极面与热交换水箱连接， 在热交换水箱中部的出水口连接高压 泵， 高压泵与毛细管连接， 毛细管与蒸发器进水管连接， 蒸发器的出水管 与热交换水箱在下部的进水口连接， 在蒸发器的后面装有排风机； 在热电 半导体制冷板的热极面设有散热装置， 装有风机和排气管。
本实用新型的特征还在于：
所述的热电半导体制冷板的热极面可与热交换水箱连接。
所述的直流稳压电源为可调稳压电源。
所述的热电半导体制冷板为 8-40 个。
所述的半导体热电制热交换水箱中的液体为汽车用防冻液。
所述的热交换水箱与热电半导体制冷板接触板面内侧连接有纵截面为 U型的金属导热块。
所述的金属导热块为铝合金材料， 与热电半导体制冷板数量相同。 本热电半导体制冷无需空气压缩机和制冷剂制冷，采用直流稳压电源连 接热电半导体制冷板制冷，出风口温度为 5-15°C，制热时出风口温度为 30-90 °C可达到老式空调机相同的制冷降温和制热保暧效果。 具有无污染、 节约能 源等特点， 解决了现有空调器必须通过空气压缩氟利昂制冷剂制冷， 造成的 空气和噪声污染、 破坏环境及消耗能源的问题 ， 实现了室内温度恒定， 无 噪音和废气污染， 大大节约了能源。 并可通过调整电压大小控制温升速度， 在 6V-12V正常电压下运作， 水箱的水温在几分钟内可控制在 5-15°C度。 由于 热电半导体双制式空调器具有抗振、 耐压、 无制冷剂泄漏和使用直流电等一 系列优点， 因此本实用新型也可在轮船、 铁路机车、 客车及地下工程等特殊 场合得到广泛应用， 因此具有显著的经济效益和非常好的发展前景。 附图说明
图 1是本实用新型热电半导体双制式空调器原理示意图；
图 2是本实用新型热电半导体双制式空调器结构制冷示意图；
图 3是本实用新型热电半导体双制式空调器结构示意图；
图 4是本实用新型热电半导体双制式空调器结构制热示意图；
图中， 1.机壳， 2.稳压电源， 3. 热电半导体制冷板， 4. 热交换水箱，
5. 高压泵， 6. 毛细管， 7. 蒸发器， 8. 排风机， 9.散热装置， 10.风机，
11. 排气管， 12.导热块， 13.液体。 具体实施方式
下面结合附图和具体实施方式对本实用新型进行详细说明。 本实用新型热电半导体双制式空调器系统原理图如图 1 所示，热电半 导体双制式空调器由热电半导体制冷装置、 室内蒸发式散热装置及向室外 排温装置三部分构成。它由热电半导体制冷装置制冷（或制热）， 由室内蒸 发式散热装置向室内吹进冷气（或热风）， 由向室外排温装置将热气（或冷 气） 排出室外， 形成一个温度调节过程， 实现室内温度控制。
本实用新型热电半导体双制式空调器结构如图 2 、 图 3所示， 包括机 壳 1， 直流稳压电源 2， 与之并联连接着热电半导体制冷板 3， 热电半导体 制冷板 3的冷极面与热交换水箱 4连接， 热交换水箱 4中部的出水口连接 高压泵 5， 高压泵 5与毛细管 6连接， 毛细管 6与蒸发器 7进水管连接， 蒸发器 7的出水管与热交换水箱 4在下部的进水口连接， 在蒸发器 7的后 面装有排风机 8;在热电半导体制冷板 3的热极面设有散热装置 9，装有风 机 10和排气管 11 ; 在热交换水箱 4与热电半导体制冷板 3接触板面内侧 连接有导热块 12。
当空调器在这种状态下通电运行，热电半导体制冷板 3的冷极面制冷， 通过紧贴的热交换水箱 4板面将温度直接传递到热交换水箱 4内。 由于热 交换水箱 4内与热电半导体制冷板 3的对应位置安装有导热块 12，它迅速 地将产生得低温传递给热交换水箱 4内的液体 13。为了提高功效，液体 13 可采用汽车用防冻液作为介质。 被降温的液体 13 经连接在热交换水箱 4 中部出水口的高压泵 5以高压经毛细管 6喷入蒸发器 Ί进水管流经蒸发器 7， 然后再从蒸发器 7的出水管流回热交换水箱 4， 实现液体循环。 蒸发器 7的后面安装排风机 8将冷气吹入室， 起到降温作用。 在热电半导体制冷 板 3的热极面设有散热装置 9，通过风机 10将热极面产生的热气经排气管 11排出室外。 完成室内的降温制冷的作用。
如图 4所示，当热电半导体制冷板 3的热极面可与热交换水箱 4连接。 此时空调器热电半导体制冷板 3热极面制热， 通过紧贴的热交换水箱 4板 面将热度直接传递到热交换水箱 4内。 由于热交换水箱 4内与热电半导体 制冷板 3的对应位置安装有导热块 12，它迅速地将产生得热温传递给热交 换水箱 4内的液体 13。 被升温的液体 13经连接在热交换水箱 4中部出水 口的高压泵 5以高速经毛细管 6喷入蒸发器 Ί进水管流经蒸发器 7， 然后 再从蒸发器 7的出水管流回热交换水箱 4， 实现液体循环。 蒸发器 7的后 面安装排风机 8将冷气吹入室， 起到升温作用。 在热电半导体制冷板 3的 冷极面设有散热装置 9， 通过风机 10将冷极面产生的冷气经排气管 11排 出室外。 完成室内温保暧的作用。
本实用新型热电半导体双制式空调器直流稳压电源 2采用可调稳压电 源，通过调整电压实现，热电半导体制冷板 3的数量根据室内面积大小为 8 - 40个。 在 6V^12V正常电压下运行， 热交换水箱 4的液体 13在几分钟 内可控制在零上 5-15°C，通过调节电压的大小可实现快速升降温度或减缓 温度的变化， 起到了节电； 热交换水箱 4内与热电半导体制冷板 3接触板 面连接有导热块 12采用铝合金材料，与热电半导体制冷板 3数量相同，金 属导热块 12采用为 U型的纵截面可增加受热面积， 使传递温度速度加快。 同时起到了节电和降低能耗的作用。 当液体 13 不足则需补足液体时或出 现故障时， 打开散热装置 9， 添加液体 13和更换热电半导体制冷板 3也非 常简便。
热电半导体双制式空调器， 采用低电压工作， 即省电又安全， 大大节 约了能源， 并可通过调整电压大小控制温升速度， 操作方便， 老少皆宜。 不论是在夏季制冷降温， 还是冬季制热取暧， 都不产生噪音和废气污染， 实现了室内温度恒定， 由于本实用新型具有抗振、 耐压、 无制冷剂泄漏和 使用直流电等一系列优点， 将在各种不同场合得到广泛应用。

Claims

权利要求
1、 一种热电半导体双制式空调器， 其特征在于， 包括机壳 （1 )， 直 流稳压电源 （2)， 与之并联连接的热电半导体制冷板 （3 )， 热电半导体制 冷板（3 ) 的冷极面与热交换水箱（4)连接， 在热交换水箱（4) 中部的出 水口连接高压泵 （5 )， 高压泵 （5 ) 与毛细管 （6)连接， 毛细管 （6) 与蒸 发器 （7) 进水管连接， 蒸发器的出水管与热交换水箱 （4) 在下不得进水 口连接， 在蒸发器（7) 的后面装有排风机（8); 在热电半导体制冷板（3 ) 的热极面设有散热装置 （9)， 装有风机 （10) 和排气管 （11 )。
2、 根据权利要求 1 所述的热电半导体双制式空调器， 其特征在于， 所述的热电半导体制冷板 （3 ) 的热极面可与热交换水箱 （4) 连接。
3、 根据权利要求 1 所述的热电半导体双制式空调器， 其特征在于， 所述的直流稳压电源 （2) 为可调稳压电源。
4、 根据权利要求 1 所述的热电半导体双制式空调器， 其特征在于， 所述的热电半导体制冷板 （3 ) 为 8-40个。
5、 根据权利要求 1 所述的热电半导体双制式空调器， 其特征在于， 所述的热交换水箱 （4) 中的液体为汽车用防冻液 （13 )。
6、根据权利要求 1所述的热电半导体双制式空调器， 其特征在于， 所 述的热交换水箱 （4) 与热电半导体制冷板 （3 ) 接触板面内侧连接有纵截 面为 U型的金属导热块 （12)。
7、根据权利要求 4所述的热电半导体双制式空调器， 其特征在于， 所 述的导热块 （12) 为铝合金材料， 与热电半导体制冷板 （3 ) 数量相同。
PCT/CN2008/071686 2007-08-03 2008-07-18 Type d'appareil de climatisation à semi-conducteurs thermoélectriques pour réfrigération et chauffage WO2009018741A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3184431A1 (en) * 2015-12-25 2017-06-28 Guanghou Ehang Intelligent Technology Co., Ltd. Cooling or heating of a passenger accommodation compartment of a multi-axis passenger-carrying aircraft

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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CN103743018A (zh) * 2013-12-25 2014-04-23 王春 一种新型节能te模组空调器
CN103776117A (zh) * 2014-02-17 2014-05-07 叶炉军 一种无压缩机的汽车空调
CN104534582A (zh) * 2014-04-08 2015-04-22 侴乔力 半导体热电空调热水器
CN104390297A (zh) * 2014-11-13 2015-03-04 靖江市安信制冷设备有限公司 电子冷暖空调
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WO2020096527A1 (en) * 2018-11-08 2020-05-14 Trends Home Electrical Pte. Ltd. Air conditioner unit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2143744Y (zh) * 1992-12-11 1993-10-13 上海机械学院 一种热电式半导体空调器
CN1080711A (zh) * 1992-06-30 1994-01-12 宋乃尊 半导体通用高效冷却器
US20070012049A1 (en) * 2005-07-15 2007-01-18 Chuan-Sheng Chen Semiconductor based air conditioning device
US20080041066A1 (en) * 2006-08-21 2008-02-21 Chin-Kuang Luo Air cooling/heating device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1080711A (zh) * 1992-06-30 1994-01-12 宋乃尊 半导体通用高效冷却器
CN2143744Y (zh) * 1992-12-11 1993-10-13 上海机械学院 一种热电式半导体空调器
US20070012049A1 (en) * 2005-07-15 2007-01-18 Chuan-Sheng Chen Semiconductor based air conditioning device
US20080041066A1 (en) * 2006-08-21 2008-02-21 Chin-Kuang Luo Air cooling/heating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3184431A1 (en) * 2015-12-25 2017-06-28 Guanghou Ehang Intelligent Technology Co., Ltd. Cooling or heating of a passenger accommodation compartment of a multi-axis passenger-carrying aircraft

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