WO2009013797A1 - Method of treating work and system for treating work - Google Patents

Method of treating work and system for treating work Download PDF

Info

Publication number
WO2009013797A1
WO2009013797A1 PCT/JP2007/064374 JP2007064374W WO2009013797A1 WO 2009013797 A1 WO2009013797 A1 WO 2009013797A1 JP 2007064374 W JP2007064374 W JP 2007064374W WO 2009013797 A1 WO2009013797 A1 WO 2009013797A1
Authority
WO
WIPO (PCT)
Prior art keywords
treating work
mixed
work
gas mixture
droplets
Prior art date
Application number
PCT/JP2007/064374
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshihisa Morita
Masao Yamase
Masao Watanabe
Toshiyuki Sanada
Minori Shirota
Original Assignee
Aqua Science Corporation
Kyushu University, National University Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aqua Science Corporation, Kyushu University, National University Corporation filed Critical Aqua Science Corporation
Priority to PCT/JP2007/064374 priority Critical patent/WO2009013797A1/en
Priority to PCT/JP2008/063006 priority patent/WO2009014084A1/en
Publication of WO2009013797A1 publication Critical patent/WO2009013797A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2230/00—Other cleaning aspects applicable to all B08B range
    • B08B2230/01—Cleaning with steam

Abstract

[Problems][Means for Solving Problems] A method in which a work is treated by applying thereto a mixed-phase fluid comprising an inert gas and/or air, water vapor, and droplets, characterized in that the inert gas and/or air is mixed with water vapor to form a gas mixture and then the gas mixture is mixed with a liquid to form the droplets. In the method, properties of the gas mixture can be regulated.
PCT/JP2007/064374 2007-07-20 2007-07-20 Method of treating work and system for treating work WO2009013797A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/064374 WO2009013797A1 (en) 2007-07-20 2007-07-20 Method of treating work and system for treating work
PCT/JP2008/063006 WO2009014084A1 (en) 2007-07-20 2008-07-18 Method for treating object and object treatment system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/064374 WO2009013797A1 (en) 2007-07-20 2007-07-20 Method of treating work and system for treating work

Publications (1)

Publication Number Publication Date
WO2009013797A1 true WO2009013797A1 (en) 2009-01-29

Family

ID=40281061

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2007/064374 WO2009013797A1 (en) 2007-07-20 2007-07-20 Method of treating work and system for treating work
PCT/JP2008/063006 WO2009014084A1 (en) 2007-07-20 2008-07-18 Method for treating object and object treatment system

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063006 WO2009014084A1 (en) 2007-07-20 2008-07-18 Method for treating object and object treatment system

Country Status (1)

Country Link
WO (2) WO2009013797A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012111809A1 (en) * 2011-02-17 2012-08-23 アクアサイエンス株式会社 Series of nozzles, and substrate treatment apparatus provided with series of nozzles
WO2016093098A1 (en) * 2014-12-12 2016-06-16 アクアサイエンス株式会社 Droplet jet formation device and droplet jet formation method
CN109690743A (en) * 2016-09-28 2019-04-26 株式会社斯库林集团 Substrate board treatment and substrate processing method using same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203658712U (en) * 2013-12-26 2014-06-18 深圳市华星光电技术有限公司 Liquid crystal dripping device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07124503A (en) * 1993-11-01 1995-05-16 Mitsubishi Chem Corp Binary fluid nozzle and spray drying method using the same
JP2000246189A (en) * 1999-02-26 2000-09-12 Shibuya Kogyo Co Ltd Washer
JP2003197597A (en) * 2001-12-26 2003-07-11 Dainippon Screen Mfg Co Ltd Substrate processing device and substrate processing method
JP2003332288A (en) * 2002-05-10 2003-11-21 Lam Research Kk Water feeding method and water feeding apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07124503A (en) * 1993-11-01 1995-05-16 Mitsubishi Chem Corp Binary fluid nozzle and spray drying method using the same
JP2000246189A (en) * 1999-02-26 2000-09-12 Shibuya Kogyo Co Ltd Washer
JP2003197597A (en) * 2001-12-26 2003-07-11 Dainippon Screen Mfg Co Ltd Substrate processing device and substrate processing method
JP2003332288A (en) * 2002-05-10 2003-11-21 Lam Research Kk Water feeding method and water feeding apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012111809A1 (en) * 2011-02-17 2012-08-23 アクアサイエンス株式会社 Series of nozzles, and substrate treatment apparatus provided with series of nozzles
KR20140042782A (en) * 2011-02-17 2014-04-07 아쿠아 사이언스 가부시키카이샤 Series of nozzles, and substrate treatment apparatus provided with series of nozzles
WO2016093098A1 (en) * 2014-12-12 2016-06-16 アクアサイエンス株式会社 Droplet jet formation device and droplet jet formation method
CN109690743A (en) * 2016-09-28 2019-04-26 株式会社斯库林集团 Substrate board treatment and substrate processing method using same
CN109690743B (en) * 2016-09-28 2023-10-20 株式会社斯库林集团 Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
WO2009014084A1 (en) 2009-01-29

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