WO2008155984A1 - 基板処理方法および基板処理装置 - Google Patents

基板処理方法および基板処理装置 Download PDF

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Publication number
WO2008155984A1
WO2008155984A1 PCT/JP2008/059924 JP2008059924W WO2008155984A1 WO 2008155984 A1 WO2008155984 A1 WO 2008155984A1 JP 2008059924 W JP2008059924 W JP 2008059924W WO 2008155984 A1 WO2008155984 A1 WO 2008155984A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
peripheral portion
substrate processing
fine particles
film
Prior art date
Application number
PCT/JP2008/059924
Other languages
English (en)
French (fr)
Inventor
Masashi Kanaoka
Tadashi Miyagi
Kazuhito Shigemori
Shuichi Yasuda
Original Assignee
Sokudo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sokudo Co., Ltd. filed Critical Sokudo Co., Ltd.
Publication of WO2008155984A1 publication Critical patent/WO2008155984A1/ja

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/261—Preparing a master, e.g. exposing photoresist, electroforming
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

　反射防止膜の焼成処理（ステップＳ１２）が終了した後、レジスト膜の塗布処理（ステップＳ１４）を行う前に、基板の周縁部洗浄処理（ステップＳ１３）を実行する。反射防止膜の形成処理時には、昇華物などの微小なゴミが発生して基板周縁部に付着することがある。基板の周縁部を洗浄することによって、そのような微小なゴミを取り除き、周縁部が清浄な基板にレジストカバー膜を形成することができるため、基板周縁部の表面とレジストカバー膜との間に微小なゴミが挟み込まれることはなく、基板の周縁部におけるレジストカバー膜の剥がれを防止することができる。
PCT/JP2008/059924 2007-06-18 2008-05-29 基板処理方法および基板処理装置 WO2008155984A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007160284A JP2008311578A (ja) 2007-06-18 2007-06-18 基板処理方法および基板処理装置
JP2007-160284 2007-06-18

Publications (1)

Publication Number Publication Date
WO2008155984A1 true WO2008155984A1 (ja) 2008-12-24

Family

ID=40156143

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059924 WO2008155984A1 (ja) 2007-06-18 2008-05-29 基板処理方法および基板処理装置

Country Status (2)

Country Link
JP (1) JP2008311578A (ja)
WO (1) WO2008155984A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000199966A (ja) * 1998-11-05 2000-07-18 Hitachi Ltd レジスト塗布装置および基板端縁レジスト除去装置
JP2001217184A (ja) * 2000-02-04 2001-08-10 Nec Corp 半導体装置の製造方法
JP2006100514A (ja) * 2004-09-29 2006-04-13 Dainippon Screen Mfg Co Ltd 除去装置、保護膜形成装置、基板処理システム、および除去方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000199966A (ja) * 1998-11-05 2000-07-18 Hitachi Ltd レジスト塗布装置および基板端縁レジスト除去装置
JP2001217184A (ja) * 2000-02-04 2001-08-10 Nec Corp 半導体装置の製造方法
JP2006100514A (ja) * 2004-09-29 2006-04-13 Dainippon Screen Mfg Co Ltd 除去装置、保護膜形成装置、基板処理システム、および除去方法

Also Published As

Publication number Publication date
JP2008311578A (ja) 2008-12-25

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