WO2008153137A1 - 焼成用転写フィルム - Google Patents

焼成用転写フィルム Download PDF

Info

Publication number
WO2008153137A1
WO2008153137A1 PCT/JP2008/060869 JP2008060869W WO2008153137A1 WO 2008153137 A1 WO2008153137 A1 WO 2008153137A1 JP 2008060869 W JP2008060869 W JP 2008060869W WO 2008153137 A1 WO2008153137 A1 WO 2008153137A1
Authority
WO
WIPO (PCT)
Prior art keywords
functional pattern
burning
multilayer structure
transfer film
organic substance
Prior art date
Application number
PCT/JP2008/060869
Other languages
English (en)
French (fr)
Inventor
Akihiro Iikuma
Hideaki Shinozaki
Masahiro Kikuchi
Tatsuya Otsuka
Taiichi Kubo
Kazuhisa Ono
Original Assignee
Toppan Tdk Label Co., Ltd.
Nippon Sheet Glass Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Tdk Label Co., Ltd., Nippon Sheet Glass Co., Ltd. filed Critical Toppan Tdk Label Co., Ltd.
Priority to EP08765579.1A priority Critical patent/EP2157840A4/en
Publication of WO2008153137A1 publication Critical patent/WO2008153137A1/ja
Priority to US12/637,481 priority patent/US20100086754A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer
    • B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　機能性パターンを含む積層体に機能性パターンの形状不良や粘着層の粘着力の低下がなく、基体への転写性に優れ、機能性パターンの焼成体に形状や機能不良等の欠陥を生じない焼成用転写フィルムを提供する。 　基体の表面に機能性パターンを含む積層体を転写し、焼成することにより、機能性パターンの焼成体を形成するために用いる、焼成用転写フィルムにおいて、焼成用転写フィルムは、剥離フィルムと、剥離フィルムの一方の表面に接するように形成された積層体とを含み、積層体はさらに、機能性パターンと、機能性パターンの表面に直接接するように形成される、１層またはそれより多数の層からなる接触層とを含み、機能性パターンは、無機粉体と焼成により除去可能な有機物とを含有し、接触層は、焼成により除去可能な有機物と溶媒とを含有し、機能性パターンに含まれる有機物は、接触層に含まれる溶媒と相溶しない、焼成用転写フィルム。
PCT/JP2008/060869 2007-06-13 2008-06-13 焼成用転写フィルム WO2008153137A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08765579.1A EP2157840A4 (en) 2007-06-13 2008-06-13 TRANSFER FILM FOR BURNING
US12/637,481 US20100086754A1 (en) 2007-06-13 2009-12-14 Transfer Film for Firing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-156490 2007-06-13
JP2007156490A JP5040031B2 (ja) 2007-06-13 2007-06-13 焼成用転写フィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/637,481 Continuation US20100086754A1 (en) 2007-06-13 2009-12-14 Transfer Film for Firing

Publications (1)

Publication Number Publication Date
WO2008153137A1 true WO2008153137A1 (ja) 2008-12-18

Family

ID=40129740

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060869 WO2008153137A1 (ja) 2007-06-13 2008-06-13 焼成用転写フィルム

Country Status (4)

Country Link
US (1) US20100086754A1 (ja)
EP (1) EP2157840A4 (ja)
JP (1) JP5040031B2 (ja)
WO (1) WO2008153137A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5600458B2 (ja) * 2010-03-30 2014-10-01 株式会社トッパンＴｄｋレーベル 焼成用転写型フィルム及び焼成体を備えるガラス板の製造方法
WO2012090352A1 (ja) * 2010-12-28 2012-07-05 日本板硝子株式会社 パターン付きガラス基板、その製造方法及びその製造方法に使用する転写フィルム

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05139020A (ja) 1991-11-15 1993-06-08 Noritake Co Ltd 転写紙およびその製造方法
JPH11135009A (ja) 1997-10-27 1999-05-21 Dainippon Printing Co Ltd 転写シート
JPH11260250A (ja) 1998-03-13 1999-09-24 Dainippon Printing Co Ltd プラズマディスプレイパネル作製用の転写シート
JP2000151080A (ja) 1998-09-07 2000-05-30 Asahi Glass Co Ltd 転写式印刷パタ―ン形成方法及びこれにより印刷パタ―ンが形成されたガラス
JP2001211020A (ja) 2000-01-26 2001-08-03 Asahi Glass Co Ltd 車載用対数周期ダイポールアンテナ
JP2002270456A (ja) * 2001-03-07 2002-09-20 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
JP2003338678A (ja) * 2002-05-21 2003-11-28 Nitto Denko Corp 回路基板の製造方法、回路基板仮固定用粘着テープ、及び多層配線板
JP2006037058A (ja) * 2004-07-30 2006-02-09 Hitachi Chem Co Ltd 印刷インキ組成物、凸版反転オフセット法、レジストパターンの形成法、電子部品の製造法及び電子部品
JP2006203157A (ja) * 2004-08-23 2006-08-03 Kyocera Corp 電子部品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE679454A (ja) * 1965-04-26 1966-09-16
US6017636A (en) * 1996-04-26 2000-01-25 Shinzen Co., Ltd. Transfer system and transfer method thereof
JP3659537B2 (ja) * 1996-11-18 2005-06-15 大日本印刷株式会社 プラズマディスプレイパネル作製用転写シート
US6207268B1 (en) * 1996-11-12 2001-03-27 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
JP3640276B2 (ja) * 1996-11-12 2005-04-20 大日本印刷株式会社 転写シート
KR100536868B1 (ko) * 1997-10-03 2006-02-28 다이니폰 인사츠 가부시키가이샤 전사시트
WO2001019147A1 (fr) * 1999-09-07 2001-03-15 Asahi Glass Company Ltd. Procede de formation d'empreinte d'impression transferable, et verre portant une empreinte imprimee
JP2001167971A (ja) * 1999-12-13 2001-06-22 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法
CN1781170A (zh) * 2003-03-31 2006-05-31 Tdk株式会社 多层陶瓷电子元件的制造方法
US7045568B2 (en) * 2003-08-13 2006-05-16 Nitto Denko Corporation Aqueous dispersion type pressure-sensitive adhesive composition, and pressure-sensitive adhesive sheet
JP3808853B2 (ja) * 2003-09-12 2006-08-16 Ｔｄｋ株式会社 グリーンシート用塗料、グリーンシート、グリーンシートの製造方法および電子部品の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05139020A (ja) 1991-11-15 1993-06-08 Noritake Co Ltd 転写紙およびその製造方法
JPH11135009A (ja) 1997-10-27 1999-05-21 Dainippon Printing Co Ltd 転写シート
JPH11260250A (ja) 1998-03-13 1999-09-24 Dainippon Printing Co Ltd プラズマディスプレイパネル作製用の転写シート
JP2000151080A (ja) 1998-09-07 2000-05-30 Asahi Glass Co Ltd 転写式印刷パタ―ン形成方法及びこれにより印刷パタ―ンが形成されたガラス
JP2001211020A (ja) 2000-01-26 2001-08-03 Asahi Glass Co Ltd 車載用対数周期ダイポールアンテナ
JP2002270456A (ja) * 2001-03-07 2002-09-20 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
JP2003338678A (ja) * 2002-05-21 2003-11-28 Nitto Denko Corp 回路基板の製造方法、回路基板仮固定用粘着テープ、及び多層配線板
JP2006037058A (ja) * 2004-07-30 2006-02-09 Hitachi Chem Co Ltd 印刷インキ組成物、凸版反転オフセット法、レジストパターンの形成法、電子部品の製造法及び電子部品
JP2006203157A (ja) * 2004-08-23 2006-08-03 Kyocera Corp 電子部品の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2157840A4 *

Also Published As

Publication number Publication date
JP2008311356A (ja) 2008-12-25
JP5040031B2 (ja) 2012-10-03
EP2157840A4 (en) 2013-07-24
US20100086754A1 (en) 2010-04-08
EP2157840A1 (en) 2010-02-24

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