WO2008153107A1 - 対象物洗浄方法及び対象物洗浄システム - Google Patents

対象物洗浄方法及び対象物洗浄システム Download PDF

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Publication number
WO2008153107A1
WO2008153107A1 PCT/JP2008/060793 JP2008060793W WO2008153107A1 WO 2008153107 A1 WO2008153107 A1 WO 2008153107A1 JP 2008060793 W JP2008060793 W JP 2008060793W WO 2008153107 A1 WO2008153107 A1 WO 2008153107A1
Authority
WO
WIPO (PCT)
Prior art keywords
cleaning
mixed
phase fluid
liquid droplets
cleaning system
Prior art date
Application number
PCT/JP2008/060793
Other languages
English (en)
French (fr)
Inventor
Atsushi Hayashida
Masao Watanabe
Toshiyuki Sanada
Minori Shirota
Original Assignee
Aqua Science Corporation
Kyushu University, National University Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aqua Science Corporation, Kyushu University, National University Corporation filed Critical Aqua Science Corporation
Priority to JP2008551374A priority Critical patent/JPWO2008153107A1/ja
Publication of WO2008153107A1 publication Critical patent/WO2008153107A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)

Abstract

　気体と液滴とを含む混相流体を照射することにより対象物を洗浄する方法において、前記混相流体中の前記液滴が前記対象物に衝突した際に発生し得る、液滴衝突時キャビテーションの程度を制御することにより、所望の衝撃力を得ることを特徴とする方法。  
PCT/JP2008/060793 2007-06-14 2008-06-12 対象物洗浄方法及び対象物洗浄システム WO2008153107A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008551374A JPWO2008153107A1 (ja) 2007-06-14 2008-06-12 対象物洗浄方法及び対象物洗浄システム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP2007/061969 2007-06-14
PCT/JP2007/061969 WO2008152716A1 (ja) 2007-06-14 2007-06-14 対象物洗浄方法及び対象物洗浄システム

Publications (1)

Publication Number Publication Date
WO2008153107A1 true WO2008153107A1 (ja) 2008-12-18

Family

ID=40129333

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2007/061969 WO2008152716A1 (ja) 2007-06-14 2007-06-14 対象物洗浄方法及び対象物洗浄システム
PCT/JP2008/060793 WO2008153107A1 (ja) 2007-06-14 2008-06-12 対象物洗浄方法及び対象物洗浄システム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/061969 WO2008152716A1 (ja) 2007-06-14 2007-06-14 対象物洗浄方法及び対象物洗浄システム

Country Status (2)

Country Link
JP (1) JPWO2008153107A1 (ja)
WO (2) WO2008152716A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10991602B2 (en) 2016-05-09 2021-04-27 Ebara Corporation Substrate washing device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6612176B2 (ja) * 2016-05-09 2019-11-27 株式会社荏原製作所 基板洗浄装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04370931A (ja) * 1991-06-19 1992-12-24 Hitachi Zosen Corp 基板洗浄方法
JP2003332288A (ja) * 2002-05-10 2003-11-21 Lam Research Kk 水供給方法および水供給装置
JP2006187752A (ja) * 2005-01-06 2006-07-20 Hitachi Industrial Equipment Systems Co Ltd ２流体特殊洗浄ノズル

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197597A (ja) * 2001-12-26 2003-07-11 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4158515B2 (ja) * 2002-12-24 2008-10-01 三菱化学株式会社 洗浄用２流体ノズル及び洗浄方法
JP2005191261A (ja) * 2003-12-25 2005-07-14 Aqua Science Kk 対象物処理装置および対象物処理方法
JP2005216908A (ja) * 2004-01-27 2005-08-11 Aqua Science Kk 対象物処理装置および対象物処理方法
JP2006223995A (ja) * 2005-02-17 2006-08-31 Sony Corp 洗浄方法及び洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04370931A (ja) * 1991-06-19 1992-12-24 Hitachi Zosen Corp 基板洗浄方法
JP2003332288A (ja) * 2002-05-10 2003-11-21 Lam Research Kk 水供給方法および水供給装置
JP2006187752A (ja) * 2005-01-06 2006-07-20 Hitachi Industrial Equipment Systems Co Ltd ２流体特殊洗浄ノズル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10991602B2 (en) 2016-05-09 2021-04-27 Ebara Corporation Substrate washing device

Also Published As

Publication number Publication date
WO2008152716A1 (ja) 2008-12-18
JPWO2008153107A1 (ja) 2010-08-26

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