WO2008153101A1 - Resin composition for forming heat-cured film - Google Patents

Resin composition for forming heat-cured film Download PDF

Info

Publication number
WO2008153101A1
WO2008153101A1 PCT/JP2008/060778 JP2008060778W WO2008153101A1 WO 2008153101 A1 WO2008153101 A1 WO 2008153101A1 JP 2008060778 W JP2008060778 W JP 2008060778W WO 2008153101 A1 WO2008153101 A1 WO 2008153101A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic group
resin composition
cured
group including
cured film
Prior art date
Application number
PCT/JP2008/060778
Other languages
French (fr)
Japanese (ja)
Inventor
Tadashi Hatanaka
Junpei Kobayashi
Daniel Antonio Sahade
Original Assignee
Nissan Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Industries, Ltd. filed Critical Nissan Chemical Industries, Ltd.
Priority to CN200880020228XA priority Critical patent/CN101679633B/en
Priority to KR20107000589A priority patent/KR101486301B1/en
Priority to JP2009519304A priority patent/JP5382346B2/en
Publication of WO2008153101A1 publication Critical patent/WO2008153101A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/133711—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films
    • G02F1/133723—Polyimide, polyamide-imide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Nonlinear Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

[PROBLEMS] To provide a resin composition for heat-cured-film formation which can form a cured film having the property of aligning liquid crystals and realizing high transparency and high planarization. [MEANS FOR SOLVING PROBLEMS] The resin composition for heat-cured-film formation comprises ingredients (A) and (B). Ingredient (A): A polyimide precursor having structural units represented by the following formulae (1) and (2). Ingredient (B): A bismaleimide compound. (In the formulae, A1 is an organic group including an alicyclic structure; A2 is an organic group comprising a structure having an organic group including a structure formed by the fusion of an aliphatic ring with a benzene ring; at least one of B1 and B2 is an organic group including the structure -SO2-; and R1, R2, R3, and R4 each independently represents hydrogen or a C1-7 organic group.)
PCT/JP2008/060778 2007-06-15 2008-06-12 Resin composition for forming heat-cured film WO2008153101A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880020228XA CN101679633B (en) 2007-06-15 2008-06-12 Resin composition for forming heat-cured film
KR20107000589A KR101486301B1 (en) 2007-06-15 2008-06-12 Resin composition for forming heat-cured film
JP2009519304A JP5382346B2 (en) 2007-06-15 2008-06-12 Thermosetting film forming resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-159054 2007-06-15
JP2007159054 2007-06-15

Publications (1)

Publication Number Publication Date
WO2008153101A1 true WO2008153101A1 (en) 2008-12-18

Family

ID=40129706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060778 WO2008153101A1 (en) 2007-06-15 2008-06-12 Resin composition for forming heat-cured film

Country Status (5)

Country Link
JP (1) JP5382346B2 (en)
KR (1) KR101486301B1 (en)
CN (1) CN101679633B (en)
TW (1) TWI455960B (en)
WO (1) WO2008153101A1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009078365A1 (en) * 2007-12-14 2009-06-25 Nissan Chemical Industries, Ltd. Method for producing polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method
WO2010044381A1 (en) * 2008-10-14 2010-04-22 日本化薬株式会社 Phenolic hydroxyl group-containing polyimide resin and photosensitive resin composition using same
WO2010110221A1 (en) * 2009-03-23 2010-09-30 日産化学工業株式会社 Polyester composition for forming heat-cured film
WO2010119868A1 (en) * 2009-04-14 2010-10-21 日産化学工業株式会社 Photosensitive polyester composition for use in forming thermally cured film
JP2011076009A (en) * 2009-10-01 2011-04-14 Hitachi Displays Ltd Liquid crystal display device
WO2011115079A1 (en) * 2010-03-15 2011-09-22 日産化学工業株式会社 Liquid crystal alignment agent for use in photo-alignment process, and liquid crystal alignment film using same
WO2011115080A1 (en) * 2010-03-15 2011-09-22 日産化学工業株式会社 Polyamic acid ester liquid crystal alignment agent, and liquid crystal alignment film using same
CN102893208A (en) * 2010-03-15 2013-01-23 日产化学工业株式会社 Liquid crystal alignment agent containing polyamic acid ester and polyamic acid, and liquid crystal alignment film
CN102893206A (en) * 2010-03-15 2013-01-23 日产化学工业株式会社 Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film
WO2013125595A1 (en) * 2012-02-22 2013-08-29 日産化学工業株式会社 Composition, liquid crystal aligninig agent, liquid crystal alighment film, and liquid crystal display element
JPWO2012018121A1 (en) * 2010-08-05 2013-10-28 日産化学工業株式会社 Resin composition, liquid crystal alignment material and retardation material
KR20140004189A (en) * 2011-01-28 2014-01-10 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal alignment agent containing both polyamic acid ester and polyamic acid
JP2015081285A (en) * 2013-10-22 2015-04-27 日産化学工業株式会社 Resin composition for display substrate
KR101524195B1 (en) * 2009-03-06 2015-05-29 삼성전자주식회사 Self-crosslinking polyamic acid, self-crosslinking polyimide, manufacturing method thereof, and self-crosslinking polyimide film using the same
KR20170023153A (en) * 2014-06-25 2017-03-02 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal display element
KR101736885B1 (en) * 2009-03-31 2017-05-17 닛산 가가쿠 고교 가부시키 가이샤 Polyester composite for forming thermoset films
KR101736902B1 (en) * 2009-03-31 2017-05-17 닛산 가가쿠 고교 가부시키 가이샤 Polyester composite for forming thermoset films
JP2017156436A (en) * 2016-02-29 2017-09-07 Jsr株式会社 Liquid crystal alignment agent, liquid crystal alignment film and method for manufacturing the same, and liquid crystal device
KR101820981B1 (en) * 2010-03-15 2018-01-22 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal alignment agent containing polyamic acid ester, and liquid crystal alignment film
KR101818786B1 (en) * 2010-03-15 2018-02-21 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film
CN108948354A (en) * 2017-05-26 2018-12-07 昆山国显光电有限公司 Modified polyimide resin and preparation method thereof and application
JPWO2017175614A1 (en) * 2016-04-05 2019-02-14 三菱瓦斯化学株式会社 Resin composition and manufacturing method thereof, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board
JPWO2020203834A1 (en) * 2019-04-02 2020-10-08

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CN105219000B (en) * 2010-08-11 2017-10-27 日产化学工业株式会社 Resin combination, liquid crystal aligning material and phase difference material
KR20140045556A (en) * 2011-07-12 2014-04-16 닛산 가가쿠 고교 가부시키 가이샤 Composition liquid crystal alignment treatment agent, liquid crystal alignment film, and liquid crystal display element
CN102504698B (en) * 2011-11-22 2013-12-11 东华大学 Polyimide wire coating enamel, and preparation method and application thereof
KR101956068B1 (en) * 2011-12-27 2019-03-12 엘지이노텍 주식회사 Display device and method of fabricating the same
KR20150070276A (en) * 2012-10-18 2015-06-24 닛산 가가쿠 고교 가부시키 가이샤 Composition, liquid crystal aligning agent, liquid crystal alignment film, and liquid crystal display element
TWI497784B (en) * 2012-11-16 2015-08-21 Ind Tech Res Inst Magnetic sensing apparatus and manufacturing method thereof
TWI473838B (en) 2013-11-13 2015-02-21 財團法人工業技術研究院 Polyamic acid, polyimide, and method for manufacturing graphite sheet
CN105086316B (en) * 2014-05-15 2018-01-30 捷恩智株式会社 Thermosetting composition, cured film, colored filter, liquid crystal display cells, solid-state imager and LED illuminant heart
JP2016148777A (en) * 2015-02-12 2016-08-18 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ Composition for forming underlay film, and formation method of underlay film using same
CN111836857A (en) * 2018-03-28 2020-10-27 积水化学工业株式会社 Resin material, laminated structure, and multilayer printed wiring board
CN109912615A (en) * 2019-03-20 2019-06-21 浙江福斯特新材料研究院有限公司 Benzo alicyclic dianhydride and low dielectric coefficient polyimide precursor film
WO2021226951A1 (en) * 2020-05-14 2021-11-18 律胜科技股份有限公司 Polyimide film and manufacturing method therefor

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KR101158382B1 (en) * 2004-02-26 2012-06-22 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal aligning agent for photoalignment and liquid crystal display device utilizing the same

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JPS6147932A (en) * 1984-08-15 1986-03-08 Nissan Chem Ind Ltd Liquid crystal display element
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Cited By (44)

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KR101588364B1 (en) 2007-12-14 2016-01-25 닛산 가가쿠 고교 가부시키 가이샤 Method for producing polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method
KR20100102656A (en) * 2007-12-14 2010-09-24 닛산 가가쿠 고교 가부시키 가이샤 Method for producing polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method
WO2009078365A1 (en) * 2007-12-14 2009-06-25 Nissan Chemical Industries, Ltd. Method for producing polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method
WO2010044381A1 (en) * 2008-10-14 2010-04-22 日本化薬株式会社 Phenolic hydroxyl group-containing polyimide resin and photosensitive resin composition using same
KR101524195B1 (en) * 2009-03-06 2015-05-29 삼성전자주식회사 Self-crosslinking polyamic acid, self-crosslinking polyimide, manufacturing method thereof, and self-crosslinking polyimide film using the same
WO2010110221A1 (en) * 2009-03-23 2010-09-30 日産化学工業株式会社 Polyester composition for forming heat-cured film
CN102361932A (en) * 2009-03-23 2012-02-22 日产化学工业株式会社 Polyester composition for forming heat-cured film
TWI488914B (en) * 2009-03-23 2015-06-21 Nissan Chemical Ind Ltd Polyester composition for forming thermoset film
JP5574122B2 (en) * 2009-03-23 2014-08-20 日産化学工業株式会社 Polyester composition for thermosetting film formation
KR101736902B1 (en) * 2009-03-31 2017-05-17 닛산 가가쿠 고교 가부시키 가이샤 Polyester composite for forming thermoset films
KR101736885B1 (en) * 2009-03-31 2017-05-17 닛산 가가쿠 고교 가부시키 가이샤 Polyester composite for forming thermoset films
WO2010119868A1 (en) * 2009-04-14 2010-10-21 日産化学工業株式会社 Photosensitive polyester composition for use in forming thermally cured film
JP5626536B2 (en) * 2009-04-14 2014-11-19 日産化学工業株式会社 Photosensitive polyester composition for thermosetting film formation
JP2011076009A (en) * 2009-10-01 2011-04-14 Hitachi Displays Ltd Liquid crystal display device
WO2011115080A1 (en) * 2010-03-15 2011-09-22 日産化学工業株式会社 Polyamic acid ester liquid crystal alignment agent, and liquid crystal alignment film using same
CN102893210A (en) * 2010-03-15 2013-01-23 日产化学工业株式会社 Liquid crystal alignment agent for use in photo-alignment process, and liquid crystal alignment film using same
WO2011115079A1 (en) * 2010-03-15 2011-09-22 日産化学工業株式会社 Liquid crystal alignment agent for use in photo-alignment process, and liquid crystal alignment film using same
KR101816940B1 (en) 2010-03-15 2018-01-09 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film
JPWO2011115079A1 (en) * 2010-03-15 2013-06-27 日産化学工業株式会社 Liquid crystal aligning agent for photo-alignment treatment method, and liquid crystal alignment film using the same
KR101818786B1 (en) * 2010-03-15 2018-02-21 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film
CN102893206A (en) * 2010-03-15 2013-01-23 日产化学工业株式会社 Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film
KR101820981B1 (en) * 2010-03-15 2018-01-22 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal alignment agent containing polyamic acid ester, and liquid crystal alignment film
CN102893207A (en) * 2010-03-15 2013-01-23 日产化学工业株式会社 Polyamic acid ester liquid crystal alignment agent, and liquid crystal alignment film using same
JP5761174B2 (en) * 2010-03-15 2015-08-12 日産化学工業株式会社 Polyamic acid ester liquid crystal aligning agent and liquid crystal alignment film using the same
CN102893208A (en) * 2010-03-15 2013-01-23 日产化学工业株式会社 Liquid crystal alignment agent containing polyamic acid ester and polyamic acid, and liquid crystal alignment film
JP5835586B2 (en) * 2010-08-05 2015-12-24 日産化学工業株式会社 Resin composition, liquid crystal alignment material and retardation material
JPWO2012018121A1 (en) * 2010-08-05 2013-10-28 日産化学工業株式会社 Resin composition, liquid crystal alignment material and retardation material
KR101887720B1 (en) 2011-01-28 2018-08-10 닛산 가가쿠 가부시키가이샤 Liquid crystal alignment agent containing both polyamic acid ester and polyamic acid
KR20140004189A (en) * 2011-01-28 2014-01-10 닛산 가가쿠 고교 가부시키 가이샤 Liquid crystal alignment agent containing both polyamic acid ester and polyamic acid
JPWO2013125595A1 (en) * 2012-02-22 2015-07-30 日産化学工業株式会社 Composition, liquid crystal alignment treatment agent, liquid crystal alignment film, and liquid crystal display element
JP2018083943A (en) * 2012-02-22 2018-05-31 日産化学工業株式会社 Composition, liquid crystal orientation treatment agent, liquid crystal orientation film and liquid crystal display element
WO2013125595A1 (en) * 2012-02-22 2013-08-29 日産化学工業株式会社 Composition, liquid crystal aligninig agent, liquid crystal alighment film, and liquid crystal display element
JP2015081285A (en) * 2013-10-22 2015-04-27 日産化学工業株式会社 Resin composition for display substrate
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JP2017156436A (en) * 2016-02-29 2017-09-07 Jsr株式会社 Liquid crystal alignment agent, liquid crystal alignment film and method for manufacturing the same, and liquid crystal device
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JPWO2020203834A1 (en) * 2019-04-02 2020-10-08
WO2020203834A1 (en) * 2019-04-02 2020-10-08 日本化薬株式会社 Bismaleimide compound, photosensitive resin composition using same, cured product from said photosensitive resin composition, and semiconductor element
KR20210134696A (en) * 2019-04-02 2021-11-10 닛뽄 가야쿠 가부시키가이샤 Bismaleimide compound, photosensitive resin composition using same, cured product thereof and semiconductor device
JP7066918B2 (en) 2019-04-02 2022-05-13 日本化薬株式会社 Bismaleimide compound, photosensitive resin composition using it, cured product thereof and semiconductor device
KR102635354B1 (en) 2019-04-02 2024-02-07 닛뽄 가야쿠 가부시키가이샤 Bismaleimide compound and method for producing the same, photosensitive resin composition using the same, cured product thereof, and semiconductor device

Also Published As

Publication number Publication date
JP5382346B2 (en) 2014-01-08
CN101679633B (en) 2012-09-19
KR101486301B1 (en) 2015-01-26
CN101679633A (en) 2010-03-24
KR20100034744A (en) 2010-04-01
TWI455960B (en) 2014-10-11
TW200914494A (en) 2009-04-01
JPWO2008153101A1 (en) 2010-08-26

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